KR970018759A - 반도체 발광소자 및 그 제조방법 - Google Patents
반도체 발광소자 및 그 제조방법 Download PDFInfo
- Publication number
- KR970018759A KR970018759A KR1019960039099A KR19960039099A KR970018759A KR 970018759 A KR970018759 A KR 970018759A KR 1019960039099 A KR1019960039099 A KR 1019960039099A KR 19960039099 A KR19960039099 A KR 19960039099A KR 970018759 A KR970018759 A KR 970018759A
- Authority
- KR
- South Korea
- Prior art keywords
- light emitting
- substrate
- buffer layer
- emitting element
- semiconductor light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 9
- 238000004519 manufacturing process Methods 0.000 title claims 2
- 239000000758 substrate Substances 0.000 claims abstract 9
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims abstract 4
- 238000005215 recombination Methods 0.000 claims abstract 3
- 230000006798 recombination Effects 0.000 claims abstract 3
- 238000003776 cleavage reaction Methods 0.000 abstract 2
- 230000007017 scission Effects 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
- H01S5/32341—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0133—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
- H10H20/01335—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials the light-emitting regions comprising nitride materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/815—Bodies having stress relaxation structures, e.g. buffer layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/817—Bodies characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2301/00—Functional characteristics
- H01S2301/17—Semiconductor lasers comprising special layers
- H01S2301/173—The laser chip comprising special buffer layers, e.g. dislocation prevention or reduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2304/00—Special growth methods for semiconductor lasers
- H01S2304/04—MOCVD or MOVPE
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0201—Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
- H01S5/0202—Cleaving
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
- H01S5/021—Silicon based substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/223—Buried stripe structure
- H01S5/2231—Buried stripe structure with inner confining structure only between the active layer and the upper electrode
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Led Devices (AREA)
Abstract
Description
Claims (3)
- 반대의 정면 및 배면을 갖는 Si 기판(1)과; 해당 Si 기판(1)의 정면상에 형성된 비정질 또는 다결정의 제1버퍼층(2)과; 해당 제1 버퍼층(2)상에, 전자와 정공의 재결합에 의해 발광하는 발광영역을 포함하도록 순차 형성된 복수의 GaN계 화합물 반도체층(3, 4, 5)을 구비하는 반도체 발광 소자.
- 제1항에 있어서, 상기 제1버퍼층(2)은 Si 또는 Si C로 이루어지는 반도체 발광 소자.
- 반대의 정면 및 배면을 갖는 Si 기판(1)을 준비하는 공정과; Si 기판(1)의 정면상에 비정질 또는 다결정의 버퍼층을 형성하는 공정과; 상기 GaN계 화합물 반도체층이 전자와 정공의 재결합에 의해 발광하는 발광영역을 포함하도록 상기 버퍼층상에 복수의 GaN계 화합물 반도체층(3, 4, 5)을 순차 성장시키는 공정을 구비하는 반도체 발광 소자의 제조방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24561195A JPH0992882A (ja) | 1995-09-25 | 1995-09-25 | 半導体発光素子,及びその製造方法 |
JP245611 | 1995-09-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970018759A true KR970018759A (ko) | 1997-04-30 |
Family
ID=17136286
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960039099A Ceased KR970018759A (ko) | 1995-09-25 | 1996-09-10 | 반도체 발광소자 및 그 제조방법 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5764673A (ko) |
EP (1) | EP0764989A1 (ko) |
JP (1) | JPH0992882A (ko) |
KR (1) | KR970018759A (ko) |
CN (1) | CN1148734A (ko) |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6258619B1 (en) | 1996-12-06 | 2001-07-10 | Rohm Ltd | Fabrication of semiconductor light emitting device |
US6103604A (en) * | 1997-02-10 | 2000-08-15 | Trw Inc. | High electron mobility transparent conductor |
CN1159750C (zh) * | 1997-04-11 | 2004-07-28 | 日亚化学工业株式会社 | 氮化物半导体的生长方法 |
DE19715572A1 (de) * | 1997-04-15 | 1998-10-22 | Telefunken Microelectron | Verfahren zum Herstellen von epitaktischen Schichten eines Verbindungshalbleiters auf einkristallinem Silizium und daraus hergestellte Leuchtdiode |
JP3480297B2 (ja) * | 1997-10-10 | 2003-12-15 | 豊田合成株式会社 | 半導体素子 |
US6559467B2 (en) * | 1997-11-18 | 2003-05-06 | Technologies And Devices International, Inc. | P-n heterojunction-based structures utilizing HVPE grown III-V compound layers |
US6344375B1 (en) | 1998-07-28 | 2002-02-05 | Matsushita Electric Industrial Co., Ltd | Substrate containing compound semiconductor, method for manufacturing the same and semiconductor device using the same |
SG94712A1 (en) | 1998-09-15 | 2003-03-18 | Univ Singapore | Method of fabricating group-iii nitride-based semiconductor device |
JP3505405B2 (ja) * | 1998-10-22 | 2004-03-08 | 三洋電機株式会社 | 半導体素子及びその製造方法 |
WO2001061766A1 (en) * | 2000-02-21 | 2001-08-23 | Sanken Electric Co., Ltd. | Light-emitting semiconductor device and method of manufacture thereof |
JP2001267242A (ja) * | 2000-03-14 | 2001-09-28 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体及びその製造方法 |
GB2365208A (en) * | 2000-07-19 | 2002-02-13 | Juses Chao | Amorphous alingan light emitting diode |
JP2002190621A (ja) * | 2000-10-12 | 2002-07-05 | Sharp Corp | 半導体発光素子およびその製造方法 |
US20030012984A1 (en) * | 2001-07-11 | 2003-01-16 | Tetsuzo Ueda | Buffer layer and growth method for subsequent epitaxial growth of III-V nitride semiconductors |
KR100744933B1 (ko) * | 2003-10-13 | 2007-08-01 | 삼성전기주식회사 | 실리콘 기판 상에 형성된 질화물 반도체 및 그 제조 방법 |
CN100380690C (zh) * | 2003-11-20 | 2008-04-09 | 果尚志 | 可减少高度晶格常数失配影响的半导体结构及形成的方法 |
US7741654B2 (en) * | 2004-09-16 | 2010-06-22 | Nec Corporation | Group III nitride semiconductor optical device |
CN100356595C (zh) * | 2004-09-27 | 2007-12-19 | 晶元光电股份有限公司 | Ⅲ族氮化物半导体元件及其制造方法 |
CN100435359C (zh) * | 2004-10-10 | 2008-11-19 | 晶元光电股份有限公司 | 半导体发光元件及其制造方法 |
US7338826B2 (en) * | 2005-12-09 | 2008-03-04 | The United States Of America As Represented By The Secretary Of The Navy | Silicon nitride passivation with ammonia plasma pretreatment for improving reliability of AlGaN/GaN HEMTs |
JP2008071803A (ja) * | 2006-09-12 | 2008-03-27 | Institute Of National Colleges Of Technology Japan | 化合物混晶半導体発光装置。 |
US20090272975A1 (en) * | 2008-05-05 | 2009-11-05 | Ding-Yuan Chen | Poly-Crystalline Layer Structure for Light-Emitting Diodes |
GB2467911B (en) * | 2009-02-16 | 2013-06-05 | Rfmd Uk Ltd | A semiconductor structure and a method of manufacture thereof |
JP5327489B2 (ja) * | 2009-02-20 | 2013-10-30 | キューエムシー カンパニー リミテッド | エルイーディーチップテスト装置 |
US8405068B2 (en) * | 2009-07-22 | 2013-03-26 | Rfmd (Uk) Limited | Reflecting light emitting structure and method of manufacture thereof |
US9012253B2 (en) * | 2009-12-16 | 2015-04-21 | Micron Technology, Inc. | Gallium nitride wafer substrate for solid state lighting devices, and associated systems and methods |
US20120292648A1 (en) * | 2011-05-16 | 2012-11-22 | Kabushiki Kaisha Toshiba | Nitride semiconductor device, nitride semiconductor wafer, and method for manufacturing nitride semiconductor layer |
US9312436B2 (en) | 2011-05-16 | 2016-04-12 | Kabushiki Kaisha Toshiba | Nitride semiconductor device, nitride semiconductor wafer, and method for manufacturing nitride semiconductor layer |
US9093420B2 (en) | 2012-04-18 | 2015-07-28 | Rf Micro Devices, Inc. | Methods for fabricating high voltage field effect transistor finger terminations |
US9124221B2 (en) | 2012-07-16 | 2015-09-01 | Rf Micro Devices, Inc. | Wide bandwidth radio frequency amplier having dual gate transistors |
US9147632B2 (en) | 2012-08-24 | 2015-09-29 | Rf Micro Devices, Inc. | Semiconductor device having improved heat dissipation |
US8988097B2 (en) | 2012-08-24 | 2015-03-24 | Rf Micro Devices, Inc. | Method for on-wafer high voltage testing of semiconductor devices |
US9917080B2 (en) | 2012-08-24 | 2018-03-13 | Qorvo US. Inc. | Semiconductor device with electrical overstress (EOS) protection |
US9202874B2 (en) | 2012-08-24 | 2015-12-01 | Rf Micro Devices, Inc. | Gallium nitride (GaN) device with leakage current-based over-voltage protection |
US9142620B2 (en) | 2012-08-24 | 2015-09-22 | Rf Micro Devices, Inc. | Power device packaging having backmetals couple the plurality of bond pads to the die backside |
US9070761B2 (en) | 2012-08-27 | 2015-06-30 | Rf Micro Devices, Inc. | Field effect transistor (FET) having fingers with rippled edges |
US9129802B2 (en) | 2012-08-27 | 2015-09-08 | Rf Micro Devices, Inc. | Lateral semiconductor device with vertical breakdown region |
US9325281B2 (en) | 2012-10-30 | 2016-04-26 | Rf Micro Devices, Inc. | Power amplifier controller |
TWI618268B (zh) | 2012-12-07 | 2018-03-11 | 晶元光電股份有限公司 | 發光裝置 |
CN103872206B (zh) * | 2012-12-14 | 2019-10-25 | 晶元光电股份有限公司 | 形成发光装置的制造方法及其所制成的发光装置 |
US9455327B2 (en) | 2014-06-06 | 2016-09-27 | Qorvo Us, Inc. | Schottky gated transistor with interfacial layer |
US9536803B2 (en) | 2014-09-05 | 2017-01-03 | Qorvo Us, Inc. | Integrated power module with improved isolation and thermal conductivity |
US10615158B2 (en) | 2015-02-04 | 2020-04-07 | Qorvo Us, Inc. | Transition frequency multiplier semiconductor device |
US10062684B2 (en) | 2015-02-04 | 2018-08-28 | Qorvo Us, Inc. | Transition frequency multiplier semiconductor device |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3849707A (en) * | 1973-03-07 | 1974-11-19 | Ibm | PLANAR GaN ELECTROLUMINESCENT DEVICE |
DE2738329A1 (de) * | 1976-09-06 | 1978-03-09 | Philips Nv | Elektrolumineszierende galliumnitridhalbleiteranordnung und verfahren zu deren herstellung |
US4139858A (en) * | 1977-12-12 | 1979-02-13 | Rca Corporation | Solar cell with a gallium nitride electrode |
JPS59203799A (ja) * | 1983-04-28 | 1984-11-17 | Sharp Corp | 炭化珪素単結晶基板の製造方法 |
NL8701497A (nl) * | 1987-06-26 | 1989-01-16 | Philips Nv | Halfgeleiderinrichting voor het opwekken van electromagnetische straling. |
JP2829319B2 (ja) * | 1988-09-16 | 1998-11-25 | 豊田合成株式会社 | 窒化ガリウム系化合物半導体発光素子 |
JPH0289306A (ja) * | 1988-09-27 | 1990-03-29 | Oki Electric Ind Co Ltd | 半導体薄膜の形成方法 |
JPH02178915A (ja) * | 1988-12-28 | 1990-07-11 | Kyocera Corp | 半導体素子の製造方法 |
JP3026087B2 (ja) * | 1989-03-01 | 2000-03-27 | 豊田合成株式会社 | 窒化ガリウム系化合物半導体の気相成長方法 |
JPH0429023A (ja) * | 1990-05-25 | 1992-01-31 | Tanaka Kikinzoku Kogyo Kk | 多点温度測定素子 |
JPH0831419B2 (ja) * | 1990-12-25 | 1996-03-27 | 名古屋大学長 | 単結晶珪素基板上への化合物半導体単結晶の作製方法 |
JP3160914B2 (ja) * | 1990-12-26 | 2001-04-25 | 豊田合成株式会社 | 窒化ガリウム系化合物半導体レーザダイオード |
US5290393A (en) * | 1991-01-31 | 1994-03-01 | Nichia Kagaku Kogyo K.K. | Crystal growth method for gallium nitride-based compound semiconductor |
JP3352712B2 (ja) * | 1991-12-18 | 2002-12-03 | 浩 天野 | 窒化ガリウム系半導体素子及びその製造方法 |
WO1994003931A1 (en) * | 1992-08-07 | 1994-02-17 | Asahi Kasei Kogyo Kabushiki Kaisha | Nitride based semiconductor device and manufacture thereof |
US5425860A (en) * | 1993-04-07 | 1995-06-20 | The Regents Of The University Of California | Pulsed energy synthesis and doping of silicon carbide |
US5393647A (en) * | 1993-07-16 | 1995-02-28 | Armand P. Neukermans | Method of making superhard tips for micro-probe microscopy and field emission |
DE69503299T2 (de) * | 1994-04-20 | 1999-01-21 | Akasaki, Isamu, Nagoya, Aichi | Galliumnitrid-Diodenlaser und Verfahren zu seiner Herstellung |
US5540786A (en) * | 1995-03-21 | 1996-07-30 | The Hong Kong University Of Science & Technology | Light emitting material |
-
1995
- 1995-09-25 JP JP24561195A patent/JPH0992882A/ja active Pending
-
1996
- 1996-04-15 EP EP96105896A patent/EP0764989A1/en not_active Withdrawn
- 1996-08-08 CN CN96109402A patent/CN1148734A/zh active Pending
- 1996-09-10 KR KR1019960039099A patent/KR970018759A/ko not_active Ceased
-
1997
- 1997-09-25 US US08/937,152 patent/US5764673A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5764673A (en) | 1998-06-09 |
CN1148734A (zh) | 1997-04-30 |
JPH0992882A (ja) | 1997-04-04 |
EP0764989A1 (en) | 1997-03-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR970018759A (ko) | 반도체 발광소자 및 그 제조방법 | |
KR970054585A (ko) | 질화물계 iii-v족 화합물 반도체 소자 및 그의 제조 방법 | |
KR970072575A (ko) | 발광 소자 및 그 제조 방법 | |
ATE279799T1 (de) | Verbindungshalbleiterstruktur für optoelektronische bauelemente | |
EP1624496A4 (de) | Leuchtdiode | |
KR930022619A (ko) | 반도체 발광소자 | |
KR960003001A (ko) | 수직 공동 표면 방출 레이저(vcsel) 및 수직 공동 표면 방출 레이저(vcsel)용 패턴화 미러의 제조 방법 | |
KR920020797A (ko) | 반도체레이저 | |
JP2000058918A (ja) | 半導体発光素子 | |
KR910008873A (ko) | 반도체발광소자 | |
KR920013824A (ko) | 레이저 다이오드 제조방법 | |
KR920011003A (ko) | 화합물 반도체 레이저 | |
KR930003446A (ko) | 반도체 발광소자 제조방법 | |
KR970018882A (ko) | 반도체 레이저 다이오드 및 그 제조방법 | |
KR940008174A (ko) | 반도체 레이저 다이오드의 제조방법 | |
KR960039510A (ko) | 반도체 레이저 | |
KR920020801A (ko) | 고출력 가시광 반도체 레이저 소자의 제조방법 | |
KR910020954A (ko) | 반도체의 고휘도 적색 led 전극 및 그 제조방법 | |
KR860003676A (ko) | 발광다이오드의 제조방법 | |
KR970030946A (ko) | 청색 발광소자 | |
KR940004875A (ko) | 발광다이오드 제조방법 | |
KR930005140A (ko) | 화합물 반도체소자 및 그 제조방법 | |
KR940004873A (ko) | 발광다이오드 및 제조방법 | |
KR930003473A (ko) | 반도체 레이저의 제조방법 | |
KR900004045A (ko) | 접합전류 제한 영역을 갖는 이중 헤테로 접합형 발광다이오드의 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19960910 |
|
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 19960910 Comment text: Request for Examination of Application |
|
PG1501 | Laying open of application | ||
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 19990525 Patent event code: PE09021S01D |
|
E601 | Decision to refuse application | ||
PE0601 | Decision on rejection of patent |
Patent event date: 19990729 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 19990525 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |