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KR970011205U - 와이어 본딩용 히터 블록 - Google Patents

와이어 본딩용 히터 블록

Info

Publication number
KR970011205U
KR970011205U KR2019950020169U KR19950020169U KR970011205U KR 970011205 U KR970011205 U KR 970011205U KR 2019950020169 U KR2019950020169 U KR 2019950020169U KR 19950020169 U KR19950020169 U KR 19950020169U KR 970011205 U KR970011205 U KR 970011205U
Authority
KR
South Korea
Prior art keywords
wire bonding
heater block
heater
block
bonding
Prior art date
Application number
KR2019950020169U
Other languages
English (en)
Other versions
KR200193444Y1 (ko
Inventor
김강산
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR2019950020169U priority Critical patent/KR200193444Y1/ko
Publication of KR970011205U publication Critical patent/KR970011205U/ko
Application granted granted Critical
Publication of KR200193444Y1 publication Critical patent/KR200193444Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10162—Shape being a cuboid with a square active surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
KR2019950020169U 1995-08-04 1995-08-04 와이어 본딩용 히터 블록 KR200193444Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950020169U KR200193444Y1 (ko) 1995-08-04 1995-08-04 와이어 본딩용 히터 블록

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950020169U KR200193444Y1 (ko) 1995-08-04 1995-08-04 와이어 본딩용 히터 블록

Publications (2)

Publication Number Publication Date
KR970011205U true KR970011205U (ko) 1997-03-29
KR200193444Y1 KR200193444Y1 (ko) 2000-09-01

Family

ID=19420189

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950020169U KR200193444Y1 (ko) 1995-08-04 1995-08-04 와이어 본딩용 히터 블록

Country Status (1)

Country Link
KR (1) KR200193444Y1 (ko)

Also Published As

Publication number Publication date
KR200193444Y1 (ko) 2000-09-01

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Legal Events

Date Code Title Description
UA0108 Application for utility model registration

Comment text: Application for Utility Model Registration

Patent event code: UA01011R08D

Patent event date: 19950804

UG1501 Laying open of application
A201 Request for examination
UA0201 Request for examination

Patent event date: 19970822

Patent event code: UA02012R01D

Comment text: Request for Examination of Application

Patent event date: 19950804

Patent event code: UA02011R01I

Comment text: Application for Utility Model Registration

E902 Notification of reason for refusal
UE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event code: UE09021S01D

Patent event date: 19991008

E701 Decision to grant or registration of patent right
UE0701 Decision of registration

Patent event date: 20000403

Comment text: Decision to Grant Registration

Patent event code: UE07011S01D

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