KR970005973B1 - 압-감 접착제 - Google Patents
압-감 접착제 Download PDFInfo
- Publication number
- KR970005973B1 KR970005973B1 KR1019880010404A KR880010404A KR970005973B1 KR 970005973 B1 KR970005973 B1 KR 970005973B1 KR 1019880010404 A KR1019880010404 A KR 1019880010404A KR 880010404 A KR880010404 A KR 880010404A KR 970005973 B1 KR970005973 B1 KR 970005973B1
- Authority
- KR
- South Korea
- Prior art keywords
- adhesive
- pressure
- sensitive adhesive
- weight
- monomer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
Description
Claims (9)
- (a) (ⅰ) 평균 4내지 12개의 탄소원자를 가진 알칼기를 함유하는 알킬 아크릴레이트가 주성분인 하나이상의 단량체와 (ⅱ) 약 0 내지 15중량부의 하나 이상의 강한 극성 공중합성 단량체 또는 약 0 내지 30중량부의 하나 이상의 보통 극성의 공중합성 단량체의 자외선 조사 중합된 약 50 내지 95중량부 및 (b) 지방족 중합체 수지로서 평균 분자량은 약 300내지 2500, 다중분산지수는 약 5 미만, 유리 전이온도는 약 40내지 120℃, 용해도 계수는 약 7 내지 9.5(cal/cc)-1/2인 하나 이상의 점착성 수지 약 5 내지 50중량부를 포함하며, 약 95%이상의 단량체 전환율을 가지는 압-감 접착제.
- 제1항에 있어서, 지방족 중합체 수지의 약 1 내지 약 80중량%의 방향족 성분을 함유하는 압-감 접착제.
- 제1항 또는 제2항에 있어서, 지방족 중합체 수지가 시스-피페릴렌, 트란스-피페릴렌, 이소프렌, 2-메틸-2-부텐, 펜텐, 펜타디엔, 헥사디엔, 시클로펜타디엔, 디시클로 펜타디엔, α-피넨, β-피넨과 리모넨으로 구성된 군에서 선택된 지방족 C-5 또는 (C-5)2단량계 분획에서 유되되는 것인 압-감 접착제.
- 제1항에 있어서, 방향족 성분이 상기 지방족 중합체 수지의 약 40 내지 약 60중량%를 구성하며 상기 방향족 성분은 스티렌, 비닐톨루엔, p-메틸 스티렌, p-메록시스티렌, α-메틸스티렌, t-부틸스티렌, 부틸스티렌, s-부틸스티렌, 에틸스티렌, 스틸벤과 1, 1-디페닐에틸렌으로 구성된 군으로부터 선택된 C-9 방향족 단량체 탄화수소 분획에서 유되든 것인 압-감 접착제.
- 제1항에 있어서, 중합성 단량체와 점착제의 중량을 기준으로 약 0.01 내지 약 1중량%의 광개시제를 추가로 함유한 압-감 접착제.
- 제1항에 있어서, 중합성 단량체와 점착제의 중량을 구진으로 약 0.01 내지 약 1중량%의 교차 결합체를 추가로 함유하는 압감 접착제.
- 제1항에 있어서, 평균지금이 약 10 내지 약 200미크론인 약 5 내지 65부피%의 소구(miorobubbles)를 추가로 함유하는 압-감 접착제.
- 가요성 캐리어 웨브의 최소한 한면에 제1항의 압-감 접착제가 접착된 압-감 접착 테이프.
- 가용성 캐리어 웨브의 최소한 한면에 제1항의 압-감 접착제가 릴리스 가능하도록 접착된 압-감 전이테이프.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US8593887A | 1987-08-14 | 1987-08-14 | |
US085,938 | 1997-08-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR890003912A KR890003912A (ko) | 1989-04-18 |
KR970005973B1 true KR970005973B1 (ko) | 1997-04-22 |
Family
ID=22194974
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019880010404A Expired - Fee Related KR970005973B1 (ko) | 1987-08-14 | 1988-08-13 | 압-감 접착제 |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0303430B1 (ko) |
JP (1) | JPS6466280A (ko) |
KR (1) | KR970005973B1 (ko) |
BR (1) | BR8804101A (ko) |
DE (1) | DE3886470T2 (ko) |
ES (1) | ES2048202T3 (ko) |
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1341126C (en) * | 1988-06-28 | 2000-10-24 | Albert I. Everaerts | Pressure-sensitive adhesive |
CA1340130C (en) * | 1988-06-28 | 1998-11-17 | Mark D. Purgett | Pressure-sensitive adhesive tapes |
JP2974150B2 (ja) * | 1989-06-30 | 1999-11-08 | 王子製紙株式会社 | 粘着シート |
DE3923023A1 (de) * | 1989-07-12 | 1991-01-24 | Siemens Ag | Uv-haertbarer klebstoff fuer ein halbleiterchipmontageverfahren |
CA2156164A1 (en) * | 1993-02-16 | 1994-09-01 | Lori A. Bilski | System comprising release agent and high peel adhesion repositionable adhesive |
EP0707604B1 (en) * | 1993-07-08 | 2000-05-10 | Avery Dennison Corporation | Acrylic-saturated rubber hybrid pressure-sensitive adhesives |
US5654387A (en) * | 1993-11-10 | 1997-08-05 | Minnesota Mining And Manufacturing Company | Pressure sensitive adhesives |
EP1097978B1 (en) * | 1993-11-10 | 2004-02-11 | Minnesota Mining And Manufacturing Company | Tackified pressure sensitive adhesives |
US5620795A (en) * | 1993-11-10 | 1997-04-15 | Minnesota Mining And Manufacturing Company | Adhesives containing electrically conductive agents |
US5602221A (en) * | 1993-11-10 | 1997-02-11 | Minnesota Mining And Manufacturing Company | Pressure sensitive adhesives with good low energy surface adhesion |
US5616670A (en) * | 1993-11-10 | 1997-04-01 | Minnesota Mining And Manufacturing Company | Pressure sensitive adhesives with good oily surface adhesion |
US5683798A (en) * | 1993-11-10 | 1997-11-04 | Minnesota Mining And Manufacturing Company | Tackified pressure sensitive adhesives |
ATE193721T1 (de) * | 1994-08-12 | 2000-06-15 | Avery Dennison Corp | Klebriggemachter, druckempfindlicher emulsionsklebstoff |
ATE200510T1 (de) * | 1994-10-11 | 2001-04-15 | Nitto Denko Corp | Schutzfolie für anstrichfilm |
JPH08269431A (ja) * | 1995-03-31 | 1996-10-15 | Mitsubishi Chem Basf Co Ltd | 粘着剤組成物 |
JP3670049B2 (ja) * | 1995-03-31 | 2005-07-13 | ビーエーエスエフディスパージョン株式会社 | ディレードタック型粘着剤組成物 |
US5695837A (en) * | 1995-04-20 | 1997-12-09 | Minnesota Mining And Manufacturing Company | Tackified acrylic adhesives |
US6844391B1 (en) | 1998-09-23 | 2005-01-18 | Avery Dennison Corporation | Adhesives with improved rivet properties and laminates using the same |
WO2000016976A1 (en) | 1998-09-23 | 2000-03-30 | Avery Dennison Corporation | Adhesives with improved rivet properties and laminates using the same |
US6608134B1 (en) | 1999-05-07 | 2003-08-19 | Avery Dennison Corporation | Adhesives and method for making same |
JP4825992B2 (ja) * | 1999-08-11 | 2011-11-30 | 綜研化学株式会社 | アクリル系粘着剤組成物、該組成物を用いた粘着テープの製造方法および粘着テープ |
US6663978B1 (en) | 2000-06-28 | 2003-12-16 | 3M Innovative Properties Company | High refractive index pressure-sensitive adhesives |
US7166686B2 (en) | 2000-06-28 | 2007-01-23 | 3M Innovative Properties Company | High refractive index pressure-sensitive adhesives |
JP4640740B2 (ja) * | 2000-12-04 | 2011-03-02 | 日東電工株式会社 | 感圧性接着剤組成物、感圧性接着シート及び光学フィルム |
US6800366B2 (en) * | 2000-12-21 | 2004-10-05 | Lg Chem, Ltd. | Acrylic adhesive compositions for polarizing film and the polarizer film using the same |
JP4822035B2 (ja) * | 2001-02-19 | 2011-11-24 | 綜研化学株式会社 | アクリル系粘着剤組成物及び該組成物を用いた粘着テープの製造方法 |
US7332540B2 (en) | 2004-02-18 | 2008-02-19 | Eastman Chemical Company | Aromatic-acrylate tackifier resins |
US7262242B2 (en) | 2004-02-18 | 2007-08-28 | Eastman Chemical Company | Aromatic/acrylate tackifier resin and acrylic polymer blends |
US7238732B2 (en) | 2004-02-18 | 2007-07-03 | Eastman Chemical Company | Radiation-curable adhesive compositions |
JP2006096958A (ja) * | 2004-09-30 | 2006-04-13 | Nippon Shokubai Co Ltd | 粘着剤組成物 |
JP5408640B2 (ja) * | 2006-09-04 | 2014-02-05 | 日東電工株式会社 | 紫外線硬化型粘着剤組成物、紫外線硬化型粘着シート及びその製造方法 |
DE102007030407A1 (de) * | 2007-06-29 | 2009-01-02 | Henkel Ag & Co. Kgaa | Etiketten mit wasserlösbaren UV-härtenden Klebstoffen |
JP5087414B2 (ja) | 2008-01-22 | 2012-12-05 | 日東電工株式会社 | 光硬化型アクリル系粘弾性体組成物、アクリル系粘弾性体、アクリル系粘弾性体層テープ又はシート、及びそれらの製造方法 |
JP2009256607A (ja) | 2008-03-17 | 2009-11-05 | Nitto Denko Corp | アクリル系粘着剤、アクリル系粘着剤層、アクリル系粘着テープ又はシート |
DE102008023758A1 (de) | 2008-05-09 | 2009-11-12 | Tesa Se | Haftklebebänder zur Verklebung von Druckplatten |
KR101969733B1 (ko) | 2009-02-13 | 2019-04-17 | 애버리 데니슨 코포레이션 | 접착제 화합물 |
ES2459305T3 (es) | 2009-09-11 | 2014-05-08 | Avery Dennison Corporation | Adhesivo sensible a la presión con capacidad de adherencia inicial y doble reticulado |
JP2013514445A (ja) * | 2009-12-18 | 2013-04-25 | スリーエム イノベイティブ プロパティズ カンパニー | 低表面エネルギー基材用感圧性接着剤 |
KR101824274B1 (ko) | 2010-03-25 | 2018-01-31 | 닛토덴코 가부시키가이샤 | 광학용 아크릴계 점착제 조성물 및 광학용 아크릴계 점착 테이프 |
US9279022B1 (en) * | 2014-09-08 | 2016-03-08 | Sirrus, Inc. | Solution polymers including one or more 1,1-disubstituted alkene compounds, solution polymerization methods, and polymer compositions |
JP2011046961A (ja) * | 2010-11-04 | 2011-03-10 | Soken Chem & Eng Co Ltd | アクリル系粘着剤組成物、該組成物を用いた粘着テープの製造方法および粘着テープ |
EP2722736B1 (en) * | 2011-07-19 | 2018-07-11 | LG Chem, Ltd. | Touch panel |
JP6114004B2 (ja) * | 2011-11-10 | 2017-04-12 | 日東電工株式会社 | 粘着剤組成物、及び粘着シート |
JP5950669B2 (ja) * | 2012-04-16 | 2016-07-13 | 日東電工株式会社 | 粘着シート及び粘着剤組成物 |
CN105518093A (zh) | 2013-03-05 | 2016-04-20 | 艾利丹尼森公司 | 不同的双功能泡沫带 |
JP6325313B2 (ja) * | 2014-03-31 | 2018-05-16 | リンテック株式会社 | シート状粘着剤および粘着シート |
EP3182398A1 (en) | 2015-12-18 | 2017-06-21 | 3M Innovative Properties Company | Identification plate |
JP6229763B2 (ja) * | 2016-06-20 | 2017-11-15 | 東亞合成株式会社 | 粘着付与剤及び粘着剤組成物、並びにその用途 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2443414C2 (de) * | 1974-09-11 | 1983-05-19 | Beiersdorf Ag, 2000 Hamburg | Verfahren zur Herstellung von selbstklebend ausgerüsteten Produkten |
JPS5417942A (en) * | 1977-07-09 | 1979-02-09 | Sony Corp | Adhesive mass |
US4599265A (en) * | 1982-11-04 | 1986-07-08 | Minnesota Mining And Manufacturing Company | Removable pressure-sensitive adhesive tape |
JPS6026074A (ja) * | 1983-07-21 | 1985-02-08 | Nagoyashi | 感圧性接着剤製造用の感光性樹脂組成物 |
-
1988
- 1988-08-08 DE DE3886470T patent/DE3886470T2/de not_active Expired - Fee Related
- 1988-08-08 EP EP88307317A patent/EP0303430B1/en not_active Expired - Lifetime
- 1988-08-08 ES ES88307317T patent/ES2048202T3/es not_active Expired - Lifetime
- 1988-08-12 BR BR8804101A patent/BR8804101A/pt not_active Application Discontinuation
- 1988-08-12 JP JP63201827A patent/JPS6466280A/ja active Pending
- 1988-08-13 KR KR1019880010404A patent/KR970005973B1/ko not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
ES2048202T3 (es) | 1994-03-16 |
DE3886470D1 (de) | 1994-02-03 |
DE3886470T2 (de) | 1994-07-14 |
BR8804101A (pt) | 1989-03-07 |
KR890003912A (ko) | 1989-04-18 |
JPS6466280A (en) | 1989-03-13 |
EP0303430A1 (en) | 1989-02-15 |
EP0303430B1 (en) | 1993-12-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR970005973B1 (ko) | 압-감 접착제 | |
US5028484A (en) | Pressure-sensitive adhesive | |
KR960005179B1 (ko) | 점착성 아크릴 감압 접착제 | |
EP0821716B1 (en) | Tackified acrylic adhesives | |
EP0357204B1 (en) | Tackified terpolymer adhesives | |
EP1318181B1 (en) | Hot melt acrylic pressure sensitive adhesive and use thereof | |
JP4113582B2 (ja) | ポリオレフィン表面用感圧接着剤 | |
CA2105077C (en) | Multi-stage irradiation process for production of acrylic based compositions and compositions made thereby | |
CA1335020C (en) | Hotmelt contact adhesives which can be crosslinked with ultraviolet radiation in the air | |
EP1112289B1 (en) | Low temperature electron beam polymerization | |
JPH05179208A (ja) | 両面粘着テープの製造方法 | |
JPH1030078A (ja) | 接着性組成物及び塗工方法 | |
US5135816A (en) | Radiation-reactive phenylbutadiene multiblock copolymers | |
EP0109177B1 (en) | Removable pressure-sensitive adhesive tape | |
US7429409B2 (en) | UV-crosslinking block copolymers | |
JP2596707B2 (ja) | 放射線硬化性ホットメルト感圧接着剤 | |
JPH108013A (ja) | アクリル系粘接着剤組成物 | |
JP3464772B2 (ja) | アクリル系ホットメルト粘着剤組成物 | |
JP3510722B2 (ja) | 粘弾性シートの製造方法 | |
JP3154739B2 (ja) | 光重合性接着剤組成物とこれを用いた感圧性接着剤およびその接着シ―ト類 | |
JP2003277521A (ja) | 光架橋方法 | |
JP3282857B2 (ja) | 光重合性接着剤組成物とこれを用いた感圧性接着剤およびその接着シ―ト類 | |
JPH04270774A (ja) | 放射線硬化型感圧接着剤及びその接着シート | |
JPH01139640A (ja) | 粘着剤組成物 | |
JPH03115481A (ja) | 活性エネルギー線硬化型ホットメルト感圧接着剤組成物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
A201 | Request for examination | ||
P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
G160 | Decision to publish patent application | ||
PG1605 | Publication of application before grant of patent |
St.27 status event code: A-2-2-Q10-Q13-nap-PG1605 |
|
E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
LAPS | Lapse due to unpaid annual fee | ||
PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20000805 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20000805 |
|
R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |