KR960042909A - Semiconductor device manufacturing method - Google Patents
Semiconductor device manufacturing method Download PDFInfo
- Publication number
- KR960042909A KR960042909A KR1019950010733A KR19950010733A KR960042909A KR 960042909 A KR960042909 A KR 960042909A KR 1019950010733 A KR1019950010733 A KR 1019950010733A KR 19950010733 A KR19950010733 A KR 19950010733A KR 960042909 A KR960042909 A KR 960042909A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor device
- device manufacturing
- forming
- accuracy
- job
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 6
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 5
- 238000000034 method Methods 0.000 claims abstract 6
- 239000002184 metal Substances 0.000 claims 1
- 238000001459 lithography Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Electron Beam Exposure (AREA)
Abstract
본 발명은 반도체소자 제조방법에 관한 것으로, 반도체소자 제조공정중 리소그래피공정시 사용하는 잡-파일의 프로그램을 새롭게 고안한 것으로써, 종래의 비대칭적 프리얼라인 방식을 대칭적인 프리얼라인 방식으로 바꾸어 얼라인마크의 비대칭성을 보상하여 중첩정도를 개선함으로써 반도체소자의 신뢰성을 향상시킬 수 있는 기술이다.BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method for manufacturing a semiconductor device, and by newly devising a program of a job file used in a lithography process in a semiconductor device manufacturing process, a conventional asymmetric prealign method is replaced with a symmetrical free alignment method. It is a technology that can improve the reliability of semiconductor devices by improving the degree of overlap by compensating the asymmetry of the alignment mark.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제2도는 본 발명의 실시예에 따른 반도체소자 제조방법을 도시한 관계도.2 is a relationship diagram showing a method of manufacturing a semiconductor device according to an embodiment of the present invention.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950010733A KR960042909A (en) | 1995-05-02 | 1995-05-02 | Semiconductor device manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950010733A KR960042909A (en) | 1995-05-02 | 1995-05-02 | Semiconductor device manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR960042909A true KR960042909A (en) | 1996-12-21 |
Family
ID=66523702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019950010733A Ceased KR960042909A (en) | 1995-05-02 | 1995-05-02 | Semiconductor device manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR960042909A (en) |
-
1995
- 1995-05-02 KR KR1019950010733A patent/KR960042909A/en not_active Ceased
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19950502 |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20000228 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 19950502 Comment text: Patent Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20020130 Patent event code: PE09021S01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20020513 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20020130 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |