KR960036146A - α-헥사티에닐을 포함하는 아티클 - Google Patents
α-헥사티에닐을 포함하는 아티클 Download PDFInfo
- Publication number
- KR960036146A KR960036146A KR1019960005463A KR19960005463A KR960036146A KR 960036146 A KR960036146 A KR 960036146A KR 1019960005463 A KR1019960005463 A KR 1019960005463A KR 19960005463 A KR19960005463 A KR 19960005463A KR 960036146 A KR960036146 A KR 960036146A
- Authority
- KR
- South Korea
- Prior art keywords
- article
- nuclear
- thienyl
- phase
- thin film
- Prior art date
Links
- 125000001544 thienyl group Chemical group 0.000 claims abstract 6
- 239000010409 thin film Substances 0.000 claims abstract 6
- 239000000843 powder Substances 0.000 claims abstract 2
- 229910052586 apatite Inorganic materials 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- VSIIXMUUUJUKCM-UHFFFAOYSA-D pentacalcium;fluoride;triphosphate Chemical compound [F-].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O VSIIXMUUUJUKCM-UHFFFAOYSA-D 0.000 claims 3
- 239000010408 film Substances 0.000 claims 2
- 239000013078 crystal Substances 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/649—Aromatic compounds comprising a hetero atom
- H10K85/655—Aromatic compounds comprising a hetero atom comprising only sulfur as heteroatom
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/464—Lateral top-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/466—Lateral bottom-gate IGFETs comprising only a single gate
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Thin Film Transistor (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Description
Claims (7)
- α-핵사티에닐을 포함하는 아티클에 있어서, 상기 α-핵사티에닐양은 CuK 파우더 X-레이 굴절 패턴에서 2θ=4.31, 8.64, 17.32, 26.15 및 29.08°에서의 굴절 패턴을 보여주는 α-핵사티에닐의 페이즈로 이루어지는 것을 특징으로 하는 α-핵사티에닐을 포함하는 아티클.
- 제 1항에 있어서, 상기 α-핵사티에닐 페이즈는 오차 범위가 약 ±1%내인 a=0.914㎚, b=0.568㎚ 및 c=2.067㎚인 단위셀축 및 β=90°인 단사정계 각도를 지닌 단사정계 결정 대칭을 갖는 것을 특징으로 하는 α-핵사티에닐을 포함하는 아티클.
- 제 1항에 있어서, 상기 페이즈는 응용된 α-핵사티에닐의 부피의 적어도 일부분을 고체화하는 단계를 포함하는 공정에 의해 제조되는 것을 특징으로 하는 α-핵사티에닐을 포함하는 아티클.
- 제 1항에 있어서, 상기 페이즈는 295℃이상의 온도인 기판상에 α-핵사티에닐을 증착시키는 단계를 포함하는 공정에 의해 제조되는 것을 특징으로 하는 α-핵사티에닐을 포함하는 아티클.
- 제 1항에 있어서, 상기 양은 상기 페이즈 막을 포함하는 것을 특징으로 하는 α-핵사티에닐을 포함하는 아티클.
- 제 5항에 있어서, 하나 이상의 박막 트랜지스터를 포함하며, 상기 박막 트랜지스터중 소정의 하나의 박막 트랜지스터는 α-핵사티에닐의 상기 페이즈 막을 포함하는 것을 특징으로 하는 α-핵사티에닐을 포함하는 아티클.
- 제 6항에 있어서, 상기 아티클은 플랫 스크린 디스플레이인 것을 특징으로 하는 α-핵사티에닐을 포함하는 아티클.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US393,494 | 1995-03-02 | ||
US08/393,494 US5659181A (en) | 1995-03-02 | 1995-03-02 | Article comprising α-hexathienyl |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960036146A true KR960036146A (ko) | 1996-10-28 |
KR100397243B1 KR100397243B1 (ko) | 2004-03-04 |
Family
ID=23554910
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960005463A KR100397243B1 (ko) | 1995-03-02 | 1996-03-02 | α-헥사티에닐을포함하는물품 |
Country Status (8)
Country | Link |
---|---|
US (1) | US5659181A (ko) |
EP (1) | EP0730313B1 (ko) |
JP (1) | JP3168245B2 (ko) |
KR (1) | KR100397243B1 (ko) |
CA (1) | CA2166752C (ko) |
DE (1) | DE69637892D1 (ko) |
MX (1) | MX9600741A (ko) |
SG (1) | SG50605A1 (ko) |
Families Citing this family (67)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6839158B2 (en) | 1997-08-28 | 2005-01-04 | E Ink Corporation | Encapsulated electrophoretic displays having a monolayer of capsules and materials and methods for making the same |
US7242513B2 (en) | 1997-08-28 | 2007-07-10 | E Ink Corporation | Encapsulated electrophoretic displays having a monolayer of capsules and materials and methods for making the same |
JP4664501B2 (ja) | 1998-04-10 | 2011-04-06 | イー インク コーポレイション | 有機系電界効果トランジスタを用いる電子ディスプレイ |
AU3987299A (en) | 1998-05-12 | 1999-11-29 | E-Ink Corporation | Microencapsulated electrophoretic electrostatically-addressed media for drawing device applications |
US6215130B1 (en) * | 1998-08-20 | 2001-04-10 | Lucent Technologies Inc. | Thin film transistors |
US6842657B1 (en) | 1999-04-09 | 2005-01-11 | E Ink Corporation | Reactive formation of dielectric layers and protection of organic layers in organic semiconductor device fabrication |
US6498114B1 (en) | 1999-04-09 | 2002-12-24 | E Ink Corporation | Method for forming a patterned semiconductor film |
AU7094400A (en) | 1999-08-31 | 2001-03-26 | E-Ink Corporation | A solvent annealing process for forming a thin semiconductor film with advantageous properties |
EP1208603A1 (en) * | 1999-08-31 | 2002-05-29 | E Ink Corporation | Transistor for an electronically driven display |
US6197663B1 (en) | 1999-12-07 | 2001-03-06 | Lucent Technologies Inc. | Process for fabricating integrated circuit devices having thin film transistors |
US6414164B1 (en) * | 2000-07-12 | 2002-07-02 | International Business Machines Corporation | Synthesis of soluble derivatives of sexithiophene and their use as the semiconducting channels in thin-film filed-effect transistors |
DE10034873B4 (de) * | 2000-07-18 | 2005-10-13 | Pacifica Group Technologies Pty Ltd | Verfahren und Bremsanlage zum Regeln des Bremsvorgangs bei einem Kraftfahrzeug |
US7078261B2 (en) * | 2002-12-16 | 2006-07-18 | The Regents Of The University Of California | Increased mobility from organic semiconducting polymers field-effect transistors |
CN1823425A (zh) * | 2003-07-10 | 2006-08-23 | 松下电器产业株式会社 | 有机薄膜晶体管及其制造方法、以及使用了它的有源矩阵型显示器和无线识别标签 |
KR100692448B1 (ko) | 2003-11-17 | 2007-03-09 | 후지제롯쿠스 가부시끼가이샤 | 유기 반도체 트랜지스터 소자, 이것을 사용한 반도체 장치및 그 반도체 장치의 제조 방법 |
JP4401826B2 (ja) * | 2004-03-10 | 2010-01-20 | キヤノン株式会社 | 電界効果型トランジスタおよびその製造方法 |
JP4401836B2 (ja) * | 2004-03-24 | 2010-01-20 | キヤノン株式会社 | 電界効果型トランジスタおよびその製造方法 |
US7435989B2 (en) * | 2005-09-06 | 2008-10-14 | Canon Kabushiki Kaisha | Semiconductor device with layer containing polysiloxane compound |
US7695999B2 (en) * | 2005-09-06 | 2010-04-13 | Canon Kabushiki Kaisha | Production method of semiconductor device |
JP5335228B2 (ja) * | 2006-12-27 | 2013-11-06 | キヤノン株式会社 | 新規化合物および有機半導体素子の製造方法 |
JP2010225758A (ja) * | 2009-03-23 | 2010-10-07 | Fuji Xerox Co Ltd | 有機半導体トランジスタ |
JP4893767B2 (ja) * | 2009-03-24 | 2012-03-07 | 富士ゼロックス株式会社 | 有機半導体トランジスタ |
JP5347690B2 (ja) * | 2009-04-30 | 2013-11-20 | 富士ゼロックス株式会社 | 有機電界発光素子、及び表示媒体 |
US9276336B2 (en) | 2009-05-28 | 2016-03-01 | Hsio Technologies, Llc | Metalized pad to electrical contact interface |
WO2010138493A1 (en) | 2009-05-28 | 2010-12-02 | Hsio Technologies, Llc | High performance surface mount electrical interconnect |
WO2014011232A1 (en) | 2012-07-12 | 2014-01-16 | Hsio Technologies, Llc | Semiconductor socket with direct selective metalization |
WO2011153298A1 (en) | 2010-06-03 | 2011-12-08 | Hsio Technologies, Llc | Electrical connector insulator housing |
WO2011139619A1 (en) | 2010-04-26 | 2011-11-10 | Hsio Technologies, Llc | Semiconductor device package adapter |
US8789272B2 (en) | 2009-06-02 | 2014-07-29 | Hsio Technologies, Llc | Method of making a compliant printed circuit peripheral lead semiconductor test socket |
US8610265B2 (en) | 2009-06-02 | 2013-12-17 | Hsio Technologies, Llc | Compliant core peripheral lead semiconductor test socket |
US9196980B2 (en) | 2009-06-02 | 2015-11-24 | Hsio Technologies, Llc | High performance surface mount electrical interconnect with external biased normal force loading |
WO2010141298A1 (en) | 2009-06-02 | 2010-12-09 | Hsio Technologies, Llc | Composite polymer-metal electrical contacts |
WO2010141295A1 (en) | 2009-06-02 | 2010-12-09 | Hsio Technologies, Llc | Compliant printed flexible circuit |
WO2010141303A1 (en) | 2009-06-02 | 2010-12-09 | Hsio Technologies, Llc | Resilient conductive electrical interconnect |
US9136196B2 (en) | 2009-06-02 | 2015-09-15 | Hsio Technologies, Llc | Compliant printed circuit wafer level semiconductor package |
US9603249B2 (en) | 2009-06-02 | 2017-03-21 | Hsio Technologies, Llc | Direct metalization of electrical circuit structures |
US9613841B2 (en) | 2009-06-02 | 2017-04-04 | Hsio Technologies, Llc | Area array semiconductor device package interconnect structure with optional package-to-package or flexible circuit to package connection |
WO2010141316A1 (en) | 2009-06-02 | 2010-12-09 | Hsio Technologies, Llc | Compliant printed circuit wafer probe diagnostic tool |
US8955216B2 (en) | 2009-06-02 | 2015-02-17 | Hsio Technologies, Llc | Method of making a compliant printed circuit peripheral lead semiconductor package |
WO2010141311A1 (en) | 2009-06-02 | 2010-12-09 | Hsio Technologies, Llc | Compliant printed circuit area array semiconductor device package |
US9699906B2 (en) | 2009-06-02 | 2017-07-04 | Hsio Technologies, Llc | Hybrid printed circuit assembly with low density main core and embedded high density circuit regions |
US8987886B2 (en) | 2009-06-02 | 2015-03-24 | Hsio Technologies, Llc | Copper pillar full metal via electrical circuit structure |
WO2012074963A1 (en) | 2010-12-01 | 2012-06-07 | Hsio Technologies, Llc | High performance surface mount electrical interconnect |
US9318862B2 (en) | 2009-06-02 | 2016-04-19 | Hsio Technologies, Llc | Method of making an electronic interconnect |
US9930775B2 (en) | 2009-06-02 | 2018-03-27 | Hsio Technologies, Llc | Copper pillar full metal via electrical circuit structure |
US8525346B2 (en) | 2009-06-02 | 2013-09-03 | Hsio Technologies, Llc | Compliant conductive nano-particle electrical interconnect |
WO2012078493A1 (en) | 2010-12-06 | 2012-06-14 | Hsio Technologies, Llc | Electrical interconnect ic device socket |
US9276339B2 (en) | 2009-06-02 | 2016-03-01 | Hsio Technologies, Llc | Electrical interconnect IC device socket |
WO2011002709A1 (en) | 2009-06-29 | 2011-01-06 | Hsio Technologies, Llc | Compliant printed circuit semiconductor tester interface |
US8618649B2 (en) | 2009-06-02 | 2013-12-31 | Hsio Technologies, Llc | Compliant printed circuit semiconductor package |
US8988093B2 (en) | 2009-06-02 | 2015-03-24 | Hsio Technologies, Llc | Bumped semiconductor wafer or die level electrical interconnect |
US9232654B2 (en) | 2009-06-02 | 2016-01-05 | Hsio Technologies, Llc | High performance electrical circuit structure |
US8928344B2 (en) | 2009-06-02 | 2015-01-06 | Hsio Technologies, Llc | Compliant printed circuit socket diagnostic tool |
US8970031B2 (en) | 2009-06-16 | 2015-03-03 | Hsio Technologies, Llc | Semiconductor die terminal |
US8803539B2 (en) | 2009-06-03 | 2014-08-12 | Hsio Technologies, Llc | Compliant wafer level probe assembly |
WO2010147782A1 (en) | 2009-06-16 | 2010-12-23 | Hsio Technologies, Llc | Simulated wirebond semiconductor package |
US9320144B2 (en) | 2009-06-17 | 2016-04-19 | Hsio Technologies, Llc | Method of forming a semiconductor socket |
US8984748B2 (en) | 2009-06-29 | 2015-03-24 | Hsio Technologies, Llc | Singulated semiconductor device separable electrical interconnect |
US10159154B2 (en) | 2010-06-03 | 2018-12-18 | Hsio Technologies, Llc | Fusion bonded liquid crystal polymer circuit structure |
US8758067B2 (en) | 2010-06-03 | 2014-06-24 | Hsio Technologies, Llc | Selective metalization of electrical connector or socket housing |
US9689897B2 (en) | 2010-06-03 | 2017-06-27 | Hsio Technologies, Llc | Performance enhanced semiconductor socket |
US9350093B2 (en) | 2010-06-03 | 2016-05-24 | Hsio Technologies, Llc | Selective metalization of electrical connector or socket housing |
JP5966353B2 (ja) | 2011-12-26 | 2016-08-10 | 富士ゼロックス株式会社 | 有機半導体トランジスタ |
US9761520B2 (en) | 2012-07-10 | 2017-09-12 | Hsio Technologies, Llc | Method of making an electrical connector having electrodeposited terminals |
US10667410B2 (en) | 2013-07-11 | 2020-05-26 | Hsio Technologies, Llc | Method of making a fusion bonded circuit structure |
US10506722B2 (en) | 2013-07-11 | 2019-12-10 | Hsio Technologies, Llc | Fusion bonded liquid crystal polymer electrical circuit structure |
US9559447B2 (en) | 2015-03-18 | 2017-01-31 | Hsio Technologies, Llc | Mechanical contact retention within an electrical connector |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2664430B1 (fr) * | 1990-07-04 | 1992-09-18 | Centre Nat Rech Scient | Transistor a effet de champ en couche mince de structure mis, dont l'isolant et le semiconducteur sont realises en materiaux organiques. |
US5315129A (en) * | 1990-08-20 | 1994-05-24 | University Of Southern California | Organic optoelectronic devices and methods |
JP3224829B2 (ja) * | 1991-08-15 | 2001-11-05 | 株式会社東芝 | 有機電界効果型素子 |
-
1995
- 1995-03-02 US US08/393,494 patent/US5659181A/en not_active Expired - Lifetime
-
1996
- 1996-01-08 CA CA002166752A patent/CA2166752C/en not_active Expired - Fee Related
- 1996-02-21 EP EP96301149A patent/EP0730313B1/en not_active Expired - Lifetime
- 1996-02-21 DE DE69637892T patent/DE69637892D1/de not_active Expired - Lifetime
- 1996-02-26 MX MX9600741A patent/MX9600741A/es not_active IP Right Cessation
- 1996-02-27 JP JP03919096A patent/JP3168245B2/ja not_active Expired - Fee Related
- 1996-03-01 SG SG1996006342A patent/SG50605A1/en unknown
- 1996-03-02 KR KR1019960005463A patent/KR100397243B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0730313B1 (en) | 2009-04-08 |
SG50605A1 (en) | 1998-07-20 |
KR100397243B1 (ko) | 2004-03-04 |
EP0730313A2 (en) | 1996-09-04 |
JPH08264805A (ja) | 1996-10-11 |
DE69637892D1 (de) | 2009-05-20 |
CA2166752C (en) | 2000-06-27 |
JP3168245B2 (ja) | 2001-05-21 |
CA2166752A1 (en) | 1996-09-03 |
MX9600741A (es) | 1997-02-28 |
US5659181A (en) | 1997-08-19 |
EP0730313A3 (en) | 1998-03-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR960036146A (ko) | α-헥사티에닐을 포함하는 아티클 | |
CA2160394A1 (en) | Method of Making an Organic Thin Film Transistor, and Article Made by the Method | |
KR930001757A (ko) | 실리카 선구 물질로 기판을 피복시키는 방법 | |
EP1170323A3 (en) | Thermoplastic resin film, process for production thereof and optical film | |
DE60313974D1 (de) | Mehrsschichtfolie enthaltend amorphes polymer | |
EP0816900A3 (en) | Phase retarder and liquid crystal display device using the same | |
BR9908335A (pt) | Composição de revestimento composta demulti-componentes e substrato revestido | |
ES2144470T3 (es) | Procedimiento para fabricar una pelicula de doble capa. | |
EP1559745A4 (en) | COMPOSITION FOR LIQUID CRYSTAL COMPOUND AND OPTICAL RETARDANT FILM USING THE SAME | |
EP1045289A3 (en) | A lithographic process having sub-wavelength resolution | |
EP1176466A4 (en) | HALFTONE PHASE SLIDER MASK AND PRELIMINATING SUCH A MASK | |
ATE141306T1 (de) | Beschichtungsverfahren | |
IE792151L (en) | Oxybenzoyl copolyesters | |
Agina et al. | Thiophene-based monolayer OFETs prepared by Langmuir techniques | |
JPS5440653A (en) | Substrate for liquid crystal display device | |
KR920017187A (ko) | 반도체 장치의 제조방법 | |
KR960029848A (ko) | 불소 함유 유기고분자 배향막재료 및 이를 채용한 액정표시소자 | |
JPS526381A (en) | Liquid crystal composition | |
TWI265861B (en) | Gas barrier resin | |
KR890015977A (ko) | 열 분해에 의한 초전도 금속산화물 필름의 제조 | |
DE59608932D1 (de) | Kunststoffolien für folienkondensatoren und herstellungsverfahren | |
KR890701428A (ko) | 유지용기 | |
KR840000980A (ko) | 반도체막의 제조 방법 | |
JPS5286482A (en) | Production of biaxially oriented films of crystalline thermoplastic re sins having antistatic properties and low temperature heat-sealing pro perties | |
Shirotani et al. | Anomalous absorption spectra of highly oriented thin films of triphenothiaselenazine |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19960302 |
|
PG1501 | Laying open of application | ||
A201 | Request for examination | ||
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20001212 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 19960302 Comment text: Patent Application |
|
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20020830 Patent event code: PE09021S01D |
|
E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20030623 |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20030826 Patent event code: PR07011E01D |
|
PR1002 | Payment of registration fee |
Payment date: 20030827 End annual number: 3 Start annual number: 1 |
|
PG1601 | Publication of registration | ||
PR1001 | Payment of annual fee |
Payment date: 20060728 Start annual number: 4 End annual number: 4 |
|
PR1001 | Payment of annual fee |
Payment date: 20070731 Start annual number: 5 End annual number: 5 |
|
PR1001 | Payment of annual fee |
Payment date: 20080728 Start annual number: 6 End annual number: 6 |
|
PR1001 | Payment of annual fee |
Payment date: 20090819 Start annual number: 7 End annual number: 7 |
|
PR1001 | Payment of annual fee |
Payment date: 20100818 Start annual number: 8 End annual number: 8 |
|
PR1001 | Payment of annual fee |
Payment date: 20110824 Start annual number: 9 End annual number: 9 |
|
FPAY | Annual fee payment |
Payment date: 20120802 Year of fee payment: 10 |
|
PR1001 | Payment of annual fee |
Payment date: 20120802 Start annual number: 10 End annual number: 10 |
|
FPAY | Annual fee payment |
Payment date: 20130801 Year of fee payment: 11 |
|
PR1001 | Payment of annual fee |
Payment date: 20130801 Start annual number: 11 End annual number: 11 |
|
PR1001 | Payment of annual fee |
Payment date: 20140811 Start annual number: 12 End annual number: 12 |
|
LAPS | Lapse due to unpaid annual fee | ||
PC1903 | Unpaid annual fee |