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KR960028780A - Component Mounting Device - Google Patents

Component Mounting Device Download PDF

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Publication number
KR960028780A
KR960028780A KR1019940038348A KR19940038348A KR960028780A KR 960028780 A KR960028780 A KR 960028780A KR 1019940038348 A KR1019940038348 A KR 1019940038348A KR 19940038348 A KR19940038348 A KR 19940038348A KR 960028780 A KR960028780 A KR 960028780A
Authority
KR
South Korea
Prior art keywords
component
circuit board
printed circuit
component support
movable rail
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
KR1019940038348A
Other languages
Korean (ko)
Other versions
KR0155794B1 (en
Inventor
오병준
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019940038348A priority Critical patent/KR0155794B1/en
Publication of KR960028780A publication Critical patent/KR960028780A/en
Application granted granted Critical
Publication of KR0155794B1 publication Critical patent/KR0155794B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

본 발명은 인쇄회로기판에 전기·전자부품들을 자동으로 장착하기 위한 장치에 관한 것이다.The present invention relates to an apparatus for automatically mounting electrical and electronic components on a printed circuit board.

본 발명의 부품장착장치에 있어서는, 인쇄회로기판에 장착될 부품이 놓이는 부품지지부들 중 가동레일에 인접하게 위치하는 부품지지부가 고정레일에 대해 진퇴가능하게 설치되어 있으므로, 인쇄회로기판의 크기에 맞추어 가동레일이 이동될 때그 부품지지부도 함께 이동시킬 수 있다. 따라서, 흡착헤드가 가동레일에 인접한 부품지지부와 인쇄회로기판 사이를 왕복이동하는 거리를 단축시킬 수 있어, 부품을 장착하는데 소요되는 작업시간이 절감되는 효과가 있다.In the component mounting apparatus of the present invention, since the component support portion positioned adjacent to the movable rail among the component support portions on which the component to be mounted on the printed circuit board is placed is provided to be retractable with respect to the fixed rail, it is adapted to the size of the printed circuit board. When the movable rail is moved, the component support can also be moved. Therefore, the suction head can shorten the distance reciprocating between the component support portion adjacent to the movable rail and the printed circuit board, thereby reducing the work time required for mounting the component.

Description

부품 장착장치Component Mounting Device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제2도는 제1도에 도시된 부품장착장치의 평면도, 제3도는 본 발명에 따른 부품장착장치의 사시도, 제4도는 제3도에 도시된 부품장착장치의 평면도2 is a plan view of the component mounting apparatus shown in FIG. 1, FIG. 3 is a perspective view of the component mounting apparatus according to the present invention, and FIG. 4 is a plan view of the component mounting apparatus shown in FIG.

Claims (2)

프레임과, 이 프레임상에 고정된 고정레일과, 이 고정레일과 대향하며 고정레일에 대해 진퇴가능하게 상기프레임상에 설치된 가동레일과, 상기 레일들에 의해 이송되는 인쇄회로기판에 장착될 부품이 놓여지며 상기 각 레일들의외측에 마련되는 한 쌍의 부품지지부와, 이 부품지지부들로부터 부품을 척킹하여 상기 인쇄회로기판에 장착하도록 구동되는 흡착헤드를 갖춘 것에 있어서, 상기 부품지지부들 중 가동레일에 인접한 부품지지부는 상기 프레임상에서 상기 고정레일에 대해 진퇴가능하도록 된 것을 특징으로 하는 부품장착장치.A frame, a fixed rail fixed on the frame, a movable rail mounted on the frame opposite to the fixed rail and retractable with respect to the fixed rail, and a component to be mounted on a printed circuit board carried by the rails. And a pair of component support parts placed on the outside of each of the rails and a suction head driven to chuck the components from the component support parts to be mounted on the printed circuit board. And an adjacent component support portion is retractable with respect to said fixed rail on said frame. 제1항에 있어서, 상기 가동레일에 인접된 부품지지부는 그 가동레일에 고정결합된 것을 특징으로 하는 부품장착장치The component mounting apparatus according to claim 1, wherein the component support portion adjacent to the movable rail is fixedly coupled to the movable rail.
KR1019940038348A 1994-12-28 1994-12-28 Component mounting device Expired - Fee Related KR0155794B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940038348A KR0155794B1 (en) 1994-12-28 1994-12-28 Component mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940038348A KR0155794B1 (en) 1994-12-28 1994-12-28 Component mounting device

Publications (2)

Publication Number Publication Date
KR960028780A true KR960028780A (en) 1996-07-22
KR0155794B1 KR0155794B1 (en) 1998-12-15

Family

ID=19404604

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940038348A Expired - Fee Related KR0155794B1 (en) 1994-12-28 1994-12-28 Component mounting device

Country Status (1)

Country Link
KR (1) KR0155794B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100613736B1 (en) * 1998-05-25 2006-08-22 소니 가부시끼 가이샤 Assembly device
CN110087402A (en) * 2018-01-26 2019-08-02 韩华精密机械株式会社 Component mounting device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105050334B (en) * 2015-07-09 2017-10-24 厦门弘信电子科技股份有限公司 The upper trigger of FPC pretreatment line
CN105246267A (en) * 2015-09-29 2016-01-13 芜湖宏景电子股份有限公司 Fast movement structure for printed circuit board (PCB) bonding pad chip mounter

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100613736B1 (en) * 1998-05-25 2006-08-22 소니 가부시끼 가이샤 Assembly device
CN110087402A (en) * 2018-01-26 2019-08-02 韩华精密机械株式会社 Component mounting device

Also Published As

Publication number Publication date
KR0155794B1 (en) 1998-12-15

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Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19941228

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