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KR960027798U - Semiconductor package lead forming device - Google Patents

Semiconductor package lead forming device

Info

Publication number
KR960027798U
KR960027798U KR2019950000608U KR19950000608U KR960027798U KR 960027798 U KR960027798 U KR 960027798U KR 2019950000608 U KR2019950000608 U KR 2019950000608U KR 19950000608 U KR19950000608 U KR 19950000608U KR 960027798 U KR960027798 U KR 960027798U
Authority
KR
South Korea
Prior art keywords
semiconductor package
forming device
lead forming
package lead
semiconductor
Prior art date
Application number
KR2019950000608U
Other languages
Korean (ko)
Other versions
KR0131053Y1 (en
Inventor
곽노권
Original Assignee
주식회사한미금형
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사한미금형 filed Critical 주식회사한미금형
Priority to KR2019950000608U priority Critical patent/KR0131053Y1/en
Publication of KR960027798U publication Critical patent/KR960027798U/en
Application granted granted Critical
Publication of KR0131053Y1 publication Critical patent/KR0131053Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR2019950000608U 1995-01-17 1995-01-17 Lead Forming Device of Semiconductor Package KR0131053Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950000608U KR0131053Y1 (en) 1995-01-17 1995-01-17 Lead Forming Device of Semiconductor Package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950000608U KR0131053Y1 (en) 1995-01-17 1995-01-17 Lead Forming Device of Semiconductor Package

Publications (2)

Publication Number Publication Date
KR960027798U true KR960027798U (en) 1996-08-17
KR0131053Y1 KR0131053Y1 (en) 1998-12-01

Family

ID=19406775

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950000608U KR0131053Y1 (en) 1995-01-17 1995-01-17 Lead Forming Device of Semiconductor Package

Country Status (1)

Country Link
KR (1) KR0131053Y1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100398188B1 (en) * 2000-12-15 2003-09-19 현대자동차주식회사 Start plate steel forming apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100398188B1 (en) * 2000-12-15 2003-09-19 현대자동차주식회사 Start plate steel forming apparatus

Also Published As

Publication number Publication date
KR0131053Y1 (en) 1998-12-01

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Legal Events

Date Code Title Description
A201 Request for examination
UA0108 Application for utility model registration

Comment text: Application for Utility Model Registration

Patent event code: UA01011R08D

Patent event date: 19950117

UA0201 Request for examination

Patent event date: 19950117

Patent event code: UA02012R01D

Comment text: Request for Examination of Application

UG1501 Laying open of application
E902 Notification of reason for refusal
UE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event code: UE09021S01D

Patent event date: 19980327

E701 Decision to grant or registration of patent right
UE0701 Decision of registration

Patent event date: 19980715

Comment text: Decision to Grant Registration

Patent event code: UE07011S01D

REGI Registration of establishment
UR0701 Registration of establishment

Patent event date: 19980911

Patent event code: UR07011E01D

Comment text: Registration of Establishment

UR1002 Payment of registration fee

Start annual number: 1

End annual number: 3

Payment date: 19980911

UG1601 Publication of registration
LAPS Lapse due to unpaid annual fee