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KR960022685A - Polyamide resin composition excellent in transparency - Google Patents

Polyamide resin composition excellent in transparency Download PDF

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Publication number
KR960022685A
KR960022685A KR1019940037810A KR19940037810A KR960022685A KR 960022685 A KR960022685 A KR 960022685A KR 1019940037810 A KR1019940037810 A KR 1019940037810A KR 19940037810 A KR19940037810 A KR 19940037810A KR 960022685 A KR960022685 A KR 960022685A
Authority
KR
South Korea
Prior art keywords
parts
weight
transparency
resin composition
polyamide resin
Prior art date
Application number
KR1019940037810A
Other languages
Korean (ko)
Inventor
김재경
이창황
Original Assignee
백영배
동양나이론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 백영배, 동양나이론 주식회사 filed Critical 백영배
Priority to KR1019940037810A priority Critical patent/KR960022685A/en
Publication of KR960022685A publication Critical patent/KR960022685A/en

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  • Compositions Of Macromolecular Compounds (AREA)

Abstract

본 발명은 투명성과 직선강도가 우수한 모노필라멘트(Monofilament)용 폴리아미드 수지 조성물에 관한 것으로, 카프로락탐 70~85중량부 및 헥사메칠렌디아민과 아디핀산의 염 15~30중량부를 기본 조성비로 하고, 전기 조성 100중량부에 대하여 5~10중량부에 w-아미노운데칸산을 포함하는 것을 특징으로 한다.The present invention relates to a polyamide resin composition for monofilament (Monofilament) excellent in transparency and linear strength, 70 to 85 parts by weight of caprolactam and 15 to 30 parts by weight of the salt of hexamethylenediamine and adipic acid as a basic composition ratio, It is characterized by including w-aminoundecanoic acid in 5 to 10 parts by weight based on 100 parts by weight of the electrical composition.

Description

투명성이 우수한 폴리아미드 수지 조성물Polyamide resin composition excellent in transparency

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

Claims (1)

카프로락탐 70~85중량부 및 헥사메칠렌디아민과 아디핀산의 염 15~30중량부를 기본 조성비로 하고, 전기 조성 100중량부에 대하여 5~10중량부의 w-아미노운데칸산을 포함하는 것을 특징으로 하는 투명성이 우수한 폴리이미드 수지조성물.70 to 85 parts by weight of caprolactam and 15 to 30 parts by weight of a salt of hexamethylenediamine and adipic acid as a basic composition ratio, and 5 to 10 parts by weight of w-aminoundecanoic acid is contained based on 100 parts by weight of the electrical composition. Polyimide resin composition excellent in transparency. ※ 참고사항 :최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940037810A 1994-12-28 1994-12-28 Polyamide resin composition excellent in transparency KR960022685A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940037810A KR960022685A (en) 1994-12-28 1994-12-28 Polyamide resin composition excellent in transparency

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940037810A KR960022685A (en) 1994-12-28 1994-12-28 Polyamide resin composition excellent in transparency

Publications (1)

Publication Number Publication Date
KR960022685A true KR960022685A (en) 1996-07-18

Family

ID=66769761

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940037810A KR960022685A (en) 1994-12-28 1994-12-28 Polyamide resin composition excellent in transparency

Country Status (1)

Country Link
KR (1) KR960022685A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100328147B1 (en) * 1996-12-30 2002-11-07 주식회사 효성 Manufacturing method of polyamide mono-filament having excellent flexibility

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100328147B1 (en) * 1996-12-30 2002-11-07 주식회사 효성 Manufacturing method of polyamide mono-filament having excellent flexibility

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Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19941228

A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 19960409

Comment text: Request for Examination of Application

Patent event code: PA02011R01I

Patent event date: 19941228

Comment text: Patent Application

PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 19980826

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 19981130

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 19980826

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I