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KR960019633A - Inking device and bad die inking method on wafer using same - Google Patents

Inking device and bad die inking method on wafer using same Download PDF

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Publication number
KR960019633A
KR960019633A KR1019940028470A KR19940028470A KR960019633A KR 960019633 A KR960019633 A KR 960019633A KR 1019940028470 A KR1019940028470 A KR 1019940028470A KR 19940028470 A KR19940028470 A KR 19940028470A KR 960019633 A KR960019633 A KR 960019633A
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KR
South Korea
Prior art keywords
inking
wafer
die
defective
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1019940028470A
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Korean (ko)
Inventor
최임철
Original Assignee
김주용
현대전자산업 주식회사
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Application filed by 김주용, 현대전자산업 주식회사 filed Critical 김주용
Priority to KR1019940028470A priority Critical patent/KR960019633A/en
Publication of KR960019633A publication Critical patent/KR960019633A/en
Ceased legal-status Critical Current

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Abstract

본 발명은 잉킹장치 및 이를 이용한 웨이퍼상의 불량다이 잉킹방법에 관한 것으로, 잉킹에 소용되는 공정시간을 단축하고 일정한 잉킹을 실행하기 위하여 웨이퍼의 모든 다이를 순차적으로 테스트하며 불량으로 판정된 다이의 맵을 기억시키고, 테스트 완료후 웨이퍼를 잉킹부로 로드시킨 다음 상기 저장된 불량다이의 맵에 따라 불량다이에 잉킹을 실행하므로써 소자의 수율을 향상시킬 수 있도록 잉킹장치 및 이를 이용한 웨이퍼상의 불량다이 잉킹방법에 관한 것이다.The present invention relates to an inking apparatus and a method of inferring a defective die on a wafer using the same, wherein the dies are sequentially tested for all dies of a wafer and a map of dies determined to be defective in order to shorten the process time required for inking and to execute a constant inking. The present invention relates to an inking apparatus and a defect die inking method on a wafer using the same, wherein the wafer is loaded into the inking portion after the test is completed and the inking is performed on the defective die according to the map of the stored defective die. .

Description

잉킹(INKING)장치 및 이를 이용한 웨이퍼상의 불량다이 잉킹방법Inking device and bad die inking method on wafer using same

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제2도는 본 발명에 따른 잉킹장치의 블럭도,2 is a block diagram of an inking apparatus according to the present invention;

제3도는 제2도의 잉킹장치를 이용한 웨이퍼상의 불량다이 잉킹방법을 설명하기 위한 순서도.FIG. 3 is a flow chart for explaining a bad die inking method on a wafer using the inking apparatus of FIG.

Claims (2)

잉킹장치에 있어서, 웨이퍼의 각 다이를 테스트하기 위한 다이 테스트부와, 상기 다이 테이스트부로부터 웨이퍼가 로드되도록 구성되며 불량다이에 잉킹을 실행하기 위한 잉킹부와, 상기 다이 테스트부로부터 접속되며 불량다이의 맵을 기억시키기 위한 불량다이 맵 저장부와, 상기 불량다이 맵 저장부에 기억된 불량다이 맵을 독출하여 상기 잉킹부가 동작되도록 제어하는 제어부로 구성된 것을 특징으로 하는 잉킹장치.An inking apparatus, comprising: a die test section for testing each die of a wafer; an inking section configured to load the wafer from the die taste section; And a control unit for controlling the inking unit to read the bad die map stored in the bad die map storage unit, and control the inking unit to be operated. 잉킹장치를 이용한 웨이퍼상의 불량다이 잉킹방법에 있어서, 다이 테스트로부터 웨이퍼상의 불량다이드들의 맵을 불량다이 맵 저정부에 저장한 후 상기 불량다이 맵 저장부에 저장된 맵에따라 상기 웨이퍼상의 불량다이들에 대하여 잉킹을 실시하는 단계로 이루어지는 것을 특징으로 하는 잉킹장치를 이용한 웨이퍼상의 불량다이 잉킹방법.In the defective die inking method on the wafer using an inking apparatus, a die die on the wafer is stored according to a map stored in the defective die map storage after storing a map of defective dies on the wafer from a die test. A method of defective die inking on a wafer using an inking apparatus, characterized in that the step of inking is performed. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940028470A 1994-11-01 1994-11-01 Inking device and bad die inking method on wafer using same Ceased KR960019633A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940028470A KR960019633A (en) 1994-11-01 1994-11-01 Inking device and bad die inking method on wafer using same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940028470A KR960019633A (en) 1994-11-01 1994-11-01 Inking device and bad die inking method on wafer using same

Publications (1)

Publication Number Publication Date
KR960019633A true KR960019633A (en) 1996-06-17

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KR1019940028470A Ceased KR960019633A (en) 1994-11-01 1994-11-01 Inking device and bad die inking method on wafer using same

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KR (1) KR960019633A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100510475B1 (en) * 1998-08-10 2005-10-25 삼성전자주식회사 Inker for sorting die and method for dotting die with ink
KR20220050459A (en) 2020-10-16 2022-04-25 이인철 Temperature maintaining device for aquarium

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100510475B1 (en) * 1998-08-10 2005-10-25 삼성전자주식회사 Inker for sorting die and method for dotting die with ink
KR20220050459A (en) 2020-10-16 2022-04-25 이인철 Temperature maintaining device for aquarium

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