KR960015935U - Heat sink for hybrid integrated circuit printed board with improved adhesion and heat dissipation - Google Patents
Heat sink for hybrid integrated circuit printed board with improved adhesion and heat dissipationInfo
- Publication number
- KR960015935U KR960015935U KR2019940028320U KR19940028320U KR960015935U KR 960015935 U KR960015935 U KR 960015935U KR 2019940028320 U KR2019940028320 U KR 2019940028320U KR 19940028320 U KR19940028320 U KR 19940028320U KR 960015935 U KR960015935 U KR 960015935U
- Authority
- KR
- South Korea
- Prior art keywords
- integrated circuit
- printed board
- improved adhesion
- hybrid integrated
- circuit printed
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940028320U KR200156209Y1 (en) | 1994-10-28 | 1994-10-28 | Heat sink for hybrid integrated circuit printed board with improved adhesion and heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940028320U KR200156209Y1 (en) | 1994-10-28 | 1994-10-28 | Heat sink for hybrid integrated circuit printed board with improved adhesion and heat dissipation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR960015935U true KR960015935U (en) | 1996-05-17 |
| KR200156209Y1 KR200156209Y1 (en) | 1999-09-01 |
Family
ID=19396658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019940028320U KR200156209Y1 (en) | 1994-10-28 | 1994-10-28 | Heat sink for hybrid integrated circuit printed board with improved adhesion and heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR200156209Y1 (en) |
-
1994
- 1994-10-28 KR KR2019940028320U patent/KR200156209Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR200156209Y1 (en) | 1999-09-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| UA0108 | Application for utility model registration |
Comment text: Application for Utility Model Registration Patent event code: UA01011R08D Patent event date: 19941028 |
|
| UG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| UA0201 | Request for examination |
Patent event date: 19960603 Patent event code: UA02012R01D Comment text: Request for Examination of Application Patent event date: 19941028 Patent event code: UA02011R01I Comment text: Application for Utility Model Registration |
|
| E902 | Notification of reason for refusal | ||
| UE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event code: UE09021S01D Patent event date: 19981127 |
|
| E701 | Decision to grant or registration of patent right | ||
| UE0701 | Decision of registration |
Patent event date: 19990312 Comment text: Decision to Grant Registration Patent event code: UE07011S01D |
|
| REGI | Registration of establishment | ||
| UR0701 | Registration of establishment |
Patent event date: 19990610 Patent event code: UR07011E01D Comment text: Registration of Establishment |
|
| UR1002 | Payment of registration fee |
Start annual number: 1 End annual number: 3 Payment date: 19990611 |
|
| UG1601 | Publication of registration | ||
| UR1001 | Payment of annual fee |
Payment date: 20020521 Start annual number: 4 End annual number: 4 |
|
| FPAY | Annual fee payment |
Payment date: 20030522 Year of fee payment: 5 |
|
| UR1001 | Payment of annual fee |
Payment date: 20030522 Start annual number: 5 End annual number: 5 |
|
| LAPS | Lapse due to unpaid annual fee |