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KR960005922A - 웨이퍼 운반장치 및 운반장치 제조방법 - Google Patents

웨이퍼 운반장치 및 운반장치 제조방법 Download PDF

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Publication number
KR960005922A
KR960005922A KR1019940016647A KR19940016647A KR960005922A KR 960005922 A KR960005922 A KR 960005922A KR 1019940016647 A KR1019940016647 A KR 1019940016647A KR 19940016647 A KR19940016647 A KR 19940016647A KR 960005922 A KR960005922 A KR 960005922A
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KR
South Korea
Prior art keywords
carrier
wafer
edge
curvature
transport apparatus
Prior art date
Application number
KR1019940016647A
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English (en)
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KR0135802B1 (ko
Inventor
최선용
유근홍
박진호
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019940016647A priority Critical patent/KR0135802B1/ko
Priority to JP7195729A priority patent/JPH0855895A/ja
Priority to US08/501,168 priority patent/US5755469A/en
Publication of KR960005922A publication Critical patent/KR960005922A/ko
Application granted granted Critical
Publication of KR0135802B1 publication Critical patent/KR0135802B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

웨이퍼 운반장치 및 운반장치 제조방법이 개시되어 있다. 웨이퍼 운반장치 (transfer arm)의 끝부분에 해당하는 웨이퍼 운반대(transfer blade)에 있어서, 운반대의 측면 및 평면 모서리가 둥근것을 특징으로 하는 웨이퍼 운반장치를 제공하고, 상기 운반대 제조에 있어서, 상기 운반대의 모서리를 연마시켜 제조하는 웨이퍼 운반장치의 제조방법을 제공한다.
본 발명에 의한 둥근 모양의 측면 및 평면 모서리를 갖는 운반대와 상기 운반대의 모서리를 연마시켜 운반대를 웨이퍼 운반장치를 제조하면, 종래 발생되던 모서리 깨짐 현상을 감소 시킬 수 있다.

Description

웨이퍼 운반장치 및 운반장치 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 웨이퍼 로딩시 발생되는 불량을 설명하기 위한 캐리어, 웨이퍼, 및 운반대의 단면을 개략적으로 도시한 단면도이다.

Claims (11)

  1. 웨이퍼 운반장치(transfer arm)의 끝부분에 해당하는 웨이퍼 운반대 (transfer blade)에 있어서, 상기 운반대 측면의 모서리가 둥근 것을 특징으로 하는 웨이퍼 운반장치.
  2. 제1항에 있어서, 상기 운반대의 평면의 모서리 역시 등근 것을 특징으로 하는 웨이퍼 운반장치.
  3. 제1항에 있어서, 상기 측면 모서리의 모양이 운반대 두께 T에 대해, 반지름이 T / 2인 원구의 반원구에 해당하는 모양인 것을 특징으로 하는 웨이퍼 운반장치.
  4. 제1항에 있어서, 상기 측면 모서리의 모양이 유선형인 것을 특징으로 하는 웨이퍼 운반장치.
  5. 제4항에 있어서, 상기 유선형의 모서리는 유선형이 시작되는 운반대 모서리의 곡률반경을 R이라 하고, 모서리 끝부분의 곡률반경을 r이라 할 때, R이 r보다 크고, R은 운반대 두께 T보다 작은 것을 특징으로 하는 웨이퍼 운반장치.
  6. 제4항에 있어서, 상기 유선형의 모서리는 유선형이 시작되는 운반대 모서리의 곡률반경을 R이라 하고, 모서리 끝부분의 곡률반경을 r이라 할 때, R이 r보다 작거나 같고, r은 운반대 두께 T보다 작은 것을 특징으로 하는 웨이퍼 운반장치.
  7. 제4항에 있어서, 상기 유선형의 모서리는 상기 모서리에 다수의 곡률반경을 갖는 원들이 존재하고, 상기 다수의 곡률반경들은 유선형이 시작되는 운반대 모서리로부터 운반대 두께 T의 중심부로 갈수록 곡률반경이 작아지는 모양인 것을 특징으로 하는 웨이퍼 운반장치.
  8. 제1항에 있어서, 상기 측면 모서리 윗부분이 끝으로 갈수록 가늘어지면서 그 끝은 둥근 것을 특징으로 하는 웨이퍼 운반장치.
  9. 제1항에 있어서, 상기 측면 모서리 아랫부분이 끝으로 갈수록 가늘어지면서 그 끝은 둥근 것을 특징으로 하는 웨이퍼 운반장치.
  10. 제9항에 있어서, 상기 가늘어지는 모양이 급하고 완만한 두번의 경사를 갖는 것을 특징으로 하는 웨이퍼 운반장치.
  11. 웨이퍼 운반장치(transfer arm)의 끝부분에 해당하는 웨이퍼 운반대 (transfer blade)의 제조방법에 있어서, 상기 운반대의 측면 및 평면 모서리를 연마시켜 운반대의 측면 및 평면 모서리를 둥글게 하는 것을 특징으로 하는 웨이퍼 운반장치 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940016647A 1994-07-11 1994-07-11 웨이퍼 운반장치 및 운반장치 제조방법 KR0135802B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1019940016647A KR0135802B1 (ko) 1994-07-11 1994-07-11 웨이퍼 운반장치 및 운반장치 제조방법
JP7195729A JPH0855895A (ja) 1994-07-11 1995-07-10 ウェーハ運搬台
US08/501,168 US5755469A (en) 1994-07-11 1995-07-11 Wafer transfer blade

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940016647A KR0135802B1 (ko) 1994-07-11 1994-07-11 웨이퍼 운반장치 및 운반장치 제조방법

Publications (2)

Publication Number Publication Date
KR960005922A true KR960005922A (ko) 1996-02-23
KR0135802B1 KR0135802B1 (ko) 1998-04-29

Family

ID=19387742

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940016647A KR0135802B1 (ko) 1994-07-11 1994-07-11 웨이퍼 운반장치 및 운반장치 제조방법

Country Status (3)

Country Link
US (1) US5755469A (ko)
JP (1) JPH0855895A (ko)
KR (1) KR0135802B1 (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6267423B1 (en) 1995-12-08 2001-07-31 Applied Materials, Inc. End effector for semiconductor wafer transfer device and method of moving a wafer with an end effector
DE19630932A1 (de) * 1996-07-31 1998-02-05 Wacker Siltronic Halbleitermat Träger für eine Halbleiterscheibe und Verwendung des Trägers
KR19990049363A (ko) * 1997-12-12 1999-07-05 윤종용 웨이퍼 이송장치의 암
US6585478B1 (en) 2000-11-07 2003-07-01 Asm America, Inc. Semiconductor handling robot with improved paddle-type end effector
US6454327B1 (en) * 2001-07-27 2002-09-24 Taiwan Semiconductor Manufacturing Co., Ltd Wafer blade equipped with edge bumper
US7011484B2 (en) * 2002-01-11 2006-03-14 Taiwan Semiconductor Manufacturing Co., Ltd. End effector with tapered fingertips
US20050036855A1 (en) * 2003-08-13 2005-02-17 Texas Instruments Incorporated Robot blade for handling of semiconductor waffers
US20080142616A1 (en) * 2006-12-15 2008-06-19 Bacoustics Llc Method of Producing a Directed Spray
US20100147396A1 (en) * 2008-12-15 2010-06-17 Asm Japan K.K. Multiple-Substrate Transfer Apparatus and Multiple-Substrate Processing Apparatus
CN109461693B (zh) * 2017-09-06 2023-06-02 台湾积体电路制造股份有限公司 晶片传送装置、晶片处理系统及方法
JP7260578B2 (ja) * 2021-03-19 2023-04-18 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法、および、プログラム

Family Cites Families (6)

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Publication number Priority date Publication date Assignee Title
DE2631502A1 (de) * 1976-07-13 1978-01-19 Siemens Ag Greifwerkzeug fuer eine saugpinzette
US4618178A (en) * 1985-06-07 1986-10-21 Clifford L. Hutson Hand held vacuum actuated pickup instrument
US4620738A (en) * 1985-08-19 1986-11-04 Varian Associates, Inc. Vacuum pick for semiconductor wafers
US4778332A (en) * 1987-02-09 1988-10-18 The Perkin-Elmer Corporation Wafer flip apparatus
US5080549A (en) * 1987-05-11 1992-01-14 Epsilon Technology, Inc. Wafer handling system with Bernoulli pick-up
FR2624778B1 (fr) * 1987-12-22 1994-09-23 Recif Sa Embout pour pipette a vide

Also Published As

Publication number Publication date
KR0135802B1 (ko) 1998-04-29
JPH0855895A (ja) 1996-02-27
US5755469A (en) 1998-05-26

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