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KR960000734A - Multi-substrate transfer device - Google Patents

Multi-substrate transfer device Download PDF

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Publication number
KR960000734A
KR960000734A KR1019940014496A KR19940014496A KR960000734A KR 960000734 A KR960000734 A KR 960000734A KR 1019940014496 A KR1019940014496 A KR 1019940014496A KR 19940014496 A KR19940014496 A KR 19940014496A KR 960000734 A KR960000734 A KR 960000734A
Authority
KR
South Korea
Prior art keywords
substrate
substrate transfer
guide
roller
rotor
Prior art date
Application number
KR1019940014496A
Other languages
Korean (ko)
Other versions
KR0129582B1 (en
Inventor
조경수
Original Assignee
김주용
현대전자산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 김주용, 현대전자산업 주식회사 filed Critical 김주용
Priority to KR1019940014496A priority Critical patent/KR0129582B1/en
Priority to US08/493,569 priority patent/US5713717A/en
Priority to DE19522942A priority patent/DE19522942B4/en
Priority to JP7158053A priority patent/JP2804730B2/en
Publication of KR960000734A publication Critical patent/KR960000734A/en
Application granted granted Critical
Publication of KR0129582B1 publication Critical patent/KR0129582B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

본 발명은 그 중심부에 회전운동을 하는 원형의 회전자(13)가 형성되고, 그 상부 표면은 기판 전달 이동 방향을 안내하는 가이드 수단(12,18,19)이 형성된 지지판, 일측단은 상기 회전자(13)에 고정되고 타측단은 기판이 올려지며, 상기 가이드 수단(12,18,19)과 결합되는 가이드 결합수단(5,16,17)이 구성되어 기판을 전달하는 기판 전달암을 포함하여 구성되는 것을 특징으로 하는 다중 기판 전달장치에 관한 것이다.The present invention is a circular rotor (13) is formed in the center of the rotational movement, the upper surface of the support plate formed with guide means (12, 18, 19) for guiding the direction of substrate transfer movement, one end is the rotational The other end is fixed to the electron (13) and the substrate is mounted, the guide coupling means (5, 16, 17) coupled to the guide means (12, 18, 19) is configured to include a substrate transfer arm for transferring the substrate It relates to a multiple substrate transfer apparatus characterized in that configured.

그리고, 본 발명은 다수의 기판 전달암이 형성되어 특정장비에서 기판의 이동을 여러장 동시에 수행함으로, 공정시간의 단축을 가져와 반도체 소자의 생산력을 향상시키며, 장비 구매 갯수의 감소로 인한 비용절감의 효과를 가져온다.In addition, the present invention is a plurality of substrate transfer arm is formed to perform the movement of the substrate several sheets at the same time at the same time, thereby reducing the process time to improve the productivity of the semiconductor device, the cost savings due to the reduction in the number of equipment purchased Brings effect.

Description

다중 기판 전달 장치Multi-substrate transfer device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 기판 전달장치가 이용되는 반도체 장치의 구성 예시도.1 is an exemplary configuration diagram of a semiconductor device in which a substrate transfer device is used.

제5도는 기판 전달 모듈의 일부를 포함한 기판 전달암의 전진상태 측면도.5 is an advanced side view of a substrate transfer arm including a portion of the substrate transfer module.

제7도는 기판 전달 모듈내의 기판 전달암의 후진상태 평면도.7 is a plan view of the reverse state of the substrate transfer arm in the substrate transfer module.

제8도는 기판 전달 모듈내의 마그네틱 배치를 표시한 평면도.8 is a plan view showing the magnetic placement within the substrate transfer module.

Claims (4)

기판 전달 장치에 있어서, 그 중심부에 회전운동을 하는 원형의 회전자(13)가 형성되고, 그 상부 표면은 기판 전달 이동 방향을 안내하는 가이드 수단(12,18,19)이 형성된 지지판, 일측단은 상기 회전자(13)에 고정되고 타측단은 기판이 올려지며, 상기 가이드 수단(12,18,19)과 결합되는 가이드 결합수단(5,16,17)이 구성되어 기판을 전달하는 다수의 기판 전달암을 포함하여 구성되는 것을 특징으로 하는 다중 기판 전달장치.In the substrate transfer apparatus, a circular rotor (13) is formed in the center of the rotating body, and the upper surface thereof has a support plate (12, 18, 19) formed with guide means (12, 18, 19) for guiding the substrate transfer movement direction, and one side end. Is fixed to the rotor 13 and the other end is a substrate is mounted, a plurality of guide coupling means (5, 16, 17) coupled to the guide means (12, 18, 19) is configured to transfer the substrate Multiple substrate transfer apparatus comprising a substrate transfer arm. 제1항에 있어서, 상기 기판 전달암은, 회전자(13)에 고정되는 일측단에 형성되는 원통형의 구동중심롤러(1), 상기 기판 전달암 타측에 형성되는 기판 로더판(7), 상기 기판 로더판(7)을 지지하는 원통형의 기판 로더판 지지롤러(6), 상기 구동중심롤러(1) 및 기판 로더판 지지롤러(6)를 연결하는 롤러 연결판(2), 상기 구동중심롤러(1)가 고정된 회전자(13)방향으로 기판 로더판(6)의 구동을 위해 상기 롤러연결판(2)이 굴절되도록 구동중심롤러(1) 및 기판 로더판 지지롤러(6)사이에 형성된 다수의 굴절수단(3,4)을 포함하여 구성되는 것을 특징으로 하는 다중 기판 전달 장치.The substrate transfer arm according to claim 1, wherein the substrate transfer arm comprises a cylindrical drive center roller (1) formed at one end fixed to the rotor (13), a substrate loader plate (7) formed at the other side of the substrate transfer arm, and the Cylindrical substrate loader plate support roller 6 supporting the substrate loader plate 7, roller connecting plate 2 connecting the drive center roller 1 and the substrate loader plate support roller 6, and the drive center roller Between the drive center roller 1 and the substrate loader plate support roller 6 such that the roller connecting plate 2 is deflected for driving the substrate loader plate 6 in the direction of the rotor 13 in which (1) is fixed. Multiple substrate transfer device, characterized in that it comprises a plurality of refractive means (3,4) formed. 제1항에 있어서, 상기 가이드 수단(12,18,19)과 가이드 결합수단(5,16,17)은 서로 다른 극성을 가지는 자석(12,5)인 것을 특징으로 하는 다중 기판 전달 장치.2. Multi-substrate transfer device according to claim 1, characterized in that the guide means (12,18,19) and the guide coupling means (5,16,17) are magnets (12,5) having different polarities. 제1항에 있어서, 상기 가이드 수단(12,18,19)은 기판 전달 이동로를 따라 형성된 가이드 홈(18,19)이고, 가이드 결합수단(5,16,17)은 상기 홈(18,19)을 따라 이동하는 가이드봉(16,17)인 것을 특징으로 하는 다중 기판 전달장치.The method of claim 1, wherein the guide means (12, 18, 19) is a guide groove (18, 19) formed along the substrate transfer path, the guide coupling means (5, 16, 17) is the groove (18, 19) Multi-substrate transfer device, characterized in that the guide rods (16,17) to move along. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940014496A 1994-06-23 1994-06-23 Multi-substrate transfer device KR0129582B1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1019940014496A KR0129582B1 (en) 1994-06-23 1994-06-23 Multi-substrate transfer device
US08/493,569 US5713717A (en) 1994-06-23 1995-06-22 Multi-substrate feeder for semiconductor device manufacturing system
DE19522942A DE19522942B4 (en) 1994-06-23 1995-06-23 Multi-substrate feed station for semiconductor device manufacturing system
JP7158053A JP2804730B2 (en) 1994-06-23 1995-06-23 Multiple board transmission device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940014496A KR0129582B1 (en) 1994-06-23 1994-06-23 Multi-substrate transfer device

Publications (2)

Publication Number Publication Date
KR960000734A true KR960000734A (en) 1996-01-25
KR0129582B1 KR0129582B1 (en) 1998-04-06

Family

ID=19386133

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940014496A KR0129582B1 (en) 1994-06-23 1994-06-23 Multi-substrate transfer device

Country Status (4)

Country Link
US (1) US5713717A (en)
JP (1) JP2804730B2 (en)
KR (1) KR0129582B1 (en)
DE (1) DE19522942B4 (en)

Cited By (1)

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Publication number Priority date Publication date Assignee Title
CN110870057A (en) * 2017-07-14 2020-03-06 株式会社荏原制作所 Substrate holding device

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JP3947761B2 (en) * 1996-09-26 2007-07-25 株式会社日立国際電気 Substrate processing apparatus, substrate transfer machine, and substrate processing method
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JPH10329069A (en) * 1997-03-31 1998-12-15 Daihen Corp Control method for conveyance system
JP3722598B2 (en) * 1997-07-16 2005-11-30 株式会社ダイヘン 2-arm type transfer robot
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US20040018070A1 (en) * 2002-07-25 2004-01-29 Applied Materials, Inc. Compact and high throughput semiconductor fabrication system
US8668422B2 (en) * 2004-08-17 2014-03-11 Mattson Technology, Inc. Low cost high throughput processing platform
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US8267636B2 (en) * 2007-05-08 2012-09-18 Brooks Automation, Inc. Substrate transport apparatus
KR102436038B1 (en) 2011-03-11 2022-08-24 브룩스 오토메이션 인코퍼레이티드 Substrate processing tool
CN102774652A (en) * 2012-07-31 2012-11-14 深圳市华星光电技术有限公司 Supporting arm of LCD (liquid crystal display) panel handling device
CN104308859B (en) * 2014-09-19 2016-03-23 重庆交通大学 Heavy-duty precision redundant three-arm manipulator based on driving

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Cited By (2)

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Publication number Priority date Publication date Assignee Title
CN110870057A (en) * 2017-07-14 2020-03-06 株式会社荏原制作所 Substrate holding device
CN110870057B (en) * 2017-07-14 2023-09-01 株式会社荏原制作所 Substrate holding device

Also Published As

Publication number Publication date
US5713717A (en) 1998-02-03
JPH0851138A (en) 1996-02-20
DE19522942B4 (en) 2005-07-14
KR0129582B1 (en) 1998-04-06
JP2804730B2 (en) 1998-09-30
DE19522942A1 (en) 1996-01-04

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