KR950700556A - 하이브리드 집적 광 회로 제조방법 및 광파 발산 장치(Method for producing a hybrid integrated optiocal circuit and devicen for emitting light waves) - Google Patents
하이브리드 집적 광 회로 제조방법 및 광파 발산 장치(Method for producing a hybrid integrated optiocal circuit and devicen for emitting light waves)Info
- Publication number
- KR950700556A KR950700556A KR1019940703194A KR19940703194A KR950700556A KR 950700556 A KR950700556 A KR 950700556A KR 1019940703194 A KR1019940703194 A KR 1019940703194A KR 19940703194 A KR19940703194 A KR 19940703194A KR 950700556 A KR950700556 A KR 950700556A
- Authority
- KR
- South Korea
- Prior art keywords
- optiocal
- devicen
- producing
- circuit
- emitting light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/44—Mechanical structures for providing tensile strength and external protection for fibres, e.g. optical transmission cables
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/30—Optical coupling means for use between fibre and thin-film device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4245—Mounting of the opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4255—Moulded or casted packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Optical Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4300652A DE4300652C1 (de) | 1993-01-13 | 1993-01-13 | Verfahren zur Herstellung einer hybrid integrierten optischen Schaltung und Vorrichtung zur Emission von Lichtwellen |
PCT/DE1993/001155 WO1994016348A1 (de) | 1993-01-13 | 1993-12-04 | Verfahren zur herstellung einer hybrid integrierten optischen schaltung und vorrichtung zur emission von lichtwellen |
Publications (1)
Publication Number | Publication Date |
---|---|
KR950700556A true KR950700556A (ko) | 1995-01-16 |
Family
ID=6478080
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940703194A Ceased KR950700556A (ko) | 1993-01-13 | 1994-09-13 | 하이브리드 집적 광 회로 제조방법 및 광파 발산 장치(Method for producing a hybrid integrated optiocal circuit and devicen for emitting light waves) |
Country Status (6)
Country | Link |
---|---|
US (2) | US5475775A (ko) |
EP (1) | EP0630486B1 (ko) |
JP (1) | JPH07504770A (ko) |
KR (1) | KR950700556A (ko) |
DE (2) | DE4300652C1 (ko) |
WO (1) | WO1994016348A1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100687162B1 (ko) * | 1999-02-05 | 2007-02-27 | 소니 가부시끼 가이샤 | 광 도파 장치, 광 송수신 장치, 광 도파 장치의 제조방법, 및 광 송수신 장치의 제조 방법 |
Families Citing this family (49)
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EP0617314A4 (en) | 1992-09-10 | 1995-10-18 | Fujitsu Ltd | SYSTEM WITH OPTICAL SWITCHING AND ITS COMPONENTS. |
US6693736B1 (en) | 1992-09-10 | 2004-02-17 | Fujitsu Limited | Optical circuit system and components of same |
DE4300652C1 (de) * | 1993-01-13 | 1994-03-31 | Bosch Gmbh Robert | Verfahren zur Herstellung einer hybrid integrierten optischen Schaltung und Vorrichtung zur Emission von Lichtwellen |
US5555333A (en) * | 1993-07-12 | 1996-09-10 | Ricoh Company, Ltd. | Optical module and a fabrication process thereof |
DE4401219A1 (de) * | 1994-01-18 | 1995-07-20 | Bosch Gmbh Robert | Integriert optisches Bauelement und Verfahren zur Herstellung eines integriert optischen Bauelements |
US5556808A (en) * | 1994-06-30 | 1996-09-17 | Motorola Inc. | Method for aligning a semiconductor device |
DE4423112A1 (de) * | 1994-07-01 | 1996-01-04 | Bosch Gmbh Robert | Verfahren zum Herstellen und Justieren eines Halbleiterbauelements |
GB2293248B (en) * | 1994-09-07 | 1998-02-18 | Northern Telecom Ltd | Providing optical coupling between optical components |
SE9403574L (sv) * | 1994-10-19 | 1996-04-20 | Ericsson Telefon Ab L M | Optokomponentkapsel med optiskt gränssnitt |
WO1996022177A1 (de) * | 1995-01-18 | 1996-07-25 | Robert Bosch Gmbh | Anordnung zur umsetzung von optischen in elektrische signale und verfahren zur herstellung |
DE19501285C1 (de) * | 1995-01-18 | 1996-05-15 | Bosch Gmbh Robert | Anordnung zur Umsetzung von optischen in elektrische Signale und Verfahren zur Herstellung |
JP3658426B2 (ja) * | 1995-01-23 | 2005-06-08 | 株式会社日立製作所 | 光半導体装置 |
GB2321971B (en) * | 1996-01-23 | 1999-05-26 | Bosch Gmbh Robert | Method for manufacturing an integrated optical circuit |
DE19616932A1 (de) * | 1996-04-27 | 1997-10-30 | Bosch Gmbh Robert | Optisches, strahlteilendes Bauelement sowie Verfahren zur Herstellung einer Prismenträgerplatte für ein solches Bauelement |
US5721797A (en) * | 1996-05-28 | 1998-02-24 | Lucent Technologies Inc. | Apparatus and method for mounting a laser to a substrate and aligning the laser with an optical conduit |
DE19642088A1 (de) * | 1996-10-12 | 1998-04-16 | Bosch Gmbh Robert | Verfahren zur Herstellung eines mikrostrukturierten Körpers, eines Gußrahmens und eines integriert-optischen Bauteils |
SE508068C2 (sv) * | 1996-12-19 | 1998-08-24 | Ericsson Telefon Ab L M | Mikroreplikering i metall |
KR100248049B1 (ko) * | 1997-07-31 | 2000-03-15 | 윤종용 | 정렬용 플랫폼을 이용한 광섬유의 수동정렬 장치 |
DE19743992C1 (de) * | 1997-09-26 | 1999-06-24 | Siemens Ag | Verfahren zum Herstellen eines optoelektronischen Steckeraufnahmeelementes und optoelektronischer Stecker |
US5987196A (en) * | 1997-11-06 | 1999-11-16 | Micron Technology, Inc. | Semiconductor structure having an optical signal path in a substrate and method for forming the same |
KR19990061766A (ko) * | 1997-12-31 | 1999-07-26 | 윤종용 | 광섬유 및 광도파로 소자 접속 구조 |
US5977567A (en) * | 1998-01-06 | 1999-11-02 | Lightlogic, Inc. | Optoelectronic assembly and method of making the same |
SE522114C2 (sv) | 1998-08-18 | 2004-01-13 | Ericsson Telefon Ab L M | Metalliska byggelement för optoelektronik |
US6315463B1 (en) | 1998-08-21 | 2001-11-13 | Infineon Technologies Ag | Method for production of an optoelectronic female connector element, and an optoelectronic connector |
DE19842694A1 (de) * | 1998-09-17 | 2000-04-20 | Harting Elektrooptische Bauteile Gmbh & Co Kg | Mikrostrukturierter Körper sowie Verfahren zu seiner Herstellung |
US6400855B1 (en) | 1999-04-16 | 2002-06-04 | Radiant Photonics, Inc. | N × N optical switching array device and system |
FR2793037B1 (fr) * | 1999-04-28 | 2001-08-10 | France Telecom | Assemblage d'une puce de circuit integre optique sur une plate-forme de connexion de fibres optiques pour former un composant optique miniature |
JP2003502866A (ja) * | 1999-06-17 | 2003-01-21 | インフィネオン テクノロジーズ アクチエンゲゼルシャフト | 軟質ボンディング部を有する電子部品およびこのような部品を製造するための方法 |
DE19932430C2 (de) | 1999-07-12 | 2002-03-14 | Harting Elektrooptische Bauteile Gmbh & Co Kg | Opto-elektronische Baugruppe sowie Bauteil für diese Baugruppe |
JP3865036B2 (ja) * | 2000-04-07 | 2007-01-10 | セイコーエプソン株式会社 | 光モジュール及びその製造方法並びに光伝達装置 |
US6932516B2 (en) * | 2000-07-19 | 2005-08-23 | Canon Kabushiki Kaisha | Surface optical device apparatus, method of fabricating the same, and apparatus using the same |
US7068870B2 (en) * | 2000-10-26 | 2006-06-27 | Shipley Company, L.L.C. | Variable width waveguide for mode-matching and method for making |
US6661567B2 (en) * | 2000-12-06 | 2003-12-09 | Bookham Technology Plc | Optical amplifier, optical amplifier hybrid assembly and method of manufacture |
US6672773B1 (en) | 2000-12-29 | 2004-01-06 | Amkor Technology, Inc. | Optical fiber having tapered end and optical connector with reciprocal opening |
US6709170B2 (en) * | 2001-01-08 | 2004-03-23 | Optical Communications Products, Inc. | Plastic encapsulation of optoelectronic devices for optical coupling |
DE10100679A1 (de) * | 2001-01-09 | 2002-07-11 | Abb Research Ltd | Träger für Bauelemente der Mikrosystemtechnik |
GB2372108A (en) * | 2001-02-10 | 2002-08-14 | Bookham Technology Plc | Alignment of optical component using V-grooves in an optical chip |
US20040212802A1 (en) * | 2001-02-20 | 2004-10-28 | Case Steven K. | Optical device with alignment compensation |
WO2002079843A1 (en) * | 2001-03-28 | 2002-10-10 | Iljin Corporation | Plug-in type optical module |
WO2002079844A1 (en) * | 2001-03-28 | 2002-10-10 | Iljin Corporation | Small-formed optical module |
US7413688B2 (en) * | 2001-09-17 | 2008-08-19 | Kenneth Noddings | Fabrication of optical devices and assemblies |
GB0128616D0 (en) * | 2001-11-29 | 2002-01-23 | Denselight Semiconductors Pte | Standoffs for passive alignment of semiconductor chip and coupling bench |
US7024082B2 (en) * | 2003-05-16 | 2006-04-04 | Eastman Kodak Company | Apparatus and method for forming an optical converter |
US7218970B2 (en) * | 2003-06-20 | 2007-05-15 | Cardiac Pacemakers, Inc. | System for medical lead tunneling |
WO2005025748A1 (en) * | 2003-09-17 | 2005-03-24 | Nanocomms Patents Limited | Microstructure devices and their production |
CN102798936B (zh) * | 2011-05-23 | 2016-05-04 | 鸿富锦精密工业(深圳)有限公司 | 光纤耦合连接器 |
HK1202822A1 (en) | 2012-05-16 | 2015-10-09 | Sanofi-Aventis Deutschland Gmbh | Dispense interface |
FR3028050B1 (fr) * | 2014-10-29 | 2016-12-30 | Commissariat Energie Atomique | Substrat pre-structure pour la realisation de composants photoniques, circuit photonique et procede de fabrication associes |
US10852492B1 (en) * | 2014-10-29 | 2020-12-01 | Acacia Communications, Inc. | Techniques to combine two integrated photonic substrates |
Family Cites Families (23)
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JPS59121008A (ja) * | 1982-12-27 | 1984-07-12 | Tokyo Inst Of Technol | 三次元光集積回路 |
CA1255382A (en) * | 1984-08-10 | 1989-06-06 | Masao Kawachi | Hybrid optical integrated circuit with alignment guides |
US4732446A (en) * | 1985-10-02 | 1988-03-22 | Lamar Gipson | Electrical circuit and optical data buss |
EP0495559B1 (en) * | 1987-01-21 | 1994-10-05 | AT&T Corp. | Hybrid laser for optical communications |
DE3736026A1 (de) * | 1987-10-24 | 1989-05-03 | Standard Elektrik Lorenz Ag | Optoelektrisches bauelement und verfahren zu dessen herstellung |
US4904036A (en) * | 1988-03-03 | 1990-02-27 | American Telephone And Telegraph Company, At&T Bell Laboratories | Subassemblies for optoelectronic hybrid integrated circuits |
US4897711A (en) * | 1988-03-03 | 1990-01-30 | American Telephone And Telegraph Company | Subassembly for optoelectronic devices |
JPH02131202A (ja) * | 1988-11-11 | 1990-05-21 | Omron Tateisi Electron Co | 光導波路の製造方法 |
DE58908841D1 (de) * | 1989-05-31 | 1995-02-09 | Siemens Ag | Oberflächenmontierbares Opto-Bauelement. |
DE3919262A1 (de) * | 1989-06-13 | 1990-12-20 | Hoechst Ag | Verfahren zur herstellung eines planaren optischen kopplers |
US5230990A (en) * | 1990-10-09 | 1993-07-27 | Brother Kogyo Kabushiki Kaisha | Method for producing an optical waveguide array using a resist master |
US5119451A (en) * | 1990-12-31 | 1992-06-02 | Texas Instruments Incorporated | Optical waveguides as interconnects from integrated circuit to integrated circuit and packaging method using same |
US5123066A (en) * | 1991-04-25 | 1992-06-16 | At&T Bell Laboratories | Molded optical package utilizing leadframe technology |
FR2677490B1 (fr) * | 1991-06-07 | 1997-05-16 | Thomson Csf | Emetteur-recepteur optique a semiconducteurs. |
US5179609A (en) * | 1991-08-30 | 1993-01-12 | At&T Bell Laboratories | Optical assembly including fiber attachment |
JP2552213B2 (ja) * | 1991-11-26 | 1996-11-06 | アダマンド工業株式会社 | 光半導体素子実装用レセプタクル |
EP0548440A1 (en) * | 1991-12-23 | 1993-06-30 | International Business Machines Corporation | Bilithic composite for optoelectronic integration |
US5265184A (en) * | 1992-05-28 | 1993-11-23 | Motorola, Inc. | Molded waveguide and method for making same |
DE4232608C2 (de) * | 1992-09-29 | 1994-10-06 | Bosch Gmbh Robert | Verfahren zum Herstellen eines Deckels für eine integriert optische Schaltung |
DE4300652C1 (de) * | 1993-01-13 | 1994-03-31 | Bosch Gmbh Robert | Verfahren zur Herstellung einer hybrid integrierten optischen Schaltung und Vorrichtung zur Emission von Lichtwellen |
US5343544A (en) * | 1993-07-02 | 1994-08-30 | Minnesota Mining And Manufacturing Company | Integrated optical fiber coupler and method of making same |
US5359687A (en) * | 1993-08-23 | 1994-10-25 | Alliedsignal Inc. | Polymer microstructures which facilitate fiber optic to waveguide coupling |
US5367593A (en) * | 1993-09-03 | 1994-11-22 | Motorola, Inc. | Optical/electrical connector and method of fabrication |
-
1993
- 1993-01-13 DE DE4300652A patent/DE4300652C1/de not_active Expired - Fee Related
- 1993-12-04 DE DE59308317T patent/DE59308317D1/de not_active Expired - Fee Related
- 1993-12-04 EP EP94900752A patent/EP0630486B1/de not_active Expired - Lifetime
- 1993-12-04 WO PCT/DE1993/001155 patent/WO1994016348A1/de active IP Right Grant
- 1993-12-04 US US08/295,915 patent/US5475775A/en not_active Expired - Fee Related
- 1993-12-04 JP JP6515572A patent/JPH07504770A/ja active Pending
-
1994
- 1994-09-13 KR KR1019940703194A patent/KR950700556A/ko not_active Ceased
-
1995
- 1995-08-25 US US08/519,223 patent/US5574806A/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100687162B1 (ko) * | 1999-02-05 | 2007-02-27 | 소니 가부시끼 가이샤 | 광 도파 장치, 광 송수신 장치, 광 도파 장치의 제조방법, 및 광 송수신 장치의 제조 방법 |
Also Published As
Publication number | Publication date |
---|---|
DE4300652C1 (de) | 1994-03-31 |
US5574806A (en) | 1996-11-12 |
EP0630486A1 (de) | 1994-12-28 |
DE59308317D1 (de) | 1998-04-30 |
JPH07504770A (ja) | 1995-05-25 |
US5475775A (en) | 1995-12-12 |
EP0630486B1 (de) | 1998-03-25 |
WO1994016348A1 (de) | 1994-07-21 |
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Legal Events
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PA0105 | International application |
Patent event date: 19940913 Patent event code: PA01051R01D Comment text: International Patent Application |
|
PG1501 | Laying open of application | ||
A201 | Request for examination | ||
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 19970830 Comment text: Request for Examination of Application |
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PN2301 | Change of applicant |
Patent event date: 19990916 Comment text: Notification of Change of Applicant Patent event code: PN23011R01D |
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PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20000630 Patent event code: PE09021S01D |
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E601 | Decision to refuse application | ||
PE0601 | Decision on rejection of patent |
Patent event date: 20000929 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20000630 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |