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KR950025934U - Automatic package cleaning device - Google Patents

Automatic package cleaning device

Info

Publication number
KR950025934U
KR950025934U KR2019940003557U KR19940003557U KR950025934U KR 950025934 U KR950025934 U KR 950025934U KR 2019940003557 U KR2019940003557 U KR 2019940003557U KR 19940003557 U KR19940003557 U KR 19940003557U KR 950025934 U KR950025934 U KR 950025934U
Authority
KR
South Korea
Prior art keywords
cleaning device
automatic package
package cleaning
automatic
package
Prior art date
Application number
KR2019940003557U
Other languages
Korean (ko)
Other versions
KR970004615Y1 (en
Inventor
신영철
서명균
Original Assignee
현대전자산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업 주식회사 filed Critical 현대전자산업 주식회사
Priority to KR2019940003557U priority Critical patent/KR970004615Y1/en
Publication of KR950025934U publication Critical patent/KR950025934U/en
Application granted granted Critical
Publication of KR970004615Y1 publication Critical patent/KR970004615Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR2019940003557U 1994-02-25 1994-02-25 Auto package cleaning device KR970004615Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940003557U KR970004615Y1 (en) 1994-02-25 1994-02-25 Auto package cleaning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940003557U KR970004615Y1 (en) 1994-02-25 1994-02-25 Auto package cleaning device

Publications (2)

Publication Number Publication Date
KR950025934U true KR950025934U (en) 1995-09-18
KR970004615Y1 KR970004615Y1 (en) 1997-05-13

Family

ID=19377858

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940003557U KR970004615Y1 (en) 1994-02-25 1994-02-25 Auto package cleaning device

Country Status (1)

Country Link
KR (1) KR970004615Y1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100315216B1 (en) * 1999-11-17 2001-11-26 전성호 The system of preventing separation of panel and film in cleaning machine use sticky rubber roller.

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5285217B2 (en) * 2006-11-27 2013-09-11 Ｔｏｗａ株式会社 Electronic component manufacturing apparatus and manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100315216B1 (en) * 1999-11-17 2001-11-26 전성호 The system of preventing separation of panel and film in cleaning machine use sticky rubber roller.

Also Published As

Publication number Publication date
KR970004615Y1 (en) 1997-05-13

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Legal Events

Date Code Title Description
A201 Request for examination
UA0108 Application for utility model registration

Comment text: Application for Utility Model Registration

Patent event code: UA01011R08D

Patent event date: 19940225

UA0201 Request for examination

Patent event date: 19940225

Patent event code: UA02012R01D

Comment text: Request for Examination of Application

UG1501 Laying open of application
UG1604 Publication of application

Patent event code: UG16041S01I

Comment text: Decision on Publication of Application

Patent event date: 19970422

E701 Decision to grant or registration of patent right
UE0701 Decision of registration

Patent event date: 19970808

Comment text: Decision to Grant Registration

Patent event code: UE07011S01D

REGI Registration of establishment
UR0701 Registration of establishment

Patent event date: 19970827

Patent event code: UR07011E01D

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