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KR950023248A - 표면실장형 전자부품 - Google Patents

표면실장형 전자부품 Download PDF

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Publication number
KR950023248A
KR950023248A KR1019940034323A KR19940034323A KR950023248A KR 950023248 A KR950023248 A KR 950023248A KR 1019940034323 A KR1019940034323 A KR 1019940034323A KR 19940034323 A KR19940034323 A KR 19940034323A KR 950023248 A KR950023248 A KR 950023248A
Authority
KR
South Korea
Prior art keywords
housing
metal member
dummy metal
surface mount
soldering
Prior art date
Application number
KR1019940034323A
Other languages
English (en)
Other versions
KR0146389B1 (ko
Inventor
유세이 오야마
Original Assignee
무라타 야스타카
가부시키가이샤 무라타 세이사쿠쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 무라타 야스타카, 가부시키가이샤 무라타 세이사쿠쇼 filed Critical 무라타 야스타카
Publication of KR950023248A publication Critical patent/KR950023248A/ko
Application granted granted Critical
Publication of KR0146389B1 publication Critical patent/KR0146389B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1028—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being held between spring terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
    • H03H9/58—Multiple crystal filters
    • H03H9/60—Electric coupling means therefor
    • H03H9/605—Electric coupling means therefor consisting of a ladder configuration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

본 발명은, 땜납부착용 더미 금속부재를 하우징에 고정하기 위한 접착제를 사용하지 않고 완성된 표면실장형 전자부품을 얻는다.
본 발명은, 하우징(1)의 한쪽 단부에 입력단자(10)와, 접지단자(11) 및, 출력단자(12)가 도출되고, 다른 쪽 단부에 땜납부착용 더미 금속부재(20)가 배치되어 있다. 더미 금속부재(20)의 양단부에는 각각 빠짐방지용 갈고랑이부(21)가 설치되어 있다. 이 빠짐방지용 갈고랑이부(21)가 하우징(10)에 설치된 凹부(5)의 경사부(5a,5b)에 걸려 더미 금속부재(20)와 하우징(1)을 견고하게 고정한다

Description

표면실장형 전자부품
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 제1도에 도시한 표면실장형 전자부품의 일부 단면도.
제3도는 제2도에 도시한 표면실장형 전자부품의 전기등가회로도.

Claims (2)

  1. 전기기능 소자를 내장한 하우징과, 이 하우징의 한쪽 단부에 도출된 리드단자 및, 빠짐방지부를 갖춘 땜납부착용 더미 금속부재를 구비하고, 상기 빠짐방지부를 상기 하우징의 다른쪽 단부에 설치된 걸림부에 끼워 맞추어 상기 땜납부착용 더미 금속부재와 상기 하우징을 고정시키는 것을 특징으로 하는 표면실장형 전자부품.
  2. 단순 상자형상을 이루는 하우징과, 이 하우징내에 수납된 전압공진자, 접촉편부와 외부접속부를 갖추고, 상기 접촉편부가 상기 하우징내에 수납되며, 상기 외부접속부가 상기 하우징의 한쪽 단부에서 도출된 리드단자 및, 빠짐방지부를 갖춘 땜납부착용 더미 금속부재를 구비하고, 상기 빠짐방지부가 상기 하우징의 다른쪽 단부에 설치된 걸림부에 끼워 맞추어져 상기 땜납부착용 더미 금속부재와 상기 하우징이 고정되고 있는 것을 특징으로 하는 표면실장형 사다리형 필터.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940034323A 1993-12-15 1994-12-15 표면실장형 전자부품 KR0146389B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5314613A JPH07170144A (ja) 1993-12-15 1993-12-15 表面実装型電子部品
JP93-314613 1993-12-15

Publications (2)

Publication Number Publication Date
KR950023248A true KR950023248A (ko) 1995-07-28
KR0146389B1 KR0146389B1 (ko) 1998-10-01

Family

ID=18055413

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940034323A KR0146389B1 (ko) 1993-12-15 1994-12-15 표면실장형 전자부품

Country Status (5)

Country Link
US (1) US5821672A (ko)
JP (1) JPH07170144A (ko)
KR (1) KR0146389B1 (ko)
CN (1) CN1047043C (ko)
TW (1) TW256986B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5872493A (en) * 1997-03-13 1999-02-16 Nokia Mobile Phones, Ltd. Bulk acoustic wave (BAW) filter having a top portion that includes a protective acoustic mirror
US6233133B1 (en) * 1999-05-05 2001-05-15 Shui-Te Weng Capacitor
DE102016003866A1 (de) * 2015-04-10 2016-10-13 Marquardt Gmbh Baugruppe

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2416876A (en) * 1945-01-04 1947-03-04 Walter E Kuenstler Casing for piezoelectric crystals
US2577576A (en) * 1950-11-30 1951-12-04 Mannes N Glickman Hermetic crystal holder
US3697789A (en) * 1970-06-23 1972-10-10 Citizen Watch Co Ltd Mechanical oscillator
JPS587672Y2 (ja) * 1977-08-11 1983-02-10 株式会社村田製作所 圧電振動子の密閉構造
US5265316A (en) * 1987-02-27 1993-11-30 Seiko Epson Corporation Method of manufacturing a pressure seal type piezoelectric oscillator
US5274529A (en) * 1990-03-05 1993-12-28 Murata Manufacturing Co., Ltd. Electronic device with molded case

Also Published As

Publication number Publication date
CN1111043A (zh) 1995-11-01
TW256986B (ko) 1995-09-11
KR0146389B1 (ko) 1998-10-01
CN1047043C (zh) 1999-12-01
JPH07170144A (ja) 1995-07-04
US5821672A (en) 1998-10-13

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