KR950021462A - 온도 검출 회로를 갖는 반도체 집적 장치 및 그 동작 방법 - Google Patents
온도 검출 회로를 갖는 반도체 집적 장치 및 그 동작 방법 Download PDFInfo
- Publication number
- KR950021462A KR950021462A KR1019940038134A KR19940038134A KR950021462A KR 950021462 A KR950021462 A KR 950021462A KR 1019940038134 A KR1019940038134 A KR 1019940038134A KR 19940038134 A KR19940038134 A KR 19940038134A KR 950021462 A KR950021462 A KR 950021462A
- Authority
- KR
- South Korea
- Prior art keywords
- directional
- semiconductor element
- integrated device
- diode
- circuit
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 19
- 238000001514 detection method Methods 0.000 title claims 3
- 238000011017 operating method Methods 0.000 title 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract 2
- 238000000034 method Methods 0.000 claims 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 230000002457 bidirectional effect Effects 0.000 claims 1
- 230000003472 neutralizing effect Effects 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/101—Integrated devices comprising main components and built-in components, e.g. IGBT having built-in freewheel diode
- H10D84/141—VDMOS having built-in components
- H10D84/143—VDMOS having built-in components the built-in components being PN junction diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/101—Integrated devices comprising main components and built-in components, e.g. IGBT having built-in freewheel diode
- H10D84/141—VDMOS having built-in components
- H10D84/143—VDMOS having built-in components the built-in components being PN junction diodes
- H10D84/144—VDMOS having built-in components the built-in components being PN junction diodes in antiparallel diode configurations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Semiconductor Integrated Circuits (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Abstract
Description
Claims (4)
- 반도체 집적 장치에 있어서, 반도체 집적 장치내에 형성된 반도체 소자와, 상기 반도체 소자상에 형성된 절연막과, 상기 절연막상에 형성된 다결정질 실리콘막과, 상기 실리콘막 내에 형성된 두 방향 도전성 방향 회로와, 상기 반도체 소자의 온도 검출용으로서 한 방향으로 바이어스된 상기 방향 회로로 이루어지는 것을 특징으로 하는 반도체 집적 장치.
- 제1항에 있어서, 상기 두 방향 도전성 방향 회로는, 상기 반도체 소자의 온도를 검출하는 제1다이오드와 축적된 정전하를 중성화하기 위한 제2다이오드를 갖는 한 쌍의 다이오드 회로를 구비함을 특징으로 하는 반도체 집적 장치.
- 제1항에 있어서, 상기 두 방향 도전성 방향 회로는, 상기 방향 회로의 한 방향으로 바이어스된 방향과 일치하여 그 순방향으로 형성된 제1다이오드를 갖는 한쌍의 다이오드 회로와, 상기 방향 회로의 상기 한 방향으로 바이어스된 방향에 역 방향을 순방향으로 하여 형성된 제2다이오드를 갖는 다른 한 쌍의 다이오드 회로를 구비함을 특징으로 하는 반도체 집적 장치.
- 반도체 소자와 두 방향 도전성 방향 회로를 포함하는 반도체 집적장치 동작 방법에 있어서, 상기 반도체 소자의 온도 검출을 위하여 양 쪽의 도전 방향으로 바이어스되는 상기 방향 회로를 제공하는 단계와, 상기 반도체 소자의 온도 검출을 위하여 다른 도전 방향으로 바이어스되는 상기 방향 회로를 제공하는 단계를 구비함을 특징으로 하는 반도체 집적 장치 동작 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP93-335188 | 1993-12-28 | ||
JP5335188A JP2630242B2 (ja) | 1993-12-28 | 1993-12-28 | 温度検出用ダイオード付パワーmosfet |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950021462A true KR950021462A (ko) | 1995-07-26 |
KR0145640B1 KR0145640B1 (ko) | 1998-08-01 |
Family
ID=18285752
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940038134A KR0145640B1 (ko) | 1993-12-28 | 1994-12-28 | 온도 검출 회로를 갖는 반도체 집적 장치 및 그 동작 방법 |
Country Status (3)
Country | Link |
---|---|
US (1) | US5500547A (ko) |
JP (1) | JP2630242B2 (ko) |
KR (1) | KR0145640B1 (ko) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3752796B2 (ja) * | 1997-03-26 | 2006-03-08 | 日産自動車株式会社 | 温度検知回路 |
DE19904575C1 (de) * | 1999-02-04 | 2000-03-30 | Siemens Ag | Temperaturgeschützter Halbleiterschalter mit Temperatursensor und zusätzlichem Ladungsträger-Detektor, der eine echte Übertemperatur von einer vermeintlichen unterscheidbar macht |
US6233190B1 (en) | 1999-08-30 | 2001-05-15 | Micron Technology, Inc. | Method of storing a temperature threshold in an integrated circuit, method of modifying operation of dynamic random access memory in response to temperature, programmable temperature sensing circuit and memory integrated circuit |
JP2002009284A (ja) * | 2000-06-19 | 2002-01-11 | Mitsubishi Electric Corp | 電力用半導体素子及び電力用半導体装置 |
JP4620889B2 (ja) * | 2001-03-22 | 2011-01-26 | 三菱電機株式会社 | 電力用半導体装置 |
US7018095B2 (en) * | 2002-06-27 | 2006-03-28 | Intel Corporation | Circuit for sensing on-die temperature at multiple locations |
US6990030B2 (en) * | 2003-10-21 | 2006-01-24 | Hewlett-Packard Development Company, L.P. | Magnetic memory having a calibration system |
JP4765252B2 (ja) * | 2004-01-13 | 2011-09-07 | 株式会社豊田自動織機 | 温度検出機能付き半導体装置 |
JP2006186249A (ja) * | 2004-12-28 | 2006-07-13 | Toshiba Corp | 半導体装置 |
US7544545B2 (en) * | 2005-12-28 | 2009-06-09 | Vishay-Siliconix | Trench polysilicon diode |
EP1977450B1 (en) | 2006-01-18 | 2015-06-10 | Vishay-Siliconix | Floating gate structure with high electrostatic discharge performance |
JP4929860B2 (ja) * | 2006-06-12 | 2012-05-09 | 株式会社デンソー | 半導体装置 |
JP5125106B2 (ja) * | 2007-01-15 | 2013-01-23 | 株式会社デンソー | 半導体装置 |
DE102014222214A1 (de) * | 2014-10-30 | 2016-05-04 | Robert Bosch Gmbh | Integrierte Halbleiterschaltung |
JP6512025B2 (ja) * | 2015-08-11 | 2019-05-15 | 富士電機株式会社 | 半導体素子及び半導体素子の製造方法 |
EP3916806B1 (en) * | 2019-09-25 | 2023-11-29 | Fuji Electric Co., Ltd. | Semiconductor device |
JP2022136608A (ja) * | 2021-03-08 | 2022-09-21 | キオクシア株式会社 | 半導体記憶装置 |
JP2023039607A (ja) | 2021-09-09 | 2023-03-22 | セイコーエプソン株式会社 | 電気光学装置および電子機器 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0693485B2 (ja) * | 1985-11-29 | 1994-11-16 | 日本電装株式会社 | 半導体装置 |
JPS62156850A (ja) * | 1985-12-28 | 1987-07-11 | Nec Corp | 半導体装置 |
US5025298A (en) * | 1989-08-22 | 1991-06-18 | Motorola, Inc. | Semiconductor structure with closely coupled substrate temperature sense element |
US5237481A (en) * | 1991-05-29 | 1993-08-17 | Ixys Corporation | Temperature sensing device for use in a power transistor |
-
1993
- 1993-12-28 JP JP5335188A patent/JP2630242B2/ja not_active Expired - Fee Related
-
1994
- 1994-12-27 US US08/364,240 patent/US5500547A/en not_active Expired - Lifetime
- 1994-12-28 KR KR1019940038134A patent/KR0145640B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR0145640B1 (ko) | 1998-08-01 |
US5500547A (en) | 1996-03-19 |
JPH07202129A (ja) | 1995-08-04 |
JP2630242B2 (ja) | 1997-07-16 |
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