KR950014423B1 - 구리를 기재로 한 전자부품 구조용의 금속합금 - Google Patents
구리를 기재로 한 전자부품 구조용의 금속합금 Download PDFInfo
- Publication number
- KR950014423B1 KR950014423B1 KR1019870009983A KR870009983A KR950014423B1 KR 950014423 B1 KR950014423 B1 KR 950014423B1 KR 1019870009983 A KR1019870009983 A KR 1019870009983A KR 870009983 A KR870009983 A KR 870009983A KR 950014423 B1 KR950014423 B1 KR 950014423B1
- Authority
- KR
- South Korea
- Prior art keywords
- metal alloy
- alloy
- copper
- weight ratio
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010949 copper Substances 0.000 title claims description 35
- 229910052802 copper Inorganic materials 0.000 title claims description 31
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 29
- 229910001092 metal group alloy Inorganic materials 0.000 title claims description 25
- 229910045601 alloy Inorganic materials 0.000 claims description 93
- 239000000956 alloy Substances 0.000 claims description 93
- 229910052791 calcium Inorganic materials 0.000 claims description 25
- 229910052698 phosphorus Inorganic materials 0.000 claims description 25
- 229910052749 magnesium Inorganic materials 0.000 claims description 24
- 239000000203 mixture Substances 0.000 claims description 17
- 229910052718 tin Inorganic materials 0.000 claims description 10
- 238000001556 precipitation Methods 0.000 claims description 8
- 230000009467 reduction Effects 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 6
- 238000005097 cold rolling Methods 0.000 claims description 4
- 239000012535 impurity Substances 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 2
- 238000005266 casting Methods 0.000 claims description 2
- 238000010622 cold drawing Methods 0.000 claims description 2
- 238000001192 hot extrusion Methods 0.000 claims description 2
- 229910052744 lithium Inorganic materials 0.000 claims description 2
- 229910052748 manganese Inorganic materials 0.000 claims description 2
- 239000011572 manganese Substances 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 230000004927 fusion Effects 0.000 claims 1
- 230000002496 gastric effect Effects 0.000 claims 1
- 238000005098 hot rolling Methods 0.000 claims 1
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 claims 1
- 238000007711 solidification Methods 0.000 claims 1
- 230000008023 solidification Effects 0.000 claims 1
- 239000011777 magnesium Substances 0.000 description 25
- 239000011575 calcium Substances 0.000 description 18
- 229910000765 intermetallic Inorganic materials 0.000 description 11
- 238000011282 treatment Methods 0.000 description 10
- 238000005275 alloying Methods 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 230000006399 behavior Effects 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 6
- 239000011574 phosphorus Substances 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 5
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 4
- 238000003483 aging Methods 0.000 description 4
- 229910052793 cadmium Inorganic materials 0.000 description 4
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 3
- 230000032683 aging Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- 238000005482 strain hardening Methods 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 238000007792 addition Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 229910000389 calcium phosphate Inorganic materials 0.000 description 2
- 239000001506 calcium phosphate Substances 0.000 description 2
- 235000011010 calcium phosphates Nutrition 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000006392 deoxygenation reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 2
- 229910000882 Ca alloy Inorganic materials 0.000 description 1
- 229910014474 Ca-Sn Inorganic materials 0.000 description 1
- 206010010269 Conditions caused by cold Diseases 0.000 description 1
- 229910019074 Mg-Sn Inorganic materials 0.000 description 1
- 229910019382 Mg—Sn Inorganic materials 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 238000007545 Vickers hardness test Methods 0.000 description 1
- RAOSIAYCXKBGFE-UHFFFAOYSA-K [Cu+3].[O-]P([O-])([O-])=O Chemical compound [Cu+3].[O-]P([O-])([O-])=O RAOSIAYCXKBGFE-UHFFFAOYSA-K 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000538 analytical sample Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910021538 borax Inorganic materials 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000006477 desulfuration reaction Methods 0.000 description 1
- 230000023556 desulfurization Effects 0.000 description 1
- 238000001493 electron microscopy Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 210000001672 ovary Anatomy 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000004328 sodium tetraborate Substances 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
Abstract
Description
Claims (7)
- 전자 구성부품의 구조에 특히 적합한 구리를 기재로 한 금속합금에 있어서, Mg 0.05∼1wt%, P 0.03∼0.9wt%, Ca 0.002∼0.004wt%, 나머지 불순물 함유구리를 포함하며, 그 금속합금에 포함된 Mg와 P사이의 중량비는 1∼5이고, 조합하여 그 금속합금에 포함된 Mg과 Ca 사이의 중량비는 5∼50임을 특징으로하는 금속합금.
- 전자구성부품의 구조에 특히 적합한 구리를 기재로 한 금속 합금에 있어서, Mg 0.05-1wt%, P 0.03∼0.9wt%, Ca 0.002∼0.04wt%, 나머지 틴(tin)(Sn) 0.03wt%∼0.15wt% 함유구리를 포함하며, 그 금속합금에 포함된 Mg와 P 사이의 중량비는 1∼5이고, 조합하여 그 금속합금에 포함된 Mg과 Ca 사이의 중량비는 5∼50임을 특징으로 하는 금속합금.
- 전자구성품의 구조에 특히 적합한 구리를 기재로한 금속합금에 있어서, Mg 0.05∼1wt%, P 0.03∼0.9wt%, Ca 0.003∼0.04wt%, 나머지 지르코륨(Zr) 0.02∼0.05wt% 함유구리를 포함하며, 그 금속합금에 포함된 Mg와 P사이의 중량비는 1∼5이고, 조합하여 그 금속합금에 포함된 Mg과 Ca 사이의 중량비는 5∼50임을 특징으로 하는 금속합금.
- 전자구성부품의 구조에 특히 적합한 구리를 기재로한 금속합금에 있어서, Mg 0.05∼1wt%, P 0.03∼0.9wt%, Ca 0.02∼0.04wt%, 나머지 은(Ag) 0.02wt%∼0.06wt% 함유구리를 포함하며, 그 금속합금에 포함된 Mg와 P 사이의 중량비는 1∼5이고, 조합하여 그 금속합금에 포함된 Mg과 Ca 사이의 중량비는 5∼50임을 특징으로 하는 금속합금.
- 전자구성부품의 구조에 특히 적합한 구리를 기재로한 금속합금에 있어서, Mg 0.05∼1wt%, P 0.03∼0.9wt%, Ca 0.002∼0.04wt%, 나머지 리튬(Li) 0.01wt% 이하 함유구리를 포함하며, 그 금속합금에 포함된 Mg와 P 사이의 중량비는 1∼5이고, 조합하여 그 금속합금에 포함된 Mg과 Ca 사이의 중량비는 5∼50임을 특징으로 하는 금속합금.
- 전자구성부품의 구조에 특히 적합한 구리를 기재로한 금속합금에 있어서, Mg 0.05∼1wt%, P 0.03∼0.9wt%, Ca 0.002∼0.04wt%, 나머지 망간 0.01wt% 이하 함유구리를 포함하며, 그 금속합금에 포함된 Mg와 P 사이의 중량비는 1∼5이고, 조합하여 그 금속합금에 포함된 Mg과 Ca 사이의 중량비는 5∼50임을 특징으로 하는 금속합금.
- 전자구성부품의 적합한 구리합금을 얻는 방법에 있어서, 제1 항 내지 제7항에 의하 금속합금중 어느 하나에 대응되는 조성을 가진 합금을 용융(fusion)후 주조(casting)에 의해 제조하여 , 그 응고합금(solidified alloy)을 온도 860∼890℃에서 열간압연 또는 열간압출에 의해 가공하고, 그 다음 그 합금을 냉간압연 또는 냉간인발에 의해 가공하여 압하율(壓下率 : reduction) 50∼80%를 얻으며, 더 개량된 기계적 특성 또는 전기특성을 각각 얻을 수 있는지의 여부에 따라 온도 365-380℃와 415-428℃ 사이에서 선택한 간격내의 온도에서 충분한 시간동안 그 합금을 지속시키는 석출열처리(precipitation heat treatnent)에 의해 그 합금을 고온 시효-경화(artificial age-herdening) 처리함을 특징으로 하는 위 구리합금을 얻는 방법.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT???86-48445-A | 1986-09-11 | ||
IT48445-A/86 | 1986-09-11 | ||
IT48445/86A IT1196620B (it) | 1986-09-11 | 1986-09-11 | Lega metallica a base di rame di tipo perfezionato,particolarmente per la costruzione di componenti elettronici |
Publications (2)
Publication Number | Publication Date |
---|---|
KR880004118A KR880004118A (ko) | 1988-06-01 |
KR950014423B1 true KR950014423B1 (ko) | 1995-11-27 |
Family
ID=11266583
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019870009983A Expired - Lifetime KR950014423B1 (ko) | 1986-09-11 | 1987-09-09 | 구리를 기재로 한 전자부품 구조용의 금속합금 |
Country Status (15)
Country | Link |
---|---|
US (1) | US4859417A (ko) |
JP (1) | JP2534073B2 (ko) |
KR (1) | KR950014423B1 (ko) |
AT (1) | AT393697B (ko) |
BE (1) | BE1000537A4 (ko) |
CA (1) | CA1307139C (ko) |
DE (1) | DE3729509C2 (ko) |
ES (1) | ES2004813A6 (ko) |
FI (1) | FI87239C (ko) |
FR (1) | FR2603896B1 (ko) |
GB (1) | GB2194961B (ko) |
IT (1) | IT1196620B (ko) |
NL (1) | NL193947C (ko) |
NO (1) | NO169396C (ko) |
SE (1) | SE463566B (ko) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FI88887C (fi) * | 1989-05-09 | 1993-07-26 | Outokumpu Oy | Kopparlegering avsedd att anvaendas i svetselektroder vid motstaondssvetsning |
JP3796784B2 (ja) * | 1995-12-01 | 2006-07-12 | 三菱伸銅株式会社 | コネクタ製造用銅合金薄板およびその薄板で製造したコネクタ |
US6241831B1 (en) | 1999-06-07 | 2001-06-05 | Waterbury Rolling Mills, Inc. | Copper alloy |
JP4490305B2 (ja) * | 2005-02-18 | 2010-06-23 | Dowaホールディングス株式会社 | 銅粉 |
DE102007015442B4 (de) | 2007-03-30 | 2012-05-10 | Wieland-Werke Ag | Verwendung einer korrosionsbeständigen Kupferlegierung |
FR2958789B1 (fr) * | 2010-04-09 | 2012-05-11 | Abb France | Dispositif de protection contre les surtensions transitoires a deconnecteur thermique ameliore |
DE102012014311A1 (de) * | 2012-07-19 | 2014-01-23 | Hochschule Pforzheim | Verfahren zur Herstellung eines CuMg-Werkstoffs und dessen Verwendung |
JP2020002439A (ja) * | 2018-06-29 | 2020-01-09 | 株式会社神戸製鋼所 | ヒューズ用銅合金 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3677745A (en) * | 1969-02-24 | 1972-07-18 | Cooper Range Co | Copper base composition |
US3698965A (en) * | 1970-04-13 | 1972-10-17 | Olin Corp | High conductivity,high strength copper alloys |
JPS5344136B2 (ko) * | 1974-12-23 | 1978-11-27 | ||
US4202688A (en) * | 1975-02-05 | 1980-05-13 | Olin Corporation | High conductivity high temperature copper alloy |
US4233067A (en) * | 1978-01-19 | 1980-11-11 | Sumitomo Electric Industries, Ltd. | Soft copper alloy conductors |
US4305762A (en) * | 1980-05-14 | 1981-12-15 | Olin Corporation | Copper base alloy and method for obtaining same |
US4400351A (en) * | 1980-06-13 | 1983-08-23 | Mitsubishi Kinzoku Kabushiki Kaisha | High thermal resistance, high electric conductivity copper base alloy |
JPS59114338A (ja) * | 1982-12-16 | 1984-07-02 | Katayama Seisakusho:Kk | トレンチヤ |
JPS6046340A (ja) * | 1983-08-23 | 1985-03-13 | Furukawa Electric Co Ltd:The | リ−ドフレ−ム用銅合金 |
JPS60245753A (ja) * | 1984-05-22 | 1985-12-05 | Nippon Mining Co Ltd | 高力高導電銅合金 |
US4605532A (en) * | 1984-08-31 | 1986-08-12 | Olin Corporation | Copper alloys having an improved combination of strength and conductivity |
JPH0653901B2 (ja) * | 1986-09-08 | 1994-07-20 | 古河電気工業株式会社 | 電子電気機器用銅合金 |
-
1986
- 1986-09-11 IT IT48445/86A patent/IT1196620B/it active
-
1987
- 1987-08-14 GB GB8719334A patent/GB2194961B/en not_active Expired - Fee Related
- 1987-09-03 DE DE3729509A patent/DE3729509C2/de not_active Expired - Fee Related
- 1987-09-08 AT AT0226487A patent/AT393697B/de not_active IP Right Cessation
- 1987-09-09 SE SE8703493A patent/SE463566B/sv not_active IP Right Cessation
- 1987-09-09 KR KR1019870009983A patent/KR950014423B1/ko not_active Expired - Lifetime
- 1987-09-09 CA CA000546480A patent/CA1307139C/en not_active Expired - Lifetime
- 1987-09-10 FR FR878712572A patent/FR2603896B1/fr not_active Expired
- 1987-09-10 FI FI873925A patent/FI87239C/fi active IP Right Grant
- 1987-09-10 NO NO873776A patent/NO169396C/no unknown
- 1987-09-10 ES ES8702610A patent/ES2004813A6/es not_active Expired
- 1987-09-10 BE BE8701016A patent/BE1000537A4/fr not_active IP Right Cessation
- 1987-09-11 JP JP62226721A patent/JP2534073B2/ja not_active Expired - Fee Related
- 1987-09-11 NL NL8702171A patent/NL193947C/nl not_active IP Right Cessation
-
1988
- 1988-11-30 US US07/279,297 patent/US4859417A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
SE8703493D0 (sv) | 1987-09-09 |
NL193947C (nl) | 2001-03-02 |
KR880004118A (ko) | 1988-06-01 |
NO873776D0 (no) | 1987-09-10 |
NO169396B (no) | 1992-03-09 |
ATA226487A (de) | 1991-05-15 |
JP2534073B2 (ja) | 1996-09-11 |
FI87239C (fi) | 1992-12-10 |
GB2194961B (en) | 1991-01-02 |
FI873925L (fi) | 1988-03-12 |
FR2603896A1 (fr) | 1988-03-18 |
IT8648445A0 (it) | 1986-09-11 |
NL8702171A (nl) | 1988-04-05 |
SE8703493L (sv) | 1988-03-12 |
NO169396C (no) | 1992-06-17 |
JPS6369934A (ja) | 1988-03-30 |
GB2194961A (en) | 1988-03-23 |
BE1000537A4 (fr) | 1989-01-24 |
FR2603896B1 (fr) | 1989-09-08 |
ES2004813A6 (es) | 1989-02-01 |
AT393697B (de) | 1991-11-25 |
SE463566B (sv) | 1990-12-10 |
CA1307139C (en) | 1992-09-08 |
DE3729509C2 (de) | 1996-10-02 |
NL193947B (nl) | 2000-11-01 |
IT1196620B (it) | 1988-11-16 |
FI87239B (fi) | 1992-08-31 |
NO873776L (no) | 1988-03-14 |
FI873925A0 (fi) | 1987-09-10 |
DE3729509A1 (de) | 1988-03-24 |
GB8719334D0 (en) | 1987-09-23 |
US4859417A (en) | 1989-08-22 |
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