KR950007218A - Electronic component lead wire and manufacturing method - Google Patents
Electronic component lead wire and manufacturing method Download PDFInfo
- Publication number
- KR950007218A KR950007218A KR1019940020468A KR19940020468A KR950007218A KR 950007218 A KR950007218 A KR 950007218A KR 1019940020468 A KR1019940020468 A KR 1019940020468A KR 19940020468 A KR19940020468 A KR 19940020468A KR 950007218 A KR950007218 A KR 950007218A
- Authority
- KR
- South Korea
- Prior art keywords
- lead wire
- band
- electronic component
- aluminum
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title claims abstract description 38
- 238000004519 manufacturing process Methods 0.000 title claims abstract 9
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 26
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 26
- 238000003466 welding Methods 0.000 claims 11
- 229910052751 metal Inorganic materials 0.000 claims 6
- 239000002184 metal Substances 0.000 claims 6
- 238000000034 method Methods 0.000 claims 3
- 239000010409 thin film Substances 0.000 claims 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000011888 foil Substances 0.000 abstract description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/242—Terminals the capacitive element surrounding the terminal
- H01G4/245—Tabs between the layers of a rolled electrode
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G1/00—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Coils Or Transformers For Communication (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
본 발명은 전자 부품 리드선 및 그 제조 방법에 관하여 개시하고 있으며, 전자 부품 리드선은 박판 밴드의 코일의 형상으로 감겨져 있고, 리드선과 알루미늄 탭으로 구성되는데, 상기 리드선은 소정의 공간을 두고 밴드에 고정된 일단부와, 각각에 대해 그 위에 용접된 알루미늄 탭의 일단부를 가진 타단부를 가지며, 상기 알루미늄 탭은 평평하게 형성된 타단부를 갖고, 평평한 탭의 일면은 하나의 동일 방향으로 향하게 된다. 따라서, 탭의 일면상에 형성된 핀은 탭의 둘레에 감겨진 알루미늄박에 손상을 주는 것으로부터 예방할 수 있게 된다.The present invention discloses an electronic component lead wire and a method of manufacturing the same, wherein the electronic component lead wire is wound in the shape of a coil of a thin plate band, and is composed of a lead wire and an aluminum tab, wherein the lead wire is fixed to the band with a predetermined space. It has one end and the other end with one end of each of the aluminum tabs welded thereon, the aluminum tab having the other end formed flat, with one side of the flat tab facing in the same direction. Therefore, the pin formed on one surface of the tab can be prevented from damaging the aluminum foil wound around the tab.
[선택도] 제1도[Selectivity] First Degree
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제1도는 본 발명에 따른 박판 밴드(thin leaf band)상에 용접된 전자부품 리드선의 정면도,1 is a front view of an electronic component lead wire welded on a thin leaf band according to the present invention,
제4도는 박(foil)에 손상을 주지 않고 알루미늄박에 부착된 알루미늄 탭의 한면을 도시하는 전자부품 리드선의 측단면도,4 is a side cross-sectional view of an electronic component lead wire showing one side of an aluminum tab attached to an aluminum foil without damaging the foil;
제7도는 박판 밴드의 돌기부에 리드선 단부를 용접한 본 발명에 따른 제2실시예의 전자부품 리드선을 도시하는 사시도.7 is a perspective view showing a lead wire of an electronic component according to a second embodiment of the present invention in which a lead wire end is welded to a protrusion of a thin band.
Claims (24)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5227923A JPH0757979A (en) | 1993-08-19 | 1993-08-19 | Lead wire of electronic device and manufacturing method and apparatus therefor |
JP93-227923 | 1993-08-19 | ||
JP6135107A JPH07320990A (en) | 1994-05-25 | 1994-05-25 | Lead wire for electronic parts and method and device for manufacturing it |
JP94-135107 | 1994-05-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR950007218A true KR950007218A (en) | 1995-03-21 |
Family
ID=26469043
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940020468A Ceased KR950007218A (en) | 1993-08-19 | 1994-08-19 | Electronic component lead wire and manufacturing method |
Country Status (5)
Country | Link |
---|---|
KR (1) | KR950007218A (en) |
CN (2) | CN1054229C (en) |
GB (1) | GB2282089B (en) |
MY (1) | MY111294A (en) |
TW (2) | TW383895U (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5426672B2 (en) * | 2008-07-10 | 2014-02-26 | シロー インダストリーズ インコーポレイテッド | Metal forming method and coiled welding assembly |
CH701973A1 (en) * | 2009-10-12 | 2011-04-15 | Polycontact Ag | Creating an electric connection between a contact plate of an electromechanic switch, and a stranded wire on a power supply and/or signaling line, comprises electrical conductively connecting together the plate and the stranded wire |
CN110896000A (en) * | 2018-08-24 | 2020-03-20 | 东莞市成东电子科技有限公司 | Welding process of thin film capacitor |
CN112768247B (en) * | 2021-01-29 | 2022-03-08 | 南通三华电子工业有限公司 | Aluminum electrolytic capacitor lead-out wire and production equipment thereof |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4196959A (en) * | 1977-12-27 | 1980-04-08 | Beckman Instruments, Inc. | Carrier strip for round lead pins and method for making the same |
GB2041256B (en) * | 1979-01-24 | 1983-02-09 | Bicc Burndy Ltd | Electric wiring harnesses |
GB2057311B (en) * | 1979-08-31 | 1983-03-09 | Plessey Co Ltd | Making electrical connectors |
GB2069377B (en) * | 1980-02-16 | 1983-02-02 | Plessey Co Ltd | Manufacture of carrier strip for electrical contact members |
FR2625594B1 (en) * | 1988-01-05 | 1990-05-04 | Thomson Csf | CHARGE DUPLICATOR FOR CHARGE TRANSFER DEVICE |
DE69119381T2 (en) * | 1990-12-21 | 1996-11-14 | Whitaker Corp | Procedure for attaching a connector to a circuit element and solder connection frame therefor |
-
1994
- 1994-08-10 GB GB9416190A patent/GB2282089B/en not_active Expired - Fee Related
- 1994-08-15 TW TW086214740U patent/TW383895U/en not_active IP Right Cessation
- 1994-08-15 TW TW086104659A patent/TW326540B/en active
- 1994-08-15 MY MYPI94002131A patent/MY111294A/en unknown
- 1994-08-19 CN CN94116819A patent/CN1054229C/en not_active Expired - Fee Related
- 1994-08-19 KR KR1019940020468A patent/KR950007218A/en not_active Ceased
-
1998
- 1998-11-23 CN CN98122815A patent/CN1096086C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1096086C (en) | 2002-12-11 |
GB2282089B (en) | 1996-08-28 |
CN1109998A (en) | 1995-10-11 |
CN1222742A (en) | 1999-07-14 |
GB9416190D0 (en) | 1994-09-28 |
TW383895U (en) | 2000-03-01 |
TW326540B (en) | 1998-02-11 |
GB2282089A (en) | 1995-03-29 |
CN1054229C (en) | 2000-07-05 |
MY111294A (en) | 1999-10-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19940819 |
|
PG1501 | Laying open of application | ||
A201 | Request for examination | ||
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 19981110 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 19940819 Comment text: Patent Application |
|
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20010730 Patent event code: PE09021S01D |
|
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20020719 Patent event code: PE09021S01D |
|
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20030326 Patent event code: PE09021S01D |
|
E601 | Decision to refuse application | ||
PE0601 | Decision on rejection of patent |
Patent event date: 20031229 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20030326 Comment text: Notification of reason for refusal Patent event code: PE06011S01I Patent event date: 20020719 Comment text: Notification of reason for refusal Patent event code: PE06011S01I Patent event date: 20010730 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |