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KR950004464A - 칩 범프의 제조방법 - Google Patents

칩 범프의 제조방법 Download PDF

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Publication number
KR950004464A
KR950004464A KR1019930013346A KR930013346A KR950004464A KR 950004464 A KR950004464 A KR 950004464A KR 1019930013346 A KR1019930013346 A KR 1019930013346A KR 930013346 A KR930013346 A KR 930013346A KR 950004464 A KR950004464 A KR 950004464A
Authority
KR
South Korea
Prior art keywords
bump
photoresist film
forming
pad
barrier metal
Prior art date
Application number
KR1019930013346A
Other languages
English (en)
Inventor
박종한
박춘근
하선호
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019930013346A priority Critical patent/KR950004464A/ko
Priority to FR9408641A priority patent/FR2707797B1/fr
Priority to JP6161470A priority patent/JPH0778826A/ja
Priority to CN94107870A priority patent/CN1102504A/zh
Priority to DE4424962A priority patent/DE4424962A1/de
Priority to US08/275,550 priority patent/US5418186A/en
Publication of KR950004464A publication Critical patent/KR950004464A/ko

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
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Abstract

칩 범프의 제조방법이 개시된다. 이는 패드가 완성된 기판의 전면에 베리어메탈을 형성하는 단계, 상기 기판의 전면에 포토레지스트막을 형성하여 패드 부위를 개구하는 단계, 상기 개구 부위에 도금을 통하여 금속 범프를 형성하는 단계, 상기 범프를 마스크로 하여 상기 포토레지스트막을 선택적으로 제거하는 단계, 잔여 포토레지스트막을 마스크로 하여 소정 영역의 베리어메탈을 식각하는 단계 및 상기 잔여 포토레지스트막을 제거하여 패드의 상부에 범프를 형성하는 단계를 포함하여 이루어지는데, 공정이 단순화되고 비용이 절감되며 품질이 우수한 칩 범프를 얻을 수 있다.

Description

칩 범프의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제14도는 본 발명의 일실시예에 따라 칩 범프를 제조하기 위한 공정의 흐름도이고, 제15도 내지 제19도는 제14도에 나타난 본 발명의 일실시예에 따라 칩 범프를 제조하기 위한 공정을 나타내는 도면이다.

Claims (2)

  1. 반도체 칩의 패드 위에 리이드를 직접 붙일 수 있는 금속층의 범프를 제조하는 단계를 포함하는 칩 범프의 제조방법에 있어서, 상기 방법이 패드가 완성된 기판의 전면에 베리어메탈을 형성하는 단계; 상기 기판의 전면에 포토레지스트막을 형성하여 패드 부위를 개구하는 단계; 상기 개구 부위에 도금을 통하여 금속 범프를 형성하는 단계; 상기 범프를 마스크로 하여 상기 포토레지스트막을 선택적으로 제거하는 단계; 잔여 포토레지스트막을 마스크로 하여 소정 영역의 베리어메탈을 식각하는 단계; 및 상기 잔여 포토레지스트막을 제거하여 패드의 상부에 범프를 형성하는 단계를 포함하는 것을 특징으로 하는 반도체 장치의 칩 범프 제조방법.
  2. 제1항에 있어서, 상기 범프의 두께가 상기 베리어메탈 두께로 수십배로서, 베리어메탈의 식각시 범프의 식각으로 범프의 두께에 영향이 없는 것을 특징으로 하는 칩 범프의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930013346A 1993-07-15 1993-07-15 칩 범프의 제조방법 KR950004464A (ko)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1019930013346A KR950004464A (ko) 1993-07-15 1993-07-15 칩 범프의 제조방법
FR9408641A FR2707797B1 (fr) 1993-07-15 1994-07-12 Procédé de fabrication de bosses pour puces.
JP6161470A JPH0778826A (ja) 1993-07-15 1994-07-13 チップバンプの製造方法
CN94107870A CN1102504A (zh) 1993-07-15 1994-07-14 制造芯片隆起部的方法
DE4424962A DE4424962A1 (de) 1993-07-15 1994-07-14 Verfahren zur Herstellung eines Chip-Anschlusses
US08/275,550 US5418186A (en) 1993-07-15 1994-07-15 Method for manufacturing a bump on a semiconductor chip

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KR1019930013346A KR950004464A (ko) 1993-07-15 1993-07-15 칩 범프의 제조방법

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KR950004464A true KR950004464A (ko) 1995-02-18

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JP (1) JPH0778826A (ko)
KR (1) KR950004464A (ko)
CN (1) CN1102504A (ko)
DE (1) DE4424962A1 (ko)
FR (1) FR2707797B1 (ko)

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US5418186A (en) 1995-05-23
CN1102504A (zh) 1995-05-10
FR2707797B1 (fr) 1996-07-05
JPH0778826A (ja) 1995-03-20
DE4424962A1 (de) 1995-01-19
FR2707797A1 (fr) 1995-01-20

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