KR940022676A - 액상 에피택셜 성장용 화합물 반도체 단결정 기판 - Google Patents
액상 에피택셜 성장용 화합물 반도체 단결정 기판 Download PDFInfo
- Publication number
- KR940022676A KR940022676A KR1019940003946A KR19940003946A KR940022676A KR 940022676 A KR940022676 A KR 940022676A KR 1019940003946 A KR1019940003946 A KR 1019940003946A KR 19940003946 A KR19940003946 A KR 19940003946A KR 940022676 A KR940022676 A KR 940022676A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- compound semiconductor
- single crystal
- epitaxial growth
- semiconductor single
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 33
- 239000004065 semiconductor Substances 0.000 title claims abstract description 18
- 150000001875 compounds Chemical class 0.000 title claims abstract description 16
- 239000013078 crystal Substances 0.000 title claims abstract description 15
- 239000007788 liquid Substances 0.000 title claims abstract 7
- 230000003746 surface roughness Effects 0.000 claims abstract description 13
- 239000004973 liquid crystal related substance Substances 0.000 claims 7
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims 3
- -1 GaAs compound Chemical class 0.000 claims 2
- 238000005259 measurement Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000007517 polishing process Methods 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02387—Group 13/15 materials
- H01L21/02395—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02546—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02576—N-type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02623—Liquid deposition
- H01L21/02625—Liquid deposition using melted materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02623—Liquid deposition
- H01L21/02628—Liquid deposition using solutions
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
- Led Devices (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Description
Claims (11)
- 기판 표면의 복수 장소에서 측정한 표면 거칠기의 평균치가 1㎛ 내지 20㎛의 범위내에 있는 액상 에피택셜 성장용 화합물 반도체 단결정 기판.
- 제1항에 있어서, 표면 거칠기가, 거의 1cm2의 표면적마다 구분된 기판 표면의 영역 내에서 길이 1mm의 선 위를 따라 측정한 표면의 최대 높이와 최소 높이의 차이이며, 복수 장소에서 측정한 복수 개의 표면 거칠기의 측정치 중에서 50% 이상이 1㎛ 내지 20㎛의 범위내에 있는 액상 에피택셜 성장용 화합물 반도체 단결정 기판.
- 제1항에 있어서, 표면 거칠기가, 거의 1cm2의 표면적마다 구분된 기판 표면의 영역 내에서 길이 1mm의 선 위를 따라 측정한 표면의 최대 높이와 최소 높이의 차이이며, 복수 장소에서 측정한 복수 개의 표면 거칠기의 측정치 중에서 50% 이상이 1㎛ 내지 10㎛의 범위내에 있는 액상 에피택셜 성장용 화합물 반도체 단결정 기판.
- 제1항에 있어서, 기판이 GaAs계 화합물 반도체로 이루어진 액상 에피택셜 성장용 화합물 반도체 단결정 기판.
- 제4항에 있어서, 기판이 적외선 또는 가시광선의 발광 다이오드용 에피택셜 웨이퍼의 기판으로서 사용되는 액상 에피택셜 성장용 화합물 반도체 단결정 기판.
- 기판 표면이 거의 1cm2의 표면적 영역마다 1점씩 측정된 복수 개의 표면 거칠기의 측정치 중에서 50% 이상이 1㎛ 내지 20㎛의 범위내에 있으며, 표면 거칠기가 상기한 영역내에서 길이 1mm의 선 위를 따라 측정한 표면의 최대 높이와 최소 높이의 차이인 액상 에피택셜 성장용 화합물 반도체 단결정 기판.
- 제6항에 있어서, 기판이 GaAs계 화합물 반도체로 이루어진 액상 에피택셜 성장용 화합물 반도체 단결정 기판.
- 제7항에 있어서, 기판이, 적외선 또는 가시광선의 발광다이오드용 μ에피택셜 웨이퍼의 기판으로서 사용되는 액상 에피택셜 성장용 화합물 반도체 단결정 기판.
- 기판 표면의 거의 1cm2의 표면적 영역마다 1점씩 측정된 복수 개의 표면 거칠기의 측정치 중에서 50% 이상이 1㎛ 내지 10㎛의 범위내에 있으며, 표면 거칠기가 상기한 영역내에서 길이 1mm의 선 위를 따라 측정한 표면의 최대 높이와 최소 높이의 차이인 액상 에피택셜 성장용 화합물 반도체 단결정 기판.
- 제9항에 있어서, 기판이 GaAs계 화합물 반도체로 이루어진 액상 에피택셜 성장용 화합물 반도체 단결정 기판
- 제10항에 있어서, 기판이, 적외선 또는 가시광선의 발광 다이오드용 에피택셜 웨이퍼의 기판으로서 사용되는 액상 에피택셜 성장용 화합물 반도체 단결정 기판.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP93-040336 | 1993-03-02 | ||
JP4033693A JP2642031B2 (ja) | 1992-05-19 | 1993-03-02 | 化合物半導体の液相エピタキシャル成長方法及び化合物半導体単結晶基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR940022676A true KR940022676A (ko) | 1994-10-21 |
KR0156486B1 KR0156486B1 (ko) | 1998-10-15 |
Family
ID=12577793
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940003946A KR0156486B1 (ko) | 1993-03-02 | 1994-03-02 | 액상 에피텍셜 성장용 화합물 반도체 단결정 기판 |
Country Status (3)
Country | Link |
---|---|
US (2) | US5514903A (ko) |
KR (1) | KR0156486B1 (ko) |
TW (1) | TW230822B (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3207146B2 (ja) * | 1997-12-25 | 2001-09-10 | ローム株式会社 | 半導体装置の製法 |
KR100265328B1 (ko) * | 1998-04-22 | 2000-09-15 | 김영환 | 반구형 그레인을 갖는 폴리실리콘 박막의 표면적 변화율 측정방법과 그를 이용한 정전용량 측정 방법 및 장치 |
US6896729B2 (en) * | 2001-07-05 | 2005-05-24 | Axt, Inc. | Method and apparatus for growing semiconductor crystals with a rigid support with carbon doping and resistivity control and thermal gradient control |
US7067849B2 (en) * | 2001-07-17 | 2006-06-27 | Lg Electronics Inc. | Diode having high brightness and method thereof |
US6949395B2 (en) * | 2001-10-22 | 2005-09-27 | Oriol, Inc. | Method of making diode having reflective layer |
US7148520B2 (en) | 2001-10-26 | 2006-12-12 | Lg Electronics Inc. | Diode having vertical structure and method of manufacturing the same |
EP1605498A1 (en) * | 2004-06-11 | 2005-12-14 | S.O.I. Tec Silicon on Insulator Technologies S.A. | A method of manufacturing a semiconductor wafer |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3877052A (en) * | 1973-12-26 | 1975-04-08 | Bell Telephone Labor Inc | Light-emitting semiconductor apparatus for optical fibers |
US4342148A (en) * | 1981-02-04 | 1982-08-03 | Northern Telecom Limited | Contemporaneous fabrication of double heterostructure light emitting diodes and laser diodes using liquid phase epitaxy |
US4422888A (en) * | 1981-02-27 | 1983-12-27 | Xerox Corporation | Method for successfully depositing doped II-VI epitaxial layers by organometallic chemical vapor deposition |
JPS63256600A (ja) * | 1987-04-15 | 1988-10-24 | Hitachi Cable Ltd | Ga↓1↓−↓xAl↓xAsエピタキシヤルウエハの製造方法 |
JP2953468B2 (ja) * | 1989-06-21 | 1999-09-27 | 三菱化学株式会社 | 化合物半導体装置及びその表面処理加工方法 |
US5032366A (en) * | 1990-04-30 | 1991-07-16 | Union Carbide Coatings Service Technology Corporation | Boron nitride boat and process for producing it |
JPH04343484A (ja) * | 1991-05-21 | 1992-11-30 | Eastman Kodak Japan Kk | 発光ダイオードアレイ |
US5346581A (en) * | 1993-04-01 | 1994-09-13 | At&T Bell Laboratories | Method of making a compound semiconductor device |
-
1994
- 1994-02-28 TW TW083101677A patent/TW230822B/zh not_active IP Right Cessation
- 1994-03-02 KR KR1019940003946A patent/KR0156486B1/ko not_active IP Right Cessation
-
1995
- 1995-03-03 US US08/400,271 patent/US5514903A/en not_active Expired - Lifetime
- 1995-05-26 US US08/451,572 patent/US5639299A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR0156486B1 (ko) | 1998-10-15 |
TW230822B (ko) | 1994-09-21 |
US5639299A (en) | 1997-06-17 |
US5514903A (en) | 1996-05-07 |
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