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KR940008684U - 리드프레임 - Google Patents

리드프레임

Info

Publication number
KR940008684U
KR940008684U KR2019920018103U KR920018103U KR940008684U KR 940008684 U KR940008684 U KR 940008684U KR 2019920018103 U KR2019920018103 U KR 2019920018103U KR 920018103 U KR920018103 U KR 920018103U KR 940008684 U KR940008684 U KR 940008684U
Authority
KR
South Korea
Prior art keywords
lead frame
lead
frame
Prior art date
Application number
KR2019920018103U
Other languages
English (en)
Other versions
KR0124548Y1 (ko
Inventor
정관호
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR92018103U priority Critical patent/KR0124548Y1/ko
Publication of KR940008684U publication Critical patent/KR940008684U/ko
Application granted granted Critical
Publication of KR0124548Y1 publication Critical patent/KR0124548Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/4826—Connecting between the body and an opposite side of the item with respect to the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73215—Layer and wire connectors

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR92018103U 1992-09-23 1992-09-23 리드프레임 KR0124548Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR92018103U KR0124548Y1 (ko) 1992-09-23 1992-09-23 리드프레임

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR92018103U KR0124548Y1 (ko) 1992-09-23 1992-09-23 리드프레임

Publications (2)

Publication Number Publication Date
KR940008684U true KR940008684U (ko) 1994-04-21
KR0124548Y1 KR0124548Y1 (ko) 1998-10-01

Family

ID=19340529

Family Applications (1)

Application Number Title Priority Date Filing Date
KR92018103U KR0124548Y1 (ko) 1992-09-23 1992-09-23 리드프레임

Country Status (1)

Country Link
KR (1) KR0124548Y1 (ko)

Also Published As

Publication number Publication date
KR0124548Y1 (ko) 1998-10-01

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Legal Events

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Comment text: Application for Utility Model Registration

Patent event code: UA01011R08D

Patent event date: 19920923

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E701 Decision to grant or registration of patent right
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Comment text: Decision to Grant Registration

Patent event code: UE07011S01D

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