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KR940006440A - 광 전류 시스템 공학에서 배전판 및 배전 시스템용 차폐 전도체들의 접속을 위한 인쇄 회로 기판 및 어셈블리 모듈 - Google Patents

광 전류 시스템 공학에서 배전판 및 배전 시스템용 차폐 전도체들의 접속을 위한 인쇄 회로 기판 및 어셈블리 모듈 Download PDF

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Publication number
KR940006440A
KR940006440A KR1019930014510A KR930014510A KR940006440A KR 940006440 A KR940006440 A KR 940006440A KR 1019930014510 A KR1019930014510 A KR 1019930014510A KR 930014510 A KR930014510 A KR 930014510A KR 940006440 A KR940006440 A KR 940006440A
Authority
KR
South Korea
Prior art keywords
printed circuit
circuit board
assembly module
distribution
cutting
Prior art date
Application number
KR1019930014510A
Other languages
English (en)
Inventor
라이힐레 한스
Original Assignee
라이힐레 한스
라이힐레+데-마사리 아게
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CH240692A external-priority patent/CH683759A5/de
Priority claimed from CH240792A external-priority patent/CH683955A5/de
Application filed by 라이힐레 한스, 라이힐레+데-마사리 아게 filed Critical 라이힐레 한스
Publication of KR940006440A publication Critical patent/KR940006440A/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/03—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections
    • H01R9/05—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections for coaxial cables
    • H01R9/0515—Connection to a rigid planar substrate, e.g. printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/03—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections
    • H01R9/05—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections for coaxial cables
    • H01R9/0527—Connection to outer conductor by action of a resilient member, e.g. spring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T24/00—Buckles, buttons, clasps, etc.
    • Y10T24/44—Clasp, clip, support-clamp, or required component thereof
    • Y10T24/44017—Clasp, clip, support-clamp, or required component thereof with specific mounting means for attaching to rigid or semirigid supporting structure or structure-to-be-secured
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T24/00—Buckles, buttons, clasps, etc.
    • Y10T24/44—Clasp, clip, support-clamp, or required component thereof
    • Y10T24/44239—Encircling gripping member including semirigid band and operator for tightening

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Multi-Conductor Connections (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

인쇄 회로 기판에 있어서 모듈러 접속부와 스위칭 수단을 차례로 배열한 멀티-모듈러 배열이 특징이 되며, 인쇄 회로 기판은 절단하므로써 하나의 모듈 인쇄 회로 기판을 얻기 위하여 접속부와 스위칭 수단의 인접한 모듈간에 각각 하나의 정규의 절단부를 갖고 있다.
본 발명은 단지 절단하므로써 필요에 따라서 일정 수의 모듈을 얻을수 있기에 적합한 임의 수의 모듈을 포함하는 멀티 모듈러 인쇄 회로 기판을 제공한다.

Description

광전류 시스템 공학에서 배전판 및 배전 시스템용 차폐 전도체들의 접속을 위한 인쇄 회로 기판 및 어셈블리 모듈
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 인쇄 회로 기판에 대한 개략도,
제2도는 본 발명에 따른 어셈블리 모듈에 대한 개략도.

Claims (8)

  1. 모듈러 접속부와 스위칭 수단(2,3)의 멀티-모듈러 배열로 되어 있고, 절단 하므로써 하나의 모듈인쇄 회로기판을 얻기 위하여 모듈러 접속부의 인접 모듈 사이에 있는 하나의 정규의 절단부(4)와 스위칭 수단(2,3)을 갖고 있는 것을 특징으로 하는 인쇄 회로 기관.
  2. 제1항에 있어서, 차폐 전도체의 접속용으로서 절단에 의한 인쇄 회로 기판과 접지 패드 분리를 위한 인쇄 회로 기판(1)의 정규의 절단부들(4)의 연장부 각각에 하나의 정규의 절단부(24)를 갖고 있는 인쇄 회로 기판(1)의 전체 길이를 가로질러 연장되는 금속 접지 패드(21)를 포함하는 것을 특징으로 하는 인쇄 기판.
  3. 광-전류 시스템 공학에서 배전판 및 배전 시스템용 차폐된 전도체들의 접속을 위한 인쇄 회로 기판의 어셈블리 모듈에 있어서, 인쇄 회로 기판에 접속될 수 있는 접지 패드(21)을 포함하며 이 접지 패드상에는 쉘형 전도체 수용 영역(23)을 갖고 있는 하나 이상의 전도체를 착탈 가능하게 둘러싸는 하나 이상의 스프링 클램프(22,22′)가 도관형으로 지지 되어 있는 것을 특징으로하는 어셈블리 모듈.
  4. 제3항에 있어서, 금속 접지 패드(21)이 다중 모듈로서 형성되고 차례로 배열된 다수의 스프링 클램프(22)를 포함하며 접지 패드(21)를 포함하며 접지 패드(21)은 절단하므로써 하나의 모듈을 얻을 수 있도록 인접한 2개의 스프링 클램프(22)들 간에 각각 하나의 정규의 절단부(4)를 갖고 있는 것을 특징으로 하는 어셈블리 모듈.
  5. 제3항에 있어서, 상기 스프링 클램프(22)는 U형인 것을 특징으로 하는 어셈블리 모듈
  6. 제5항에 있어서, 상기 스프링 클램프(22)는 여러 직경을 갖고 있는 다양한 전도체들을 수용하기 위하여 각각의 상단에 2개 이상의 전도체수용 영역(23)을 갖고 있는 것을 특징으로 하는 어셈블리 모듈.
  7. 제3항에 있어서, 상기 스프링 클램프(22)는 또한 응력 변형 릴리이프 디바이이스로서 이용될 수 있는 것을 특징으로 하는 어셈블리 모듈.
  8. 제3항에 있어서, 상기 접지 패드(21)은 케이블 커플러(9)의 푸쉬-드로우 수용을 위한 슬롯(5)를 포함하는 것을 특징으로 하는 어셈블리 모듈.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930014510A 1992-07-30 1993-07-29 광 전류 시스템 공학에서 배전판 및 배전 시스템용 차폐 전도체들의 접속을 위한 인쇄 회로 기판 및 어셈블리 모듈 KR940006440A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CH02406/92 1992-07-30
CH240692A CH683759A5 (de) 1992-07-30 1992-07-30 Printplatte.
CH240792A CH683955A5 (de) 1992-07-30 1992-07-30 Montagemodul für einen Anschluss abgeschirmter Leiter für Verteiler und Verteilersysteme im Schwachstrom-Anlagebau.
CH02407/92 1992-07-30

Publications (1)

Publication Number Publication Date
KR940006440A true KR940006440A (ko) 1994-03-23

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930014510A KR940006440A (ko) 1992-07-30 1993-07-29 광 전류 시스템 공학에서 배전판 및 배전 시스템용 차폐 전도체들의 접속을 위한 인쇄 회로 기판 및 어셈블리 모듈

Country Status (7)

Country Link
US (1) US5402315A (ko)
EP (1) EP0586841A1 (ko)
KR (1) KR940006440A (ko)
CN (1) CN1086948A (ko)
AU (1) AU4433193A (ko)
CA (1) CA2101038A1 (ko)
TW (1) TW255090B (ko)

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Also Published As

Publication number Publication date
US5402315A (en) 1995-03-28
TW255090B (ko) 1995-08-21
AU4433193A (en) 1994-02-03
CA2101038A1 (en) 1994-01-31
CN1086948A (zh) 1994-05-18
EP0586841A1 (de) 1994-03-16

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Patent event date: 19930729

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