KR940006428A - 플라즈마 발생방법 및 발생장치 - Google Patents
플라즈마 발생방법 및 발생장치 Download PDFInfo
- Publication number
- KR940006428A KR940006428A KR1019930011564A KR930011564A KR940006428A KR 940006428 A KR940006428 A KR 940006428A KR 1019930011564 A KR1019930011564 A KR 1019930011564A KR 930011564 A KR930011564 A KR 930011564A KR 940006428 A KR940006428 A KR 940006428A
- Authority
- KR
- South Korea
- Prior art keywords
- plasma generating
- plasma
- electrodes
- sample stage
- generated
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
- H01J37/32302—Plural frequencies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
- H01J37/32155—Frequency modulation
- H01J37/32165—Plural frequencies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
Claims (11)
- 절열물로 구성한 체인버에, 3개이상의 전극을 배치하고, 상기 전극에 위상이 배치순으로 상이하는 고주파를 인가하여 플라즈마를 발생시킬때, 플라즈마발생부의 전자를 회전시키는 것을 특징으로 하는 플라즈마발생방법.
- 제1항에 있어서, 체임버의 3개이상의 전극의 위치가 대략 동일원주상에 있는 것을 특징으로 하는 플라즈마 발생방법.
- 절염물로 구성한 체임버에, 3개이상의 전극을 배치하고, 상기 전극에 위상이 배치순으로 상이하는 고주파를 인가하여 플라즈마를 발생시킬때, 플라즈마발생부의 전자를 회전시키고, 상기 3개이상의 전극이외에 피처리물을 얹어놓는 시료대를 배치하는 동시에 상기 플라즈마발생부에서 발생한 반응생성물에 의해서 상기 피처리물을 에칭하는 것을 특징으로 하는 플라즈마발생장치.
- 제3항에 있어서, 시료대에 바이어스를 인가하는 것을 특징으로 하는 플라즈마발생장치.
- 제3항에 있어서, 시료대의 위치가 체임버의 3개이상의 전극과 대략 동일한 높이인것을 특징으로 하는 플라즈마발생장치.
- 절연물로 구성한 체임버에, 3개이상의 전극을 배치하고, 상기 전극에 위상이 배치순으로 상이하는 고주파를 인가하여 플라즈마를 발생시킬때, 플라즈마발생부의 전자를 회전시키고, 상기 3개이상의 전극 이외에 피처리물을 얹어놓는 시료대를 배치하는 동시에 상기 플라즈마발생부에서 발생한 반응생성물에 의해 상기 피처리물을 CVD하는 것을 특징으로 하는 플라즈마발생장치.
- 제6항에 있어서, 시료대에 바이어스를 인가하는 것을 특징으로 하는 플라즈마발생장치.
- 제6항에 있어서, 시료대의 위치가 체임버의 3개이상의 전극파 대략 동일한 높이인것을 특징으로 하는 플라즈마발생장치.
- 절열물로구성한 체임버에 3개이상의 전극을 배치하고, 상기 전극에 위상이 배치순으로 상이하는 고주파를 인가하여 플라즈마를 발생시킬때, 플라즈마발생부의 전지를 회전시키는 것과, 상기 3개이상의 전극이외에 피처리물을 얹어놓는 시료대를 가진것과, 상기 플라즈마발생부에서 발생한 반응생성물에 의해서 상기 피처리물을 도핑하는 것을 특징으로 하는 플라즈마발생장치.
- 제9항에 있어서, 시료대에 바이어스를 인가하는 것을 특징으로 하는 플라즈마발생장치.
- 제9항에 있어서, 시료대와 플라즈마 발생부의 사이에 전위치를 발생시키는 것을 특징으로 하는 플라즈마발생장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4167177A JPH0613196A (ja) | 1992-06-25 | 1992-06-25 | プラズマ発生方法および発生装置 |
JP92-167177 | 1992-06-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR940006428A true KR940006428A (ko) | 1994-03-23 |
KR0139402B1 KR0139402B1 (ko) | 1998-08-17 |
Family
ID=15844852
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019930011564A Expired - Fee Related KR0139402B1 (ko) | 1992-06-25 | 1993-06-24 | 플라즈마발생방법 및 플라즈마발생장치 |
Country Status (3)
Country | Link |
---|---|
US (1) | US5436424A (ko) |
JP (1) | JPH0613196A (ko) |
KR (1) | KR0139402B1 (ko) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5330606A (en) * | 1990-12-14 | 1994-07-19 | Matsushita Electric Industrial Co., Ltd. | Plasma source for etching |
TW249313B (ko) * | 1993-03-06 | 1995-06-11 | Tokyo Electron Co | |
US5945008A (en) * | 1994-09-29 | 1999-08-31 | Sony Corporation | Method and apparatus for plasma control |
US5932116A (en) * | 1995-06-05 | 1999-08-03 | Tohoku Unicom Co., Ltd. | Power supply for multi-electrode discharge |
US5705433A (en) * | 1995-08-24 | 1998-01-06 | Applied Materials, Inc. | Etching silicon-containing materials by use of silicon-containing compounds |
US5573595A (en) * | 1995-09-29 | 1996-11-12 | Lam Research Corporation | Methods and apparatus for generating plasma |
US5824606A (en) * | 1996-03-29 | 1998-10-20 | Lam Research Corporation | Methods and apparatuses for controlling phase difference in plasma processing systems |
JP2002535825A (ja) * | 1999-01-20 | 2002-10-22 | エヌ・ケー・ティー リサーチ センター アクティーゼルスカブ | プラズマ励起方法及びその使用 |
US6265831B1 (en) * | 1999-03-31 | 2001-07-24 | Lam Research Corporation | Plasma processing method and apparatus with control of rf bias |
US7602127B2 (en) | 2005-04-18 | 2009-10-13 | Mks Instruments, Inc. | Phase and frequency control of a radio frequency generator from an external source |
DE102007055010A1 (de) * | 2007-11-14 | 2009-05-28 | Forschungsverbund Berlin E.V. | Verfahren und Generatorschaltung zur Erzeugung von Plasmen mittels Hochfrequenzanregung |
CN103606508A (zh) * | 2013-11-27 | 2014-02-26 | 苏州市奥普斯等离子体科技有限公司 | 一种颗粒材料表面等离子体处理装置 |
WO2016070148A1 (en) * | 2014-10-31 | 2016-05-06 | California Institute Of Technology | Toroidal plasma systems |
WO2020106408A1 (en) * | 2018-11-21 | 2020-05-28 | Applied Materials, Inc. | Device and method for tuning plasma distribution using phase control |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2538987A1 (fr) * | 1983-01-05 | 1984-07-06 | Commissariat Energie Atomique | Enceinte pour le traitement et notamment la gravure de substrats par la methode du plasma reactif |
JPS60153129A (ja) * | 1984-01-20 | 1985-08-12 | Seiko Instr & Electronics Ltd | 半導体装置の製造方法 |
JPS6244576A (ja) * | 1984-09-14 | 1987-02-26 | Anelva Corp | 多電極放電反応処理装置 |
JPH06104898B2 (ja) * | 1988-01-13 | 1994-12-21 | 忠弘 大見 | 減圧表面処理装置 |
US4871421A (en) * | 1988-09-15 | 1989-10-03 | Lam Research Corporation | Split-phase driver for plasma etch system |
JPH02298024A (ja) * | 1989-05-12 | 1990-12-10 | Tadahiro Omi | リアクティブイオンエッチング装置 |
US5150375A (en) * | 1989-06-14 | 1992-09-22 | Mitsubishi Denki Kabushiki Kaisha | Substance vaporizing apparatus |
JPH0747820B2 (ja) * | 1989-09-22 | 1995-05-24 | 株式会社日立製作所 | 成膜装置 |
TW221318B (ko) * | 1990-07-31 | 1994-02-21 | Tokyo Electron Co Ltd | |
JPH0729734B2 (ja) * | 1991-08-27 | 1995-04-05 | 株式会社トヨックス | ホース巻取リール |
US5228939A (en) * | 1991-12-30 | 1993-07-20 | Cheng Chu | Single wafer plasma etching system |
-
1992
- 1992-06-25 JP JP4167177A patent/JPH0613196A/ja active Pending
-
1993
- 1993-06-24 KR KR1019930011564A patent/KR0139402B1/ko not_active Expired - Fee Related
- 1993-06-24 US US08/080,824 patent/US5436424A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR0139402B1 (ko) | 1998-08-17 |
JPH0613196A (ja) | 1994-01-21 |
US5436424A (en) | 1995-07-25 |
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