KR940006427Y1 - 독서용 확대경 - Google Patents
독서용 확대경 Download PDFInfo
- Publication number
- KR940006427Y1 KR940006427Y1 KR2019910005087U KR910005087U KR940006427Y1 KR 940006427 Y1 KR940006427 Y1 KR 940006427Y1 KR 2019910005087 U KR2019910005087 U KR 2019910005087U KR 910005087 U KR910005087 U KR 910005087U KR 940006427 Y1 KR940006427 Y1 KR 940006427Y1
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- KR
- South Korea
- Prior art keywords
- magnifier
- reading
- present
- lens
- handle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B25/00—Eyepieces; Magnifying glasses
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- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
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- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Optics & Photonics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Lenses (AREA)
Abstract
Description
Claims (1)
- 렌즈부(1)와, 지지대부(2)와 손잡이부(3)를 가지는 막대형의 독서용 확대경에 있어서, 상기 렌즈부(1)는 밑면이 평평하고 윗면이 볼록하며 일측은 손잡이부(3)가 형성되고, 다른 일측은 둥글게 형성되어져 있으며, 상기 지지대(2)는 손잡이부(3)를 제외한 외주연부 전체에 걸쳐 수직으로 형성되어진 것을 특징으로하는 독서용 확대경.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019910005087U KR940006427Y1 (ko) | 1991-04-12 | 1991-04-12 | 독서용 확대경 |
US07/706,898 US5157588A (en) | 1991-03-30 | 1991-05-29 | Semiconductor package and manufacture thereof |
US07/859,663 US5199164A (en) | 1991-03-30 | 1992-03-30 | Method of manufacturing semiconductor package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019910005087U KR940006427Y1 (ko) | 1991-04-12 | 1991-04-12 | 독서용 확대경 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920020069U KR920020069U (ko) | 1992-11-17 |
KR940006427Y1 true KR940006427Y1 (ko) | 1994-09-24 |
Family
ID=19312692
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019910005087U Expired - Lifetime KR940006427Y1 (ko) | 1991-03-30 | 1991-04-12 | 독서용 확대경 |
Country Status (2)
Country | Link |
---|---|
US (1) | US5157588A (ko) |
KR (1) | KR940006427Y1 (ko) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5586388A (en) * | 1991-05-31 | 1996-12-24 | Nippondenso Co., Ltd. | Method for producing multi-board electronic device |
JP2765278B2 (ja) * | 1991-05-31 | 1998-06-11 | 株式会社デンソー | 電子装置の製造方法 |
EP0516149B1 (en) * | 1991-05-31 | 1998-09-23 | Denso Corporation | Electronic device |
US5646827A (en) * | 1991-05-31 | 1997-07-08 | Nippondenso Co., Ltd. | Electronic device having a plurality of circuit boards arranged therein |
JP2705368B2 (ja) * | 1991-05-31 | 1998-01-28 | 株式会社デンソー | 電子装置 |
CA2071381C (en) * | 1991-07-19 | 1998-12-15 | Youji Satou | Electronic apparatus, card-type electronic component used with the electronic apparatus, and electronic system with expanding apparatus for expanding function of electronic apparatus |
US5544007A (en) * | 1991-07-19 | 1996-08-06 | Kabushiiki Kaisha Toshiba | Card-shaped electronic device used with an electronic apparatus and having shield plate with conductive portion on a lateral side |
US5404271A (en) | 1991-07-30 | 1995-04-04 | Kabushiki Kaisha Toshiba | Electronic apparatus having a card storing section formed within a body between a support frame and an upper case of the body and having functional elements mounted between the support frame and a lower case of the body |
US5504648A (en) * | 1991-09-06 | 1996-04-02 | Kabushiki Kaisha Toshiba | Electronic apparatus and electronic system with expanding apparatus having interlock, ejector, grounding, and lock mechanisms, for expanding function of electronic apparatus |
US5229917A (en) * | 1992-07-24 | 1993-07-20 | The United States Of America As Represented By The Secretary Of The Air Force | VLSI integration into a 3-D WSI dual composite module |
US5323292A (en) * | 1992-10-06 | 1994-06-21 | Hewlett-Packard Company | Integrated multi-chip module having a conformal chip/heat exchanger interface |
DE4326207A1 (de) * | 1992-10-06 | 1994-04-07 | Hewlett Packard Co | Mechanisch schwimmendes Mehr-Chip-Substrat |
DE4237632A1 (de) * | 1992-11-07 | 1994-05-11 | Export Contor Ausenhandelsgese | Schaltungsanordnung |
US5307240A (en) * | 1992-12-02 | 1994-04-26 | Intel Corporation | Chiplid, multichip semiconductor package design concept |
KR100245257B1 (ko) * | 1993-01-13 | 2000-02-15 | 윤종용 | 웨이퍼 수준의 반도체 패키지의 제조방법 |
US5331591A (en) * | 1993-02-01 | 1994-07-19 | At&T Bell Laboratories | Electronic module including a programmable memory |
US5379187A (en) * | 1993-03-25 | 1995-01-03 | Vlsi Technology, Inc. | Design for encapsulation of thermally enhanced integrated circuits |
DE4310446C1 (de) * | 1993-03-31 | 1994-05-05 | Export Contor Ausenhandelsgese | Schaltungsanordnung |
US5455387A (en) * | 1994-07-18 | 1995-10-03 | Olin Corporation | Semiconductor package with chip redistribution interposer |
JP3054576B2 (ja) * | 1995-04-26 | 2000-06-19 | シャープ株式会社 | 半導体装置 |
FR2758935B1 (fr) * | 1997-01-28 | 2001-02-16 | Matra Marconi Space France | Boitier micro-electronique multi-niveaux |
US5856915A (en) * | 1997-02-26 | 1999-01-05 | Pacesetter, Inc. | Vertically stacked circuit module using a platform having a slot for establishing multi-level connectivity |
JP3653417B2 (ja) * | 1999-06-09 | 2005-05-25 | 株式会社日立製作所 | マルチチップモジュールの封止構造 |
JP2002058134A (ja) * | 2000-08-09 | 2002-02-22 | Auto Network Gijutsu Kenkyusho:Kk | 電子制御ユニットの搭載構造 |
US6703559B2 (en) * | 2001-07-19 | 2004-03-09 | Kyocera America, Inc. | Feedthrough assembly having cut-out areas in metal housing adjacent ceramic feedthrough |
GB2379330A (en) * | 2001-08-29 | 2003-03-05 | Motorola Inc | Package for electronic components and method for forming a package for electronic components |
JP2004165501A (ja) * | 2002-11-14 | 2004-06-10 | Alps Electric Co Ltd | 回路モジュール |
CN100386010C (zh) * | 2003-07-02 | 2008-04-30 | 西门子公司 | 易受电磁干扰的电子元件和/或电子装置的电路的屏蔽装置 |
US7675151B1 (en) * | 2005-06-01 | 2010-03-09 | Rockwell Collins, Inc. | Silicon-based packaging for electronic devices |
DE102006056363B4 (de) * | 2006-11-29 | 2010-12-09 | Infineon Technologies Ag | Halbleitermodul mit mindestens zwei Substraten und Verfahren zur Herstellung eines Halbleitermoduls mit zwei Substraten |
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US9731370B2 (en) | 2013-04-30 | 2017-08-15 | Infineon Technologies Ag | Directly cooled substrates for semiconductor modules and corresponding manufacturing methods |
JPWO2014188632A1 (ja) * | 2013-05-23 | 2017-02-23 | パナソニック株式会社 | 放熱構造を有する半導体装置および半導体装置の積層体 |
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CN106057755B (zh) * | 2016-08-22 | 2018-08-07 | 许恩明 | 一种用于多芯片封装的散热机构 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4320438A (en) * | 1980-05-15 | 1982-03-16 | Cts Corporation | Multi-layer ceramic package |
US4296456A (en) * | 1980-06-02 | 1981-10-20 | Burroughs Corporation | Electronic package for high density integrated circuits |
US4468717A (en) * | 1982-06-09 | 1984-08-28 | Sperry Corporation | Apparatus for cooling integrated circuit chips |
DE3573137D1 (en) * | 1984-10-03 | 1989-10-26 | Sumitomo Electric Industries | Material for a semiconductor device and process for its manufacture |
GB2167906B (en) * | 1984-11-23 | 1988-08-10 | Gec Avionics | Rack mounted circuit module |
EP0346061A3 (en) * | 1988-06-08 | 1991-04-03 | Fujitsu Limited | Integrated circuit device having an improved package structure |
US4980753A (en) * | 1988-11-21 | 1990-12-25 | Honeywell Inc. | Low-cost high-performance semiconductor chip package |
US5053853A (en) * | 1990-05-08 | 1991-10-01 | International Business Machines Corporation | Modular electronic packaging system |
-
1991
- 1991-04-12 KR KR2019910005087U patent/KR940006427Y1/ko not_active Expired - Lifetime
- 1991-05-29 US US07/706,898 patent/US5157588A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
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US5157588A (en) | 1992-10-20 |
KR920020069U (ko) | 1992-11-17 |
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