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KR940001369A - Lead frame - Google Patents

Lead frame Download PDF

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Publication number
KR940001369A
KR940001369A KR1019920011473A KR920011473A KR940001369A KR 940001369 A KR940001369 A KR 940001369A KR 1019920011473 A KR1019920011473 A KR 1019920011473A KR 920011473 A KR920011473 A KR 920011473A KR 940001369 A KR940001369 A KR 940001369A
Authority
KR
South Korea
Prior art keywords
lead
lead frame
chip
dummy
attachment portion
Prior art date
Application number
KR1019920011473A
Other languages
Korean (ko)
Inventor
윤진현
채승헌
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019920011473A priority Critical patent/KR940001369A/en
Publication of KR940001369A publication Critical patent/KR940001369A/en

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  • Lead Frames For Integrated Circuits (AREA)

Abstract

리드 프레임의 사각 형상의 칩 부착부의 타변보다 긴 변의 중심부에서 리드 프레임의 인너 (inner) 리드와는 분리 배치되고 칩에 연결되지 않는 더미 (dummy) 리드 형상부가 상기 칩 부착부의 타변 보다 긴 양변에 연결되어 형성된 구조를 갖는 것을 특징으로 하는 리드 프레임.In the center of the longer side than the other side of the square chip attachment portion of the lead frame, a dummy lead shape that is separated from the inner lead of the lead frame and is not connected to the chip is connected to both sides longer than the other side of the chip attachment portion. Lead frame characterized in that it has a structure formed.

Description

리드 프레임Lead frame

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제3도 내지 제4도는 본 발명의 리드 프레임을 나타낸 도면이다.3 to 4 are views showing the lead frame of the present invention.

Claims (7)

리드 프레임의 사각 형상의 칩 부착부의 타변 보다 긴 변의 중심부에서 리드 프레임의 인너(inner) 리드와는 분리 배치되고, 칩에 연결되지 않는 더미 (dummy) 리드 형상부가 상기 칩 부착부의 타변 보다 긴 양변에 연결되어 형성된 구조를 갖는 것을 특징으로 하는 리드 프레임.A dummy lead shape that is separated from the inner lead of the lead frame and is not connected to the chip is disposed at the center of the longer side than the other side of the rectangular chip attaching portion of the lead frame, and on both sides longer than the other side of the chip attaching portion. A lead frame having a structure formed by being connected. 제1항에 있어서, 리드 프레임의 상기 더미 리드 형상부는 댐바(dambar)와 칩 부착부와의 사이에 배치되어 댐바와 칩부착부와 공히 연결되어 있는 것을 특징으로 하는 리드 프레임.The lead frame according to claim 1, wherein the dummy lead-shaped portion of the lead frame is disposed between the dambar and the chip attaching portion and is connected to the dambar and the chip attaching portion. 제1항에 있어서, 상기 더미 리드 형상부는 칩 부착부의 타변 보다 짧은 단변방향으로 다수개의 확장된 리드들을 갖고 있며 이 리드들은 칩 부착부의 타변보다 긴 장변 방향으로 확장 형성된 리드에 공히 연결된 구조임을 특징으로 하는 리드 프레임.The method of claim 1, wherein the dummy lead shape has a plurality of extended leads in a shorter direction shorter than the other side of the chip attachment portion, the leads are connected to the lead extending in the long side direction longer than the other side of the chip attachment portion Lead frame. 제3항에 있어서, 상기 더미 리드 형상부는 댐바에 적어도 하나 또는 그 이상의 리드로 상호 연결됨을 특징으로 하는 리드 프레임.4. The lead frame of claim 3, wherein the dummy lead features are interconnected by at least one or more leads to a dambar. 리드 프레임의 사각 형상의 칩 부착부의 타변보다 긴 장변의 중심부에서 리드 프레임의 인너 리드와는 분리 배치되고 칩에 연결되지 않으며, 댐바와 상기 칩 부착부 간에 배치되어 있는 더미 리드 형상부가 상기 댐바에 연결되어 있는 것을 특징으로 하는 리드 프레임.At the center of the long side longer than the other side of the rectangular chip attachment portion of the lead frame, a dummy lead shape portion disposed separately from the inner lead of the lead frame and not connected to the chip, and disposed between the dam bar and the chip attachment portion, is connected to the dam bar. Lead frame characterized in that. 제5항에 있어서, 상기 더미 리드 형상부는 칩 부착부의 타변 보다 짧은 단변 방향으로 다수개의 확장된 리드들을 갖고 있으며 이 리드들은 칩 부착부의 타변보다 긴 장변 방향으로 확장 형성된 리드에 공히 연결된 구조임을 특징으로 하는 리드 프레임,The method of claim 5, wherein the dummy lead shape has a plurality of extended leads in a shorter direction than the other side of the chip attachment portion, the leads are connected to the lead extending in the long side direction longer than the other side of the chip attachment portion Lead frame, 제6항에 있어서, 상기 더미 리드 형상부는 댐바에 적어도 하나 또는 그 이상의 리드로 상호 연결됨을 특징으로 하는 리드 프레임.7. The lead frame of claim 6, wherein the dummy lead features are interconnected by at least one or more leads to a dambar. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019920011473A 1992-06-29 1992-06-29 Lead frame KR940001369A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019920011473A KR940001369A (en) 1992-06-29 1992-06-29 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019920011473A KR940001369A (en) 1992-06-29 1992-06-29 Lead frame

Publications (1)

Publication Number Publication Date
KR940001369A true KR940001369A (en) 1994-01-11

Family

ID=67296537

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920011473A KR940001369A (en) 1992-06-29 1992-06-29 Lead frame

Country Status (1)

Country Link
KR (1) KR940001369A (en)

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