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KR930022497A - Epoxy resin composition and resin-sealed semiconductor device sealed with the composition - Google Patents

Epoxy resin composition and resin-sealed semiconductor device sealed with the composition Download PDF

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Publication number
KR930022497A
KR930022497A KR1019920005449A KR920005449A KR930022497A KR 930022497 A KR930022497 A KR 930022497A KR 1019920005449 A KR1019920005449 A KR 1019920005449A KR 920005449 A KR920005449 A KR 920005449A KR 930022497 A KR930022497 A KR 930022497A
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South Korea
Prior art keywords
epoxy resin
weight
resin
composition
epoxy
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KR1019920005449A
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Korean (ko)
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KR950003901B1 (en
Inventor
박세동
조용석
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김충세
고려화학 주식회사
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Priority to KR1019920005449A priority Critical patent/KR950003901B1/en
Publication of KR930022497A publication Critical patent/KR930022497A/en
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Publication of KR950003901B1 publication Critical patent/KR950003901B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

본 발명에서는 에폭시수지 10∼20중량%, 페놀수지5∼15중량%, 실리카 50∼90중량% 및 다관능 에폭시수지 10∼40중량%로 구성된 에폭시수지 조성물 및 수지 밀봉형 반도체 장치에 관한 것이다.The present invention relates to an epoxy resin composition composed of 10 to 20% by weight of epoxy resin, 5 to 15% by weight of phenol resin, 50 to 90% by weight of silica, and 10 to 40% by weight of polyfunctional epoxy resin, and a resin-sealed semiconductor device.

본 발명의 에폭시 수지 조성물은 기존의 에폭시 수지 조성물과 비교하여 탄성률과 내부응력이 낮고, 수지 조성물과 리이드 프레임과의 부착성이 대단히 우수하고 내습성이 뛰어나고 또한 땜납 침비시 고온에서도 팩키지 크랙이 줄어든다. 그리고 상기 에폭시 수지 조성물은 성형성이 양호하기 때문에 수지 밀봉형 반도체 장치 밀봉에 사용하기 적합한 것이다. 상술한 바와 같이, 본 발명의 폭시 수지 조성물은 반도체 산업이 날로 발전하고 있고 팩키지의 양상도 점점 작아지고 박판화되어가고 있는 현상에 비추어 볼때 고밀도 표면 실장형 팩키지 밀봉형으로 적합하다.The epoxy resin composition of the present invention has a lower elastic modulus and internal stress as compared to the conventional epoxy resin composition, has excellent adhesion between the resin composition and the lead frame, excellent moisture resistance, and reduces package cracks even at high temperatures during soldering. The epoxy resin composition is suitable for use in sealing a resin-sealed semiconductor device because of its good moldability. As described above, the epoxy resin composition of the present invention is suitable as a high-density surface mount package sealed type in view of the phenomenon that the semiconductor industry is developing day by day and the aspect of packages is getting smaller and thinner.

Description

에폭시 수지 조성물과 그 조성물로 밀봉된 수지 밀봉형 반도체장치Epoxy resin composition and resin-sealed semiconductor device sealed with the composition

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (8)

에폭시 수지 조성물에 있어서, 에폭시수지10∼20중량%, 페놀수지5∼15중량%, 및 실리카 50∼87중량%로 구성됨을 특징으로 하는 에폭시수지 조성물.Epoxy resin composition comprising 10 to 20% by weight of epoxy resin, 5 to 15% by weight of phenol resin, and 50 to 87% by weight of silica. 제1항에 있어서, 상기 에폭시 조성물에서 하기 식(I)로 표시되는 폴리우레탄 변성고무 수지가 에폭시수지전체 사용량의 40∼80중량%로 포함됨을 특징으로 하는 에폭시 수지 조성물.The epoxy resin composition according to claim 1, wherein the polyurethane-modified rubber resin represented by the following formula (I) is contained in the epoxy composition at 40 to 80% by weight of the total amount of epoxy resin. 상기식에서 n은 1∼3이며, A는 디올을 가진 고무로 부타디엔, 부타디엔 변성체 및 실리콘화합물로서 실리콘의 구조는 하기 식 (Ⅱ)로 표시된다.In the above formula, n is 1 to 3, A is a rubber having a diol, butadiene, butadiene modified body and silicon compound, the structure of silicon is represented by the following formula (II). 여기서, R1∼R4는 서로 같거나 독립해서 다룰 수 있는 것으로 하이드로젠, 탄소수가 1∼3인 알킬기 또는 페닐기, 톨루일, 나프타닐등의 방향족이고, n은 20내지 200이다.Herein, R 1 to R 4 may be the same as or independently of each other, and are hydrogen, an alkyl group having 1 to 3 carbon atoms, or an aromatic group such as phenyl group, toluyl, naphtanyl, and n are 20 to 200. 1항에 있어서, 상기 에폭시 조성물에서 다관능 에폭시수지가 에폭시수지 전체 사용량의 10∼40중량%로 포함됨을 특징으로 하는 에폭시 수지조성물.The epoxy resin composition according to claim 1, wherein the epoxy composition comprises 10 to 40% by weight of the total amount of the epoxy resin. 1항에 있어서, 상기 에폭시 조성물에 알킬페놀을 페놀 전체 사용량의 30∼100중량%로 포함됨을 특징으로 하는 에폭시 수지 조성물.The epoxy resin composition according to claim 1, wherein the epoxy composition contains 30 to 100% by weight of the total amount of the phenol. 에폭시 수지 조성물로 밀봉된 수지밀봉형 반도체 장치에 있어서, 에폭시수지 10∼20중량%, 페놀수지5∼15중량%, 및 실리카 50∼90중량%로 구성되는 에폭시 수지 조성물로 밀봉되는 것을 특징으로 하는 수지 밀봉형 반도체 장치.A resin-sealed semiconductor device sealed with an epoxy resin composition, wherein the resin-sealed semiconductor device is sealed with an epoxy resin composition composed of 10 to 20% by weight of epoxy resin, 5 to 15% by weight of phenol resin, and 50 to 90% by weight of silica. Resin-sealed semiconductor device. 제5항에 있어서 상기 에폭시 조성물에서 하기식(Ⅰ)로 표시되는 폴리우레탄 변성고무 수지가 에폭시수지전체 사용량의 40∼80중량%로 포함됨을 특징으로 하는 수지 밀봉형 반도체 장치.The resin-sealed semiconductor device according to claim 5, wherein the polyurethane-modified rubber resin represented by the following formula (I) is contained in the epoxy composition at 40 to 80% by weight of the total amount of epoxy resin. 상기식에서 n은 1∼3이며, A는 디올을 가진 고무로 부타디엔, 부타이엔 변성체 및 실리콘화합물로서 실리콘의 구조는 하기 식(Ⅱ)로 표시된다.In the above formula, n is 1 to 3, A is a rubber having a diol, butadiene, butadiene modified body and silicon compound, and the structure of silicon is represented by the following formula (II). 여기서, R1∼R4는 서로 같거나 독립해서 다를 수 있는 것으로 하이드로켄, 탄소수가 1∼3인 알킬키 또는 페닐기, 톨루일, 나프타닐등의 방향족이고, n은 20 내지 200이다.Here, R 1 to R 4 may be the same as or different from each other, and may be aromatic, such as a hydrokene, an alkyl key having 1 to 3 carbon atoms, or a phenyl group, toluyl or naphtanyl, and n is 20 to 200. 제5항에 있어서, 상기 에폭시 조성물에서 다관능 에폭시수시가 에폭시수지 전체 사용량의 10∼40중량%로 포함됨을 특징으로 하는 수지 밀봉형 반도체 장치.The resin-sealed semiconductor device according to claim 5, wherein the polyfunctional epoxy resin is contained in the epoxy composition in an amount of 10 to 40% by weight based on the total amount of the epoxy resin. 제5항에 있어서, 상기 에폭시 조성물에 알킬페놀을 페놀 전체 사용량의 30∼100중량%로 포함됨을 특징으로 하는 수지 밀봉형 반도체 장치.6. The resin-sealed semiconductor device according to claim 5, wherein the epoxy composition contains 30 to 100% by weight of the total amount of phenol used in the alkyl composition. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019920005449A 1992-04-01 1992-04-01 Epoxy resin composition and resin-sealed semiconductor device sealed with the composition KR950003901B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019920005449A KR950003901B1 (en) 1992-04-01 1992-04-01 Epoxy resin composition and resin-sealed semiconductor device sealed with the composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019920005449A KR950003901B1 (en) 1992-04-01 1992-04-01 Epoxy resin composition and resin-sealed semiconductor device sealed with the composition

Publications (2)

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KR930022497A true KR930022497A (en) 1993-11-24
KR950003901B1 KR950003901B1 (en) 1995-04-20

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KR1019920005449A KR950003901B1 (en) 1992-04-01 1992-04-01 Epoxy resin composition and resin-sealed semiconductor device sealed with the composition

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