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KR930007907Y1 - Lead flame die bonding apparatus for thickness measurement - Google Patents

Lead flame die bonding apparatus for thickness measurement Download PDF

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Publication number
KR930007907Y1
KR930007907Y1 KR2019900022477U KR900022477U KR930007907Y1 KR 930007907 Y1 KR930007907 Y1 KR 930007907Y1 KR 2019900022477 U KR2019900022477 U KR 2019900022477U KR 900022477 U KR900022477 U KR 900022477U KR 930007907 Y1 KR930007907 Y1 KR 930007907Y1
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South Korea
Prior art keywords
lead frame
die bonding
die
bonding apparatus
thickness
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Expired - Fee Related
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KR2019900022477U
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Korean (ko)
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KR920013693U (en
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박용호
박노명
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금성일렉트론 주식회사
문정환
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7565—Means for transporting the components to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/759—Means for monitoring the connection process

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

내용 없음.No content.

Description

두께측정장치를 구비한 리이드프레임의 다이본딩기Lead Frame Die Bonding Machine with Thickness Measurement Device

제 1 도는 종래 다이본딩기(die bonding m/c)의 정면사진.1 is a front photograph of a conventional die bonding (die bonding m / c).

제 2 도는 본 고안에 따른 두께측정장치의 설치 위치도.2 is an installation position of the thickness measuring device according to the present invention.

제 3 도는 두께측정장치의 일예시도.3 is an exemplary view of a thickness measuring device.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

1 : 스톡로우더(stock loader) 2 : 리이드프레임(leadframe)1: stock loader 2: leadframe

3 : 두께측정장치 4 : 다이본딩장치3: thickness measuring apparatus 4: die bonding apparatus

S : 두께측정장치의 설치위치S: Location of thickness measuring device

본 고안은 리이드프레임의 패들(paddle)에 웨이퍼칩(wafer chip)을 접착시키는 다이본딩기에 관한 것이다.The present invention relates to a die bonding machine for bonding a wafer chip to a paddle of a lead frame.

종래의 리이드프레임 다이본딩기는, 제 1 도의 도면에서와 같이, 리이드프레임(2)의 입력부와, 리이드프레임(2)의 패들에 웨이퍼칩을 접착시키는 다이본딩장치부(4)와, 접착이 완료된 리이드프레임(2)을 다음공정으로 이송시키는 출력부로 이루어진다. 리이드프레임(2)의 입력부에는 접착될 리이드프레임(2)을 저장하는 스톡로우더(1)가 있다.The conventional lead frame die bonding machine, as shown in FIG. 1, has an input portion of the lead frame 2, a die bonding device portion 4 for adhering the wafer chips to the paddle of the lead frame 2, and the bonding is completed. It consists of an output unit for transferring the lead frame 2 to the next process. At the input of the lead frame 2 there is a stock loader 1 for storing the lead frame 2 to be bonded.

다이본딩기가 작동하면, 스톡로우더(1)에 담겨져 있는 리이드프레임(2)이 그라인더(grinder)및 모터롤러(moter toller)에 의해 일매씩 다이본딩장치(4)로 이송된다. 다이본딩장치(4)에서는 스톡로우더(1)로부터 이송되어 온 리이드프레임(2)의 패들에 웨이퍼칩을 접착시킨 후 리이드프레임(2)의 출력부로 전달한다. 접착이 완료된 리이드프레임(2)은 출력부로부터 몰딩등의 후공정으로 넘겨지게 된다.When the die bonding machine is operated, the lead frame 2 contained in the stock loader 1 is transferred to the die bonding apparatus 4 one by one by a grinder and a motor roller. In the die bonding apparatus 4, the wafer chip is adhered to the paddle of the lead frame 2, which is transferred from the stock loader 1, and then transferred to the output unit of the lead frame 2. The lead frame 2, which has been bonded, is handed over from the output to the post process such as molding.

이와 같은 다이본딩기에서는, 스톡로우더(1)에 수용되어 있는 리이드프레임(2)이 그라인더 및 모터롤러에 의해 다이본딩장치(4)로 이송될 때, 1매씩 이송되어야 함에도 불구하고 실제에 있어서는 2매이상이 부착되어 함께 이송되는 경우가 종종 발생한다. 이러한, 경우에는, 당해 리이드프레임(2)에 제품불량이 발생할 뿐만 아니라, 몰딩등의 후공정에서 성형넘침을 일으켜 주위에 있는 제품에까지 불량을 일으키게 할수 있다.In such a die-bonding machine, when the lead frame 2 accommodated in the stock loader 1 is transferred to the die-bonding apparatus 4 by the grinder and the motor roller, in reality, although the lead frame 2 should be conveyed one by one, Often more than one is attached and conveyed together. In such a case, not only the product defect occurs in the lead frame 2, but also the molding overflow may occur in a post-process such as molding to cause defects in the surrounding products.

본 고안은, 상기와 같은 종래의 다이본딩기에서 발생하는 문제점을 해결하기 위하여 안출된 것이다. 상기 문제점을 해결하기 위하여, 본 고안에 따른 다이본딩기에서는, 리이드프레임의 입력부, 즉 스톡로우더(1)와 다이본딩장치 사이에 다이본딩장치로 입력되는 리이드프레임의 두께를 측정할 수 있는 두께측정장치를 구비한다. 이 두께측정장치는 다이본딩장치로 입력되는 리이드프임의 두께가 설정치보다 클때, 즉 리이드프레임이 일매이상 입력될 때, 장치의 정지와 필요에 따라 경보음등의 발생을 위한 에러출력신호를 발한다. 이에 의하여, 기계의 정지 및 작업자의 조치가 행하여 지게 되어, 복수의 리이드프레임이 입력되는 것을 방지할 수 있다.The present invention is devised to solve the problems occurring in the conventional die bonding machine as described above. In order to solve the above problems, in the die bonding machine according to the present invention, the thickness measurement that can measure the thickness of the lead frame input to the lead frame, that is, the lead frame input between the stock loader (1) and the die bonding apparatus With a device. When the thickness of the lead frame input to the die-bonding device is larger than the set value, that is, when one or more lead frames are input, the thickness measuring device issues an error output signal for stopping the device and generating an alarm sound, if necessary. As a result, stop of the machine and measures of the operator are performed, and it is possible to prevent the plurality of lead frames from being input.

제 2 도는, 본 고안에 따라 리이드프레임(2)의 두께측정장치(3)를 설치할 위치를 나타낸 것이다. 이 도면에서 "S"로 표시되어 있는 바와같이, 리이드프레임(2)의 두께측정장치(3)는, 리이드프레임(2)입력부의 스톡로우더(1)와 다이본딩장치(4)사이에 설치된다. 그리고 제 3 도는 광학식 측정센서를 구비한 두께측정장치(S)의 일예를 도시한 것이다. 두께측정장치(3)는 입력되는 리이드프레임(2)의 두께를 측정할 수 있는 두께측정센서와 이 센서의 감지결과에 따라 에러신호를 발할 수 있는 도시않은 출력부를 구비한다. 두께측정장치(3)의 에러신호는 다이본딩장치(4)로 입력되는 리이드프레임(2)의 두께가 설정치보다 두꺼울 때, 이송을 정지시키는 신호 혹은 이와 동시에 그것을 작업자에게 경고하는 신호이다. 따라서, 두께측정장치(3)의 출력부는, 간단한 전기적회로로 이루어진 제어기로 구성할 수 있지만, 센서의 감지량과 설정치를 비교하고, 비교의 결과에 따라 에러신호를 발하여 다이본딩장치(4)를 제어할 수 있는 PC 제어부로 구성될 수도 있다.2 shows the position where the thickness measuring device 3 of the lead frame 2 is to be installed according to the present invention. As indicated by "S" in this figure, the thickness measuring device 3 of the lead frame 2 is provided between the stock loader 1 and the die bonding device 4 of the lead frame 2 input unit. . 3 shows an example of a thickness measuring device S equipped with an optical measuring sensor. The thickness measuring device 3 includes a thickness measuring sensor capable of measuring the thickness of the lead frame 2 to be input, and an output unit not shown, which can emit an error signal according to the detection result of the sensor. The error signal of the thickness measuring device 3 is a signal for stopping the transfer when the thickness of the lead frame 2 input to the die bonding device 4 is thicker than a set value or a signal for warning the worker at the same time. Therefore, although the output part of the thickness measuring apparatus 3 can be comprised by the controller which consists of a simple electrical circuit, it compares the sensing amount of a sensor with a setting value, and issues an error signal according to the result of a comparison, and connects the die bonding apparatus 4 to it. It may be configured as a PC control unit that can be controlled.

이와같은 본 고안의 다이본딩기에서는, 스톡로우더(1)에 저장되어 있는 리이드프레임(2)이 그라인더 및 모터롤러에 의해 다이본딩장치(4)로 이송될 때, 스톡로우더(1)와 다이본딩장치(4)사이에 설치되어 있는 두께측정장치(3)의 센서에 의해 입력되는 리이드프레임(2)의 두께가 측정된다. 측정된 리이드프레임(2)의 두께는 두께측정장치(3)에 의해 설정치와 비교되며, 비교의 결과 설정치와 일치할때, 즉 리이드프레임(2)이 일매만이 이송되고 있을 경우에는, 그 이송을 그대로 유지시켜 다이본딩장치(4)가 정상적인 작업을 할 수 있도록 한다. 비교의 결과가 설정치와 다를 때, 즉 복수의 리이드프레임(2)이 이송되고 있는 경우에는, 에러신호를 발하여 리이드프레임(2)의 이송을 정지시키고, 필요에 따라서는, 작업자에게 경보음 내지는 경보등을 통해 이를 알린다. 이에 의해, 리이드프레임(2)의 이송은 일단 정지하고 작업자에 의해 적절히 조치된 후에 다시 작업이 계속된다.In such a die bonding machine of the present invention, when the lead frame 2 stored in the stock loader 1 is transferred to the die bonding apparatus 4 by the grinder and the motor roller, the die bonding device and die bonding with the stock loader 1 The thickness of the lead frame 2 input by the sensor of the thickness measuring device 3 provided between the devices 4 is measured. The measured thickness of the lead frame 2 is compared with the set value by the thickness measuring device 3, and when the result of the comparison coincides with the set value, that is, when only one sheet of the lead frame 2 is being transferred, Maintaining it as it is so that the die bonding apparatus 4 can perform a normal operation. When the result of the comparison is different from the set value, that is, when the plurality of lead frames 2 are being conveyed, an error signal is issued to stop the conveyance of the lead frames 2 and, if necessary, an alarm sound or an alarm to the operator. Inform them via Thereby, the conveyance of the lead frame 2 is stopped once, and work is continued again after it is suitably taken by an operator.

따라서, 본 고안에 따른 다이본딩기에 의하여, 복수의 리이드프레임(2)이 다이본딩장치(4)로 이송되는 것을 확실하게 방지할 수 있다.Therefore, the die bonding machine according to the present invention can reliably prevent the plurality of lead frames 2 from being transferred to the die bonding apparatus 4.

본 고안에 따른 다이본딩기에 사용될 수 있는 두께측정장치(3)의 센서는, 도시한 실시예에서 광학적 컴퍼레이터(comparator)가 채용되어 있지만(제 3 도 참조), 전술의 목적을 달성할 수 있는 것이라면 이에 한하지 않고 모두 적용가능하다. 예를들어, 스핀들형이나 레버형의 다이알게이지나 올도테스터(orthotester)와 같은 기계적 컴퍼레이터, 기체나 액체를 이용하는 유체컴퍼레이터, 또는 저항형, 유도형 혹은 용량형등의 전기적컴퍼레이터도 적용될 수 있다. 그러나, 리이드프레임(2)의 보호에 만전을 기하고자 할 경우에는 도시된 실시예의 경우와 같은 무접촉방식의 광학적 센서를 채용하는 것이 바람직하다.The sensor of the thickness measuring apparatus 3 which can be used in the die bonding machine according to the present invention is an optical comparator in the illustrated embodiment (see FIG. 3), but can achieve the above object. If so, all of them are applicable. For example, a mechanical comparator such as a spindle or lever type die gauge or an ordhotester, a fluid comparator using a gas or a liquid, or an electrical comparator such as a resistive, inductive or capacitive type may also be applied. Can be. However, in order to ensure the protection of the lead frame 2, it is preferable to employ a contactless optical sensor as in the case of the illustrated embodiment.

이상과 같이, 본 고안에 따라 리이드프레임(2)의 다이본딩기에 리이드프레임(2)의 두께측정장치(3)를 채용함으로써, 복수의 리이드프레임(2)이 다이본딩장치(4)로 이송되는 것을 확실하게 방지하여 그에 따라 발생할 수 있는 제품불량, 공정지연등의 문제를 완전히 없앨 수 있다.As described above, by employing the thickness measuring device 3 of the lead frame 2 in the die bonding device of the lead frame 2 according to the present invention, the plurality of lead frames 2 are transferred to the die bonding device 4 It can prevent the product defect, process delay, etc., which can occur accordingly.

Claims (1)

리이드프레임(2)을 저장하는 스톡로우더(1)와 스톡로우더(1)로부터 리이드프레임(2)을 이송하는 이송기구를 가진 리이드프레임입력부와 상기 입력부로부터 이송된 리이드프레임(2)의 패들에 웨이퍼칩을 접착시키는 다이본딩장치부(4)와, 접착이 완료된 리이드프레임(2)의 출력부로 이루어진 다이본딩기에 있어서, 상기 스톡로우더(1)와 상기 다이본딩장치(4)사이에, 이송되고 있는 리이드프레임(2)의 두께를 검출하고 검출된 양을 설정치와 비교하여 복수의 리이드프레임(2)이 이송되고 있는 경우에 리이드프레임(2)의 이송정지를 위한 출력신호, 또는 이와함께 경보신호를 발하는 두께측정장치(3)가 설치되어 있는 것을 특징으로 하는 리이드프레임의 다이본딩기.A wafer on a paddle of a lead frame input unit having a stock loader 1 for storing the lead frame 2 and a transfer mechanism for transferring the lead frame 2 from the stock loader 1 and the lead frame 2 transferred from the input unit In the die bonding machine which consists of the die-bonding apparatus part 4 which adhere | attaches a chip | tip, and the output part of the lead frame 2 with which adhesion | attachment was completed, it is conveyed between the stock loader 1 and the die-bonding apparatus 4. When the thickness of the lead frame 2 is detected and the detected amount is compared with the set value, an output signal for stopping the transfer of the lead frame 2 or an alarm signal is issued when the lead frames 2 are being transferred. Die-bonding machine for lead frame, characterized in that the thickness measuring device (3) is provided.
KR2019900022477U 1990-12-31 1990-12-31 Lead flame die bonding apparatus for thickness measurement Expired - Fee Related KR930007907Y1 (en)

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Application Number Priority Date Filing Date Title
KR2019900022477U KR930007907Y1 (en) 1990-12-31 1990-12-31 Lead flame die bonding apparatus for thickness measurement

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Application Number Priority Date Filing Date Title
KR2019900022477U KR930007907Y1 (en) 1990-12-31 1990-12-31 Lead flame die bonding apparatus for thickness measurement

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KR920013693U KR920013693U (en) 1992-07-27
KR930007907Y1 true KR930007907Y1 (en) 1993-11-24

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KR20220104339A (en) * 2021-01-18 2022-07-26 진민지 Sloped mold prefabricated pedestal

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KR20220104339A (en) * 2021-01-18 2022-07-26 진민지 Sloped mold prefabricated pedestal

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