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KR920013230A - 와이어 본딩 시스템 - Google Patents

와이어 본딩 시스템 Download PDF

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Publication number
KR920013230A
KR920013230A KR1019910023125A KR910023125A KR920013230A KR 920013230 A KR920013230 A KR 920013230A KR 1019910023125 A KR1019910023125 A KR 1019910023125A KR 910023125 A KR910023125 A KR 910023125A KR 920013230 A KR920013230 A KR 920013230A
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South Korea
Prior art keywords
wire bonding
wire
data
coupler
storage means
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KR1019910023125A
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KR100236665B1 (ko
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겐스케 사와세
히로미 오가타
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사토 겐이치로
롬 가부시키가이샤
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K15/00—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers
    • G06K15/02—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers using printers
    • G06K15/12—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers using printers by photographic printing, e.g. by laser printers
    • G06K15/1238—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers using printers by photographic printing, e.g. by laser printers simultaneously exposing more than one point
    • G06K15/1242—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers using printers by photographic printing, e.g. by laser printers simultaneously exposing more than one point on one main scanning line
    • G06K15/1247—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers using printers by photographic printing, e.g. by laser printers simultaneously exposing more than one point on one main scanning line using an array of light sources, e.g. a linear array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Wire Bonding (AREA)

Abstract

내용 없음

Description

와이어 본딩 시스템
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1실시예에 관계된 와이어 본딩 시스템의 구성을 나타낸 블럭도, 제2도는 제1도에 있어서 메모리(12)의 기억 내용을 나타낸 도면.

Claims (20)

  1. 와이어 본딩부위를 결정하는 결정수단과, 결정된 와이어 본딩부위를 데이터로서 기억하는 기억수단과, 상기 데이터에 의거하여 와이어본딩을 실행하는 와이어결합기를 구비하여 구성된 것을 특징으로 하는 와이어 본딩 시스템.
  2. 제1항에 있어서, 상기 기억수단이 반도체 메모리인 것을 특징으로 하는 와이어본딩 시스템.
  3. 제2항에 있어서, 반도체 메모리와 와이어결합기와의 사이를 접속하고, 해당 반도체 메모리에 기억되어 있는 데이터를 와이어결합기로 전송하기 위한 통신회선을 구비한 것을 특징으로 하는 와이어 본딩 시스템.
  4. 제3항에 있어서, 반도체 메모리로 부터 데이터를 송신하기 위한 인터페이스인 I/O 포트를 구비한 것을 특징으로 하는 와이어 본딩 시스템.
  5. 제1항에 있어서, 와이어결합기는 상기 기억수단에서 데이터를 받아 기억하는 제2기억수단을 갖는 것을 특징으로 하는 와이어 본딩 시스템.
  6. 제5항에 있어서, 와이어결합기는 제2기억수단에서 데이터를 판독하여 와이어본딩을 실행하는 프로세서를 구비한 것을 특징으로 하는 와이어 본딩 시스템.
  7. 제1항에 있어서, 상기 기억수단은 디스크 메모리에 데이터를 기록하는 디스크 드라이브인 것을 특징으로 하는 와이어 본딩 시스템.
  8. 제7항에 있어서, 와이어결합기는 상기 디스크드라이브에 의해 디스크메모리에 기록된 데이터를 판독하는 제2디스크드라이브를 구비한 것을 특징으로 하는 와이어 본딩 시스템.
  9. 제8항에 있어서, 와이어결합기는 제2디스크드라이브에서 데이터를 판독하여 와이어본딩을 실행하는 프로세서를 구비한 것을 특징으로 하는 와이어 본딩 시스템.
  10. 제1항에 있어서, 기억수단에 내장되는 데이터는 와이어본딩의 대상으로 될 수 있는 복수의 본딩패드에 대해서, 실제로 와이어본딩을 할 것인가에 대한 여부를 나타내는 두개의 값을 가진 데이터를 포함하는 것을 특징으로 하는 와이어 본딩 시스템.
  11. 제1항에 있어서, 기억수단에 내장되는 데이터는 와이어본딩의 대상으로 될 수 있는 복수의 본딩패드를 그룹으로 나누고, 또한 각 그룹을 서로 식별하기 위한 데이터를 포함하는 것을 특징으로 하는 와이어 본딩 시스템.
  12. 제1항에 있어서, 결정수단은 와이어본딩의 대상으로 될 수 있는 복수의 본딩패드를 포함하는 1개의 그룹에 대해서, 해당 그룹에 포함되는 복수의 본딩패드에 본딩을 행할지의 여부를 결정하는 수단과, 상기 그룹마다의 결정을 모든 그룹에 대해 실행시키는 수단을 구비한 것을 특징으로 하는 와이어 본딩 시스템.
  13. 제1항에 있어서, 결정수단은 기판표면에 형성된 복수의 본딩패드중에 소정의 복수의 본딩패드에 대해 각각 본딩할 것인가의 여부를 결정하는 것을 특징으로 하는 와이어 본딩 시스템.
  14. 제13항에 있어서, 결정수단은 복수의 기판이 수납되어 있는 매거진에서 기판을 꺼내어 본딩할 것인가에 대한 여부를 결정하는 대상으로 하는 것을 특징으로 하는 와이어 본딩 시스템.
  15. 제14항에 있어서, 기억수단은 결정수단에 의한 기판의 취출순서로 상기 데이터를 기억하는 것을 특징으로 하는 와이어 본딩 시스템.
  16. 제15항에 있어서, 와이어결합기는 결정수단에 의한 기판의 취출순서와 같은 순서로 상기 매거진에서 기판을 취출하여 해당순서로 와이어본딩을 행하는 것을 특징으로 하는 와이어 본딩 시스템.
  17. LED어레이를 포함하는 LED헤드용의 기판 표면에 형성된 복수의 본딩 패드중에 소정의 복수 본딩패드에 대해서 LED어레이의 광량을 검출하면서 각각 본딩할지에 대한 여부를 결정함으로써 와이어본딩 부위를 결정하는 광량조정장치와, 결정된 와이어 본딩 부위를 데이터로서 기억하는 기억수단과, 상기 데이터에 의거하여 와이어 본딩을 실행하는 와이어결합기로 구성된 것을 특징으로 하는 LED헤드용 와이어 본딩 시스템.
  18. 와이어 본딩 부위를 나타내는 데이터를 입력하는 수단과, 입력된 데이터에 의거하여 와이어본딩을 실행하는 수단으로 구성된 것을 특징으로 하는 와이어결합기.
  19. 제18항에 있어서, 상기 입력수단은 통신회선으로부터 데이터를 기억하는 메모리이며, 와이어결합기는 메모리에서 데이터를 판독하여 와이어본딩을 실행하는 프로세서를 구비한 것을 특징으로 하는 와이어결합기.
  20. 제18항에 있어서, 상기 입력수단은 디스크메모리에서 데이터를 판독하는 디스크드라이브이며, 와이어결합기는 디스크드라이브에서 데이터를 판독하여 와이어 본딩을 실행하는 프로세서를 구비한 것을 특징으로 하는 와이어결합기.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910023125A 1990-12-21 1991-12-16 와이어 본딩 시스템 KR100236665B1 (ko)

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Application Number Priority Date Filing Date Title
JP90-413173 1990-12-21
JP2413173A JP2701991B2 (ja) 1990-12-21 1990-12-21 ワイヤボンダ

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KR920013230A true KR920013230A (ko) 1992-07-28
KR100236665B1 KR100236665B1 (ko) 2000-01-15

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US (1) US5199629A (ko)
EP (1) EP0493016B1 (ko)
JP (1) JP2701991B2 (ko)
KR (1) KR100236665B1 (ko)
DE (1) DE69117474T2 (ko)
TW (1) TW315043U (ko)

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US20060140233A1 (en) * 2004-12-28 2006-06-29 Jesse Chin Laser driver with integrated bond options for selectable currents

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JPS61104566U (ko) * 1984-12-14 1986-07-03
US4870325A (en) * 1985-12-18 1989-09-26 William K. Wells, Jr. Ornamental light display apparatus
JPS62179123A (ja) * 1986-01-31 1987-08-06 Toshiba Corp ワイヤボンデイング装置
JPS6362241A (ja) * 1986-09-02 1988-03-18 Toshiba Corp ワイヤボンデイング方法
JPS6386532A (ja) * 1986-09-30 1988-04-16 Toshiba Corp ワイヤボンデイング装置
JPH0664691B2 (ja) * 1986-10-11 1994-08-22 日本ケミコン株式会社 磁気ヘッド用コアの加工方法
JPH06105675B2 (ja) * 1987-09-17 1994-12-21 松下電器産業株式会社 平坦なレジスト膜の形成方法
JPH0787196B2 (ja) * 1987-12-23 1995-09-20 株式会社新川 ボンデイング方法

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DE69117474T2 (de) 1996-07-11
KR100236665B1 (ko) 2000-01-15
EP0493016A3 (en) 1993-01-13
JP2701991B2 (ja) 1998-01-21
EP0493016A2 (en) 1992-07-01
EP0493016B1 (en) 1996-02-28
JPH04221838A (ja) 1992-08-12
TW315043U (en) 1997-09-01
US5199629A (en) 1993-04-06
DE69117474D1 (de) 1996-04-04

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