KR920012263A - 특이 디히드록시메틸 포스핀 옥사이드 유효량을 갖는 난연성 에폭시 수지 조성물 및 그의 생성방법 - Google Patents
특이 디히드록시메틸 포스핀 옥사이드 유효량을 갖는 난연성 에폭시 수지 조성물 및 그의 생성방법 Download PDFInfo
- Publication number
- KR920012263A KR920012263A KR1019910022028A KR910022028A KR920012263A KR 920012263 A KR920012263 A KR 920012263A KR 1019910022028 A KR1019910022028 A KR 1019910022028A KR 910022028 A KR910022028 A KR 910022028A KR 920012263 A KR920012263 A KR 920012263A
- Authority
- KR
- South Korea
- Prior art keywords
- resin composition
- phosphine oxide
- weight
- dihydroxymethyl
- epoxy resin
- Prior art date
Links
- UOODTIXQSIWURU-UHFFFAOYSA-N OC(O)[PH2]=O Chemical compound OC(O)[PH2]=O UOODTIXQSIWURU-UHFFFAOYSA-N 0.000 title claims 10
- 239000003822 epoxy resin Substances 0.000 title claims 5
- 239000000203 mixture Substances 0.000 title claims 5
- 229920000647 polyepoxide Polymers 0.000 title claims 5
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title claims 2
- 239000003063 flame retardant Substances 0.000 title claims 2
- 238000004519 manufacturing process Methods 0.000 title claims 2
- 239000011342 resin composition Substances 0.000 claims 14
- 125000000217 alkyl group Chemical group 0.000 claims 6
- 238000000034 method Methods 0.000 claims 6
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 4
- 125000002947 alkylene group Chemical group 0.000 claims 4
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims 4
- 229910052794 bromium Inorganic materials 0.000 claims 4
- 229910052698 phosphorus Inorganic materials 0.000 claims 4
- 239000011574 phosphorus Substances 0.000 claims 4
- OZEIKKSJNYAJPR-UHFFFAOYSA-N [hydroxymethyl(2-methylpropyl)phosphoryl]methanol Chemical group CC(C)CP(=O)(CO)CO OZEIKKSJNYAJPR-UHFFFAOYSA-N 0.000 claims 2
- FLCUXRQEJUPWHI-UHFFFAOYSA-N [tert-butyl(hydroxymethyl)phosphoryl]methanol Chemical compound CC(C)(C)P(=O)(CO)CO FLCUXRQEJUPWHI-UHFFFAOYSA-N 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- XWSQLOKESIKBIA-UHFFFAOYSA-N [hydroxymethyl(methyl)phosphoryl]methanol Chemical compound OCP(=O)(C)CO XWSQLOKESIKBIA-UHFFFAOYSA-N 0.000 claims 1
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 claims 1
- YACKEPLHDIMKIO-UHFFFAOYSA-N methylphosphonic acid Chemical compound CP(O)(O)=O YACKEPLHDIMKIO-UHFFFAOYSA-N 0.000 claims 1
- MPQXHAGKBWFSNV-UHFFFAOYSA-N oxidophosphanium Chemical class [PH3]=O MPQXHAGKBWFSNV-UHFFFAOYSA-N 0.000 claims 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4071—Curing agents not provided for by the groups C08G59/42 - C08G59/66 phosphorus containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5397—Phosphine oxides
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Fireproofing Substances (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
Description
Claims (15)
- 에폭시 수지, 경화제 및 하기 일반식을 갖는 적어도 하나의 디히드록시메틸 포스핀 옥사이드 유효량으로 구성되는, 난연성을 갖는 에폭시 수지 조성물:(상기식에서, R은 C1-약 C8인 알킬기 또는, R'가 C2-약 C8인 알킬렌기를 나타내는 R'OH기를 나타낸다)
- 제1항에 있어서, R은 C1-약 C4인 알킬기이고, R'는 C2-약 C4인 알킬렌기인 수지 조성물.
- 제1항에 있어서, 디히드록시메틸 포스핀 산화물이, 이소부틸-비스(히드록시메틸)포스핀 옥사이드, t-부틸-비스(히드록시메틸)포스핀 옥사이드, 메틸-비스(히드록시메틸)포스핀 옥사이드 및 그의 혼합물들로 구성되는 군으로부터 선택되는 수지 조성물.
- 제1항에 있어서, 인 함량이 수지 조성물의 중량 기준으로 0.01-5중량%범위로 제공되는 양으로, 디히드록시메틸 포스핀 옥사이드가 존재하는 수지 조성물.
- 제4항에 있어서, 인 함량이 수지 조성물의 중량 기준으로 0.05-2중량%범위로 제공되는 양으로, 디히드록 시메틸 포스핀 옥사이드가 존재하는 수지 조성물.
- 제1항에 있어서, 수지 조성물의 중량기준으로 브롬 약 1.0-약 30중량%를 포함함을 특징으로 하는 수지 조성물.
- 제6항에 있어서, 수지 조성물의 중량 기준으로 브롬 약 2-약 11중량%를 포함함을 특징으로 하는 수지 조성물.
- 에폭시 수지, 경화제 및 하기 일반식을 갖는 적어도 하나의 디히드록시메틸 포스핀 옥사이드 유효량을 반응시키는 것으로 구성되는 난연성을 가진 에폭시 수지 조성물의 생성방법:(상기식에서, R은 C1-약 C8인 알킬기 또는, R'가 C2-약 C8인 알킬렌기를 나타내는 R'OH기를 나타낸다)
- 제8항에 있어서, R은 C1-약 C4인 알킬기이고, R'는 C2-약 C4인 알킬렌기인 방법.
- 제9항에 있어서, 디히드록시메틸 포스핀 옥사이드가, 이소부틸-비스(히드록시메틸)포스핀 옥사이드, t-부틸-비스(히드록시메틸)포스핀 옥사이드, 메틸-비스(히드록시메틸)포스핀 옥사이드 및 그의 혼합물들로 구성되는 군으로부터 선택되는 방법.
- 제8항에 있어서, 인 함량이 수지 조성물의 중량 기준으로 0.01-5중량% 범위로 제공되는 양으로, 디히드록시메틸 포스핀 옥사이드가 존재하는 방법.
- 제11항에 있어서, 인 함량이 수지 조성물의 중량 기준으로 0.05-2중량% 범위로 제공되는 양으로 디히드록시메틸 포스핀 옥사이드가 존재하는 방법.
- 제8항에 있어서, 수지 조성물의 중량 기준으로 브롬 약1.0-약 30중량%를 포함함을 특징으로 하는 방법.
- 제13항에 있어서, 수지 조성물의 중량기준으로 브롬 약 2-약 11중량%를 포함함을 특징으로 하는 방법.
- 제8항의 방법에 의해 생성된 생성물.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/626,508 | 1990-12-12 | ||
US07/626,508 US5084546A (en) | 1990-12-12 | 1990-12-12 | Fire retardant epoxy resin compositions containing methylol substituted phosphine oxides |
Publications (1)
Publication Number | Publication Date |
---|---|
KR920012263A true KR920012263A (ko) | 1992-07-25 |
Family
ID=24510665
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019910022028A KR920012263A (ko) | 1990-12-12 | 1991-12-03 | 특이 디히드록시메틸 포스핀 옥사이드 유효량을 갖는 난연성 에폭시 수지 조성물 및 그의 생성방법 |
Country Status (7)
Country | Link |
---|---|
US (1) | US5084546A (ko) |
EP (1) | EP0490065B1 (ko) |
JP (1) | JPH04306254A (ko) |
KR (1) | KR920012263A (ko) |
AT (1) | ATE165858T1 (ko) |
CA (1) | CA2057356A1 (ko) |
DE (1) | DE69129359D1 (ko) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1167124C (zh) | 1999-06-15 | 2004-09-15 | 住友电木株式会社 | 半导体封装用的环氧树脂模制材料、其产生方法和使用该材料的半导体器件 |
JP4568937B2 (ja) * | 2000-01-17 | 2010-10-27 | 住友ベークライト株式会社 | 難燃性樹脂組成物、これを用いたプリプレグ及び積層板 |
TW587094B (en) | 2000-01-17 | 2004-05-11 | Sumitomo Bakelite Co | Flame-retardant resin composition comprising no halogen-containing flame retardant, and prepregs and laminates using such composition |
EP2379643B1 (en) | 2008-12-17 | 2012-11-14 | Basf Se | Layered silicate flame retardant compositions |
EP2382265B1 (en) | 2008-12-29 | 2012-10-31 | Basf Se | Dopo-flame retardant in epoxy resins |
KR20130026520A (ko) | 2010-05-07 | 2013-03-13 | 바스프 에스이 | 아미노구아니딘페닐포스피네이트 난연제 조성물 |
WO2012013652A1 (en) | 2010-07-28 | 2012-02-02 | Basf Se | Phosphinic acid hydrazide flame retardant compositions |
WO2012013565A1 (en) | 2010-07-29 | 2012-02-02 | Basf Se | Phosphinic acid hydrazide flame retardant compositions |
WO2013174791A1 (en) | 2012-05-22 | 2013-11-28 | Basf Se | Phosphinyliminophosphoranes as flame retardants |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2916473A (en) * | 1955-06-17 | 1959-12-08 | Austin L Bullock | Methylol-phosphorus modified epoxy resins |
US3666543A (en) * | 1969-11-24 | 1972-05-30 | Ludwig Maier | Tris-(2-hydroxyalkyl)-phosphine oxide flame retardant articles |
US3925265A (en) * | 1970-11-12 | 1975-12-09 | Hooker Chemicals Plastics Corp | Methyl phosphine oxides as flame retardants for organic polymers |
US4345059A (en) * | 1981-05-18 | 1982-08-17 | Fmc Corporation | Fire retardant epoxy resins containing 3-hydroxyalkylphosphine oxides |
GB8704240D0 (en) * | 1987-02-24 | 1987-04-01 | Albright & Wilson | Phosphine oxides |
ATE145222T1 (de) * | 1989-08-11 | 1996-11-15 | Siemens Ag | Flammwidrige giessharzformstoffe |
-
1990
- 1990-12-12 US US07/626,508 patent/US5084546A/en not_active Expired - Fee Related
-
1991
- 1991-10-21 DE DE69129359T patent/DE69129359D1/de not_active Expired - Lifetime
- 1991-10-21 EP EP91117902A patent/EP0490065B1/en not_active Expired - Lifetime
- 1991-10-21 AT AT91117902T patent/ATE165858T1/de not_active IP Right Cessation
- 1991-12-03 KR KR1019910022028A patent/KR920012263A/ko not_active Application Discontinuation
- 1991-12-09 JP JP3349427A patent/JPH04306254A/ja active Pending
- 1991-12-10 CA CA002057356A patent/CA2057356A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US5084546A (en) | 1992-01-28 |
CA2057356A1 (en) | 1992-06-13 |
EP0490065B1 (en) | 1998-05-06 |
JPH04306254A (ja) | 1992-10-29 |
EP0490065A2 (en) | 1992-06-17 |
DE69129359D1 (de) | 1998-06-10 |
EP0490065A3 (en) | 1992-11-25 |
ATE165858T1 (de) | 1998-05-15 |
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Legal Events
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PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19911203 |
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A201 | Request for examination | ||
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 19961203 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 19911203 Comment text: Patent Application |
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PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 19981127 Patent event code: PE09021S01D |
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PE0601 | Decision on rejection of patent |
Patent event date: 19990219 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 19981127 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |