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KR920010258A - 리드프레임 반송장치 - Google Patents

리드프레임 반송장치 Download PDF

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Publication number
KR920010258A
KR920010258A KR1019910021882A KR910021882A KR920010258A KR 920010258 A KR920010258 A KR 920010258A KR 1019910021882 A KR1019910021882 A KR 1019910021882A KR 910021882 A KR910021882 A KR 910021882A KR 920010258 A KR920010258 A KR 920010258A
Authority
KR
South Korea
Prior art keywords
lead frame
detection
leadframe
loader
predetermined position
Prior art date
Application number
KR1019910021882A
Other languages
English (en)
Other versions
KR950013736B1 (ko
Inventor
미찌오 요네모도
마사유끼 시무라
Original Assignee
아라이 가즈오
가부시끼가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아라이 가즈오, 가부시끼가이샤 신가와 filed Critical 아라이 가즈오
Publication of KR920010258A publication Critical patent/KR920010258A/ko
Application granted granted Critical
Publication of KR950013736B1 publication Critical patent/KR950013736B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Control Of Conveyors (AREA)
  • Special Conveying (AREA)
  • Sorting Of Articles (AREA)
  • Feeding Of Articles To Conveyors (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)

Abstract

내용 없음

Description

리드프레임 반송장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 1실시예를 도시한 개략 평면도.
제2도는 제1도의 로우더주변의 개략 정면도.
제3도는 본 발명의 실시예의 주요부를 도시한 것으로서, (a)는 평면도, (b)는 정면도, (c)는 우측도면.

Claims (1)

  1. 로우더로부터 푸셔로 리드프레임을 피이더레일로 보내는 리드프레임 반송장치에 있어서, 상기 로우더와 상기 피이더레일 사이에 2개의 광학식 검출 센서가 리드프레임의 양쪽단부쪽에 설치되고, 상기 푸셔는 상기 검출센서에 의한 검출위치에 리드프레임의 제1의 소정위치를 보낸후에 제2의 소정위치를 보내는 구성으로 되어있고, 상기 검출센서에 의하여 리드프레임의 비대칭 형상부분을 동시에 확인하여 표리 및 정역를 검출하는 것을 특징으로 하는 리드프레임 반송장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.
KR1019910021882A 1990-11-30 1991-11-30 리드프레임 반송장치 KR950013736B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2-336611 1990-11-30
JP90-336611 1990-11-30
JP2336611A JP2794486B2 (ja) 1990-11-30 1990-11-30 リードフレーム搬送装置

Publications (2)

Publication Number Publication Date
KR920010258A true KR920010258A (ko) 1992-06-26
KR950013736B1 KR950013736B1 (ko) 1995-11-15

Family

ID=18300951

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910021882A KR950013736B1 (ko) 1990-11-30 1991-11-30 리드프레임 반송장치

Country Status (3)

Country Link
US (1) US5208464A (ko)
JP (1) JP2794486B2 (ko)
KR (1) KR950013736B1 (ko)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH071784A (ja) * 1993-04-14 1995-01-06 Agfa Gevaert Nv 熱印刷装置における染料供与体材料の種類の検知
JP3225334B2 (ja) * 1995-06-14 2001-11-05 株式会社新川 リードフレームの検出装置
US5836454A (en) * 1996-01-17 1998-11-17 Micron Technology, Inc. Lead frame casing
US5629126A (en) * 1996-06-17 1997-05-13 Hewlett-Packard Company Phosphor film composition having sensitivity in the red for use in image capture
KR100506801B1 (ko) * 1998-05-26 2005-11-03 삼성전자주식회사 리드프레임을 식별할 수 있는 리드프레임 공급장치
EP1349199A1 (de) * 2002-03-28 2003-10-01 Esec Trading S.A. Einrichtung für die Montage von Halbleiterchips
DE10310262A1 (de) 2002-03-28 2003-10-23 Esec Trading Sa Einrichtung für die Montage von Halbleiterchips
CN103295942A (zh) * 2012-02-28 2013-09-11 无锡华润安盛科技有限公司 引线框阵列的上料系统
KR101364502B1 (ko) * 2012-07-16 2014-02-20 (주)아이콘 카메라 렌즈용 스페이서 두께 측정 장치
TWI489567B (zh) * 2013-04-26 2015-06-21 Gallant Micro Machining Co Ltd With the wafer under the bonding device
KR101471024B1 (ko) * 2013-06-12 2014-12-09 (주)아이콘 카메라 렌즈용 스페이서 두께 측정 장치
CN110271854B (zh) * 2019-06-06 2022-05-03 深圳市时代高科技设备股份有限公司 输送装置的物料输送方法及装置与存储介质
KR102660884B1 (ko) * 2021-04-02 2024-04-26 엘지전자 주식회사 전송 전력 제어

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5729310A (en) * 1980-07-28 1982-02-17 Kitagawa Ind Co Ltd Lower end part structure of furniture leg
US4736108A (en) * 1986-07-29 1988-04-05 Santana Engineering Systems Apparatus and method for testing coplanarity of semiconductor components
US4929845A (en) * 1989-02-27 1990-05-29 At&T Bell Laboratories Method and apparatus for inspection of substrates

Also Published As

Publication number Publication date
KR950013736B1 (ko) 1995-11-15
JP2794486B2 (ja) 1998-09-03
JPH04206745A (ja) 1992-07-28
US5208464A (en) 1993-05-04

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