[go: up one dir, main page]

KR920003498A - 반도체 제조장치 - Google Patents

반도체 제조장치 Download PDF

Info

Publication number
KR920003498A
KR920003498A KR1019910012221A KR910012221A KR920003498A KR 920003498 A KR920003498 A KR 920003498A KR 1019910012221 A KR1019910012221 A KR 1019910012221A KR 910012221 A KR910012221 A KR 910012221A KR 920003498 A KR920003498 A KR 920003498A
Authority
KR
South Korea
Prior art keywords
supply
section
lead frame
semiconductor
positioning
Prior art date
Application number
KR1019910012221A
Other languages
English (en)
Other versions
KR950014676B1 (ko
Inventor
도미오 미노호시
도요히코 다케다
히데오 누마타
Original Assignee
아오이 죠이치
가부시키가이샤 도시바
다케다이 마사다카
도시바 마이크로 일렉트로닉스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아오이 죠이치, 가부시키가이샤 도시바, 다케다이 마사다카, 도시바 마이크로 일렉트로닉스 가부시키가이샤 filed Critical 아오이 죠이치
Publication of KR920003498A publication Critical patent/KR920003498A/ko
Application granted granted Critical
Publication of KR950014676B1 publication Critical patent/KR950014676B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1705—Lamina transferred to base from adhered flexible web or sheet type carrier
    • Y10T156/1707—Discrete spaced laminae on adhered carrier
    • Y10T156/171—Means serially presenting discrete base articles or separate portions of a single article
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1744—Means bringing discrete articles into assembled relationship
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53187—Multiple station assembly apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

내용 없음

Description

반도체 제조장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 1실시예에 따른 반도체제조장치를 도시한 평면도.
제2도는 리드프레임의 반송로를 도시한 단면도.
제3도는 상기 제1도에 도시한 반도체제조장치의 접착제공급부(14)를 나타낸 평면도.

Claims (3)

  1. 복수의 리드프레임이 배치되는 제1공급부(12)와, 이 제1공급부(12)로부터 공급되는 리드프레임을 환원 또는 비산화 분위기중에서 간헐적으로 반송하는 반송부 (11), 이 반송부(11)에 설치되어 상기 리드프레임상에 접착제를 공급하는 제2공급부(14), 복수의 반도체소자가 배치되는 제3공급부(15), 이 제3공급부(15)로부터 공급되는 반도체소자의 위치결정을 행하는 위치결정부(16), 상기 반송부(11)에 설치되어 상기 리드프레임상에 반도체소자를 접합시키는 접합부(101), 반도체소자 접착후의 리드프레임을 수납하는 수납부(19), 상기 제3공급부(15)와 상기 위치결정부 (16)사이 및 상기 위치결정부(16)와 상기 접합부(101)의 사이에서 각각 반도체소자의 이송을 행하는 이송부(17) 및, 상기 제1공급부(12)와 반송부(11), 제2공급부 (14), 제3공급부(15), 위치결정부(16), 접합부(101), 수납부(19)및 상기 이송부 (17) 의 각 동작을 자동제어하는 제어부(20)를 구비하여 구성된 것을 특징으로 하는 반도체제조장치.
  2. 제1항에 있어서, 상기 제2공급부(14)가 적어도 2개 이상의 공급장치(33a, 33b)를 갖추고 있고, 또 각각의 공급장치에 있어서 접착제 공급핀은 리드프레임의 섬상영역의 피치수에 대한 정수배로 되어 있는 것을 특징으로 하는 반도체제조장치.
  3. 제1항에 있어서, 상기 이송부(17)가 반도체소자를 유지하기 위한 처크홀더 (18)를 갖추고 있고, 또 상기 처크홀더(18)에는 적어도 2개 이상의 처크(18a, 18b)가 설치되어 있는 것을 특징으로 하는 반도체제조장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910012221A 1990-07-19 1991-07-18 반도체 제조장치 KR950014676B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP02-189485 1990-07-19
JP2189485A JP2619123B2 (ja) 1990-07-19 1990-07-19 半導体製造装置

Publications (2)

Publication Number Publication Date
KR920003498A true KR920003498A (ko) 1992-02-29
KR950014676B1 KR950014676B1 (ko) 1995-12-13

Family

ID=16242052

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910012221A KR950014676B1 (ko) 1990-07-19 1991-07-18 반도체 제조장치

Country Status (3)

Country Link
US (1) US5871610A (ko)
JP (1) JP2619123B2 (ko)
KR (1) KR950014676B1 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100481527B1 (ko) * 1998-04-02 2005-06-08 삼성전자주식회사 다이 본딩 장치
US6248201B1 (en) * 1999-05-14 2001-06-19 Lucent Technologies, Inc. Apparatus and method for chip processing
US6168963B1 (en) * 1999-06-21 2001-01-02 Lucent Technologies, Inc. System for adhering parts
JP4549491B2 (ja) * 2000-03-13 2010-09-22 大日本印刷株式会社 樹脂封止型半導体装置
KR100484088B1 (ko) * 2002-12-06 2005-04-20 삼성전자주식회사 멀티 칩 패키지용 다이 어태치와 경화 인라인 장치
TWI236321B (en) * 2003-04-10 2005-07-11 Protec Co Ltd Tape feeder for chip mounters
CN101884089B (zh) * 2007-12-03 2012-02-08 松下电器产业株式会社 芯片安装系统
CN115020309B (zh) * 2022-08-09 2022-10-14 四川晁禾微电子有限公司 一种引线框架排列装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3909933A (en) * 1973-03-30 1975-10-07 Western Electric Co Method for transferring and bonding articles
JPS5446472A (en) * 1977-09-20 1979-04-12 Nec Corp Device and method for fabrication of semiconductor device
DE3303951A1 (de) * 1983-02-05 1984-08-09 Standard Elektrik Lorenz Ag, 7000 Stuttgart Bestueckungstisch zum manuellen bestuecken von schaltungstraegern
JPH0777308B2 (ja) * 1987-05-28 1995-08-16 三洋電機株式会社 部品装着装置
JPH01121926A (ja) * 1987-11-06 1989-05-15 Nec Corp メモリ回路
JPH01121926U (ko) * 1988-02-13 1989-08-18
US4855007A (en) * 1988-06-03 1989-08-08 Motorola Inc. Automatic die attach workholder

Also Published As

Publication number Publication date
KR950014676B1 (ko) 1995-12-13
JP2619123B2 (ja) 1997-06-11
US5871610A (en) 1999-02-16
JPH0476926A (ja) 1992-03-11

Similar Documents

Publication Publication Date Title
DE68928320D1 (de) Randmontierte Packung vom Oberflächen-Montierungstyp, für integrierte Halbleiterschaltungsanordnungen
DE68917398D1 (de) Integrierte Schaltungshalbleiteranordnung mit verbesserter Einrichtung für Speiseleitungen.
DE69223692D1 (de) Trägerfolie für gedruckte Schaltung und Halbleiterchip
DE69219535D1 (de) Behälter für Halbleiter-Wafer
IT1206086B (it) Sistema per il rivestimento di substrati sottili (wafer) a semiconduttori.
DE3888880D1 (de) Träger für einen Halbleiterapparat.
DE3787505D1 (de) Haltevorrichtung für einen Kunststoffträger für einen Chip mit Anschlussdrähten.
DE3381732D1 (de) Packung fuer halbleiterchip.
DE3481795D1 (de) Kuehlungsanordnung fuer halbleiterchips.
EP0473796A4 (en) Semiconductor device having a plurality of chips
DE3669017D1 (de) Leistungshalbleitermodul mit keramiksubstrat.
DE68910738D1 (de) Hohle Plastikpackung für Halbleiteranordnungen.
SE8303174L (sv) Anordning for transport av arbetsstycken
DE69513361D1 (de) Trägerbehälter für Substratscheiben
KR920003498A (ko) 반도체 제조장치
DE69103748D1 (de) Trägerkassette für Halbleiterscheiben.
DE69206331D1 (de) Klebeband zum Befestigen von Halbleiterplättchen.
IT8323707A0 (it) Substrato di cablaggio, procedimento per la sua fabbricazione, e dispositivo a semiconduttore utilizzante il substrato stesso.
DE69113553D1 (de) Schnittstellenvorrichtung zum Transportieren von Substraten zwischen Verarbeitungsgeräten.
KR890011020A (ko) 실리콘 웨이퍼의 수평 이송장치
KR910008817A (ko) 이너리이드 본딩장치
KR910011112A (ko) 부품 공급 시스템
DE69114455D1 (de) Halbleiteranordnung mit Filmträger.
JPS6467932A (en) Semiconductor wafer cassette conveyor
DE69114217D1 (de) Träger für filmmontierte Halbleiter-Vorrichtung.

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19910718

PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 19910718

Comment text: Request for Examination of Application

PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 19941229

Patent event code: PE09021S01D

G160 Decision to publish patent application
PG1605 Publication of application before grant of patent

Comment text: Decision on Publication of Application

Patent event code: PG16051S01I

Patent event date: 19951117

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 19960312

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 19960605

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 19960605

End annual number: 3

Start annual number: 1

PR1001 Payment of annual fee

Payment date: 19971230

Start annual number: 4

End annual number: 4

PR1001 Payment of annual fee

Payment date: 19991129

Start annual number: 5

End annual number: 5

PR1001 Payment of annual fee

Payment date: 20001129

Start annual number: 6

End annual number: 6

PR1001 Payment of annual fee

Payment date: 20011130

Start annual number: 7

End annual number: 7

PR1001 Payment of annual fee

Payment date: 20021128

Start annual number: 8

End annual number: 8

FPAY Annual fee payment

Payment date: 20031128

Year of fee payment: 9

PR1001 Payment of annual fee

Payment date: 20031128

Start annual number: 9

End annual number: 9

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee