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KR910016818A - 경화성 수지, 그의 제조 방법 및 전자부품용 보호막 - Google Patents

경화성 수지, 그의 제조 방법 및 전자부품용 보호막 Download PDF

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Publication number
KR910016818A
KR910016818A KR1019910004557A KR910004557A KR910016818A KR 910016818 A KR910016818 A KR 910016818A KR 1019910004557 A KR1019910004557 A KR 1019910004557A KR 910004557 A KR910004557 A KR 910004557A KR 910016818 A KR910016818 A KR 910016818A
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KR
South Korea
Prior art keywords
curable resin
organic group
integer
structural formula
protective film
Prior art date
Application number
KR1019910004557A
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English (en)
Inventor
히로시게 오끼노시마
히데또 가또
Original Assignee
카나가와 치히로
신에쓰 가가꾸 고교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 카나가와 치히로, 신에쓰 가가꾸 고교 가부시끼가이샤 filed Critical 카나가와 치히로
Publication of KR910016818A publication Critical patent/KR910016818A/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
    • C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Indole Compounds (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Paints Or Removers (AREA)

Abstract

내용 없음

Description

경화성 수지, 그의 제조 방법 및 전자부품용 보호막
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (3)

  1. 하기 구조식(Ⅰ)의 경화성 수지.
    상기 식 중, R1및 R2는 서로 동일하거나 또는 상이한 것으로서, 탄소수 1 내지 10의 치환되지 않거나 또는 치환된 1가 탄화수소기이고, R3은 2가 유기기이며, X는 방향족 고리를 함유하는 4가 유기기이고, Y는 2가 유기기이며, m은 1 내지 3의 정수이고, n은 1 이상의 정수이다.
  2. 하기 구조식(Ⅱ)의 폴리이미드와 하기 구조식(Ⅲ)의 아미노실리콘 화합물을 반응시킴을 특징으로 하는 하기 구조식(Ⅰ)의 경화성 수지를 제조하는 방법.
    (R'O)mR2 (3-m)SiR3NH2(Ⅲ)
    상기 식 중 R1및 R2는 서로 동일하거나 또는 상이한 것으로서, 탄소수 1 내지 10의 치환되지 않거나 또는 치환된 1가 탄화수소기이고, R3은 2가 유기기이며, X는 방향족 고리를 함유하는 4가 유기기이고, Y는 2가 유기기이며, m은 1 내지 3의 정수이고, n은 1 이상의 정수이다.
  3. 제1항 기재의 경화성 수지를 경화시킨 전자부품 보호막.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910004557A 1990-03-23 1991-03-22 경화성 수지, 그의 제조 방법 및 전자부품용 보호막 KR910016818A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2073971A JP2606402B2 (ja) 1990-03-23 1990-03-23 硬化性樹脂及びその製造方法
JP2-73971 1990-03-23

Publications (1)

Publication Number Publication Date
KR910016818A true KR910016818A (ko) 1991-11-05

Family

ID=13533482

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910004557A KR910016818A (ko) 1990-03-23 1991-03-22 경화성 수지, 그의 제조 방법 및 전자부품용 보호막

Country Status (3)

Country Link
EP (1) EP0448359A1 (ko)
JP (1) JP2606402B2 (ko)
KR (1) KR910016818A (ko)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
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JP2712993B2 (ja) * 1992-01-17 1998-02-16 信越化学工業株式会社 硬化性樹脂、その溶液及びその製造法並びに電子部品用保護膜
JP2674415B2 (ja) * 1992-01-27 1997-11-12 信越化学工業株式会社 感光性樹脂組成物及び電子部品用保護膜
DE4240274B4 (de) * 1992-12-01 2004-02-12 Minnesota Mining And Manufacturing Co., Saint Paul Polysiloxane mit fluoraliphaten- und carboxylhaltigen terminalen Gruppen, ihre Herstellung und ihre Verwendung bei der Behandlung von Fasersubstraten
MY124687A (en) * 1998-05-20 2006-06-30 Hitachi Chemical Co Ltd Insulating adhesive for electronic parts, and lead frame and semiconductor device using the same
US8491997B2 (en) * 2006-06-22 2013-07-23 Sabic Innovative Plastics Ip B.V. Conductive wire comprising a polysiloxane/polyimide copolymer blend
US8071693B2 (en) 2006-06-22 2011-12-06 Sabic Innovative Plastics Ip B.V. Polysiloxane/polyimide copolymers and blends thereof
US20080236864A1 (en) 2007-03-28 2008-10-02 General Electric Company Cross linked polysiloxane/polyimide copolymers, methods of making, blends thereof, and articles derived therefrom
US8013251B2 (en) 2008-03-17 2011-09-06 Sabic Innovative Plastics Ip B.V. Electrical wire comprising an aromatic polyketone and polysiloxane/polyimide block copolymer composition
TWI635139B (zh) * 2017-03-02 2018-09-11 律勝科技股份有限公司 感光性透明樹脂
JP7088640B2 (ja) * 2017-08-01 2022-06-21 旭化成株式会社 半導体装置、及びその製造方法
JP7088639B2 (ja) * 2017-08-01 2022-06-21 旭化成株式会社 半導体装置、及びその製造方法
JP7088636B2 (ja) * 2017-07-11 2022-06-21 旭化成株式会社 半導体装置、及びその製造方法
JP7088638B2 (ja) * 2017-08-01 2022-06-21 旭化成株式会社 半導体装置、及びその製造方法
JP2019029556A (ja) * 2017-08-01 2019-02-21 旭化成株式会社 半導体装置、及びその製造方法
WO2025013912A1 (ja) * 2023-07-10 2025-01-16 Ａｇｃ株式会社 化合物、組成物、表面処理剤、物品、及び物品の製造方法
WO2025013913A1 (ja) * 2023-07-10 2025-01-16 Ａｇｃ株式会社 化合物、組成物、表面処理剤、物品の製造方法及び物品
CN118772407B (zh) * 2024-09-09 2025-01-07 济南大学 一种聚酰亚胺复合材料用大分子硅烷偶联剂及其制备方法和应用

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Publication number Publication date
JPH03275722A (ja) 1991-12-06
JP2606402B2 (ja) 1997-05-07
EP0448359A1 (en) 1991-09-25

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PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19910322

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