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KR910008817A - Inner lead bonding device - Google Patents

Inner lead bonding device Download PDF

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Publication number
KR910008817A
KR910008817A KR1019900016246A KR900016246A KR910008817A KR 910008817 A KR910008817 A KR 910008817A KR 1019900016246 A KR1019900016246 A KR 1019900016246A KR 900016246 A KR900016246 A KR 900016246A KR 910008817 A KR910008817 A KR 910008817A
Authority
KR
South Korea
Prior art keywords
chip
bond
bonding
positioning
stage
Prior art date
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Application number
KR1019900016246A
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Korean (ko)
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KR940002759B1 (en
Inventor
고오지 사또오
쥰이찌 이데
Original Assignee
아라이 가즈오
가부시끼가이샤 신가와
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Application filed by 아라이 가즈오, 가부시끼가이샤 신가와 filed Critical 아라이 가즈오
Publication of KR910008817A publication Critical patent/KR910008817A/en
Application granted granted Critical
Publication of KR940002759B1 publication Critical patent/KR940002759B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

내용 없음No content

Description

이너리이드 본딩장치Inner lead bonding device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

이 도면은 본 발명의 1실시예를 도시하며, 제 1 도는 평면도,This figure shows one embodiment of the invention, the first figure being a plan view,

제 2 도는 측면도이다.2 is a side view.

Claims (2)

칩 픽업포지션에서 칩을 진공흡착하여 칩 위치결정 포지션에 이송하는 칩 이송수단과, 상기 칩 위치결정포지션과 본딩포지션간에 왕복이동이 가능하며, 상기 칩 위치결정 포지션에 있어서 상기 칩 이송수단에 의해 이송되어 얹혀진 칩을 진공흡착하는 본드스테이지와, 칩 위치결정표지션에 위치한 상태의 본드스테이지상에 얹혀진 칩을 수정할 칩 위치결정 수단과, 캐리어테이프의 리이드를 본딩포지션에 이송하는 캐리어테이프 이송수단과, 캐리어테이프의 리이드를 본딩포지션에 위치하고 있는 본딩스테이지상의 칩에 가압하여 본딩하는 본드투울로 구비된 것을 특징으로 하는 이너리이드 본딩 장치.Chip conveying means for vacuum-sucking chips at the chip pick-up position and transferring them to the chip positioning position, and reciprocating between the chip positioning position and the bonding position is possible, and transported by the chip conveying means in the chip positioning position. A bond stage for vacuum-sucking the loaded chip, a chip positioning means for correcting the chip placed on the bond stage in a state positioned at the chip positioning mark, a carrier tape transfer means for transferring the lead of the carrier tape to the bonding position; An inner lead bonding apparatus, comprising: a bond to press a lead of a carrier tape to bond to a chip on a bonding stage located at a bonding position. 제 1 항에 있어서, 상기 위치결정수단은 인접하는 2변이 직각으로 형성된 고정클릭으로 이루어지고 본드스테이지를 XY방향으로 구동시켜 본드스테이지 상의 칩을 고정클릭의 직각인 2변에 가압하여 칩을 수정하는 것을 특징으로 하는 이너리이드 본딩장치.The method of claim 1, wherein the positioning means comprises a fixed click formed by two adjacent sides at right angles, and drives the bond stage in the XY direction to press the chip on the bond stage to two sides perpendicular to the fixed click to modify the chip. Inner lead bonding apparatus, characterized in that. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019900016246A 1989-10-16 1990-10-13 Inner lead bonding device Expired - Fee Related KR940002759B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1-268610 1989-10-16
JP1268610A JPH03129844A (en) 1989-10-16 1989-10-16 Inner lead bonding device

Publications (2)

Publication Number Publication Date
KR910008817A true KR910008817A (en) 1991-05-31
KR940002759B1 KR940002759B1 (en) 1994-04-02

Family

ID=17460934

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900016246A Expired - Fee Related KR940002759B1 (en) 1989-10-16 1990-10-13 Inner lead bonding device

Country Status (2)

Country Link
JP (1) JPH03129844A (en)
KR (1) KR940002759B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030062752A (en) * 2002-01-18 2003-07-28 금호산업주식회사 Conductive Spray Composition and Application

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2803769B2 (en) * 1991-11-08 1998-09-24 富士通株式会社 Method for manufacturing semiconductor device
JP3005786B2 (en) * 1993-07-26 2000-02-07 株式会社新川 Chip bonding method and apparatus
JP2915350B2 (en) * 1996-07-05 1999-07-05 株式会社アルテクス Ultrasonic vibration bonding chip mounting device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2572619B1 (en) * 1984-10-30 1986-12-26 Ebauchesfabrik Eta Ag METHOD FOR ASSEMBLING AND CONNECTING INTEGRATED CIRCUITS TO CIRCUIT UNITS AND MACHINE FOR IMPLEMENTING SAME
JP2746989B2 (en) * 1989-03-17 1998-05-06 株式会社東芝 Chip positioning method and device, inner lead bonding apparatus, and inner lead bonding method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030062752A (en) * 2002-01-18 2003-07-28 금호산업주식회사 Conductive Spray Composition and Application

Also Published As

Publication number Publication date
JPH03129844A (en) 1991-06-03
KR940002759B1 (en) 1994-04-02

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