KR910005204B1 - 트랜스퍼 성형장치 및 그 제조방법 - Google Patents
트랜스퍼 성형장치 및 그 제조방법 Download PDFInfo
- Publication number
- KR910005204B1 KR910005204B1 KR1019880001357A KR880001357A KR910005204B1 KR 910005204 B1 KR910005204 B1 KR 910005204B1 KR 1019880001357 A KR1019880001357 A KR 1019880001357A KR 880001357 A KR880001357 A KR 880001357A KR 910005204 B1 KR910005204 B1 KR 910005204B1
- Authority
- KR
- South Korea
- Prior art keywords
- plunger
- motor
- displacement
- maximum current
- transfer molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
Claims (10)
- 플런저를 구동하는 전동기, 전동기의 출력샤프트의 회전운동을 직선운동으로 변환하는 운동변환기구, 플런저의 변위를 검출하는 변위 검출기를 포함하며, 몰드내에 레진을 주입하게 포트에서 플런저 하향구동에 의해 레진에 전자 부품을 봉합하기 위한 트랜스퍼 성형장치.
- 플런저를 구동하기 위한 전동기를 구성하는 구동수단 및 전동기의 출력샤프트의 회전운동을 직선운동으로 변환하는 운동변환기구, 플런저의 변위를 검출하기 위한 변위 검출수단, 플런저의 변위가 소정의 변위 까지 증가될 때까지 높은 압력이 플런저에 인가되고 플런저의 변위가 소정의 변위에 도달한 후 낮은 압력이 플런저에 인가되어 플런저의 압력동작을 제어하는 제어수단을 포함하며, 몰드내에 레진을 주입하게 포트에서 플런저 하향구동에 의해 레진에 전자부품을 봉합하기 위한 트랜스퍼 성형장치.
- 특허청구의 범위 제2항에 있어서, 제1차 최대전류(imax1)과 제2차 최대전류(imax2)는 전류의 소정의 상한으로서 전동기에 공급되며, 전동기에 공급된 최대전류는 플런저의 변위가 소정의 변위로 증가될 때까지를 제1차 최대전류(imax1)로 제한하고, 전동기에 공급된 최대전류는 플런저의 변위가 소정의 변위로 감소될 때까지를 제2차 최대전류(imax2)로 제한하는 트랜스퍼 성형장치.
- 특허청구의 범위 제3항에 있어서, 제1차 최대전류(imax1), 제2차 최대전류(imax2) 및 소정의 변위는 플런저의 운동을 제어하는 마이크로컴퓨터에 미리 세트하는 트랜스퍼 성형장치.
- 특허청구의 범위 제2항에 있어서, 플런저의 변위는 전동기에 접속된 펄스 발생기에 의해 마련된 정보에 따라 검출되는 트랜스퍼 성형장치.
- 특허청구의 범위 제2항에 있어서, 운동변환기구는 볼 스크루 잭을 포함하는 트랜스퍼 성형장치.
- 전동기, 전동기의 출력샤프트의 회전수를 계수하는 계수수단을 포함하는 전기 플런저 구동회로, 제1차 최대전류(imax1), 전동기에 공급되어 있는 전류의 상한으로서 제1차 최대전류보다 작은 제2차 최대전류(imax2) 및 전동기의 출력샤프트의 소정의 회전수를 저장하며, 플런저를 하향 구동하게 전동기의 동작 스위치가 닫혔을 때, 전동기의 동작속도를 제어하기 시작하며, 제1차 최대전류로 전동기에 공급되어 있는 최대전류를 제한하며, 모터의 출력샤프트의 회전수가 소정의 회전수로 증가된후 제2차 최대전류로 전동기에 공급되어 잇는 최대전류를 제한하고, 제2차 최대전류가 전동기에 공급되어진 최대전류로서 선택된 후에 전동기의 토오크를 제어하는 제어장치, 입력 회전속도를 감속하고 입력회전운동을 플런저에 직선출력운동으로 변환하여 플런저를 하향 구동시킨 후 전동기의 출력샤프트의 회전운동을 전달하기 위해, 전동기에 결합된 속도 감속 및 회전변환기구를 포함하며, 포트내에서 플런저 하향 구동에 의해 몰드내로 레진을 주입하는 트랜스퍼 성형장치.
- 전동기의 출력샤프트의 회전운동이 플런저에 전달되어 직선운동으로 변환된후 플런저를 하향 구동하며, 플런저의 변위가 플런저가 하향 구동되는 동안 연속적으로 검출되고, 플런저의 하향 구동을 위해 플런저에 인가된 압력이 소정의 변위로 플런저의 변위를 증가시킬 때까지 변화되며, 몰드내에 레진을 주입하게 포트에서 플런저 하향 구동에 의해 레진이 전자부품을 봉합하기 위한 트랜스퍼 성형의 제조방법.
- 특허청구의 범위 제8항에 있어서, 높은 압력은 플런저의 변위가 소정의 증가될 때까지 플런저에 인가되고, 낮은 압력은 플런저의 변위가 소정의 변위로 증가된 후 플런저에 인가되는 트랜스퍼 성형의 제조방법.
- 특허청구의 범위 제8항에 있어서, 전동기에 공급된 전류의 상한인 최대전류가 플런저에 인가된 압력의 변화로 변화되는 트랜스퍼 성형의 제조방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62-40169 | 1987-02-25 | ||
JP62040169A JPH07320B2 (ja) | 1987-02-25 | 1987-02-25 | 半導体封止用トランスファ成形装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR880009759A KR880009759A (ko) | 1988-10-05 |
KR910005204B1 true KR910005204B1 (ko) | 1991-07-23 |
Family
ID=12573263
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019880001357A Expired KR910005204B1 (ko) | 1987-02-25 | 1988-02-12 | 트랜스퍼 성형장치 및 그 제조방법 |
Country Status (5)
Country | Link |
---|---|
US (1) | US4954301A (ko) |
EP (1) | EP0280087B1 (ko) |
JP (1) | JPH07320B2 (ko) |
KR (1) | KR910005204B1 (ko) |
DE (1) | DE3870655D1 (ko) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL8802879A (nl) * | 1988-11-22 | 1990-06-18 | Ireneus Johannes Theodorus Mar | Werkwijze voor het verpakken van een afgepaste, voor het omhullen van een component bestemde hoeveelheid thermohardende kunststof, met deze werkwijze verkregen verpakking, werkwijze voor het bedrijven van een matrijs en matrijs voor het uitvoeren van deze werkwijze. |
US5056999A (en) * | 1989-04-25 | 1991-10-15 | Howmet Corporation | Apparatus for forming objects from a moldable material |
NL9101558A (nl) * | 1991-09-16 | 1993-04-16 | Amco Hi Tech Bv | Inrichting voor het in een matrijsholte inbrengen van een kunststofmateriaal. |
GB2273175B (en) * | 1992-12-04 | 1996-05-15 | Advanced Systems Automation Pt | Direct drive electro-mechanical press for encapsulating semiconductor devices |
US5516271A (en) * | 1993-12-14 | 1996-05-14 | United Technologies Corporation | Apparatus for resin transfer molding |
JP2779759B2 (ja) * | 1993-12-15 | 1998-07-23 | 日精樹脂工業株式会社 | 射出成形機の射出制御方法 |
US5783134A (en) * | 1994-01-13 | 1998-07-21 | Citizen Watch Co., Ltd. | Method of resin-sealing semiconductor device |
US5464338A (en) * | 1994-09-02 | 1995-11-07 | Marlen Research Corporation | Food pump |
US5851570A (en) * | 1997-06-12 | 1998-12-22 | Hayes; Robert O. | Electric drive for blow molding head |
US6396005B2 (en) | 1998-06-15 | 2002-05-28 | Rodgers Technology Center, Inc. | Method and apparatus for diminishing grid complexity in a tablet |
JP3486557B2 (ja) * | 1998-07-30 | 2004-01-13 | 宮崎沖電気株式会社 | トランスファ成形装置及び半導体装置の製造方法 |
US6576496B1 (en) * | 2000-08-21 | 2003-06-10 | Micron Technology, Inc. | Method and apparatus for encapsulating a multi-chip substrate array |
KR100455386B1 (ko) * | 2002-05-07 | 2004-11-06 | 삼성전자주식회사 | 다수의 반도체 소자를 동시에 성형하는 성형 장비 |
US7829004B2 (en) * | 2008-07-15 | 2010-11-09 | Asm Technology Singapore Pte Ltd | Transfer molding method and system for electronic devices |
JP2014179508A (ja) * | 2013-03-15 | 2014-09-25 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法 |
JP6077715B2 (ja) * | 2015-02-27 | 2017-02-08 | 技術研究組合次世代3D積層造形技術総合開発機構 | 粉末リコータ |
JP6549478B2 (ja) * | 2015-11-30 | 2019-07-24 | Towa株式会社 | 吐出装置、樹脂成形装置、吐出方法及び樹脂成型品の製造方法 |
US11621181B2 (en) * | 2020-05-05 | 2023-04-04 | Asmpt Singapore Pte. Ltd. | Dual-sided molding for encapsulating electronic devices |
US20230395403A1 (en) * | 2022-06-02 | 2023-12-07 | Samsung Electronics Co., Ltd. | Molding apparatus of semiconductor package |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2212752A1 (de) * | 1972-03-16 | 1973-10-04 | Demag Ag Duisburg Kunststoffte | Spritzgiessmaschinen-spritzaggregat |
US4282176A (en) * | 1978-10-02 | 1981-08-04 | Package Machinery Company | Injection molding machine with regenerative feed system |
US4240996A (en) * | 1979-04-09 | 1980-12-23 | Hunkar Laboratories, Inc. | Process for controlling part density in fast injection molding machines |
JPS5835460B2 (ja) * | 1979-09-28 | 1983-08-02 | 株式会社日立製作所 | トランスフア成形機 |
US4301100A (en) * | 1979-10-01 | 1981-11-17 | Package Machinery Company | Method and apparatus for setting a clamping load |
JPS6045571B2 (ja) * | 1980-06-18 | 1985-10-11 | 株式会社東芝 | 樹脂封止用モ−ルド装置 |
JPS57128526A (en) * | 1981-02-04 | 1982-08-10 | Toshiba Mach Co Ltd | Pressure controller for injection molding machine |
US4397806A (en) * | 1981-10-26 | 1983-08-09 | Siebolt Hettinga | Method and apparatus for mold injection |
JPS59179328A (ja) * | 1983-03-31 | 1984-10-11 | Fujitsu Ltd | モ−ルド方法 |
DE3417293A1 (de) * | 1984-05-10 | 1985-11-14 | Gebrüder Bühler AG, Uzwil | Druck- oder spritzgiessmaschine |
JPS61125823A (ja) * | 1984-11-24 | 1986-06-13 | Fanuc Ltd | 射出成形機における射出・計量機構 |
JPS61235119A (ja) * | 1985-04-12 | 1986-10-20 | Nissei Plastics Ind Co | 射出成形機の射出制御方法及び装置 |
JPS61242796A (ja) * | 1985-04-22 | 1986-10-29 | Mitsubishi Electric Corp | 加圧プレス制御装置 |
JPS61242793A (ja) * | 1985-04-22 | 1986-10-29 | Mitsubishi Electric Corp | 加圧プレスの制御装置 |
CH668385A5 (de) * | 1985-10-24 | 1988-12-30 | Buehler Ag Geb | Einspritzeinheit fuer eine giessmaschine. |
-
1987
- 1987-02-25 JP JP62040169A patent/JPH07320B2/ja not_active Expired - Fee Related
-
1988
- 1988-02-04 DE DE8888101608T patent/DE3870655D1/de not_active Expired - Lifetime
- 1988-02-04 EP EP88101608A patent/EP0280087B1/en not_active Expired - Lifetime
- 1988-02-12 KR KR1019880001357A patent/KR910005204B1/ko not_active Expired
-
1989
- 1989-07-12 US US07/378,505 patent/US4954301A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US4954301A (en) | 1990-09-04 |
JPH07320B2 (ja) | 1995-01-11 |
EP0280087A1 (en) | 1988-08-31 |
JPS63207623A (ja) | 1988-08-29 |
DE3870655D1 (de) | 1992-06-11 |
EP0280087B1 (en) | 1992-05-06 |
KR880009759A (ko) | 1988-10-05 |
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St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20050724 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
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PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20050724 |
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P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |