KR910003176Y1 - Reflow soldering device - Google Patents
Reflow soldering device Download PDFInfo
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- KR910003176Y1 KR910003176Y1 KR2019910001173U KR910001173U KR910003176Y1 KR 910003176 Y1 KR910003176 Y1 KR 910003176Y1 KR 2019910001173 U KR2019910001173 U KR 2019910001173U KR 910001173 U KR910001173 U KR 910001173U KR 910003176 Y1 KR910003176 Y1 KR 910003176Y1
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- South Korea
- Prior art keywords
- chamber
- reflow
- heated
- circuit board
- printed circuit
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- 238000005476 soldering Methods 0.000 title claims description 22
- 229910000679 solder Inorganic materials 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 11
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000007664 blowing Methods 0.000 claims 1
- 238000001816 cooling Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000005192 partition Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
내용 없음.No content.
Description
제1도는, 본 고안의 1실시예를 나타내는 측단면도.1 is a side cross-sectional view showing an embodiment of the present invention.
제2도는, 제1도의 I - I선의 단면도.2 is a cross-sectional view taken along the line I-I of FIG.
제3도는, 종래의 리플로우 납땜장치의 1예를 나태는 측단면도이다.3 is a side cross-sectional view showing an example of a conventional reflow soldering apparatus.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 프린트 기판 2 : 칩부품1 printed board 2 chip component
3 : 땜납 페이스트 4 : 리플로우(Reflow) 납땜장치의 전체3: solder paste 4: entire reflow soldering apparatus
5 : 벨트 콘베이어 6 : 예비 가열실5: belt conveyor 6: preheating chamber
6a : 반입구 7 : 리플로우실6a: entrance 7: reflow room
8 : 냉각실 9,10 : 원적외선(遠赤外線) 히이터8: Cooling chamber 9, 10: Far infrared heater
9a, 10a : 반사판 11,12 : 시즈히터(Sheathed tubular heater)9a, 10a: Reflector 11, 12: Sheathed tubular heater
13,14,15 : 팬 16 : 팬13,14,15 Fan 16: Fan
21 : 리플로우 납땜 장치의 전체 22 : 1차 예비 가열실21: Total reflow soldering apparatus 22: Primary preheating chamber
23 : 2차 예비 가열실 24 : 간막이판23: secondary preheating chamber 24: partition board
25 : 정류판 26 : 측판25: rectification plate 26: side plate
27 : 흡입구 28 : 배출구27: inlet port 28: outlet port
본 고안은, 프린트 기판의 전체를 균등하게 가열하여 납땜할수 있도록 한 리플로우 납땜 장치에 관한것이다.The present invention relates to a reflow soldering apparatus which enables the entire printed circuit board to be heated and soldered evenly.
제3도는, 종래의 리플로우 납땜장치의 1예를 나타낸 측단면도이다.3 is a side cross-sectional view showing an example of a conventional reflow soldering apparatus.
이 도면에서,(1)은, 프린트기판,(2)는 칩부품,(3)은 땜납 페이스트,(4)는 리플로우 납땜 장치의 전체를나타낸다.In this figure, reference numeral 1 denotes a printed circuit board, 2 a chip component, 3 a solder paste, and 4 a reflow soldering apparatus.
(5)는, 상기 프린트 기판(1)을 반송하는 수단으로서의 벨트 콘베이어로써, 금속제의 그물눈 형상의 것이사용되고 있다.(5) is a belt conveyor as a means of conveying the said printed circuit board 1, The metal mesh-shaped thing is used.
(6)은 상기 땜납 페이스트(3)의 융해점 미만의 온도로 가열된 공기에 의해 프린트 기판(1)을 가열하는 예비가열실로서, 프린트기판(1)의 주행방향(화살표시 A방향)의 뒤쪽에 형성되어 있다.(6) is a preheating chamber for heating the printed circuit board 1 by air heated to a temperature below the melting point of the solder paste 3, the rear side of the traveling direction (arrow display A direction) of the printed circuit board 1; It is formed in.
(7)은 상기 땜납 페이스(3)의 융해점 이상의 온도로 가열된 공기에 의해 땜납 페이스트(3)를 융해하여 프린트 기판(1)에 납땜을 행하는 리플로우실,(8)은 냉각실,(9)는 상기 예비 가열실(6)에서 프린트 기판(1)의반입구(6a)측에 형성돈 원적외선(遠赤外線)히이터이고,(10)은 상기 리플로우실(7)의 내부에 형성된 땜납페이스트(3)를 융해하는 원적외선 히이터이고,(9a),(10a)는 상기 원적외선 히이터(9),(10)의 반사판이고.(11),(12)는 상기 예비 가열실(6)내의 공기를 가열하기 위한 시즈히이터 이고,(13),(14)는 상기 예비가열실(6)내의 공기를 아래쪽으로 향해 송풍을 하는 팬이고,(15)는 상기 리플로우실(7)내의 공기를 아래쪽으로 향해 송풍하는 팬이고,(16)은 상기 프린트 기판(1)을 냉각하기 위한 팬이다.7 is a reflow chamber in which the solder paste 3 is melted by air heated at a temperature equal to or higher than the melting point of the solder face 3 and soldered to the printed circuit board 1, and a cooling chamber 9 ) Is a far-infrared heater formed on the inlet 6a side of the printed circuit board 1 in the preheating chamber 6, and 10 is a solder paste formed inside the reflow chamber 7. 3) is a far-infrared heater for melting (9a), (10a) is a reflection plate of the far-infrared heaters (9), (10). (11), (12) heats the air in the preheating chamber (6) (13) and (14) are fans that blow air downward in the preheating chamber (6), and (15) are directed downward in the reflow chamber (7). A fan is blown, and 16 is a fan for cooling the printed board 1.
종래의, 리플로우 납땜장치는 상기와 같이 구성되어 있고, 벨트 콘베이어(5)에 실린 프린트기판(1)은 화살표시 A방향으로 반송된다,The conventional reflow soldering apparatus is constructed as described above, and the printed circuit board 1 loaded on the belt conveyor 5 is conveyed in the A direction at the time of the arrow.
그리고, 프린트 기판(1)은, 예비 가열실(6)내에서 시즈 히이터(11),(12)에 의해 가열된 공기에 의해 약140℃로 가열되고, 이어서 리플로우실(7)로 들어가, 원적외선 히이터(10)에 의해 땜납 페이스트(3)가 용해하는온도 215 로 가열되어 납땜이 된다.Then, the printed circuit board 1 is heated to about 140 ° C. by air heated by the sheath heaters 11 and 12 in the preheating chamber 6, and then enters the reflow chamber 7. The far-infrared heater 10 is heated to a temperature of 215 kPa where the solder paste 3 dissolves and soldered.
이어서, 냉각실(8)에서 팬(16)에 의해 냉각되어 납땜이 종료된다.Subsequently, it cools by the fan 16 in the cooling chamber 8, and soldering is complete | finished.
그런데, 상기와 같은 종래의 리플로우 납땜장치(4)에서는, 예비 가열실(6)내의 공기는 시즈 히이터(11),(12)에 의해 가열되어 팬(13),(14)의 회전에 의해 아래쪽으로 향해 송풍되는 난류 상태로 된다.By the way, in the conventional reflow soldering apparatus 4 as described above, the air in the preheating chamber 6 is heated by the sheath heaters 11 and 12 and is rotated by the rotation of the fans 13 and 14. Turbulent conditions are blown downward.
이 때문에, 프린트 기판(1)에 대해서는 균등하게 가열되지 않으므로 가열의 불균일한 상태가 발생하고, 특히프린트 기판(1)의 반송방향(화살표시 A방향)과 직각 방향, 즉 프린트 기판(1)의 폭방향에 대해 가열의 불균일한 상태가 발생하기 쉽고, 특히 프린트 기판(1)의 중앙부와, 폭방향에 있어서의 양끝단부에서는 가열온도차가 발생하는 문제점이 있었다.For this reason, since it does not heat uniformly with respect to the printed circuit board 1, the nonuniform state of heating generate | occur | produces, especially the direction perpendicular to the conveyance direction (arrow display A direction) of the printed circuit board 1, ie, the printed circuit board 1 A nonuniform state of heating tends to occur in the width direction, and in particular, there is a problem in that a heating temperature difference occurs at the central portion of the printed board 1 and at both ends in the width direction.
그러므로, 이와같은 프린트 기판(1)을 리플로우실(7)로 반송해서 납댐을 하면 땜납 페이스트(3)의 용해가고르지 않게 되므로, 균등한 납땜을 할수 없다는 문제점이 있었다.Therefore, when the printed circuit board 1 is transported to the reflow chamber 7 and the lead dams are dissolved, the solder paste 3 becomes uneven. Therefore, there is a problem in that even soldering cannot be performed.
본 고안은, 상기의 문제점을 해결하기 위해 이루어진 것으로, 프린트의 기판을 예비 가열하는 시점에서,프린트 기관 전체를 균등하게 예비 가열함으로써, 리플로우실에서 땜납 페이스트의 용해를 균등하게 할수 있는납땜 장치를 얻는 것을 목적으로 한다.The present invention has been made to solve the above problems, and at the time of preheating the printed circuit board, a soldering apparatus capable of equalizing the dissolution of the solder paste in the reflow chamber by preheating the entire print engine evenly. The purpose is to get.
본 고안에 관련된 리플로우 납땜 장치는, 예비 가열실과 리플로우 실내의 가열된 공기의 흐름을 정류하여프린트 기판을 균등하게 가열하기 위한 정류판을 예비 가열실과 리플로우실의 내부에 각각 형성하고, 또한,가열된 공기를 팬에 의해 예비 가열실과 리플로우실의 내부에서 각각 순환시키기 위한 흡입구와 배슬구똬를형성한 측판을 형성한 것이다.In the reflow soldering apparatus according to the present invention, a rectifying plate for rectifying the flow of heated air in the preheating chamber and the reflow room to evenly heat the printed board is formed in the preheating chamber and the reflow chamber, respectively, The side plate is formed with a suction port and a bass hole for circulating the heated air inside the preheating chamber and the reflow chamber by a fan.
본 고안에서는, 팬이 회전하여 가열된 공기의 흐름이 정류판을 통과함으로써, 층류(層流)가 되어 프린트기판의 전체에 균등하게 불어붙이므로, 프린트 기판 전체가 균등하게 가열되는 동시에 땜납 페이스트도 프린트기판 전체에서 균등하게 융해되는 동시에, 예비 가열실 및 리플로우실의 내부에서 가열된 공기가 강제적으로순환된다.In the present invention, the fan is rotated so that the flow of heated air passes through the rectifying plate to form a laminar flow and uniformly blows onto the entire printed circuit board, so that the entire printed circuit board is heated evenly and solder paste is also applied. At the same time as the entire substrate is melted, the heated air is forcedly circulated inside the preheating chamber and the reflow chamber.
본 고안의 실시예를 첨부 도면에 의하여 상세히 설명하면 다음과 같다.An embodiment of the present invention will be described in detail with reference to the accompanying drawings.
제1도는, 본 고안의 1실시예를 나타내는 측단면도이고, 제2도는, 제1도의 I - I선 단면도이다.1 is a side cross-sectional view showing one embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along the line I-I of FIG.
이를 도면에서, 제3도와 동일한 부호는 동일한 부호를 나타내며,(21)은 본 고안의 리플로꾸 납땜 장치의전체를 나타낸다.In this figure, the same reference numerals as those in FIG. 3 denote the same reference numerals, and 21 denotes the entirety of the reflowing soldering apparatus of the present invention.
(22),(23)은 상기 리플로우 납땜장치(21)의 1차 예비 가열실과, 2차 예비 가열실로써. 프린트 기판(1)의 주행방향(화살표시 A방향)의 뒤쪽과 앞쪽에 형성되고, 제3도에 나타낸 종래의 예비 가열실(6)을 간막이판(24)으로써 2낄로 형성한 것이다.22 and 23 are primary preheating chambers and secondary preheating chambers of the reflow soldering apparatus 21. It is formed in the back and front of the travel direction (arrow-displayed A direction) of the printed circuit board 1, and the conventional preheating chamber 6 shown in FIG. 3 is formed into two pieces by the partition board 24. As shown in FIG.
(25)는, 이 예비 가열실(22),(23) 및 리플로우실(7)에 형성된 정류판으로써, 그 긴쪽 방향이 프린트기관(1)의 반송방향(화살표시 A방향)에 대해 직각 방향이 되도록 배열한 것이다.Reference numeral 25 denotes a rectifying plate formed in the preheating chambers 22, 23 and the reflow chamber 7, the longitudinal direction of which is perpendicular to the conveyance direction (arrow display A direction) of the print engine 1. It is arranged to be in the direction.
(26)은, 상기 정류판(25)을 지지하는 측판으로써, 각 예비 가열실(22),(23), 리플로우실(7)의 내부에 형성되고, 각 팬(13),(14),(15)에 의해 가열된 공기를 강제적으로 순환 작용이 발생하도록 하기 위한 것이다.26 is a side plate which supports the said rectifying plate 25, and is formed in each preheating chamber 22, 23, and the reflow chamber 7, and each fan 13, 14 It is for forcibly circulating the air heated by (15) to generate | occur | produce.
(27)은, 상기 측판(26)의 위부분에 형성되고, 가열된 공기를 각 측판(26)사이 내에 횹입하는 흡입구이고,(28)은 상기 측판(26)의 아래부분에 형성되고, 가열된 공기를 각 측판(26)의 사이에서 바깥쪽으로 배출하는배출구이 다.(27) is formed on the upper side of the side plate 26, and is an inlet for inserting heated air into each side plate 26, (28) is formed on the lower side of the side plate 26, It is an outlet for discharging the heated air outward between each side plate (26).
이 때문에, 측판(26)에 형성한 흡입구(27), 배출구(28)에 의해 각 측판(26)내의 공기가 각 측판(26) 사이의 안쪽에서 바깥쪽을 향해 순환작용이 이루어진다.For this reason, the air in each side plate 26 circulates from the inner side between each side plate 26 to the outer side by the suction port 27 and the discharge port 28 formed in the side plate 26. As shown in FIG.
상기와 같이 구성된 리플로우 납땜장치(21)에서, 각 예비 가열실(22),(23)의 공기는 각 시즈 히이터(11),(12)에 의해 각각 별개로 가열된다.In the reflow soldering apparatus 21 configured as described above, the air in each of the preheating chambers 22 and 23 is heated separately by the sheath heaters 11 and 12, respectively.
즉, 1차 예비 가열실(22)에서는 공기의 온도를 약 160℃로 가열하여, 프린트 기판(1)의 온도 상승율을 크게하여 프린트 기판(1)의 온도를 급속으로 140℃에 가까와 지도록 상승시킨다.That is, in the primary preheating chamber 22, the temperature of air is heated to about 160 ° C., the temperature rising rate of the printed board 1 is increased, and the temperature of the printed board 1 is rapidly raised to 140 ° C. .
이어서, 2차 에비 가열실(23)에서는 공기의 온도를 1차 예비실(22) 보다도 낮추어 140℃로 가열하고, 프린트기판(1)의 온도 상승률을 작게하여 프린트 기판(1)이 140에서 안정되도록 한다.Subsequently, in the secondary eb heating chamber 23, the temperature of the air is lowered than that of the primary preliminary chamber 22 and heated to 140 ° C., the rate of temperature rise of the printed circuit board 1 is reduced, and the printed circuit board 1 is stable at 140. Be sure to
이어서, 프린트 기판(1)은 다시 반송되어, 리플로우실(7)로 들어가 종래와 마찬가지로 납땜이 이루어진다.Subsequently, the printed circuit board 1 is conveyed again and enters the reflow chamber 7 and soldering is carried out as in the prior art.
또한, 각 예비 가열실(22),(23) 및 리플로우실(7)에서 측판(26) 사이내의 가열된 공기는 팬(13),(14) 및(15)의 구동에 의해 제2도의 화살표시 B방향으로 흐른다.In addition, in each of the preheating chambers 22, 23, and the reflow chamber 7, the heated air between the side plates 26 is driven by the fan 13, 14, and 15, and The arrow flows in the B direction.
즉, 시즈 히이터(11),(12) 또는 원적외선 히이터(10)에 의해 가열된 공기는 배출구(28)로 부터 측판(26)사이에서 바깥쪽으로 나가 상승하고, 측판(26)의 위부분의 흡입구(27)에서 흡입함으로써 순환 작용이 발생한다.That is, the air heated by the sheath heater 11, 12 or the far-infrared heater 10 rises outward between the side plates 26 from the outlet port 28, and the inlet port of the upper part of the side plate 26 is raised. By inhalation at 27, a circulation action occurs.
그런데, 가열된 공기는 팬(13),(14),(15)의 회전에 의하여 송풍되는데, 정류판(25)을 통과함으로써 정류되어 층류로 되어 프린트 기판(1)에 균등하게 불어붙이기 때문에, 프린트 기판(1)외 폭방향에 대하여 균등하게가열된다.By the way, the heated air is blown by the rotation of the fan 13, 14, 15, because it is rectified by passing through the rectifying plate 25 to form a laminar flow and evenly blows onto the printed board 1, It is heated evenly with respect to the width direction outside the printed board 1.
이 때문에, 프린트 기판(1)은 각 예비 가열실(22),(23)에서는 폭방향에 대해 균등하게 가열되는 동시에,리플로우실(7)에서도 균등하게 가열되므로, 땜납 페이스트(3)의 용해가 균등하게 이루어져서 납땜이 고른양질의 프린트 기판(1)을 얻을 수 있다.For this reason, the printed circuit board 1 is heated equally with respect to the width direction in each preheating chamber 22, 23, and it is heated evenly also in the reflow chamber 7, so that the solder paste 3 melt | dissolves; It is possible to obtain an even-quality printed board 1 with uniform soldering.
그리고, 실시예에서, 프린트 기판(1)을 반송하는 수단으로서는 벨트 콘베이어(5)대신에 프린트 기판(1)을유지하는 유지갈고리를 구비한 반송 체인이라도 좋다.In the embodiment, as a means for conveying the printed board 1, a conveying chain having a retaining hook for holding the printed board 1 instead of the belt conveyor 5 may be used.
이상에서 설명한 바와같이, 본 고안은, 에비 가열실과 리플로우실내의 가열된 공기의 호름을 정류하여 프린트 기판을 균등하게 가열하기 위한 정류판을 예비 가열실과 리플로우실의 내부에 각각 형성하고, 또한 가열된 공기를 팬으로써 예비 가열실과 리플로우실의 내부에서 각각 순환시키기 위한 흡입구와 배출구와를 형성한측판을 형성하였기 때문에, 예비 가열실에서 프린트 기판 전체가 균등하게 가열됨으로써 리플로우실에서의땜납 페이스트가 균등하게 가열됨으로써 리플로우실에서의 땜납 페이스트가 균등하게 용해하므로 납땜의 고르지 못한 상태가 없어지고, 품질이 좋은 프린트 기판을 얻을 수 있는 잇점을 갖는다.As described above, the present invention provides a rectifying plate for rectifying the heating of the heated air in the EBI heating chamber and the reflow chamber to uniformly heat the printed board, respectively, in the interior of the preheating chamber and the reflow chamber. Since the side plates formed with the inlet and outlet ports for circulating the heated air inside the preheating chamber and the reflow chamber, respectively, were formed, the entire printed circuit board was evenly heated in the preheating chamber, so that the solder paste in the reflow chamber was heated. By uniformly heating, the solder paste in the reflow chamber is dissolved evenly, eliminating the uneven state of soldering, and has the advantage of obtaining a high quality printed board.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019910001173U KR910003176Y1 (en) | 1988-07-15 | 1991-01-28 | Reflow soldering device |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019880008802A KR900002671A (en) | 1987-01-20 | 1988-07-15 | Reflow Soldering Equipment |
| KR2019910001173U KR910003176Y1 (en) | 1988-07-15 | 1991-01-28 | Reflow soldering device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019880008802A Division KR900002671A (en) | 1987-01-20 | 1988-07-15 | Reflow Soldering Equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR910003176Y1 true KR910003176Y1 (en) | 1991-05-13 |
Family
ID=26627876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019910001173U Expired KR910003176Y1 (en) | 1988-07-15 | 1991-01-28 | Reflow soldering device |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR910003176Y1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030059704A (en) * | 2002-01-04 | 2003-07-10 | 엘지전자 주식회사 | Reflow apparatus of lead free solder |
-
1991
- 1991-01-28 KR KR2019910001173U patent/KR910003176Y1/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030059704A (en) * | 2002-01-04 | 2003-07-10 | 엘지전자 주식회사 | Reflow apparatus of lead free solder |
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