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KR900021152U - Softlander - Google Patents

Softlander

Info

Publication number
KR900021152U
KR900021152U KR2019890006875U KR890006875U KR900021152U KR 900021152 U KR900021152 U KR 900021152U KR 2019890006875 U KR2019890006875 U KR 2019890006875U KR 890006875 U KR890006875 U KR 890006875U KR 900021152 U KR900021152 U KR 900021152U
Authority
KR
South Korea
Prior art keywords
softlander
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
KR2019890006875U
Other languages
Korean (ko)
Other versions
KR920000089Y1 (en
Inventor
모용선
Original Assignee
삼성항공산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성항공산업 주식회사 filed Critical 삼성항공산업 주식회사
Priority to KR2019890006875U priority Critical patent/KR920000089Y1/en
Publication of KR900021152U publication Critical patent/KR900021152U/en
Application granted granted Critical
Publication of KR920000089Y1 publication Critical patent/KR920000089Y1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR2019890006875U 1989-05-25 1989-05-25 Soft render Expired KR920000089Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019890006875U KR920000089Y1 (en) 1989-05-25 1989-05-25 Soft render

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019890006875U KR920000089Y1 (en) 1989-05-25 1989-05-25 Soft render

Publications (2)

Publication Number Publication Date
KR900021152U true KR900021152U (en) 1990-12-14
KR920000089Y1 KR920000089Y1 (en) 1992-01-15

Family

ID=19286396

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019890006875U Expired KR920000089Y1 (en) 1989-05-25 1989-05-25 Soft render

Country Status (1)

Country Link
KR (1) KR920000089Y1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200484972Y1 (en) * 2016-05-04 2017-11-15 (주)해원통상 Jackets for field work

Also Published As

Publication number Publication date
KR920000089Y1 (en) 1992-01-15

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Legal Events

Date Code Title Description
A201 Request for examination
UA0108 Application for utility model registration

Comment text: Application for Utility Model Registration

Patent event code: UA01011R08D

Patent event date: 19890525

UA0201 Request for examination

Patent event date: 19890525

Patent event code: UA02012R01D

Comment text: Request for Examination of Application

UG1501 Laying open of application
UG1604 Publication of application

Patent event code: UG16041S01I

Comment text: Decision on Publication of Application

Patent event date: 19911120

E701 Decision to grant or registration of patent right
UE0701 Decision of registration

Patent event date: 19920408

Comment text: Decision to Grant Registration

Patent event code: UE07011S01D

REGI Registration of establishment
UR0701 Registration of establishment

Patent event date: 19920414

Patent event code: UR07011E01D

Comment text: Registration of Establishment

UR1002 Payment of registration fee

Start annual number: 1

End annual number: 3

Payment date: 19920414

UR1001 Payment of annual fee

Payment date: 19950106

Start annual number: 4

End annual number: 4

UR1001 Payment of annual fee

Payment date: 19960115

Start annual number: 5

End annual number: 5

UR1001 Payment of annual fee

Payment date: 19961231

Start annual number: 6

End annual number: 6

FPAY Annual fee payment

Payment date: 19980115

Year of fee payment: 7

UR1001 Payment of annual fee

Payment date: 19980115

Start annual number: 7

End annual number: 7

LAPS Lapse due to unpaid annual fee
UC1903 Unpaid annual fee