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KR900002436A - 전자소자의 고착방법 - Google Patents

전자소자의 고착방법

Info

Publication number
KR900002436A
KR900002436A KR1019890010016A KR890010016A KR900002436A KR 900002436 A KR900002436 A KR 900002436A KR 1019890010016 A KR1019890010016 A KR 1019890010016A KR 890010016 A KR890010016 A KR 890010016A KR 900002436 A KR900002436 A KR 900002436A
Authority
KR
South Korea
Prior art keywords
electronic devices
fixing method
fixing
electronic
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
KR1019890010016A
Other languages
English (en)
Other versions
KR920005801B1 (ko
Inventor
야스히로 이와사
타까오 우시쿠보
유끼노리 야마지
Original Assignee
산켄 덴끼 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP63176386A external-priority patent/JPH0682697B2/ja
Priority claimed from JP1065672A external-priority patent/JPH0758720B2/ja
Priority claimed from JP1065671A external-priority patent/JPH0758719B2/ja
Application filed by 산켄 덴끼 가부시끼가이샤 filed Critical 산켄 덴끼 가부시끼가이샤
Publication of KR900002436A publication Critical patent/KR900002436A/ko
Application granted granted Critical
Publication of KR920005801B1 publication Critical patent/KR920005801B1/ko
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
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    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
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    • H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
KR1019890010016A 1988-07-15 1989-07-14 전자소자의 고착방법 Expired KR920005801B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP63-176386 1988-07-15
JP63176386A JPH0682697B2 (ja) 1988-07-15 1988-07-15 電子素子の固着方法
JP1-65671 1989-03-17
JP1065672A JPH0758720B2 (ja) 1989-03-17 1989-03-17 電子素子の固着方法
JP1-65672 1989-03-17
JP1065671A JPH0758719B2 (ja) 1989-03-17 1989-03-17 電子素子の固着方法

Publications (2)

Publication Number Publication Date
KR900002436A true KR900002436A (ko) 1990-02-28
KR920005801B1 KR920005801B1 (ko) 1992-07-18

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Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5161729A (en) * 1988-11-21 1992-11-10 Honeywell Inc. Package to semiconductor chip active interconnect site method
US5066614A (en) * 1988-11-21 1991-11-19 Honeywell Inc. Method of manufacturing a leadframe having conductive elements preformed with solder bumps
US5121871A (en) * 1990-04-20 1992-06-16 The United States Of America As Represented By The United States Department Of Energy Solder extrusion pressure bonding process and bonded products produced thereby
US5230462A (en) * 1992-07-08 1993-07-27 Materials Research Corporation Method of soldering a sputtering target to a backing member
CA2156941A1 (en) * 1995-08-21 1997-02-22 Jonathan H. Orchard-Webb Method of making electrical connections to integrated circuit
WO2002058876A1 (de) * 2001-01-26 2002-08-01 Robert Bosch Gmbh Verfahren zur herstellung einer verbindung, vorrichtung und leistungshalbleiterbauelement
WO2008026335A1 (en) * 2006-09-01 2008-03-06 Murata Manufacturing Co., Ltd. Electronic part device and method of manufacturing it and electronic part assembly and method of manufacturing it
JP2016129205A (ja) 2015-01-09 2016-07-14 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
WO2017164848A1 (en) * 2016-03-22 2017-09-28 Intel Corporation Void reduction in solder joints using off-eutectic solder
JP6867778B2 (ja) * 2016-10-27 2021-05-12 ローム株式会社 整流ｉｃ及びこれを用いた絶縁型スイッチング電源
US10881007B2 (en) * 2017-10-04 2020-12-29 International Business Machines Corporation Recondition process for BGA using flux
KR102633887B1 (ko) * 2019-07-16 2024-02-06 니혼도꾸슈도교 가부시키가이샤 파장 변환 부재, 광원 장치, 및, 파장 변환 부재의 제조 방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1331028A (en) * 1971-08-07 1973-09-19 Matsushita Electronics Corp Method of soldering a semiconductor plate
JPS51131274A (en) * 1975-05-10 1976-11-15 Fujitsu Ltd Tip bonding method
US4342090A (en) * 1980-06-27 1982-07-27 International Business Machines Corp. Batch chip placement system
JPS5945077A (ja) * 1982-09-07 1984-03-13 Nec Corp 電子部品の半田付方法
JPS61125025A (ja) * 1984-11-22 1986-06-12 Hitachi Ltd 半導体装置の製造方法
IN168174B (ko) * 1986-04-22 1991-02-16 Siemens Ag
DE3777522D1 (de) * 1986-10-17 1992-04-23 Hitachi Ltd Verfahren zum herstellen einer gemischten struktur fuer halbleiteranordnung.
JPH0640555B2 (ja) * 1987-02-09 1994-05-25 株式会社東芝 ダイボンデイング装置

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KR920005801B1 (ko) 1992-07-18

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