KR890015043A - Optoelectronic Integrated Circuits Subassemblies - Google Patents

Abstract

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Description

Optoelectronic Integrated Circuits Subassemblies

Since this is an open matter, no full text was included.

1 shows an optoelectronic transceiver subassembly (with the lid removed) in the same size, in accordance with an embodiment of the present invention.

2 through 3 are cross-sectional views of a portion of the base showing how the light in the all-silica waveguide is deflected upward to provide an optical test point or couple the light to a photo detector on a substrate.

Claims (21)

An optoelectronic integrated circuit subassembly comprising a single crystal semiconductor base having a major surface and an insulating layer formed on the major surface, and an optical waveguide formed entirely on the major surface, the optoelectronic integrated circuit subassembly mounted to the base and optically coupled to the waveguide. At least two optoelectronic chips physically separated from each other, and at least two physically separated to accommodate the chip, such that the cavity is separated by a material of a lid that electrically and optically insulates the chip from each other. And a single crystal semiconductor lid over said base, said cavity comprising a cavity. The lid of claim 1, wherein the lid is weld-sealed to the base, at least one waveguide of the waveguide extends downwardly to the outside thereof, and wherein the lid is external to the lid for coupling the at least one waveguide to the optical fiber. And optoelectronic integrated circuit subassembly. The electrical contact on the base of claim 1 wherein the lid has a dimension measured parallel to the major surface that is smaller than the corresponding dimension of the base and extends below the lid from the chip to the exterior thereof. An opto-electronic integrated circuit subassembly further comprising. The opto-electronic integrated circuit subassembly of claim 1, wherein the parallel edges of the base or the lid include grooves suitable for receiving guide rods. 2. The waveguide of claim 1, wherein the waveguide comprises a secondary waveguide and a transmission waveguide forming a pair of optical couplers, wherein the chip comprises a receiver photodetector optically coupled to one of the combiners and the other of the combiners. An optically coupled monitor photodetector and a laser diode coupled to one end of the transmission waveguide, and further comprising fiber alignment means disposed at the other end of the transmission waveguide. . 2. The apparatus of claim 1, wherein one of the chips comprises a laser diode optically coupled to one end of the transmission waveguide, the combiner for extracting a portion of light coupled from the laser diode to the transmission waveguide, and wherein the light is And means for directing the light at the coupler with a test point radiating upward from the base such that alignment of the laser with respect to the transmission waveguide can be monitored. An optoelectronic integrated circuit subassembly comprising a single crystal semiconductor base having a major surface, and an optical waveguide formed entirely on the major surface, comprising: an optoelectronic chip mounted on the surface and optically coupled to the waveguide; And a single crystal semiconductor lid sealed to form an wool covering the chip, and outside of the wool, means for coupling the waveguide to the optical fiber, the waveguide extending from below the lid to its exterior. Optoelectronic integrated circuit subassembly, characterized in that. 8. The device of claim 7, wherein the lid has dimensions measured parallel to the surface that are smaller than the corresponding dimensions of the base, and further comprising electrical contacts on the base that are stiff from the chip under the lid to the exterior thereof. Optoelectronic integrated circuit subassembly, characterized in that. 8. The optoelectronic integrated circuit subassembly of claim 7, wherein the parallel edges of the base or the lid include grooves suitable for receiving guide rods. An optoelectronic subassembly comprising a single crystal semiconductor base having a major surface with grooves formed therein, the optoelectronic subassembly comprising: an optical waveguide formed generally on the major surface and axially aligned with the groove; And wherein the macer is disposed in the groove to align the active region with the waveguide. The optoelectronic device according to claim 10, wherein the laser has an opposing major surface, the macer is disposed on one of the major surfaces, and a metallization having an opening is disposed on the opposing major surface. Subassembly. An optoelectronic subassembly comprising a single crystal semiconductor base and an optoelectronic device mounted thereon, the optoelectronic subassembly comprising: means for optically coupling the optoelectronic device to an optical fiber, and at least two spaced parallel to guide the subassembly; Optoelectronic subassembly comprising means for receiving a rod. The method of claim 12, wherein the base has a pair of parallel edges, the rod receiving means includes a V groove formed in each of the edges, one of the rods can be disposed in each of the grooves Optoelectronic subassembly made. A pair of edges according to claim 12, wherein said base has a pair of parallel edges and said coupling means comprises a single crystal semiconductor fixture mounted to one end of said base, said pair of edges being parallel to the edge of said base. And the inclined surface has an inclined surface forming parallel V-grooves. 15. The optoelectronic subassembly of claim 14, wherein the fixture and the base have major surfaces disposed axially aligned with respect to each other to form a channel for the V groove to receive the fiber. 15. The optoelectronic subassembly of claim 13 or 14, comprising means for attaching said rod in said V-groove. An optoelectronic integrated circuit subassembly comprising a single crystal silicon base having a major surface and an insulating layer formed on the major surface, and an optical waveguide formed entirely on the major surface, the optoelectronic integrated circuit subassembly mounted to the base and optically coupled to the waveguide, At least two optoelectronic chips that are physically separated from each other, and at least two physically separated to accommodate the chips, such that the cavities are separated by a material in the lid that electrically and optically separates the chips from each other. A single crystal silicon lid on the base, the at least one waveguide extending from below to the outside thereof, and means for coupling the at least one waveguide external to the lid to the optical fiber; And the lid corresponds to that of the base Having a dimension that is measured parallel to the main surface is smaller than the dimension,, optoelectronic integrated circuit according to claim 1, further including electrical contacts on said base extending to the outside from the chip beneath the cap subassembly. 18. The receiver of claim 17, wherein the waveguide comprises a secondary waveguide and a transmission waveguide forming a pair of optical couplers, wherein the chip is optically coupled to one of the combiners and to the other of the combiner. And a laser diode coupled to one end of said transmission waveguide. 19. The method of claim 18, wherein the base has a major surface on which a groove is formed, one of the waveguides axially aligned with the groove, the laser having a macer and an active area formed in the beggar, the macer And an optoelectronic integrated circuit subassembly arranged to align the waveguide and the active region. 18. The opto-electronic integrated circuit as claimed in claim 17, wherein the base has a pair of parallel edges and V grooves formed in each of the edges, so that a guide rod for the subassembly can be positioned in the groove. assembly. 18. The method of claim 17, wherein the base has a pair of parallel edges, and the coupling means comprises a single crystal silicon fixture mounted at one end of the base, the fixture having a pair of edges parallel to the edge of the base. And the edge has an inclined surface forming a parallel V groove, so that the guide rod for the sub assembly is positioned in the groove. ※ Note: The disclosure is based on the initial application.