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KR880003426A - Plastic capsule semiconductor device and manufacturing method thereof - Google Patents

Plastic capsule semiconductor device and manufacturing method thereof Download PDF

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Publication number
KR880003426A
KR880003426A KR1019870009326A KR870009326A KR880003426A KR 880003426 A KR880003426 A KR 880003426A KR 1019870009326 A KR1019870009326 A KR 1019870009326A KR 870009326 A KR870009326 A KR 870009326A KR 880003426 A KR880003426 A KR 880003426A
Authority
KR
South Korea
Prior art keywords
mold
plate
plastic
encapsulation
pins
Prior art date
Application number
KR1019870009326A
Other languages
Korean (ko)
Inventor
페르니씨아로 스파트리사노 안토니오
쎌라이 마리노
Original Assignee
산토 프졸로
에스 지 에스 마이크로엘레트로니카 에스·피·에이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 산토 프졸로, 에스 지 에스 마이크로엘레트로니카 에스·피·에이 filed Critical 산토 프졸로
Publication of KR880003426A publication Critical patent/KR880003426A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

내용 없음No content

Description

플라스틱 캡슐형 반도체 장치 및 이의 제조 방법Plastic capsule semiconductor device and manufacturing method thereof

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제3도는 본 발명의 제1의 양호한 실시예에 사용된 리드 프레임의 평면도.3 is a plan view of a lead frame used in the first preferred embodiment of the present invention.

제4도는 제3도에 도시한 바와 같은 프레임에 의해 형성된 플라스틱 캡슐형 반도체 장치의 단면도.4 is a cross-sectional view of a plastic encapsulated semiconductor device formed by a frame as shown in FIG.

제5도는 제4도에 도시한 바와 같은 반도체 장치의 입체도.5 is a three-dimensional view of the semiconductor device as shown in FIG.

Claims (4)

플라스틱 캡슐형 반도체 장치를 제조하기 위한 방법에 있어서, 반도체 칩, 전극과 방열판으로서 작용하고 제1표면이 반도체 칩에 납땜되는 금속판(31), 판(31)의 제2표면상에 얇고 균일한 플라스틱 층을 야기시키는 플라스틱 캡슐 하우징, 및 캡슐화 중에, 최소한 한쌍의 위치 설정핀과 리드선(38)에 관련된 몰드내에 존재하는 위치 설정기에 의해 캡슐화 몰드내에 판(31)이 정확히 배치되도록 판(31)에 접속된 리드선(38)로 구성되어, 위치 설정핀의 단부가 최종 캡슐화 단계에서 판(31)의 금속 표면에 관련하여 소정 간격을 두고 배치되고, 초기 단계에서 금속 표면에 직접 접속되거나 두꺼운 절연부의 중간 위치를 통해 간접적으로 접속되는 것을 특징으로 하는 방법.A method for manufacturing a plastic encapsulated semiconductor device, comprising: a thin and uniform plastic on a second surface of a plate 31, a metal plate 31 which acts as a semiconductor chip, an electrode and a heat sink, and a first surface is soldered to the semiconductor chip. The plastic capsule housing causing the layer, and during encapsulation, is connected to the plate 31 such that the plate 31 is correctly placed in the encapsulation mold by at least a pair of positioning pins and a locator present in the mold relative to the lead wire 38. Consisting of lead wires 38, the ends of the positioning pins being arranged at predetermined intervals relative to the metal surface of the plate 31 in the final encapsulation step, and in intermediate stages of the thick insulation directly connected to the metal surface in the initial step Method indirectly connected via a. 제1항에 있어서, 위치 설정 핀이 퇴출될 수 있고, 이것들의 단부들이 캡슐화 중에 플라스틱이 몰드를 채우는 한 판(31)에 관련하여 유지되고, 열경화 반응을 시작하기전에 퇴출되며 동시에 핀에 의해 미리 생긴 룸이 채워지지 않는 한 캡슐화 플라스틱의 주입이 계속되는 것을 특징으로 하는 방법.2. The positioning pin according to claim 1, wherein the positioning pins can be retracted, and their ends are held relative to the plate 31 on which the plastic fills the mold during encapsulation, and are retracted before starting the thermosetting reaction and at the same time by the pins. Infusion of encapsulated plastic is continued unless the pre-formed room is filled. 제1항에 있어서, 캡슐화를 시작하기전에, 한개 이상의 열 가소성 못(91)이 판(31)내에 형성된 한개이상의 구멍내에 삽입되고, 못의 단부들이 판(31)에 못 자체를 고정시키고 이 단부에 소정의 형태 및 미리 고정된 크기를 제공하도록 연속적으로 리베트되며, 캡슐화 중에, 리드선(38)에 관련된 몰드의 위치 설정기와 못(91)의 단부에 관련된 몰드에 고정된 한쌍의 핀(110,111)에 의해 몰드 내에 핀(31)이 정확히 배치되는 것을 특징으로 하는 방법.The method according to claim 1, wherein before the encapsulation begins, one or more thermoplastic nails (91) are inserted into one or more holes formed in the plates (31), with the ends of the nails fixing the nails themselves to the plates (31) and the ends thereof. To a pair of pins 110, 111 that are continuously riveted to provide a predetermined shape and a pre-determined size to, and during encapsulation, fixed to the mold locator relative to the lead wire 38 and the mold relative to the end of the nail 91. And pins (31) are correctly placed in the mold. 상기 항들 중의 어느 한 항에 청구된 바와 같은 방법에 따라 제조되는 것을 특징으로 하는 전기적으로 절연된 플라스틱 캡슐형 반도체 장치.An electrically insulated plastic encapsulated semiconductor device, which is produced according to the method as claimed in any one of the preceding claims. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019870009326A 1986-08-27 1987-08-26 Plastic capsule semiconductor device and manufacturing method thereof KR880003426A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT6611A/86 1986-08-27
IT8606611A IT1215023B (en) 1986-08-27 1986-08-27 RESIN AND ELECTRONICALLY ISOLATED ENCAPSULATED DEVICE AND SEMICONDUCTOR AND PROCESS FOR LASUA MANUFACTURE

Publications (1)

Publication Number Publication Date
KR880003426A true KR880003426A (en) 1988-05-17

Family

ID=11121391

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870009326A KR880003426A (en) 1986-08-27 1987-08-26 Plastic capsule semiconductor device and manufacturing method thereof

Country Status (3)

Country Link
JP (1) JPS6362239A (en)
KR (1) KR880003426A (en)
IT (1) IT1215023B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2596995B2 (en) * 1988-12-21 1997-04-02 シャープ株式会社 Method for manufacturing semiconductor device
JP2752677B2 (en) * 1989-01-11 1998-05-18 日本電気株式会社 Method for manufacturing semiconductor device
JPH02216838A (en) * 1989-02-17 1990-08-29 Fuji Electric Co Ltd Manufacturing method for resin-sealed semiconductor device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60130129A (en) * 1983-12-16 1985-07-11 Nec Corp Method for sealing isolation-type semiconductor element with resin

Also Published As

Publication number Publication date
JPS6362239A (en) 1988-03-18
IT8606611A0 (en) 1986-08-27
IT1215023B (en) 1990-01-31

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Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19870826

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid