KR860700203A - 금속 도금전에 플라스틱 기판의 표면을 상태조절하기 위한 조성물 및 그 방법 - Google Patents

금속 도금전에 플라스틱 기판의 표면을 상태조절하기 위한 조성물 및 그 방법

Info

Publication number: KR860700203A
Authority: KR; South Korea
Prior art keywords: composition; metal plating; plastic substrate; conditioning; substrate before
Prior art date: 1984-05-29

Application number

KR1019860700048A

Other languages

English (en)

Other versions

KR910005532B1 (ko

Inventor

알. 델 고보 안토니

Original Assignee

엔손 인코포레이티드

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1984-05-29

Filing date

1986-01-28

Publication date

1986-03-31

1985-05-08 Application filed by 엔손 인코포레이티드 filed Critical 엔손 인코포레이티드

1986-03-31 Publication of KR860700203A publication Critical patent/KR860700203A/ko

1991-07-31 Application granted granted Critical

1991-07-31 Publication of KR910005532B1 publication Critical patent/KR910005532B1/ko

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

Engineering & Computer Science (AREA)
Chemical & Material Sciences (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing & Machinery (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Chemical Kinetics & Catalysis (AREA)
General Chemical & Material Sciences (AREA)
Chemically Coating (AREA)
Manufacturing Of Printed Wiring (AREA)
Liquid Crystal (AREA)
Harvesting Machines For Root Crops (AREA)
Optical Integrated Circuits (AREA)
Compositions Of Macromolecular Compounds (AREA)

KR1019860700048A 1984-05-29 1985-05-08 금속 도금전에 플라스틱 기판의 표면을 상태조절하기 위한 조성물 및 그 방법 KR910005532B1 (ko)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
US61491284A	1984-05-29	1984-05-29
US614912		1984-05-29
PCT/US1985/000857 WO1985005755A1 (en)	1984-05-29	1985-05-08	Composition and process for conditioning the surface of plastic substrates prior to metal plating

Publications (2)

Publication Number	Publication Date
KR860700203A true KR860700203A (ko)	1986-03-31
KR910005532B1 KR910005532B1 (ko)	1991-07-31

Family

ID=24463231

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
KR1019860700048A KR910005532B1 (ko)	1984-05-29	1985-05-08	금속 도금전에 플라스틱 기판의 표면을 상태조절하기 위한 조성물 및 그 방법

Country Status (13)

Country	Link
EP (1)	EP0187150B1 (ko)
JP (1)	JPS61502262A (ko)
KR (1)	KR910005532B1 (ko)
AT (1)	ATE69352T1 (ko)
AU (1)	AU575953B2 (ko)
BR (1)	BR8506711A (ko)
CA (1)	CA1237558A (ko)
DE (1)	DE3584623D1 (ko)
DK (1)	DK35786A (ko)
GB (1)	GB2175610B (ko)
IL (1)	IL75247A (ko)
MX (1)	MX166644B (ko)
WO (1)	WO1985005755A1 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5132038A (en) *	1988-04-25	1992-07-21	Macdermid, Incorporated	Composition for preparing printed circuit through-holes for metallization
WO1989010431A1 (en) *	1988-04-25	1989-11-02	Macdermid, Incorporated	Process and composition for preparing printed circuit through-holes for metallization
US5032427A (en) *	1988-04-25	1991-07-16	Macdermid, Incorporated	Process for preparation printed circuit through-holes for metallization
US5213840A (en) *	1990-05-01	1993-05-25	Macdermid, Incorporated	Method for improving adhesion to polymide surfaces
US5221418A (en) *	1992-02-11	1993-06-22	Macdermid, Incorporated	Method for improving the surface insulation resistance of printed circuits
DE4221948C1 (de) *	1992-07-02	1993-10-21	Schering Ag	Verfahren zur Metallisierung von Kunststoffen und Verwendung
DE4326079A1 (de) *	1993-07-30	1995-02-02	Atotech Deutschland Gmbh	Verfahren zur Behandlung von Kunststoffoberflächen und Anquell-Lösung
DE102005051632B4 (de)	2005-10-28	2009-02-19	Enthone Inc., West Haven	Verfahren zum Beizen von nicht leitenden Substratoberflächen und zur Metallisierung von Kunststoffoberflächen

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5133833B2 (ko) *	1973-03-19	1976-09-22
US4086128A (en) *	1976-03-04	1978-04-25	Mitsubishi Gas Chemical Company, Inc.	Process for roughening surface of epoxy resin
US4515829A (en) *	1983-10-14	1985-05-07	Shipley Company Inc.	Through-hole plating

1985
- 1985-05-08 AT AT85902778T patent/ATE69352T1/de not_active IP Right Cessation
- 1985-05-08 GB GB08601875A patent/GB2175610B/en not_active Expired
- 1985-05-08 AU AU43568/85A patent/AU575953B2/en not_active Ceased
- 1985-05-08 JP JP60502249A patent/JPS61502262A/ja active Granted
- 1985-05-08 EP EP85902778A patent/EP0187150B1/en not_active Expired - Lifetime
- 1985-05-08 KR KR1019860700048A patent/KR910005532B1/ko not_active IP Right Cessation
- 1985-05-08 BR BR8506711A patent/BR8506711A/pt unknown
- 1985-05-08 WO PCT/US1985/000857 patent/WO1985005755A1/en active IP Right Grant
- 1985-05-08 DE DE8585902778T patent/DE3584623D1/de not_active Expired - Lifetime
- 1985-05-17 CA CA000481805A patent/CA1237558A/en not_active Expired
- 1985-05-20 IL IL75247A patent/IL75247A/xx not_active IP Right Cessation
- 1985-05-28 MX MX205418A patent/MX166644B/es unknown
1986
- 1986-01-23 DK DK35786A patent/DK35786A/da not_active Application Discontinuation

Also Published As

Publication number	Publication date
ATE69352T1 (de)	1991-11-15
EP0187150A4 (en)	1987-07-23
EP0187150B1 (en)	1991-11-06
DK35786D0 (da)	1986-01-23
DE3584623D1 (de)	1991-12-12
AU4356885A (en)	1985-12-31
JPS61502262A (ja)	1986-10-09
GB8601875D0 (en)	1986-03-05
GB2175610B (en)	1988-07-20
EP0187150A1 (en)	1986-07-16
BR8506711A (pt)	1986-09-23
GB2175610A (en)	1986-12-03
IL75247A0 (en)	1985-09-29
MX166644B (es)	1993-01-25
AU575953B2 (en)	1988-08-11
DK35786A (da)	1986-01-23
JPH0319301B2 (ko)	1991-03-14
KR910005532B1 (ko)	1991-07-31
CA1237558A (en)	1988-06-07
WO1985005755A1 (en)	1985-12-19
IL75247A (en)	1988-08-31

Publication	Publication Date	Title
IL103895A (en)	1997-04-15	Displacement metal aqueous plating solution comprising imidazole- 2-thione complexing agent and its use
DE3868114D1 (de)	1992-03-12	Verfahren zur herstellung von (2,2)-paracyclophan und dessen derivaten.
DE3572130D1 (en)	1989-09-14	Dual curing coating method for substrates with shadow areas
JPS54115351A (en)	1979-09-07	155deoxyy166hydroxyprostaglandin
DE3876215D1 (de)	1993-01-07	Zusammensetzung und verfahren zum konditionieren der oberflaeche von polycarbonat-harzen vor der metallplattierung.
KR860009023A (ko)	1986-12-19	치환된 실릴기를 갖는 신규 에테르 화합물의 제조방법
ES8801680A1 (es)	1988-02-16	Un procedimiento para la preparacion de un polimero de elevada elasticidad y dureza
IE45090L (en)	1977-12-09	N-phosphonomethylene - aminoalkane phosphonic acids.
KR860700203A (ko)	1986-03-31	금속 도금전에 플라스틱 기판의 표면을 상태조절하기 위한 조성물 및 그 방법
CA2068761A1 (en)	1992-11-18	Method for use of preflux, printed wiring board, and method for production thereof
ES8506979A1 (es)	1985-08-16	Procedimiento para preparar nuevas sales de alquil (cadena larga) amonio de n-fosfonometilglicina
BR8606955A (pt)	1987-11-03	Processo para preparar uma composicao,concentrado aditivo,composicao lubrificante,composicao combustivel e metodo para reduzir o consumo de combustivel
ES8505806A1 (es)	1985-06-16	Procedimiento para preparar nuevas sales de alquil(mixto) sulfonio de n-fosfonome-tilglicina
DK0601191T3 (da)	1999-04-26	Hidtil ukendt tetracyklisk forbindelse
HK1032916A1 (en)	2001-08-10	N,n'-bis(sulfonyl)hydrazines useful as antineoplastic agents
KR850002979A (ko)	1985-05-28	1,2,3-트리티안화합물의 신규 제조방법
ES8301931A1 (es)	1983-01-01	Un procedimiento para la preparacion de nuevos imidazoles.
HUT46901A (en)	1988-12-28	Process for keto-reduction of carbacyclin intermediers
IL106080A (en)	1997-06-10	Pharmaceutical compositions containing amidinoalkane-1, 1-bisphosphonic acids and some such novel compounds
IL63008A0 (en)	1981-09-13	Hydrocarbon soluble sodium alkyls and their manufacture
LU88287I2 (fr)	1994-05-04	Cyproternacetate (Climen)
ES8501408A1 (es)	1984-12-01	Procedimiento para la preparacion de agentes biocidas
MX9708785A (es)	1998-02-28	El uso de poliglucosidos de alquilo c16-c18, como desespumantes en composiciones de limpieza.
ATE86629T1 (de)	1993-03-15	4-piperidincarboxamid-derivate.
IT1214534B (it)	1990-01-18	4-cloro-arilossi-acetil-e 4-cloro-arilossi-propionil-malonati aventi proprieta' erbicide.

Legal Events

Date	Code	Title	Description
1986-01-28	PA0109	Patent application	Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19860128
1986-03-31	PG1501	Laying open of application
1988-11-10	A201	Request for examination
1988-11-10	PA0201	Request for examination	Patent event code: PA02012R01D Patent event date: 19881110 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 19860128 Comment text: Patent Application
1991-02-21	E902	Notification of reason for refusal
1991-02-21	PE0902	Notice of grounds for rejection	Comment text: Notification of reason for refusal Patent event date: 19910221 Patent event code: PE09021S01D
1991-07-01	G160	Decision to publish patent application
1991-07-31	PG1605	Publication of application before grant of patent	Comment text: Decision on Publication of Application Patent event code: PG16051S01I Patent event date: 19910701
1991-10-11	E701	Decision to grant or registration of patent right
1991-10-11	PE0701	Decision of registration	Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 19911011
1992-01-07	GRNT	Written decision to grant
1992-01-07	PR0701	Registration of establishment	Comment text: Registration of Establishment Patent event date: 19920107 Patent event code: PR07011E01D
1992-01-07	PR1002	Payment of registration fee	Payment date: 19920107 End annual number: 3 Start annual number: 1
1994-07-15	PR1001	Payment of annual fee	Payment date: 19940715 Start annual number: 4 End annual number: 4
1995-07-03	PR1001	Payment of annual fee	Payment date: 19950703 Start annual number: 5 End annual number: 5
1996-07-04	PR1001	Payment of annual fee	Payment date: 19960704 Start annual number: 6 End annual number: 6
1997-06-30	PR1001	Payment of annual fee	Payment date: 19970630 Start annual number: 7 End annual number: 7
1998-07-13	PR1001	Payment of annual fee	Payment date: 19980713 Start annual number: 8 End annual number: 8
1999-07-26	PR1001	Payment of annual fee	Payment date: 19990727 Start annual number: 9 End annual number: 9
2000-07-25	PR1001	Payment of annual fee	Payment date: 20000726 Start annual number: 10 End annual number: 10
2001-06-30	PR1001	Payment of annual fee	Payment date: 20010702 Start annual number: 11 End annual number: 11
2002-07-05	PR1001	Payment of annual fee	Payment date: 20020708 Start annual number: 12 End annual number: 12
2003-06-27	PR1001	Payment of annual fee	Payment date: 20030630 Start annual number: 13 End annual number: 13
2004-07-01	FPAY	Annual fee payment	Payment date: 20040702 Year of fee payment: 14
2004-07-01	PR1001	Payment of annual fee	Payment date: 20040702 Start annual number: 14 End annual number: 14
2005-05-09	EXPY	Expiration of term
2005-05-09	PC1801	Expiration of term