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KR860008235A - 에폭시 수지조성물 - Google Patents

에폭시 수지조성물 Download PDF

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Publication number
KR860008235A
KR860008235A KR1019850007973A KR850007973A KR860008235A KR 860008235 A KR860008235 A KR 860008235A KR 1019850007973 A KR1019850007973 A KR 1019850007973A KR 850007973 A KR850007973 A KR 850007973A KR 860008235 A KR860008235 A KR 860008235A
Authority
KR
South Korea
Prior art keywords
epoxy resin
resin composition
parts
weight
inorganic filler
Prior art date
Application number
KR1019850007973A
Other languages
English (en)
Other versions
KR890004087B1 (ko
Inventor
가즈오 야스라
도시하루 안도오
요시후미 이다바시
마사루 쓰찌하시
Original Assignee
시끼모리야
미쓰비시전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시끼모리야, 미쓰비시전기주식회사 filed Critical 시끼모리야
Publication of KR860008235A publication Critical patent/KR860008235A/ko
Application granted granted Critical
Publication of KR890004087B1 publication Critical patent/KR890004087B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

내용 없음

Description

에폭시 수지조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
도면은 이 발명의 실시예 및 비교예로서 각각 조제한 에폭시(Epoxy)수지 조성물의 시간경과에 따른 점도 변화를 표시한 선도이다.

Claims (3)

  1. 에폭시당량 200 이하의 에폭시수지 100중량부에 대하여 식(Ⅰ) :
    로 표시되는 n=100 정도의 페녹시수지를 0.5-10 중량부 가열혼합한 에폭시수지, 경화제 및 무기질 충전제로서 이룩한 에폭시수지 조성물.
  2. 청구범위 제1항에 있어서,
    경화제가 다연기성 카르봉산무수물 100중량부와 식(Ⅱ) :
    로 표시되는 비스페놀 A40-60 중량부와의 축합 혼합물인 에폭시수지조성물.
  3. 청구범위 제1항에 있어서,
    무기질충전제가 반토분말인 에폭시수지조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019850007973A 1985-04-10 1985-10-28 에폭시 수지 조성물 KR890004087B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP74355 1985-04-10
JP60074355A JPS61233011A (ja) 1985-04-10 1985-04-10 エポキシ樹脂組成物
JP60-74355 1985-04-10

Publications (2)

Publication Number Publication Date
KR860008235A true KR860008235A (ko) 1986-11-14
KR890004087B1 KR890004087B1 (ko) 1989-10-20

Family

ID=13544732

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019850007973A KR890004087B1 (ko) 1985-04-10 1985-10-28 에폭시 수지 조성물

Country Status (6)

Country Link
US (1) US4681904A (ko)
EP (1) EP0199180B1 (ko)
JP (1) JPS61233011A (ko)
KR (1) KR890004087B1 (ko)
CN (1) CN86102325B (ko)
DE (1) DE3678602D1 (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2668289B2 (ja) * 1991-01-25 1997-10-27 ソマール 株式会社 粉体塗料用エポキシ樹脂組成物
EP0544618A1 (de) * 1991-11-27 1993-06-02 Ciba-Geigy Ag Hochgefüllte Epoxid-Giessharzmassen
CA2176556A1 (en) * 1993-12-29 1995-07-06 Robert J. Barsotti High solids coating composition
US5691402A (en) * 1996-09-13 1997-11-25 Composite Technology Group, Llc Composite tooling material having vinyl ester resins and fillers
TW398163B (en) * 1996-10-09 2000-07-11 Matsushita Electric Ind Co Ltd The plate for heat transfer substrate and manufacturing method thereof, the heat-transfer substrate using such plate and manufacturing method thereof
US6410615B1 (en) * 1998-06-09 2002-06-25 Nitto Denko Corporation Semiconductor sealing epoxy resin composition and semiconductor device using the same
US6309587B1 (en) 1999-08-13 2001-10-30 Jeffrey L. Gniatczyk Composite molding tools and parts and processes of forming molding tools
CN100389160C (zh) * 2006-07-24 2008-05-21 杭州油漆有限公司 一种环氧地坪涂料
CN101415296B (zh) * 2008-11-24 2010-06-09 广东汕头超声电子股份有限公司覆铜板厂 一种覆铜板结构
CN108215233B (zh) * 2017-12-11 2019-12-24 湖北耐创新材料洁具有限公司 一种树脂和矿物混合浇注件的压力成型工艺
US11729915B1 (en) 2022-03-22 2023-08-15 Tactotek Oy Method for manufacturing a number of electrical nodes, electrical node module, electrical node, and multilayer structure

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE521204A (ko) * 1952-07-05 1900-01-01
US3395118A (en) * 1962-10-15 1968-07-30 Union Carbide Corp Modified thermoplastic polyhydroxyethers
US3352809A (en) * 1963-11-05 1967-11-14 Dow Chemical Co Polyglycidyl ether of a polyhydric compound with a minor amount of a polyepoxide formed by the reaction of diglycidyl ether with a polyhydric phenol
US3424707A (en) * 1964-03-18 1969-01-28 Union Carbide Corp Thermoplastic polyhydroxy ether and liquid epoxy compositions
CH544787A (de) * 1971-04-22 1973-11-30 Ciba Geigy Ag System zur Herstellung von gehärteten Formkörpern aus Epoxidharzen
US3873637A (en) * 1973-02-23 1975-03-25 Sony Corp Adhesive composition containing phenoxy and epoxy resins and a cross-linking agent therefor
CH586243A5 (ko) * 1973-12-19 1977-03-31 Ciba Geigy Ag
JPS6037810B2 (ja) * 1978-12-08 1985-08-28 東邦レーヨン株式会社 ストランドプリプレグ組成物
JPS55161842A (en) * 1979-06-04 1980-12-16 Hitachi Ltd Thermosetting resin composition
JPS58213018A (ja) * 1982-06-03 1983-12-10 Mitsubishi Electric Corp エポキシ樹脂組成物
JPS60123526A (ja) * 1983-12-06 1985-07-02 Mitsubishi Electric Corp エポキシ樹脂組成物
JPS612725A (ja) * 1984-06-15 1986-01-08 Mitsubishi Electric Corp 熱硬化性樹脂組成物

Also Published As

Publication number Publication date
KR890004087B1 (ko) 1989-10-20
EP0199180B1 (en) 1991-04-10
EP0199180A2 (en) 1986-10-29
CN86102325B (zh) 1988-12-07
EP0199180A3 (en) 1988-06-01
JPS61233011A (ja) 1986-10-17
US4681904A (en) 1987-07-21
DE3678602D1 (de) 1991-05-16
CN86102325A (zh) 1986-10-08

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