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KR850005140A - Manufacturing Method of Semiconductor Device - Google Patents

Manufacturing Method of Semiconductor Device Download PDF

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Publication number
KR850005140A
KR850005140A KR1019830005874A KR830005874A KR850005140A KR 850005140 A KR850005140 A KR 850005140A KR 1019830005874 A KR1019830005874 A KR 1019830005874A KR 830005874 A KR830005874 A KR 830005874A KR 850005140 A KR850005140 A KR 850005140A
Authority
KR
South Korea
Prior art keywords
manufacturing
semiconductor device
lead
bonding
note
Prior art date
Application number
KR1019830005874A
Other languages
Korean (ko)
Other versions
KR910007506B1 (en
Inventor
기미오 미요시
Original Assignee
아라끼 쓰네오
간사이 닛뽄 덴끼 가부시끼 가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아라끼 쓰네오, 간사이 닛뽄 덴끼 가부시끼 가이샤 filed Critical 아라끼 쓰네오
Priority to KR1019830005874A priority Critical patent/KR910007506B1/en
Publication of KR850005140A publication Critical patent/KR850005140A/en
Application granted granted Critical
Publication of KR910007506B1 publication Critical patent/KR910007506B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

내용 없음No content

Description

반도체장치의 제조방법Manufacturing Method of Semiconductor Device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

Claims (1)

반도체소자의 전극에서 연장되는 가느다란 금속선을 표면에 금속도금충이 형성되어 있지 아니한 리이드에 본딩함에 앞서서, 리이드의 표면층부를 산성용액 또는 염기성용액으로 에칭 제거하는 것을 특징으로 하는 반도체장치의 제조방법.A method of manufacturing a semiconductor device, characterized in that the surface layer portion of the lead is etched away with an acidic solution or a basic solution prior to bonding a thin metal wire extending from an electrode of the semiconductor element to a lead having no metal plating insect formed thereon. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019830005874A 1983-12-12 1983-12-12 Method of semiconductor device KR910007506B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019830005874A KR910007506B1 (en) 1983-12-12 1983-12-12 Method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019830005874A KR910007506B1 (en) 1983-12-12 1983-12-12 Method of semiconductor device

Publications (2)

Publication Number Publication Date
KR850005140A true KR850005140A (en) 1985-08-21
KR910007506B1 KR910007506B1 (en) 1991-09-26

Family

ID=19230587

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019830005874A KR910007506B1 (en) 1983-12-12 1983-12-12 Method of semiconductor device

Country Status (1)

Country Link
KR (1) KR910007506B1 (en)

Also Published As

Publication number Publication date
KR910007506B1 (en) 1991-09-26

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Patent event code: PA01091R01D

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