[go: up one dir, main page]

KR850002595A - 금속의 용해방법 - Google Patents

금속의 용해방법 Download PDF

Info

Publication number
KR850002595A
KR850002595A KR1019840000907A KR840000907A KR850002595A KR 850002595 A KR850002595 A KR 850002595A KR 1019840000907 A KR1019840000907 A KR 1019840000907A KR 840000907 A KR840000907 A KR 840000907A KR 850002595 A KR850002595 A KR 850002595A
Authority
KR
South Korea
Prior art keywords
promoter
metal
diol
gram
concentration
Prior art date
Application number
KR1019840000907A
Other languages
English (en)
Other versions
KR920006352B1 (ko
Inventor
루이스 엘리아스 모에네스 (외 1)
Original Assignee
케이.에스.커스너
다아르 인더스트리이즈 인코포레이팃드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 케이.에스.커스너, 다아르 인더스트리이즈 인코포레이팃드 filed Critical 케이.에스.커스너
Publication of KR850002595A publication Critical patent/KR850002595A/ko
Application granted granted Critical
Publication of KR920006352B1 publication Critical patent/KR920006352B1/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

내용 없음

Description

금속의 용해방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (13)

  1. 금속들을 용해시키는 방법에 있어서, 금속을 유리 염소 또는 브롬이온, 황산 약 0.2 내지 4.5 그람몰/ℓ, 과산화수소 약 0.25 내지 8그람몰/ℓ를 함유하는 수용액과 접촉시키고, 하기 일반식을 가진 디올촉진제의 유효량을 첨가시킴을 특징으로 하는 염소 또는 브롬이온들이 존재하는 용액 중에서 금속의 용해속도를 증가시키는 방법.
    상기 일반식에서, ,R1,R2,R3및 R4는 H,CH3,OC2H5또는 OC3H8에서 선택할 수 있다.
  2. 제1항에 있어서, 상기 촉진제를 0.01그람몰/ℓ이상의 농도로 공급함을 특징으로 하는 방법.
  3. 제1항에 있어서, 상기 촉진제를 약 0.1 내지 0.5그람몰/ℓ범위내의 농도로 공급함을 특징으로 하는 방법.
  4. 제1항에 있어서, 수용액에 과산화수소에 대한 중금속이온들의 분해작용을 감소시키기 위한 안정제로 페놀 술폰산나트륨을 첨가시킴을 특징으로 하는 방법.
  5. 제1항에 있어서, 과산화수소의 농도를 약 1 내지 4그람몰/ℓ로 유지시킴을 특징으로 하는 방법.
  6. 제1항에 있어서, 황산농도를 약 0.3 내지 4그람몰/ℓ로 유지시킴을 특징으로 하는 방법.
  7. 제1항에 있어서, 촉진제가 2-부틴-1,4-디올인 것을 특징으로 하는 방법.
  8. 제1항에 있어서, 촉진제가 3-헥신-2,5-디올인 것을 특징으로 하는 방법.
  9. 제1항에 있어서, 촉진제가 모노프로폭실-2-부틴-1,4-디올인 것을 특징으로 하는 방법.
  10. 제1항에 있어서, 촉진제가 디에톡실-2-부틴-1,4-디올인 것을 특징으로 하는 방법.
  11. 제1항에 있어서, 금속이 구리 또는 구리합금인 것을 특징으로 하는 방법.
  12. 제1항에 있어서, 유리 염소 또는 브롬화물의 2ppm 이상 존재하에 수행함을 특징으로 하는 방법.
  13. 제1항에 있어서, 촉진제의 농도가 0.2그람몰/ℓ이상이고 유리 염소 또는 브롬화물 25ppm 이상 존재하에 금속을 용해시킴을 특징으로 하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019840000907A 1983-08-22 1984-02-24 금속의 용해방법 KR920006352B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US06/525,078 US4437931A (en) 1983-08-22 1983-08-22 Dissolution of metals
US525,078 1983-08-22
US525078 1983-08-22

Publications (2)

Publication Number Publication Date
KR850002595A true KR850002595A (ko) 1985-05-15
KR920006352B1 KR920006352B1 (ko) 1992-08-03

Family

ID=24091823

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019840000907A KR920006352B1 (ko) 1983-08-22 1984-02-24 금속의 용해방법

Country Status (11)

Country Link
US (1) US4437931A (ko)
JP (1) JPS6050184A (ko)
KR (1) KR920006352B1 (ko)
CA (1) CA1194388A (ko)
CH (1) CH666056A5 (ko)
DE (1) DE3430345A1 (ko)
FR (1) FR2551081B1 (ko)
GB (1) GB2147543B (ko)
IT (1) IT1176623B (ko)
MX (1) MX162662A (ko)
NL (1) NL8401751A (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4522683A (en) * 1984-01-12 1985-06-11 Plastic Specialties And Technologies, Inc. Dissolution of metals utilizing tungsten-diol combinations
US4915781A (en) * 1988-07-27 1990-04-10 E. I. Du Pont De Nemours And Company Stabilized hydrogen peroxide compositions
US4875972A (en) * 1988-07-27 1989-10-24 E. I. Du Pont De Nemours And Company Hydrogen peroxide compositions containing a substituted oxybenzene compound
US4875973A (en) * 1988-07-27 1989-10-24 E. I. Du Pont De Nemours And Company Hydrogen peroxide compositions containing a substituted aminobenzaldehyde
US4952275A (en) * 1989-12-15 1990-08-28 Microelectronics And Computer Technology Corporation Copper etching solution and method
GB9425090D0 (en) * 1994-12-12 1995-02-08 Alpha Metals Ltd Copper coating
JP2002322577A (ja) * 2001-04-23 2002-11-08 Yamatoya & Co Ltd 銅張積層板用ソフトエッチング剤
JP4763519B2 (ja) * 2006-06-07 2011-08-31 株式会社トーモク 仕切り付き包装箱
US8211617B2 (en) 2009-08-17 2012-07-03 Palo Alto Research Center Incorporated Solid inks for printed masks
US8303832B2 (en) * 2009-08-17 2012-11-06 Palo Alto Research Center Incorporated Solid inks for masks for printed circuit boards and other electronic devices
US11678433B2 (en) 2018-09-06 2023-06-13 D-Wave Systems Inc. Printed circuit board assembly for edge-coupling to an integrated circuit
CN109972144A (zh) * 2019-04-10 2019-07-05 深圳市松柏实业发展有限公司 铜蚀刻液及其废液的再生利用方法和循环再生利用系统
US11647590B2 (en) 2019-06-18 2023-05-09 D-Wave Systems Inc. Systems and methods for etching of metals
US12033996B2 (en) 2019-09-23 2024-07-09 1372934 B.C. Ltd. Systems and methods for assembling processor systems

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE758162A (fr) * 1969-10-28 1971-04-01 Fmc Corp Stabilisation de solutions acidifiees d'eau
US3869401A (en) * 1972-12-04 1975-03-04 Du Pont Stabilized acidic hydrogen peroxide solutions
US4174253A (en) 1977-11-08 1979-11-13 Dart Industries Inc. Dissolution of metals utilizing a H2 O2 -H2 SO4 solution catalyzed with hydroxy substituted cycloparaffins
US4141850A (en) 1977-11-08 1979-02-27 Dart Industries Inc. Dissolution of metals

Also Published As

Publication number Publication date
NL8401751A (nl) 1985-03-18
CA1194388A (en) 1985-10-01
IT1176623B (it) 1987-08-18
FR2551081A1 (fr) 1985-03-01
MX162662A (es) 1991-06-13
KR920006352B1 (ko) 1992-08-03
FR2551081B1 (fr) 1991-02-15
IT8422380A0 (it) 1984-08-21
GB8406794D0 (en) 1984-04-18
JPH0429744B2 (ko) 1992-05-19
GB2147543B (en) 1987-02-25
US4437931A (en) 1984-03-20
DE3430345A1 (de) 1985-04-04
CH666056A5 (de) 1988-06-30
JPS6050184A (ja) 1985-03-19
GB2147543A (en) 1985-05-15

Similar Documents

Publication Publication Date Title
KR850002595A (ko) 금속의 용해방법
US3668131A (en) Dissolution of metal with acidified hydrogen peroxide solutions
KR850002838A (ko) 글리콜 에테르를 이용한 금속의 용해방법 및 그 조성물
GB1583666A (en) Brighteners for silver electroplating bath
KR850002594A (ko) ε-카프토락탐을 이용한 금속의 용해방법 및 그 조성물
FR2449648A1 (fr) Procede pour la purification de solutions acides contenant des metaux
KR850002836A (ko) 푸란 유도체를 이용한 금속의 용해방법 및 그 조성물
KR850002835A (ko) 피롤리돈을 이용한 금속의 용해방법 및 그 조성물
US6251253B1 (en) Metal alloy sulfate electroplating baths
US4422908A (en) Zinc plating
ES481474A1 (es) Un procedimiento para obtener electrodepositos de estano muyigualados y brillantes.
KR850005511A (ko) 과산화수소-황산 수용액 시스템의 금속용해속도 증진방법
ATE134224T1 (de) Elektrochemisches verfahren zur reduktion von oxalsäure zu glyoxylsäure
CN1015554B (zh) 利用钨—二元醇复合物溶解金属
KR850002837A (ko) 락톤을 이용한 금속의 용해방법 및 그 조성물
GB1289511A (ko)
KR20010043710A (ko) 전기도금욕
KR940019888A (ko) 고밀도의 반사성 주석 또는 주석-납 합금의 전착방법 및 이를 위한 용액
KR820000570B1 (ko) 금속을 용해시키는 방법
KR820000569B1 (ko) 금속의 용해방법
JP3062033B2 (ja) 鉄（ｉｉｉ）イオンによる錫スラッジの生成を抑制する方法
SU709307A1 (ru) Электролит дл электрохимического маркировани
KR880011373A (ko) 전해에 의한 수은 침전 방법
KR810000368B1 (ko) 크롬 전기 도금액 조성물
CA1110997A (en) Non-cyanide acidic silver electroplating

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19840224

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 19890224

Comment text: Request for Examination of Application

Patent event code: PA02011R01I

Patent event date: 19840224

Comment text: Patent Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 19920401

Patent event code: PE09021S01D

G160 Decision to publish patent application
PG1605 Publication of application before grant of patent

Comment text: Decision on Publication of Application

Patent event code: PG16051S01I

Patent event date: 19920702

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 19921028

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 19930115

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 19930115

End annual number: 3

Start annual number: 1

FPAY Annual fee payment

Payment date: 19950630

Year of fee payment: 4

PR1001 Payment of annual fee

Payment date: 19950630

Start annual number: 4

End annual number: 4

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee