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KR840001598A - 고착제(binder)의 제조방법 및 이의 전기영동 침적방법 - Google Patents

고착제(binder)의 제조방법 및 이의 전기영동 침적방법 Download PDF

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Publication number
KR840001598A
KR840001598A KR1019820003957A KR820003957A KR840001598A KR 840001598 A KR840001598 A KR 840001598A KR 1019820003957 A KR1019820003957 A KR 1019820003957A KR 820003957 A KR820003957 A KR 820003957A KR 840001598 A KR840001598 A KR 840001598A
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KR
South Korea
Prior art keywords
amine
epoxy resin
resol
binder
phenol
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Ceased
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KR1019820003957A
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English (en)
Inventor
헤세 볼프강 (외 2)
Original Assignee
헤인리히 벡커,베른하르트 벡크
훽스트 아크티엔 게젤샤프트
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Publication of KR840001598A publication Critical patent/KR840001598A/ko
Ceased legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02Polycondensates containing more than one epoxy group per molecule
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/44Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications
    • C09D5/4419Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications with polymers obtained otherwise than by polymerisation reactions only involving carbon-to-carbon unsaturated bonds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14Polycondensates modified by chemical after-treatment
    • C08G59/1433Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14Polycondensates modified by chemical after-treatment
    • C08G59/1433Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/145Compounds containing one epoxy group
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Emergency Medicine (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Molecular Biology (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Paints Or Removers (AREA)
  • Epoxy Resins (AREA)
  • Phenolic Resins Or Amino Resins (AREA)

Abstract

내용 없음

Description

고착제(binder)의 제조방법 및 이의 전기영동 침적방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (12)

  1. 에폭시수지가 부분적으로 탈기능화 되어, 분자단위당 평균해서 0.5 내지 1.3 에폭사이드기를 함유하며, 레졸성분이 추가로 탄화수소 또는 하이드록시알킬 또는 하이드록시알킬 라디칼로 치환될 수 있는 올리고메틸렌페놀의 메틸올 화합물로 구성되고, 또 아민은 1개 이상의 1급 또는 2급 아미노기와 최고 2개의 하이드록시기를 함유하는, 에폭시수지 및 레졸과 아민의 공축합체를 기재로 한 고착제.
  2. 제1항에 있어서, 에폭시수지가 분자량 500 내지 5,000 바람직하게는 800 내지 3,000을 갖고, 모노카복실산, 모노하이드릭페놀과/또는 모노에폭사이드 화합물을 사용하여 탈기능화시키고, 디페닐올 프로판과/또는 디페닐올메탄과 에피할로겐 하이드린으로부터 유도되며, 또 일반적으로 분자 단위당 0.8 내지 1.1 에폭사이드기를 함유하는 고착제.
  3. 제1항 또는 제2항에 있어서, 탈기능화 에폭시수지가 또한 추가해서 바람직하게는 촉매 존재하의 80 내지 180℃에서 디페닐올메탄, 디페닐올프로판과/또는 4개 내지 10개 탄소원자를 갖는 디페닐올메탄, 디페닐올프로판과/또는 디카복실산과 반응시켜 변형된 고착제.
  4. 제1항 내지 제3항 중 어느 하나에 있어서, 에폭시수지/레졸의 중량비율이 20 : 80-80 : 20인 고착제.
  5. 제1항 내지 제4항 중 어느 하나에 있어서, 레졸 성분의 모든 치환체의 치환도가 5 내지 100, 바람직하게는 10 내지 90당량%이고, 또 탄화수소 치환체는 4개 내지 16개 탄소원자를 갖는 알킬라디칼과/또는 8개 내지 10개 탄소원자를 갖는 아르알킬라디칼로 구성되고, 또 바람직하게는 파라위치에 존재하는 고착제.
  6. 제1항 내지 제5항 중 어느 하나에 있어서, 아민은 분자내에 1개 이상의 아민기능기가 1급이거나 또는 2급인 1개 이상의 아민기능기를 함유하며, 또 에폭시수지/아민의 몰비율이 1 : 0.1 내지 1 : 1, 바람직하게는 1 :(0.35내지 0.9)가 되도록 아민양을 조절한 고착제.
  7. 제1항 내지 제6항 중 어느 하나에 있어서, 산으로 가양자화된 수용성형태로 존재하며, 아민기/산의 당량비가 일반적으로 1 :(0.2 내지 2), 바람직하게는 1 :(0.5 내지 1.5)인 고착제.
  8. 제1항 내지 제7항 중 어느 하나에 있어서,추가로 안료 및 충진제와 같은 기타의 통상적인 물질과 바람직하게는 2 내지 40중량%의 수지와/또는 가소제를 함유하며, 또 MEQ치가 10 내지 80, 바람직하게는 15 내지 45인 고착제.
  9. 에폭시수지와 레졸을 반응시키고, 또 이 공축합반응 이전, 반응중 또는 반응후에 1개 이상의 1급 또는 2급 아미노기와 최대 2개의 하이드록시기를 함유하는 1개 이상의 아민과 반응시키며, 또 이어 적합한 경우 물과 산을 사용하여 수용성 클로이드 형태로 변환시킴을 특징으로 하여 제1항 내지 제8항의 고착제를 제조하는 방법.
  10. 제9항에 있어서, 에폭시수지와 레졸의 반응이 80 내지 160℃, 바람직하게는 100 내지 130℃에서 진행되며, 또 아민을 20 내지 140℃, 바람직하게는 50 내지 120℃에서 첨가하고, 또 레졸이, 처음에는 페놀을 사용 초기비율 1 :(0.1 내지 0.7), 바람직하게는 1 : (0.2 내지 0.65)로 포름알데히드와 반응시켜 올리고페놀을 제조하고, 미반응페놀을 증류제거시키고, 또 이어 올리고페놀을 통상적인 방법에 따라 메틸올 화합물로 변환시키는 방식의 몇가지 단계를 거쳐 바람직하게 제조되는 고착제 제조방법.
  11. 음극으로 연결된 제품상에 수용성 분산액 중의 양이온성 수지를 전기용동 침적시키는 방법에 있어서, 제1항 내지 제8항중 1개 또는 그 이상의 고착제의 수용성 콜로이드계를 사용 침적시킴을 특징으로 하는 전기영동 침적방법.
  12. 제1항 내지 제8항중 1개 또는 그 이상의 고착제를 함유하고, pH가 일반적으로 3.0 내지 9.0, 바람직하게는 6 내지 9인 제11항의 방법을 수행하기 위한 수용성 전기영동욕.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019820003957A 1981-09-04 1982-09-02 고착제(binder)의 제조방법 및 이의 전기영동 침적방법 Ceased KR840001598A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP3135010.0 1981-09-04
DE19813135010 DE3135010A1 (de) 1981-09-04 1981-09-04 "bindemittel auf der grundlage von mischkondensaten aus epoxydharzen, resolen und aminen, verfahren zu dessen herstellung und zur elektrophoretischen abscheidung sowie elektrophoresebad"

Publications (1)

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KR840001598A true KR840001598A (ko) 1984-05-07

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KR1019820003957A Ceased KR840001598A (ko) 1981-09-04 1982-09-02 고착제(binder)의 제조방법 및 이의 전기영동 침적방법

Country Status (11)

Country Link
US (1) US4481311A (ko)
EP (1) EP0087454B1 (ko)
JP (1) JPS58501380A (ko)
KR (1) KR840001598A (ko)
CA (1) CA1197348A (ko)
DE (2) DE3135010A1 (ko)
ES (1) ES8308577A1 (ko)
GR (1) GR76899B (ko)
IT (1) IT1157316B (ko)
WO (1) WO1983000872A1 (ko)
ZA (1) ZA826454B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3509707A1 (de) * 1984-03-16 1985-11-07 Vianova Kunstharz Ag, Werndorf Verfahren zur herstellung kathodisch abscheidbarer elektrotauchlack-bindemittel
EP0158128B1 (de) * 1984-03-16 1987-11-25 Vianova Kunstharz Aktiengesellschaft Verfahren zur Herstellung kathodisch abscheidbarer Elektrotauchlack-Bindemittel
DE3412095A1 (de) * 1984-03-31 1985-10-17 Hoechst Ag, 6230 Frankfurt Mischung zur herstellung von saeurefesten dichtungen und impraegnierungen, verfahren zu ihrer herstellung sowie ihre verwendung
JPS60260621A (ja) * 1984-06-08 1985-12-23 Dainippon Ink & Chem Inc 成形材料用樹脂組成物
DE3422474A1 (de) * 1984-06-16 1985-12-19 Basf Ag, 6700 Ludwigshafen Hitzehaertbares ueberzugsmittel und seine verwendung
AT409964B (de) 2000-11-15 2002-12-27 Solutia Austria Gmbh Selbstvernetzende wasserverdünnbare bindemittel

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NL210234A (ko) * 1956-08-30
GB1146694A (en) * 1965-03-13 1969-03-26 Reichhold Chemie Ag Water-dilutable coating compositions and lacquer binders
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UST916002I4 (en) 1972-11-06 1973-11-27 Defensive publication
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DE2320301C3 (de) * 1973-04-21 1979-10-04 Basf Ag, 6700 Ludwigshafen Im wesentlichen epoxidgruppenfreie Polykondensations-Polyadditions-Produkte und ihre Verwendung
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Also Published As

Publication number Publication date
EP0087454B1 (de) 1985-10-23
ES515481A0 (es) 1983-06-01
WO1983000872A1 (en) 1983-03-17
DE3267049D1 (en) 1985-11-28
EP0087454A1 (de) 1983-09-07
ZA826454B (en) 1983-08-31
ES8308577A1 (es) 1983-06-01
DE3135010A1 (de) 1983-03-24
IT1157316B (it) 1987-02-11
JPS58501380A (ja) 1983-08-18
GR76899B (ko) 1984-09-04
CA1197348A (en) 1985-11-26
IT8223101A0 (it) 1982-09-02
US4481311A (en) 1984-11-06

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