KR20250006425A - Stacked patch antenna module - Google Patents

Abstract

The present disclosure relates to a technology for a stacked patch antenna module in which a first to fourth feed pins penetrate a first patch antenna and a second patch antenna, wherein the first to fourth feed pins penetrate the first and second patch antennas, through-holes through which the first to fourth feed pins penetrate, respectively, are formed in a second patch antenna stacked thereon, and an internal metal layer is formed on an inner wall surface of the through-hole through which the third and/or fourth feed pins penetrate.

Description

STACKED PATCH ANTENNA MODULE

The present invention relates to a stacked patch antenna module that transmits and receives signals of multiple frequency bands by stacking multiple patch antennas.

A shark fin antenna for vehicles is installed on the exterior of a vehicle to improve the signal reception of electronic devices installed inside the vehicle.

Recently, various electronic devices are being installed in vehicles, and many antennas that receive signals in frequency bands such as GNSS (e.g. GPS (USA), Glonass (Russia)), SDARS (Sirius, XM), Telematics, Global star, and Thuraya are built into vehicle shark antennas.

However, there is a problem of insufficient mounting space when multiple antennas are mounted in the limited mounting space of a vehicle shark antenna.

Accordingly, research is being conducted on a stacked patch antenna module that stacks multiple patch antennas.

For example, the stacked patch antenna module is composed of an upper patch antenna for receiving a first frequency band signal and a lower patch antenna disposed below the upper patch antenna for receiving a second frequency band signal. The stacked patch antenna module is formed in a structure in which a feed pin for feeding the upper patch antenna penetrates the lower patch antenna. At this time, a parasitic resonance occurs in the stacked patch antenna module due to coupling between the feed pin penetrating the lower patch antenna and the lower patch antenna. That is, the stacked patch antenna module experiences a parasitic resonance in which a second frequency band signal is received together with a first frequency band signal at the upper patch antenna.

In addition, the stacked patch antenna module has a problem in that the isolation between the upper patch antenna and the lower patch antenna deteriorates as parasitic resonance occurs. That is, since the first frequency band signal and the second frequency band signal are received from the upper patch antenna, the isolation between the upper patch antenna and the lower patch antenna deteriorates.

In addition, the stacked patch antenna module has a problem in that the antenna efficiency decreases as the isolation decreases.

The matters described in the background art above are intended to help understand the background of the invention and may include matters that are not publicly available prior art.

Korean Patent Publication No. 10-2011-0066639 (Title: Vehicle antenna device) Korean Patent Publication No. 10-2010-0110052 (Title: Vehicle antenna device)

The present invention has been proposed to solve the above-mentioned conventional problems, and aims to provide a stacked patch antenna module in which the first to fourth feed pins penetrate the first patch antenna and the second patch antenna.

In addition, the present invention has another purpose of providing a laminated patch antenna module in which through holes are formed in a second patch antenna laminated on the lower side through which first to fourth feed pins pass, respectively, and an inner metal layer is formed on an inner wall surface of the through holes through which third and/or fourth feed pins pass.

In addition, another object of the present invention is to provide a stacked patch antenna module in which the upper patch of the first patch antenna stacked on the upper side is spaced apart from at least one of the first feed pin and the second feed pin to block electrical connection.

In order to achieve the above object, according to an embodiment of the present invention, a stacked patch antenna module includes a first patch antenna, a second patch antenna disposed below the first patch antenna, a first feed pin penetrating the first patch antenna and the second patch antenna, a second feed pin spaced apart from the first feed pin and penetrating the first patch antenna and the second patch antenna, a third feed pin spaced apart from the first feed pin and the second feed pin and penetrating the first patch antenna and the second patch antenna, and a fourth feed pin spaced apart from the first feed pin, the second feed pin and the third feed pin and penetrating the first patch antenna and the second patch antenna, and the second patch antenna has a plurality of via holes formed through which the first feed pin, the second feed pin, the third feed pin and the fourth feed pin respectively penetrate, and an internal metal layer is formed on an inner wall surface of at least one via hole among the plurality of via holes.

The first patch antenna is formed with a first through hole through which a first feed pin passes, a second through hole spaced apart from the first through hole and through which a second feed pin passes, a third through hole spaced apart from the first through hole and the second through hole and through which a third feed pin passes, and a fourth through hole spaced apart from the first through hole, the second through hole and the third through hole and through which a fourth feed pin passes. At this time, a virtual straight line connecting the first through hole and the third through hole and a virtual straight line connecting the second through hole and the fourth through hole can be orthogonal.

The second patch antenna may be formed with a fifth through hole through which a first feed pin passing through the first through hole passes, a sixth through hole spaced apart from the fifth through hole and through which a second feed pin passing through the second through hole passes, a seventh through hole spaced apart from the fifth and sixth through holes and through which a third feed pin passing through the third through hole passes, and an eighth through hole spaced apart from the fifth, sixth and seventh through holes and through which a fourth feed pin passing through the fourth through hole passes.

The second patch antenna may include a first inner metal layer disposed on an inner wall surface of the seventh through hole and connected to the upper patch and the lower patch of the second patch antenna and spaced apart from the third feed pin, and a second inner metal layer disposed on an inner wall surface of the eighth through hole and connected to the upper patch and the lower patch of the second patch antenna and spaced apart from the fourth feed pin.

The first patch antenna may include a first base substrate having a 1-1 through hole through which a first feed pin passes, a 2-1 through hole through which a second feed pin passes, a 3-1 through hole through which a third feed pin passes, and a 4-1 through hole through which a fourth feed pin passes are formed, a first upper patch disposed on an upper surface of the first base substrate and having a 1-2 through hole through which the first feed pin passes, a 2-2 through hole through which the second feed pin passes, a 3-2 through hole through which the third feed pin passes, and a 4-2 through hole through which the fourth feed pin passes are formed, and a first lower patch disposed on a lower surface of the first base substrate and having a 1-3 through hole through which the first feed pin passes, a 2-3 through hole through which the second feed pin passes, a 3-3 through hole through which the third feed pin passes, and a 4-3 through hole through which the fourth feed pin passes. At this time, the 1-1 through hole, the 1-2 through hole, and the 1-3 through hole overlap to form a first through hole through which the first power supply pin penetrates, the 2-1 through hole, the 2-2 through hole, and the 2-3 through hole overlap to form a second through hole through which the second power supply pin penetrates, the 3-1 through hole, the 3-2 through hole, and the 3-3 through hole overlap to form a third through hole through which the third power supply pin penetrates, and the 4-1 through hole, the 4-2 through hole, and the 4-3 through hole overlap to form a fourth through hole through which the fourth power supply pin penetrates.

At least one of the first feed pin and the second feed pin may be spaced apart from the first upper patch to form a spaced apart space, and may not be electrically connected to the first upper patch by the spaced apart space.

The second patch antenna may include a second base substrate having a 5-1 through hole through which a first feed pin passes, a 6-1 through hole through which a second feed pin passes, a 7-1 through hole through which a third feed pin passes, and an 8-1 through hole through which a fourth feed pin passes are formed, a second upper patch disposed on an upper surface of the second base substrate and having a 5-2 through hole through which the first feed pin passes, a 6-2 through hole through which the second feed pin passes, a 7-2 through hole through which the third feed pin passes, and an 8-2 through hole through which the fourth feed pin passes are formed, and a second lower patch disposed on a lower surface of the second base substrate and having a 5-3 through hole through which the first feed pin passes, a 6-3 through hole through which the second feed pin passes, a 7-3 through hole through which the third feed pin passes, and an 8-3 through hole through which the fourth feed pin passes. At this time, the 5-1st through hole, the 5-2nd through hole, and the 5-3rd through hole overlap to form a fifth through hole through which a first feed pin that has penetrated the first through hole of the first patch antenna penetrates, the 6-1st through hole, the 6-2nd through hole, and the 6-3rd through hole overlap to form a sixth through hole through which a second feed pin that has penetrated the second through hole of the first patch antenna penetrates, the 7-1st through hole, the 7-2nd through hole, and the 7-3rd through hole overlap to form a seventh through hole through which a third feed pin that has penetrated the third through hole of the first patch antenna penetrates, and the 8-1st through hole, the 8-2nd through hole, and the 8-3rd through hole overlap to form an eighth through hole through which a fourth feed pin that has penetrated the fourth through hole of the first patch antenna penetrates.

The second patch antenna includes a first inner metal layer arranged on an inner wall surface of the 7-1 through hole, a first inner metal layer arranged on an inner wall surface of the 7-2 through hole, and a first inner metal layer arranged on an inner wall surface of the 7-3 through hole, and the first inner metal layer, the first inner metal layer, and the first inner metal layer can form a first inner metal layer connecting the second upper patch and the second lower patch.

The second patch antenna includes a second-first inner metal layer arranged on an inner wall surface of the 8-1 through hole, a second-second inner metal layer arranged on an inner wall surface of the 8-2 through hole, and a second-third inner metal layer arranged on an inner wall surface of the 8-3 through hole, and the second-first inner metal layer, the second-second inner metal layer, and the second-third inner metal layer can form a second inner metal layer connecting the second upper patch and the second lower patch.

The second upper patch may be spaced apart from the first feed pin penetrating the 5-2 through hole and the second feed pin penetrating the 6-2 through hole, and may be connected to the first feed pin and the second feed pin through electromagnetic coupling.

A stacked patch antenna module according to an embodiment of the present invention may further include a first hybrid coupler connected to the first feed pin and the second feed pin and outputting a first frequency signal and a second frequency signal, and a second hybrid coupler connected to the third feed pin and the fourth feed pin and outputting a third frequency signal.

The first hybrid coupler may include a first input terminal connected to the first feed pin, a second input terminal connected to the second feed pin, a first output terminal connected to a signal processing element that processes a first frequency signal and a second frequency signal, and a second output terminal connected to a resistor.

The second hybrid coupler may include a first input terminal connected to a third feed pin, a second input terminal connected to a fourth feed pin, a first output terminal connected to a resistor, and a second output terminal connected to a signal processing element that processes a third frequency signal.

According to the present invention, a stacked patch antenna module has a second patch antenna arranged below a first patch antenna, and a metal layer formed in a through hole formed in the second patch antenna through which a third feed pin and a fourth feed pin pass, thereby eliminating parasitic resonance caused by coupling between the third feed pin and the fourth feed pin and the second patch antenna, thereby ensuring the isolation of the stacked patch antenna module.

In addition, the stacked patch antenna module has an effect of controlling the phase of the patch antenna by forming a gap between the upper patch of the first patch antenna and at least one of the first and second feed pins, thereby blocking the electrical connection between at least one of the first and second feed pins and the upper patch.

In addition, the stacked patch antenna module has the effect of improving the isolation of the patch antenna by adjusting the phase of the patch antenna by forming a gap between the upper patch of the first patch antenna and at least one of the first and second feed pins.

FIG. 1 is a drawing for explaining a stacked patch antenna module according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view illustrating a stacked patch antenna module according to an embodiment of the present invention.
FIG. 3 is an exploded perspective view illustrating the first patch antenna illustrated in FIGS. 1 and 2.
FIG. 4 is a drawing for explaining the positional relationship of through holes formed in the first patch antenna of FIG. 3.
FIG. 5 is an exploded perspective view illustrating the second patch antenna illustrated in FIGS. 1 and 2.
Fig. 6 is a drawing for explaining the positional relationship of through holes formed in the second patch antenna of Fig. 5.
FIGS. 7 to 15 are drawings for explaining modified examples of a stacked patch antenna module according to an embodiment of the present invention.
FIGS. 8 to 13 are drawings for explaining a modified structure for improving the isolation of a laminated patch antenna module according to an embodiment of the present invention.
FIGS. 14 and 15 are drawings for explaining a modified structure for minimizing frequency interference of a stacked patch antenna module according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

The examples are provided so that this invention will be more fully described to those skilled in the art, and the following examples may be modified in many different forms, and the scope of the present invention is not limited to the following examples. Rather, these examples are provided so that this disclosure will be more faithful and complete, and to fully convey the spirit of the present invention.

The terms used in this specification are used to describe particular embodiments and are not intended to limit the invention. Also, the singular form in this specification may include the plural form unless the context clearly indicates otherwise.

In the description of the embodiments, when each layer (film), region, pattern or structure is described as being formed "on" or "under" the substrate, each layer (film), region, pad or pattern, "on" and "under" include both being formed "directly" or "indirectly" via another layer. In addition, the principle is that the reference for each layer being on or under is based on the drawing.

The drawings are intended only to facilitate understanding of the invention and should not be construed as limiting the scope of the invention. In addition, the relative thickness, length, or relative size in the drawings may be exaggerated for convenience and clarity of explanation.

Referring to FIGS. 1 and 2, a stacked patch antenna module according to an embodiment of the present invention is configured to include a first patch antenna (100), a second patch antenna (200), a first feed pin (320), a second feed pin (340), a third feed pin (360), and a fourth feed pin (380). At this time, the first patch antenna (100) is arranged above the second patch antenna (200). The first to fourth feed pins (320) to (380) are configured to penetrate the first patch antenna (100) and the second patch antenna (200), and are arranged to be rotated at a predetermined angle.

Referring to FIG. 3, the first patch antenna (100) is composed of a laminate in which a first base substrate (110), a first upper patch (120), and a first lower patch (130) are laminated.

The first base substrate (110) is composed of a dielectric. As an example, the first base substrate (110) is a dielectric substrate made of a ceramic material having characteristics such as high dielectric constant and low thermal expansion coefficient.

The first base substrate (110) may be composed of a magnetic material. As an example, the first base substrate (110) is a magnetic substrate composed of a magnetic material such as ferrite.

A first base member (110) is formed with a first-first through hole (140a) through which a first power supply pin (320) passes, a second-first through hole (150a) through which a second power supply pin (340) passes, a third-first through hole (160a) through which a third power supply pin (360) passes, and a fourth-first through hole (170a) through which a fourth power supply pin (380) passes.

The first-first through hole (140a), the second-first through hole (150a), the third-first through hole (160a), and the fourth-first through hole (170a) are formed to vertically penetrate the dielectric substrate or the magnetic substrate constituting the first base substrate (110). The first-first through hole (140a), the second-first through hole (150a), the third-first through hole (160a), and the fourth-first through hole (170a) are formed to form a set angle.

As an example, the 1-1 through hole (140a), the 2-1 through hole (150a), the 3-1 through hole (160a), and the 4-1 through hole (170a) are formed to form an angle of approximately 90 degrees. At this time, a virtual straight line connecting the 1-1 through hole (140a) and the 3-1 through hole (160a) and a virtual straight line connecting the 2-1 through hole (150a) and the 4-1 through hole (170a) are orthogonal. The intersection point of the two virtual straight lines may overlap the center point of the first base material (110).

The first upper patch (120) is placed on the upper surface of the first base substrate (110). The first upper patch (120) is made of a thin plate made of a conductive material with high electrical conductivity, such as copper, aluminum, gold, or silver. The first upper patch (120) can be formed in various shapes, such as a square, a triangle, or an octagon.

In the first upper patch (120), a 1-2 through hole (140b) through which the first power supply pin (320) passes, a 2-2 through hole (150b) through which the second power supply pin (340) passes, a 3-2 through hole (160b) through which the third power supply pin (360) passes, and a 4-2 through hole (170b) through which the fourth power supply pin (380) passes are formed.

The first-2 through hole (140b), the second-2 through hole (150b), the third-2 through hole (160b), and the fourth-2 through hole (170b) are formed to vertically penetrate the first upper patch (120). The first-2 through hole (140b), the second-2 through hole (150b), the third-2 through hole (160b), and the fourth-2 through hole (170b) are formed to form a set angle.

As the first upper patch (120) is arranged (laminated) on the upper surface of the first base substrate (110), the through holes formed in the first upper patch (120) overlap with the through holes formed in the first base substrate (110). The 1-2 through hole (140b) overlaps with the 1-1 through hole (140a) of the first base substrate (110), the 2-2 through hole (150b) overlaps with the 2-1 through hole (150a) of the first base substrate (110), the 3-2 through hole (160b) overlaps with the 3-1 through hole (160a) of the first base substrate (110), and the 4-2 through hole (170b) overlaps with the 4-1 through hole (170a) of the first base substrate (110).

For example, the first-second through hole (140b), the second-second through hole (150b), the third-second through hole (160b), and the fourth-second through hole (170b) are formed to form an angle of approximately 90 degrees. At this time, a virtual straight line connecting the first-second through hole (140b) and the third-second through hole (160b) and a virtual straight line connecting the second-second through hole (150b) and the fourth-second through hole (170b) are orthogonal to each other. The intersection point of the two virtual straight lines may overlap with the center point of the first upper patch (120).

The first lower patch (130) is placed on the lower surface of the first base substrate (110). The first lower patch (130) is made of a thin plate made of a conductive material with high electrical conductivity, such as copper, aluminum, gold, or silver. The first lower patch (130) can be formed in various shapes, such as a square, a triangle, or an octagon.

In the first lower patch (130), a 1-3 through hole (140c) through which the first power supply pin (320) passes, a 2-3 through hole (150c) through which the second power supply pin (340) passes, a 3-3 through hole (160c) through which the third power supply pin (360) passes, and a 4-3 through hole (170c) through which the fourth power supply pin (380) passes are formed.

The first-3 through hole (140c), the second-3 through hole (150c), the third-3 through hole (160c), and the fourth-3 through hole (170c) are formed to vertically penetrate the first lower patch (130). The first-3 through hole (140c), the second-3 through hole (150c), the third-3 through hole (160c), and the fourth-3 through hole (170c) are formed to form a set angle.

As the first lower patch (130) is placed (laminated) on the lower surface of the first base substrate (110), the through holes formed in the first lower patch (130) overlap with the through holes formed in the first base substrate (110) and the first upper patch (120).

The 1-3 through hole (140c) overlaps with the 1-1 through hole (140a) of the first base substrate (110) and the 1-2 through hole (140b) of the first upper patch (120), the 2-3 through hole (150c) overlaps with the 2-1 through hole (150a) of the first base substrate (110) and the 2-2 through hole (150b) of the first upper patch (120), the 3-3 through hole (160c) overlaps with the 3-1 through hole (160a) of the first base substrate (110) and the 3-2 through hole (160b) of the first upper patch (120), and the 4-3 through hole (170c) overlaps with the 4-1 through hole (170a) of the first base substrate (110) and the 4-2 through hole (170b) of the first upper patch (120). It overlaps with the hole (170b).

For example, the 1st-3rd through hole (140c), the 2nd-3rd through hole (150c), the 3rd-3rd through hole (160c), and the 4th-3rd through hole (170c) are formed to form an angle of approximately 90 degrees. At this time, a virtual straight line connecting the 1st-3rd through hole (140c) and the 3rd-3rd through hole (160c) and a virtual straight line connecting the 2nd-3rd through hole (150c) and the 4th-3rd through hole (170c) are orthogonal. The intersection point of the two virtual straight lines may overlap the center point of the first lower patch (130).

Through this, the 1-1st through hole (140a), the 1-2nd through hole (140b), and the 1-3rd through hole (140c) form a first through hole (140) through which the first power supply pin (320) passes. The 2-1st through hole (150a), the 2-2nd through hole (150b), and the 2-3rd through hole (150c) form a second through hole (150) through which the second power supply pin (340) passes. The 3-1st through hole (160a), the 3-2nd through hole (160b), and the 3-3rd through hole (160c) form a third through hole (160) through which the third power supply pin (360) passes. The 4-1 through hole (170a), the 4-2 through hole (170b), and the 4-3 through hole (170c) form a third through hole (160) through which the 4th power supply pin (380) passes.

Referring to Fig. 4, the first through hole (140) to the fourth through hole (170) formed in the first patch antenna (100) are arranged to form an angle of about 90 degrees between each other. The virtual straight line connecting the first through hole (140) and the third through hole (160) and the virtual straight line connecting the second through hole (150) and the fourth through hole (170) are orthogonal. The intersection point of the two virtual straight lines is located on the virtual straight line that vertically passes through the center point of the first patch antenna (100).

Referring to FIG. 5, the second patch antenna (200) is configured as a laminate in which a second base substrate (210), a second upper patch (220), and a second lower patch (230) are laminated. The second patch antenna (200) is configured to include a first inner metal layer (280) and a second inner metal layer (290) connecting the second upper patch (220) and the second lower patch (230).

The second base substrate (210) is composed of a dielectric. As an example, the second base substrate (210) is a dielectric substrate made of a ceramic material having characteristics such as high dielectric constant and low thermal expansion coefficient.

The second base substrate (210) may also be composed of a magnetic material. As an example, the second base substrate (210) is a magnetic substrate composed of a magnetic material such as ferrite.

In the second base material (210), a 5-1 through hole (240a) through which the first power supply pin (320) passes, a 6-1 through hole (250a) through which the second power supply pin (340) passes, a 7-1 through hole (260a) through which the third power supply pin (360) passes, and an 8-1 through hole (270a) through which the fourth power supply pin (380) passes are formed.

The 5-1 through hole (240a), the 6-1 through hole (250a), the 7-1 through hole (260a), and the 8-1 through hole (270a) are formed to vertically penetrate the dielectric substrate or the magnetic substrate constituting the second base substrate (210). The 5-1 through hole (240a), the 6-1 through hole (250a), the 7-1 through hole (260a), and the 8-1 through hole (270a) are formed to form a set angle.

As an example, the 5-1 through hole (240a), the 6-1 through hole (250a), the 7-1 through hole (260a), and the 8-1 through hole (270a) are formed to form an angle of approximately 90 degrees. At this time, a virtual straight line connecting the 5-1 through hole (240a) and the 7-1 through hole (260a) and a virtual straight line connecting the 6-1 through hole (250a) and the 8-1 through hole (270a) are orthogonal. The intersection point of the two virtual straight lines may overlap the center point of the second base substrate (210).

The second upper patch (220) is placed on the upper surface of the second base substrate (210). The second upper patch (220) is made of a thin plate made of a conductive material with high electrical conductivity, such as copper, aluminum, gold, or silver. The second upper patch (220) can be formed in various shapes, such as a square, a triangle, or an octagon.

In the second upper patch (220), a 5-2 through hole (240b) through which the first power supply pin (320) passes, a 6-2 through hole (250b) through which the second power supply pin (340) passes, a 7-2 through hole (260b) through which the third power supply pin (360) passes, and an 8-2 through hole (270b) through which the fourth power supply pin (380) passes are formed.

The 5-2 through hole (240b), the 6-2 through hole (250b), the 7-2 through hole (260b), and the 8-2 through hole (270b) are formed to vertically penetrate the second upper patch (220). The 5-2 through hole (240b), the 6-2 through hole (250b), the 7-2 through hole (260b), and the 8-2 through hole (270b) are formed to form a set angle.

As the second upper patch (220) is arranged (laminated) on the upper surface of the second base substrate (210), the through holes formed in the second upper patch (220) overlap with the through holes formed in the second base substrate (210). The 5-2 through hole (240b) overlaps with the 5-1 through hole (240a) of the second base substrate (210), the 6-2 through hole (250b) overlaps with the 6-1 through hole (250a) of the second base substrate (210), the 7-2 through hole (260b) overlaps with the 7-1 through hole (260a) of the second base substrate (210), and the 8-2 through hole (270b) overlaps with the 8-1 through hole (270a) of the second base substrate (210).

As an example, the 5-2 through hole (240b), the 6-2 through hole (250b), the 7-2 through hole (260b), and the 8-2 through hole (270b) are formed to form an angle of approximately 90 degrees. At this time, a virtual straight line connecting the 5-2 through hole (240b) and the 7-2 through hole (260b) and a virtual straight line connecting the 6-2 through hole (250b) and the 8-2 through hole (270b) are orthogonal. The intersection point of the two virtual straight lines may overlap the center point of the second upper patch (220).

The second lower patch (230) is placed on the lower surface of the second base substrate (210). The second lower patch (230) is made of a thin plate made of a conductive material with high electrical conductivity, such as copper, aluminum, gold, or silver. The second lower patch (230) can be formed in various shapes, such as a square, a triangle, or an octagon.

In the second lower patch (230), a 5-3 through hole (240c) through which the first power supply pin (320) passes, a 6-3 through hole (250c) through which the second power supply pin (340) passes, a 7-3 through hole (260c) through which the third power supply pin (360) passes, and an 8-3 through hole (270c) through which the fourth power supply pin (380) passes are formed.

The 5-3 through hole (240c), the 6-3 through hole (250c), the 7-3 through hole (260c), and the 8-3 through hole (270c) are formed to vertically penetrate the second lower patch (230). The 5-3 through hole (240c), the 6-3 through hole (250c), the 7-3 through hole (260c), and the 8-3 through hole (270c) are formed to form a set angle.

As the second lower patch (230) is placed (laminated) on the lower surface of the second base substrate (210), the through holes formed in the second lower patch (230) overlap with the through holes formed in the second base substrate (210) and the second upper patch (220).

The 5-3 through hole (240c) overlaps with the 5-1 through hole (240a) of the second base substrate (210) and the 5-2 through hole (240b) of the second upper patch (220), the 6-3 through hole (250c) overlaps with the 6-1 through hole (250a) of the second base substrate (210) and the 6-2 through hole (250b) of the second upper patch (220), the 7-3 through hole (260c) overlaps with the 7-1 through hole (260a) of the second base substrate (210) and the 7-2 through hole (260b) of the second upper patch (220), and the 8-3 through hole (270c) overlaps with the 8-1 through hole (270a) of the second base substrate (210) and the 8-2 through hole (270b) of the second upper patch (220). It overlaps with the hole (270b).

For example, the 5-3 through hole (240c), the 6-3 through hole (250c), the 7-3 through hole (260c), and the 8-3 through hole (270c) are formed to form angles of approximately 90 degrees. At this time, the virtual straight line connecting the 5-3 through hole (240c) and the 7-3 through hole (260c) and the virtual straight line connecting the 6-3 through hole (250c) and the 8-3 through hole (270c) are orthogonal. The intersection point of the two virtual straight lines may overlap the center point of the second lower patch (230).

Through this, the 5-1st through hole (240a), the 5-2nd through hole (240b), and the 5-3rd through hole (240c) form a fifth through hole (240) through which the first power supply pin (320) passes. The 6-1st through hole (250a), the 6-2nd through hole (250b), and the 6-3rd through hole (250c) form a sixth through hole (250) through which the second power supply pin (340) passes. The 7-1st through hole (260a), the 7-2nd through hole (260b), and the 7-3rd through hole (260c) form a seventh through hole (260) through which the third power supply pin (360) passes. The 8-1 through hole (270a), the 8-2 through hole (270b), and the 8-3 through hole (270c) form the 8th through hole (270) through which the 4th power supply pin (380) passes.

As the second patch antenna (200) is placed (stacked) below the first patch antenna (100), the fifth through hole (240) overlaps with the first through hole (140) to form a through hole through which the first feed pin (320) passes. The sixth through hole (250) overlaps with the second through hole (150) to form a through hole through which the second feed pin (340) passes. The seventh through hole (260) overlaps with the third through hole (160) to form a through hole through which the third feed pin (360) passes. The eighth through hole (270) overlaps with the fourth through hole (170) to form a through hole through which the fourth feed pin (380) passes.

Referring to Fig. 6, the first through hole (140) to the fourth through hole (170) formed in the second patch antenna (200) are arranged to form an angle of about 90 degrees between each other. The virtual straight line connecting the first through hole (140) and the third through hole (160) and the virtual straight line connecting the second through hole (150) and the fourth through hole (170) are orthogonal. The intersection point of the two virtual straight lines is located on the virtual straight line that vertically passes through the center point of the first patch antenna (100).

The first inner metal layer (280) is arranged in the seventh through hole (260) to connect the second upper patch (220) and the second lower patch (230). The first inner metal layer (280) may include a first-first inner metal layer (280a) arranged on an inner wall surface of the seventh-first through hole (260a) forming the seventh through hole (260), a first-second inner metal layer (280b) arranged on an inner wall surface of the seventh-second through hole (260b), and a first-third inner metal layer (280c) arranged on an inner wall surface of the seventh-third through hole (260c) (see FIG. 5). Here, in order to easily explain the first internal metal layer (280), the 1-1 internal metal layer (280a) to the 1-3 internal metal layer (280c) are illustrated as being formed separately, but this is not limited to this and they may be formed integrally by plating the inner wall surface of the through hole of the first patch antenna (100).

The first internal metal layer (280) is formed of one material selected from among copper, aluminum, gold, and silver. Of course, the first internal metal layer (280) may also be formed of an alloy including one material selected from among copper, aluminum, gold, and silver.

The first inner metal layer (280) electrically connects the second upper patch (220) and the second lower patch (230) of the second patch antenna (200). The first inner metal layer (280) forms a coaxial cable with the third feed pin (360). The first inner metal layer (280) is spaced apart from the third feed pin (360) and is not electrically connected to the third feed pin (360). Through this, the first inner metal layer (280) eliminates parasitic resonance caused by coupling between the third feed pin (360) and the second patch antenna (200). Accordingly, the stacked patch antenna can prevent isolation degradation due to parasitic resonance.

The second inner metal layer (290) is arranged in the eighth through hole (270) to connect the second upper patch (220) and the second lower patch (230). The second inner metal layer (290) may include a 2-1 inner metal layer (290a) arranged on an inner wall surface of the 8-1 through hole (270a) forming the 8th through hole (270), a 2-2 inner metal layer (290b) arranged on an inner wall surface of the 8-2 through hole (270b), and a 2-1 inner metal layer (290a) arranged on an inner wall surface of the 8-3 through hole (270c) (see FIG. 5). Here, in order to easily explain the second internal metal layer (290), the 2-1 internal metal layer (290a) to the 2-3 internal metal layer (290c) are illustrated as being formed separately, but this is not limited to this, and the second internal metal layer (290) may be integrally formed by plating the inner wall surface of the through hole of the second patch antenna (200).

The second inner metal layer (290) is formed of one material selected from among copper, aluminum, gold, and silver. Of course, the second inner metal layer (290) may also be formed of an alloy including one material selected from among copper, aluminum, gold, and silver.

The second inner metal layer (290) electrically connects the second upper patch (220) and the second lower patch (230) of the second patch antenna (200). The second inner metal layer (290) forms a coaxial cable with the fourth feed pin (380). The second inner metal layer (290) is spaced apart from the fourth feed pin (380) and is not electrically connected to the fourth feed pin (380).

Through this, the second inner metal layer (290) eliminates parasitic resonance caused by coupling between the fourth feed pin (380) and the second patch antenna (200). Accordingly, the stacked patch antenna can prevent isolation degradation due to parasitic resonance.

The first feed pin (320) is inserted through a through hole formed as the first patch antenna (100) and the second patch antenna (200) are stacked. The first feed pin (320) is inserted through a first through hole (140) of the first patch antenna (100) and a fifth through hole (240) of the second patch antenna (200).

The second feed pin (340) is inserted through a through hole formed as the first patch antenna (100) and the second patch antenna (200) are stacked. The second feed pin (340) is inserted through the second through hole (150) of the first patch antenna (100) and the sixth through hole (250) of the second patch antenna (200).

The third feed pin (360) is inserted through a through hole formed as the first patch antenna (100) and the second patch antenna (200) are stacked. The third feed pin (360) is inserted through the third through hole (160) of the first patch antenna (100) and the seventh through hole (260) of the second patch antenna (200).

The fourth feed pin (380) is inserted through a through hole formed by stacking the first patch antenna (100) and the second patch antenna (200). The fourth feed pin (380) is inserted through the fourth through hole (170) of the first patch antenna (100) and the eighth through hole (270) of the second patch antenna (200).

The first feed pin (320) and the second feed pin (340) are directly connected to the first upper patch (120) of the first patch antenna (100). Accordingly, the first upper patch (120) fed by the first feed pin (320) and the second feed pin (340) operates as a radiator that transmits and receives a first frequency signal, which is a signal of approximately 1.5 GHz to 1.6 GHz band (e.g., GNSS L1 RHCP).

The first feed pin (320) and the second feed pin (340) are indirectly connected to the second upper patch (220) of the second patch antenna (200). The first feed pin (320) and the second feed pin (340) are indirectly connected to the second upper patch (220) through coupling (EM coupling (Electronic and Magnetic coupling)) in region A of FIG. 2. Accordingly, the second upper patch (220) fed by the first feed pin (320) and the second feed pin (340) operates as a radiator that transmits and receives a second frequency signal, which is a signal of approximately 1.2 GHz band (e.g., GNSS L5 RHCP).

The third feed pin (360) and the fourth feed pin (380) are directly connected to the first upper patch (120) of the first patch antenna (100). The third feed pin (360) is isolated from the second upper patch (220) by the first inner metal layer (280) electrically connecting the second upper patch (220) and the second lower patch (230) of the second patch antenna (200) and the second inner metal layer (290) electrically connecting the second upper patch (220) and the second lower patch (230) of the second patch antenna (200). Accordingly, the first upper patch (120) powered by the first feed pin (320) and the second feed pin (340) operates as a radiator that transmits and receives a third frequency signal, which is a signal in the band of approximately 1.5 GHz to 1.6 GHz (e.g., Global star 1.6 GHz LHCP, Thuraya 1.5 GHz~1.6 GHz LHCP).

Referring to FIG. 7, the stacked patch antenna may be configured to further include a first hybrid coupler (420) and a second hybrid coupler (440).

The first hybrid coupler (420) includes a first input terminal connected to the first power supply pin (320), a second input terminal connected to the second power supply pin (340), a first output terminal connected to a signal processing element that processes a first frequency signal and a second frequency signal, and a second output terminal connected to ground. At this time, a resistance of approximately 50 ohms is connected between the ground and the second output terminal. The first output terminal outputs the first frequency signal and the second frequency signal to the signal processing element.

The second hybrid coupler (440) includes a first input terminal connected to the third feed pin (360), a second input terminal connected to the fourth feed pin (380), a first output terminal connected to ground, and a second output terminal connected to a signal processing element that processes a third frequency signal. At this time, a resistance of approximately 50 ohms is connected between the ground and the first output terminal. The second output terminal outputs the third frequency signal to the signal processing element.

The stacked patch antenna may be configured such that a space (S) is formed between at least one of the first feed pin (320) and the second feed pin (340) and the first upper patch (120), such that at least one of the first feed pin (320) and the second feed pin (340) is spaced apart from the first upper patch (120). Accordingly, the first upper patch (120) is electrically disconnected from at least one of the first feed pin (320) and the second feed pin (340), thereby adjusting the phase of the stacked patch antenna module to improve isolation.

For example, referring to FIGS. 8 and 9, a stacked patch antenna has a space (S) formed between a first feed pin (320) and a first upper patch (120). A first-second through hole (140b), a second-second through hole (150b), a third-second through hole (160b), and a fourth-second through hole (170b) are formed in the first upper patch (120), and the first-second through hole (140b) is formed to have a larger area than the second-second through hole (150b), the third-second through hole (160b), and the fourth-second through hole (170b). The first-second through hole (140b) is formed to have a larger area than the first feed pin (320, i.e., the head of the first feed pin (320)). Accordingly, a gap space (S) is formed between the first feed pin (320) and the first upper patch (120).

As another example, referring to FIGS. 10 and 11, a stacked patch antenna has a space (S) formed between a second feed pin (340) and a first upper patch (120). A first-second through hole (140b), a second-second through hole (150b), a third-second through hole (160b), and a fourth-second through hole (170b) are formed in the first upper patch (120), and the second-second through hole (150b) is formed to have a larger area than the first-second through hole (140b), the third-second through hole (160b), and the fourth-second through hole (170b). The second-second through hole (150b) is formed to have a larger area than the second feed pin (340, i.e., the head of the second feed pin (340)). Accordingly, a gap space (S) is formed between the second feed pin (340) and the first upper patch (120).

As another example, referring to FIGS. 12 and 13, a stacked patch antenna has a space (S) formed between a first feed pin (320) and a first upper patch (120) and between a second feed pin (340) and the first upper patch (120). A first-second through hole (140b), a second-second through hole (150b), a third-second through hole (160b), and a fourth-second through hole (170b) are formed in the first upper patch (120), and the first-second through hole (140b) and the second-second through hole (150b) are formed to have a larger area than the third-second through hole (160b) and the fourth-second through hole (170b). The first-second through hole (140b) is formed to have a wider area than the first feed pin (320, i.e., the head of the first feed pin (320)), and the second-second through hole (150b) is formed to have a wider area than the second feed pin (340, i.e., the head of the second feed pin (340)). Accordingly, a gap space (S) is formed between the first feed pin (320) and the first upper patch (120) and between the second feed pin (340) and the first upper patch (120).

Referring to FIG. 14, the stacked patch antenna may further include an adhesive substrate (500) interposed between the first patch antenna (100) and the second patch antenna (200) to adhere and separate the first patch antenna (100) and the second patch antenna (200). Since the stacked patch antenna is configured by stacking the first patch antenna (100) and the second patch antenna (200), the first lower patch (130) and the second upper patch (220) may come into contact, causing interference in a frequency band where the second upper patch (220) resonates. The adhesive substrate (500) prevents direct contact between the first lower patch (130) and the second upper patch (220) while adhering the first patch antenna (100) and the second patch antenna (200), thereby preventing interference from occurring in the frequency band.

Meanwhile, referring to FIG. 15, the stacked patch antenna can also prevent frequency band interference of the second upper patch (220) by the first lower patch (130) by removing the first lower patch (130) of the first patch antenna (100).

The above description is merely an illustrative description of the technical idea of the present invention, and those skilled in the art will appreciate that various modifications and variations may be made without departing from the essential characteristics of the present invention. Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention but to explain it, and the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within a scope equivalent thereto should be interpreted as being included in the scope of the rights of the present invention.

100: 1st patch antenna 110: 1st base material
120: 1st upper patch 130: 1st lower patch
140: 1st through hole 150: 2nd through hole
160: 3rd through hole 170: 4th through hole
200: 2nd patch antenna 210: 2nd base material
220: 2nd upper patch 230: 2nd lower patch
240: 5th through hole 250: 6th through hole
260: 7th through hole 270: 8th through hole
280: First inner metal layer 290: Second inner metal layer
320: 1st feed pin 340: 2nd feed pin
360: 3rd power pin 380: 4th power pin
420: 1st hybrid coupler 440: 2nd hybrid coupler
500: Adhesive Base

Claims (16)

1st patch antenna;
A second patch antenna positioned below the first patch antenna;
A first feed pin penetrating the first patch antenna and the second patch antenna;
A second feed pin spaced apart from the first feed pin and penetrating through the first patch antenna and the second patch antenna;
a third feed pin spaced apart from the first feed pin and the second feed pin and penetrating the first patch antenna and the second patch antenna; and
A fourth feed pin is spaced apart from the first feed pin, the second feed pin and the third feed pin and penetrates the first patch antenna and the second patch antenna,
The second patch antenna is a laminated patch antenna module in which a plurality of via holes are formed through which the first feed pin, the second feed pin, the third feed pin, and the fourth feed pin respectively penetrate, and an internal metal layer is formed on the inner wall surface of at least one of the plurality of via holes. In the first paragraph,
In the above first patch antenna,
A first through hole through which the first power supply pin passes;
A second through hole spaced apart from the first through hole and through which the second power supply pin passes;
a third through hole spaced apart from the first through hole and the second through hole and through which the third power supply pin passes; and
A laminated patch antenna module having a fourth through hole formed spaced apart from the first through hole, the second through hole, and the third through hole and through which the fourth feed pin passes. In the second paragraph,
A stacked patch antenna module in which a virtual straight line connecting the first through hole and the third through hole and a virtual straight line connecting the second through hole and the fourth through hole are orthogonal. In the second paragraph,
In the above second patch antenna,
A fifth through hole through which the first power supply pin passes through the first through hole;
A sixth through hole spaced apart from the fifth through hole and through which the second power supply pin passing through the second through hole passes;
A seventh through hole spaced apart from the fifth through hole and the sixth through hole and through which the third power supply pin, which has penetrated the third through hole, penetrates; and
A laminated patch antenna module having an eighth through hole formed spaced apart from the fifth through hole, the sixth through hole, and the seventh through hole, and through which the fourth feed pin passing through the fourth through hole passes. In paragraph 4,
The above second patch antenna,
A first inner metal layer arranged on the inner wall surface of the seventh through hole and connected to the upper patch and lower patch of the second patch antenna and spaced apart from the third feed pin; and
A laminated patch antenna module including a second inner metal layer arranged on the inner wall surface of the eighth through hole and connected to the upper patch and lower patch of the second patch antenna, and spaced apart from the fourth feed pin. In the second paragraph,
The above first patch antenna,
A first base substrate having a 1-1 through hole through which the first power supply pin passes, a 2-1 through hole through which the second power supply pin passes, a 3-1 through hole through which the third power supply pin passes, and a 4-1 through hole through which the fourth power supply pin passes formed therein;
A first upper patch is formed on the upper surface of the first base substrate, and has a first-second through hole through which the first power supply pin passes, a second-second through hole through which the second power supply pin passes, a third-second through hole through which the third power supply pin passes, and a fourth-second through hole through which the fourth power supply pin passes; and
A laminated patch antenna comprising a first lower patch formed on a lower surface of the first base substrate, wherein a 1-3 through hole through which the first feed pin passes, a 2-3 through hole through which the second feed pin passes, a 3-3 through hole through which the third feed pin passes, and a 4-3 through hole through which the fourth feed pin passes are formed. In Article 6,
The above 1-1 through hole, the 1-2 through hole and the 1-3 through hole overlap to form a first through hole through which the first power supply pin passes,
The above 2-1 through hole, the 2-2 through hole and the 2-3 through hole overlap to form a second through hole through which the second power supply pin passes,
The above 3-1 through hole, the 3-2 through hole and the 3-3 through hole overlap to form a third through hole through which the third power supply pin passes.
A laminated patch antenna in which the above-mentioned 4-1 through hole, the above-mentioned 4-2 through hole, and the above-mentioned 4-3 through hole overlap to form a fourth through hole through which the fourth feed pin passes. In Article 6,
At least one of the first power supply pin and the second power supply pin,
A stacked patch antenna module spaced apart from the first upper patch to form a spaced apart space, and not electrically connected to the first upper patch by the spaced apart space. In the first paragraph,
The above second patch antenna,
A second base substrate having a 5-1 through hole through which the first power supply pin passes, a 6-1 through hole through which the second power supply pin passes, a 7-1 through hole through which the third power supply pin passes, and an 8-1 through hole through which the fourth power supply pin passes formed;
A second upper patch is formed on the upper surface of the second base material, and has a 5-2 through hole through which the first power supply pin passes, a 6-2 through hole through which the second power supply pin passes, a 7-2 through hole through which the third power supply pin passes, and an 8-2 through hole through which the fourth power supply pin passes; and
A laminated patch antenna module including a second lower patch disposed on a lower surface of the second base substrate and having a 5-3 through hole through which the first feed pin passes, a 6-3 through hole through which the second feed pin passes, a 7-3 through hole through which the third feed pin passes, and an 8-3 through hole through which the fourth feed pin passes are formed. In Article 9,
The above 5-1 through hole, the 5-2 through hole and the 5-3 through hole overlap to form a fifth through hole through which the first feed pin, which has penetrated the first through hole of the first patch antenna, penetrates.
The above 6-1 through hole, the 6-2 through hole and the 6-3 through hole overlap to form a 6th through hole through which the second feed pin, which has penetrated the second through hole of the first patch antenna, penetrates.
The above 7-1 through hole, the 7-2 through hole and the 7-3 through hole overlap to form a 7th through hole through which the 3rd feed pin, which has penetrated the 3rd through hole of the 1st patch antenna, penetrates.
A laminated patch antenna module in which the above-mentioned 8-1 through-hole, the above-mentioned 8-2 through-hole, and the above-mentioned 8-3 through-hole overlap to form an 8th through-hole through which the 4th feed pin, which has penetrated the 4th through-hole of the above-mentioned 1st patch antenna, penetrates. In Article 9,
The above second patch antenna,
The 1-1 inner metal layer arranged on the inner wall surface of the above 7-1 through hole;
The first-second inner metal layer arranged on the inner wall surface of the above-mentioned 7-2 through hole; and
Including the 1-3 inner metal layer arranged on the inner wall surface of the above 7-3 through hole,
A laminated patch antenna module, wherein the first-first inner metal layer, the first-second inner metal layer, and the first-third inner metal layer constitute a first inner metal layer connecting the second upper patch and the second lower patch. In Article 9,
The above second patch antenna,
A 2-1 inner metal layer arranged on the inner wall surface of the above 8-1 through hole;
The 2-2 inner metal layer arranged on the inner wall surface of the above 8-2 through hole; and
Including a 2-3 inner metal layer arranged on the inner wall surface of the above 8-3 through hole,
A laminated patch antenna module, wherein the 2-1 inner metal layer, the 2-2 inner metal layer, and the 2-3 inner metal layer constitute a second inner metal layer connecting the second upper patch and the second lower patch. In Article 9,
The above second upper patch,
A stacked patch antenna module spaced apart from the first feed pin penetrating the 5-2 through hole and the second feed pin penetrating the 6-2 through hole and connected to the first feed pin and the second feed pin through electromagnetic coupling. In the first paragraph,
A first hybrid coupler connected to the first power supply pin and the second power supply pin and outputting a first frequency signal and a second frequency signal; and
A stacked patch antenna module further comprising a second hybrid coupler connected to the third feed pin and the fourth feed pin and outputting a third frequency signal. In Article 14,
The above first hybrid coupler,
A first input terminal connected to the first power supply pin;
A second input terminal connected to the second power supply pin;
A first output terminal connected to a signal processing element that processes the first frequency signal and the second frequency signal; and
A stacked patch antenna module comprising a second output terminal connected to a resistor. In Article 14,
The above second hybrid coupler,
A first input terminal connected to the third power supply pin;
A second input terminal connected to the fourth power supply pin;
a first output terminal connected to a resistor; and
A stacked patch antenna module including a second output terminal connected to a signal processing element for processing the third frequency signal.