KR20240172341A - Apparatus for processing substrate - Google Patents

Abstract

One embodiment of the present invention provides a substrate processing device including an outer housing forming an outer appearance, an inner housing including a mounting portion for mounting an object to be processed and inserted into the inner side of the outer housing so as to be rotatable relative to the outer housing, a sputtering portion disposed in the outer housing for forming a thin film on a surface of the object to be processed, and a driving portion for providing a driving force so that the inner housing can rotate, wherein the mounting portion is formed in the shape of a concave groove portion on an outer surface of the inner housing toward the center of the inner housing.

Description

{Apparatus for processing substrate}

The present invention relates to a substrate processing device.

In general, in the manufacturing process of semiconductor devices, the formation of thin films, specifically the formation of metal layers, is formed by physical vapor deposition methods such as sputtering and chemical vapor deposition methods.

Among these, the sputtering device can deposit sputtering particles from a target onto a processing object in a space lower than atmospheric pressure. For example, when a direct current or alternating current voltage is applied to a target in a vacuum chamber containing a small amount of argon gas, an inert gas, an electric field is formed, and the argon gas is ionized into positive ions by the strong electric field, and accordingly, the positive ions accelerate and collide with the negatively charged target, and the deposit is ejected from the target by the impact and is adsorbed onto the processing object and deposited.

In conventional sputtering devices, the target and the workpiece or the plasma forming area and the workpiece are generally arranged vertically relative to the ground. As a result, foreign substances inevitably fall on the workpiece or target due to gravity, and there is a problem that the film is unevenly deposited on the surface of the workpiece or is damaged by the foreign substances, affecting the characteristics of the film.

The technical problem to be achieved by the present invention is to provide a substrate processing device including an outer housing forming an outer appearance and an inner housing rotatably inserted into the outer housing, and a mounting portion formed on an outer surface of the inner housing so that a processing object can be mounted thereon, thereby enabling uniform thin film deposition on the surface of the processing object.

One aspect of the present invention provides a substrate processing device including an outer housing forming an outer appearance, an inner housing inserted into the inner side of the outer housing so as to be rotatable relative to the outer housing and including a mounting portion on which an object to be processed is mounted, a sputtering portion disposed in the outer housing and forming a thin film on a surface of the object to be processed, and a driving portion providing a driving force so that the inner housing can rotate, wherein the mounting portion is formed in the shape of a concave groove portion on an outer surface of the inner housing toward the center of the inner housing.

In addition, a plurality of sputtering sections are provided, and each of the plurality of sputtering sections can be arranged along the inner peripheral surface of the outer housing facing the inner housing.

In addition, a plurality of anchoring portions are provided, and the plurality of anchoring portions can be arranged along the outer circumference of the inner housing facing the outer housing.

In addition, on the outer surface of the inner housing, a partition may be formed to divide one mounting portion and an adjacent mounting portion at a set interval.

Additionally, the inner housing is formed in a cylindrical shape and can rotate about a first virtual line that is perpendicular to the ground.

Additionally, the settling portion and the sputtering portion may be arranged to face each other along a second virtual line that is perpendicular to the first virtual line.

In addition, the device may further include a support member that is detachably positioned on the mounting portion and supports the object to be treated.

In addition, the support portion is arranged on one side of the mounting portion facing the sputter portion, and a guide portion that guides the insertion path of the support portion can be protrudingly formed on one side of the mounting portion.

Additionally, the inner housing may further include a vibrating unit positioned on one side of the inner housing adjacent to the mounting unit and configured to vibrate the support unit.

Additionally, a rotation limiting member may be further included to limit the rotation range of the inner housing.

A substrate processing device according to one embodiment of the present invention has the effect of reducing the time and energy consumed to form a vacuum inside the substrate processing device by limiting the vacuum region to a hollow region between the inner surface of the outer housing and the outer surface of the inner housing.

FIG. 1 is a perspective view of a substrate processing device according to one embodiment of the present invention.
Figure 2 is a cross-sectional drawing taken along line II` of Figure 1.
Figure 3 is a cross-sectional drawing taken along line II-II` of Figure 1.
Figure 4 is a perspective view of a mounting portion according to one embodiment of the present invention.
FIG. 5 is a drawing illustrating a heating unit, a vibrating unit, and a transmission unit according to one embodiment of the present invention.
FIG. 6 is a drawing showing the usage state of an opening/closing unit according to one embodiment of the present invention.
FIG. 7 and FIG. 8 are drawings illustrating a state of use of a substrate processing device according to one embodiment of the present invention.

The present invention can be modified in various ways and has various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. The effects and features of the present invention and the methods for achieving them will become clear with reference to the embodiments described in detail below together with the drawings. However, the present invention is not limited to the embodiments disclosed below, and can be implemented in various forms.

Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. When describing with reference to the drawings, identical or corresponding components are given the same drawing reference numerals and redundant descriptions thereof are omitted.

In the examples below, singular expressions include plural expressions unless the context clearly indicates otherwise.

In the examples below, terms such as “include” or “have” mean that a feature or component described in the specification is present, and do not exclude in advance the possibility that one or more other features or components may be added.

In some embodiments, where the implementation is otherwise feasible, a particular process sequence may be performed in a different order than the one described. For example, two processes described in succession may be performed substantially simultaneously, or in a reverse order from the one described.

In the drawings, the sizes of components may be exaggerated or reduced for convenience of explanation. For example, the sizes and thicknesses of each component shown in the drawings are arbitrarily shown for convenience of explanation, and therefore the following embodiments are not necessarily limited to what is shown.

FIG. 1 is a perspective view of a substrate processing apparatus according to an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line I-I` of FIG. 1, and FIG. 3 is a cross-sectional view taken along line II-II` of FIG. 1. FIG. 4 is a perspective view of a mounting portion according to an embodiment of the present invention, and FIG. 5 is a view illustrating a heating portion, a vibrating portion, and a transmission portion according to an embodiment of the present invention. FIG. 6 is a view illustrating a usage state of an opening/closing portion according to an embodiment of the present invention, and FIGS. 7 and 8 are views illustrating usage states of a substrate processing apparatus according to an embodiment of the present invention.

Referring to FIGS. 1, 7, and 8, a substrate processing device (1) according to one embodiment of the present invention can generate a magnetic field and an electric field to form a plasma region (PA), and can accelerate a gas such as argon (Ar) ionized in the plasma state and collide it with a preset target material (hereinafter, referred to as a 'target portion (320)'). Through this, a target material that has received an impact amount is released and deposited on the surface of the object to be processed (OB), thereby forming a thin film on the surface of the object to be processed (OB).

In this specification, the workpiece (OB) can be formed of various types of materials on which a vacuum deposition process is performed, and for example, the workpiece (OB) can include a substrate such as a wafer or glass.

Referring to FIGS. 1, 4, and 7, a substrate processing device (1) according to one embodiment of the present invention may include an outer housing (100), an inner housing (200), a sputtering unit (300), a support unit (400), a driving unit (500), a pressure adjusting unit (600), a heating unit (700), a vibrating unit (800), and a transmission unit (900).

An external housing (100) according to one embodiment of the present invention forms the exterior of a substrate processing device (1) and may include an external housing body (110), a cover portion (130), and a shaft portion (150).

The outer housing body (110) can provide a space into which the inner housing (200) can be rotatably inserted, and the interior can be formed as hollow.

In this specification, the first virtual line (AX1) can be interpreted as a virtual line with the ground, and the second virtual line (AX2) can be interpreted as a virtual line perpendicular to the first virtual line (AX1).

In one embodiment, the inner housing (200) can rotate clockwise or counterclockwise about the first virtual line (AX1) as an axis inside the outer housing (100).

As an example, the second virtual line (AX2) may be interpreted as a virtual line that is perpendicular to the first virtual line (AX1) and passes through the center of the inner housing body (210) and the center of the mounting portion (220).

In addition, when the fixing portion (220) and the sputtering portion (300) are positioned facing each other, the second virtual line (AX2) can be interpreted as the longitudinal central axis of the sputtering portion (300).

In this specification, 'r1' is defined as a distance from the first virtual line (AX1) to one side of the mounting portion (220) facing the sputter portion (300), 'r2' is defined as a distance from the first virtual line (AX1) to the outer surface of the inner housing (200), and 'r3' is defined as a distance from the first virtual line (AX1) to the inner surface of the outer housing (100).

Referring to FIG. 2, the internal space of the outer housing body (110) may be formed as a hollow region, and the hollow region may be formed as a cylindrical space extending from the first virtual line (AX1) to a region spaced apart by 'r3'.

Specifically, 'r3' can be formed to be greater than 'r2', which is the distance from the center to the outer surface of the inner housing (200), so that the inner housing (200) can rotate in the inner space of the outer housing body (110) without colliding with the outer housing body (110).

In one embodiment, the distance from the first virtual line (AX1) to the inner surface of the outer housing (100) may be formed to be equal to or similar to the distance from the first virtual line (AX1) to the outer surface of the inner housing (200).

As a result, the hollow area inside the substrate processing device (1) is limited to the space between the outer surface of the inner housing (200) and the inner surface of the outer housing (100), so the volume of the space that the pressure adjustment unit (600) must form as a vacuum area (VA) is limited to the volume of the space between the outer surface of the inner housing (200) and the inner surface of the outer housing (100), so that the time required for the pressure adjustment unit (600) to form the inside of the substrate processing device (1) as a vacuum area (VA) is shortened, and there is an effect of reducing the power consumption.

Referring to FIGS. 1 to 3, an outer housing body (110) according to one embodiment of the present invention may have a plurality of insertion holes (110h) formed along its periphery.

A sputtering portion (300) can be inserted and fastened into the insertion hole (110h), and the number of insertion holes (110h) can be provided corresponding to the number of sputtering portions (300).

In one embodiment, the inner diameter of the insertion hole (110h) may be formed to be the same as the outer diameter of the sputtering part (300), specifically, the sputtering main body (310) to be described later. In this way, the sputtering main body (310) is forcibly connected to the insertion hole (110h), thereby preventing fluid from flowing into or out of the space between the sputtering main body (310) and the insertion hole (110h), making it easy to maintain the inner space of the outer housing main body (110) as a vacuum region (VA).

As an optional embodiment, a sealing member (not shown in the drawing) may be positioned between the insertion hole (110h) and the sputtering body (310). As a result, the sealing member can limit the inflow and outflow of fluid into the space between the sputtering body (310) and the insertion hole (110h), thereby maintaining the internal space of the outer housing body (110) as a vacuum region (VA).

As an optional embodiment, the sputter body (310) can be fastened to the insertion hole (110h) in a screw-joining manner.

However, it is not limited thereto, and the insertion hole (110h) may be formed in various shapes to enable the sputter body (310) to be detachably attached to the external housing body (110). Accordingly, the sputter body (310) can be attached/detached from the external housing body (110) by inserting/detaching the sputter body (310) from the insertion hole (110h), thereby facilitating repair/replacement of the sputter body (310).

Referring to FIG. 1, an outer housing body (110) according to one embodiment of the present invention may have an opening (drawing symbol not set) formed on one surface. Specifically, the outer housing body (110) may have an opening formed that connects an internal space in which an inner housing (200) is installed and the outside.

The above opening may be formed to have a diameter equal to or smaller than 'r3', or equal to or larger than 'r2'. As a result, the inner housing (200) can be installed into the inner housing (100) or separated from the outer housing (100) through the opening, thereby facilitating repair/replacement of the inner housing (200).

In addition, since the object to be treated (OB) or the support (400) can be introduced into the mounting portion (220) located inside the external housing (100) through the opening, it is easy to separate the object to be treated (OB) on which the thin film has already been deposited from the mounting portion (220) and to mount the object to be treated (OB) on which the thin film has not yet been deposited onto the mounting portion (220), thereby ensuring the ease of the thin film deposition process of the object to be treated (OB).

According to one embodiment of the present invention, the cover part (130) divides the internal space and the external space of the external housing body (110) and can selectively open and close the opening.

Referring to FIGS. 1 and 3, one side of the cover part (130) can be inserted into the opening to close the internal space of the outer housing (100) in which the inner housing (200) is installed. Accordingly, by joining the cover part (130) to the opening, the internal space of the outer housing (100) can be formed as a vacuum area (VA).

In one embodiment, a handle part (131) may be connected to one side of the cover part (130). This allows a user to easily attach the cover part (130) to the external housing (100) or detach it from the external housing (100) by holding the handle part (131).

As an example, one side of the cover portion (130) may be formed of a material capable of ensuring visibility, such as glass, transparent/opaque plastic, etc. Specifically, one side of the cover portion (130) adjacent to the fixing portion (220) may be formed of a material capable of ensuring visibility.

This allows the user to check in real time the thin film deposition process of the object to be treated (OB) mounted on the mounting portion (220) through the cover portion (130), so that the object to be treated (OB) can be replaced at an appropriate time or, if a problem occurs in the thin film deposition process, this can be checked in a timely manner, thereby enabling effective surface treatment.

In one embodiment, a sealing groove (132) may be formed in the shape of a groove on one side of the cover portion (130) that comes into contact with the outer housing body (110), and a sealing portion (S) that is seated in the sealing groove (132) may be positioned to come into contact with the cover portion (130) and the outer housing body (110), respectively.

As a result, the sealing part (S) that is installed in the sealing groove part (132) has the effect of ensuring the safety and efficiency of thin film deposition by limiting the inflow/outflow of fluid or plasma area (PA) into the space between the cover part (130) and the outer housing body (110).

As an optional embodiment, the sealing groove (132) may be formed along the perimeter of one side of the outer housing body (110) that contacts the cover portion (130).

Referring to FIGS. 1 and 3, a shaft portion (150) according to one embodiment of the present invention can transmit driving force from a driving portion (500) to an inner housing (200) so that the inner housing (200) can rotate.

In one embodiment, one end of the shaft portion (150) may penetrate the outer housing (100) and be positioned in the internal space of the outer housing body (110), and an inner housing (200) may be connected to the one end of the shaft portion (150).

Through this, as the shaft part (150) receives driving force from the driving part (500) and rotates clockwise or counterclockwise, the inner housing (200) connected to the shaft part (150) and located inside the outer housing body (110) can rotate clockwise or counterclockwise.

Accordingly, as the inner housing (200) rotates in relation to the outer housing (100) by the shaft portion (150), the workpiece (OB) located on the outer surface of the inner housing (200) can be subjected to a surface treatment process sequentially from a plurality of different sputter portions (300) arranged along the inner surface of the outer housing (100).

In one embodiment, the shaft portion (150) can rotate about a first virtual line (AX1) penetrating the center of the inner housing (200) as a rotation axis. Accordingly, the inner housing (200) connected to one end of the shaft portion (150) can also rotate about the first virtual line (AX1) as a rotation axis.

In one embodiment, one end of the shaft portion (150) and the inner housing (200) may be detachably connected. Specifically, a groove portion corresponding to the shape of one end of the shaft portion (150) may be formed on one side of the inner housing (200), and when one end of the shaft portion (150) is inserted into the groove portion, the inner housing (200) and the shaft portion (150) may be detachably connected.

In one embodiment, the shaft portion (150) may be positioned in an area opposite to the area where the cover portion (130) is positioned with respect to the inner housing (200). For example, when the cover portion (130) is positioned in an area on one side (upper side as shown in FIG. 3) of the inner housing (200), the shaft portion (150) may be positioned in an area on the other side (lower side as shown in FIG. 3) of the inner housing (200) that is different from the one side.

As a result, the inner housing (200) and the shaft part (150) can be separated by opening the cover part (130) and moving the inner housing (200) in the above-mentioned one direction, so that repair/replacement of the inner housing (200) or replacement of the object to be treated (OB) that can be installed in the inner housing (200) is facilitated.

In one embodiment, the substrate processing device (1) may include a rotation limiting member (not shown in the drawing) that limits the rotation range of the shaft portion (150) or the internal housing (200). This can prevent a phenomenon in which an electrical device, such as a wire, is twisted or broken due to the shaft portion (150) or the internal housing (200) rotating in one direction by an angle greater than a preset angle.

In one embodiment, the rotation restriction member may be connected to one side of the shaft member (150) so that the shaft member (150) or the inner housing (200) can rotate within a range of 180° about the first virtual line (AX1). In this case, the workpiece (OB) mounted on one mounting member (220) can be subjected to a thin film deposition process limited to sputtering members (300) positioned within a range of 180° of the outer housing (100), and the target materials forming the target members (320) included in each of the plurality of sputtering members (300) can overlap at intervals of 180° based on the first virtual line (AX1).

Specifically, when the rotation restriction member limits the rotational range of the inner housing (200) to 180° and the six sputtering members (300) are equiangularly arranged along the circumference of the outer housing (100) with respect to the first virtual line (AX1), the six target members (320) included in each of the six sputtering members (300) may be sequentially composed of material A, material B, material C, material A, material B, and material C along the circumference direction of the outer housing (100).

As an optional embodiment, the shaft portion (150) may further include a rotary connector (not shown in the drawing) such as a slip ring, and specifically, the inner housing (200), the sputter portion (300), the pressure adjustment portion (600), the heating portion (700), the vibrating portion (800), etc. may be electrically connected to an external power supply device through the rotary connector.

When each component of the substrate processing device (1) and an external power supply are connected by wires, there was a conventional technical limitation that a twisting phenomenon occurred as the internal housing body (210) rotated, or that the rotational range of the internal housing body (210) had to be limited to prevent the twisting phenomenon. However, by electrically connecting each component of the substrate processing device (1) and an external power supply using a rotary connector, the twisting phenomenon of the wires was prevented without limiting the rotational range of the internal housing body (210), thereby overcoming the conventional technical limitation.

Referring to FIGS. 1 to 3, 7 and 8, an inner housing (200) according to one embodiment of the present invention is inserted into the interior of an outer housing (100) so as to be capable of relative rotation with the outer housing (100), and may include an inner housing body (210), a mounting portion (220) and a partition portion (230).

According to one embodiment of the present invention, the inner housing body (210) forms the outer appearance of the inner housing (200) and can rotate around the first virtual line (AX1).

Referring to FIG. 2, the radius of the inner housing body (210) may be formed as 'r2', and the radius of the inner housing body (210) may be formed smaller than the distance from the first virtual line (AX1) to the inner peripheral surface of the outer housing body (110).

Due to this, the inner housing body (210) is inserted into the outer housing body (110) and can rotate without colliding with the inner surface of the outer housing body (110).

The inner housing body (210) may be formed in a drum shape, and specifically, the inner housing body (210) may be formed in a drum shape with a solid interior or a drum shape including a closed hollow region.

As a result, the hollow area of the internal space of the outer housing body (110) is limited to the external space of the inner housing body (210), thereby reducing the exhaust amount that the pressure adjusting unit (600) must exhaust to form the internal space of the outer housing body (110) into a vacuum area (VA).

As an optional embodiment, the internal space of the inner housing body (210) may be formed as a closed hollow region, in which case the internal space of the inner housing body (210) may be communicated with the pressure adjustment unit (600) to be described later. Specifically, the inner housing body (210) forming the hollow region is connected to the pressure adjustment unit (600), and air existing inside the inner housing body (210) may be exhausted to the outside by the pressure adjustment unit (600).

Accordingly, when the internal space of the internal housing body (210) is formed in a low-pressure/vacuum state, the volumetric heat of the internal space is lower than when the internal space of the internal housing body (210) is filled with a solid or gas, so there is an effect of reducing the energy/time required for the heating unit (700) to heat the internal housing body (210) or the mounting unit (220) on which the object to be treated (OB) is mounted to a preset temperature.

However, it is not limited thereto, and the inner housing body (210) may be formed in various shapes, such as a polygonal pillar shape, so as to be inserted into the interior of the outer housing body (110) without coming into contact with the inner surface of the outer housing body (110) and to rotate about the first virtual line (AX1) as the rotation axis.

Referring to FIGS. 1 to 3, 7 and 8, a mounting portion (220) according to one embodiment of the present invention provides a space in which a treatment object (OB) is mounted, and may be formed in the shape of a concave groove portion from the outer surface of the inner housing (200) toward the center of the inner housing (200).

A plurality of anchoring parts (220) may be provided, and a plurality of anchoring parts (220) may be arranged along the outer circumference of the inner housing (200) facing the outer housing (100).

In one embodiment, a plurality of fixing portions (220) may be arranged along the outer circumference of the inner housing (200) at a preset angle based on a first virtual line (AX1), and the preset angle may be set to be the same as the angle formed by the plurality of sputtering portions (300) with respect to the first virtual line (AX1).

In one embodiment, one surface of the mounting portion (220) facing the inner surface of the outer housing (100) may be formed as a flat surface. Accordingly, a plate-shaped workpiece (OB) or a support portion (400) supporting the workpiece (OB) is arranged on the one surface of the mounting portion (220), so that a thin film can be deposited on the surface of the workpiece (OB) by the sputter portion (300) arranged on the inner surface of the outer housing (100).

Referring to FIGS. 1 and 2, the cross-sectional area of the mounting portion (220) may be formed in a shape that narrows from the outside toward the first virtual line (AX1). Specifically, the inner surface (hereinafter referred to as “slope portion (222)”) of the mounting portion (220) that extends from the above-mentioned one surface of the mounting portion (220) on which the object to be processed (OB) is placed to the outer peripheral surface of the inner housing (200) may be formed as an inclined surface that gets closer to the second virtual line (AX2) as it goes toward the first virtual line (AX1).

As an optional embodiment, the slope (222) may be formed into a curved shape that gets closer to the second virtual line (AX2) as it goes from the outside to the center.

However, it is not limited thereto, and the fixing portion (220) may be formed in various shapes such that the cross-sectional area of the fixing portion (220) adjacent to the outer surface of the inner housing body (210) is formed relatively wider than the cross-sectional area of the fixing portion (220) adjacent to the center of the inner housing body (210).

As a result, the settling portion (220) is formed in a shape that converges from the outside of the settling portion (220) to one side of the settling portion (220) where the object to be treated (OB) is placed, so that the plasma area (PA) formed in the internal space of the settling portion (220) or the space between the settling portion (220) and the sputtering portion (300) is focused on the area where the object to be treated (OB) is located, thereby improving the efficiency and precision of thin film deposition.

In addition, since the settling portion (220) is formed in a shape that converges from the outside of the settling portion (220) to one side of the settling portion (220) where the object to be treated (OB) is placed, most of the target material released from the target portion (320) is guided along a path to the surface of the object to be treated (OB) by the shape of the settling portion (220), while at the same time minimizing the target material released into the space outside the settling portion (220), thereby effectively achieving a thin film deposition effect of the object to be treated (OB).

In a conventional substrate processing device (1), the sputtering unit (300) is positioned above the workpiece (OB) and is positioned so as to face the workpiece along an imaginary line perpendicular to the ground. Accordingly, a lump of target material or foreign matter positioned above the workpiece (OB) falls on the surface of the workpiece (OB) due to the influence of gravity (G), which causes unintended pinholes to be formed in the thin film on the surface of the workpiece (OB) or destroys the thin film, resulting in uneven thin film formation, which is a problem.

Referring to FIGS. 1, 3, and 8, in order to solve the above problem, one side of the mounting portion (220) on which the workpiece (OB) is placed may be placed to face the sputter portion (300) along a second virtual line (AX2). Specifically, the second virtual line (AX2) may be defined as an imaginary line parallel to the ground, and the one side of the mounting portion (220) and the sputter portion (300) may be placed parallel to the ground.

This has the effect of preventing foreign substances or target materials of an unintended target portion (320) from falling from the surface of the object to be treated (OB), thereby ensuring the uniformity of the thin film formed on the surface of the object to be treated (OB).

In an optional embodiment, one side of the mounting portion (220) on which the workpiece (OB) can be placed is positioned above the sputter portion (300) and can be positioned to face each other along an imaginary line perpendicular to the ground. As a result, the target material emitted from the target portion (320) can be deposited on the surface of the workpiece (OB) while moving in the opposite direction to gravity (G), and foreign substances can be moved to an area opposite to the area where the workpiece (OB) is located by gravity (G), thereby ensuring the uniformity of the thin film formed on the surface of the workpiece (OB).

Referring to FIG. 4, a guide portion (221) according to one embodiment of the present invention guides the insertion path of a support portion (400) to be described later, and may be placed on one side of a mounting portion (220) facing the sputter portion (300).

In one embodiment, the guide portion (221) may be formed along the perimeter of the one side of the mounting portion (220), and a groove may be formed on one side so that the support portion (400) can be inserted. Specifically, the guide portion (221) may be formed in the shape of a rail that has a cross-section in the shape of an 'ㄱ' and extends along the perimeter of the one side of the mounting portion (220).

In one embodiment, the guide portion (221) may be formed integrally with the inner housing body (210).

As an optional embodiment, a hole may be formed to be connected to the above-mentioned surface of the mounting portion (220) and to enable the support portion (400) to be inserted and fastened.

As an optional embodiment, one side of the support member (400) may be formed in the shape of a groove formed on one side of the slope member (222) so that it can be settled.

However, it is not limited thereto, and the guide part (221) is located on one side of the fixing part (220) and can be formed in various shapes within the technical concept of providing an insertion path for the support part (400) while allowing the support part (400) to be fixed.

Accordingly, the support member (400) supporting the workpiece (OB) can be easily combined with/separated from the mounting member (220) by inserting/separating the support member (400) supporting the workpiece (OB) to be treated (OB) into/from the guide member (221), so that the support member (400) supporting the workpiece (OB) requiring thin film deposition can be mounted on the guide member (221) so that the workpiece (OB) and the sputter member (300) are positioned facing each other to deposit the thin film, and the workpiece (OB) can be removed from the internal mounting member (220) by separating the support member (400) supporting the workpiece (OB) on which the surface treatment process has already been performed from the guide member (221).

In addition, since the guide part (221) provides an insertion path for the support part (400), there is an effect in which the user can easily attach/detach the support part (400) to/from the fixing part (220).

In addition, since the support member (400) can be fixed in position by being seated in a groove formed in the guide member (221), the thin film deposition can be performed at a preset position of the support member (400) regardless of rotation or vibration of the inner housing body (210), thereby ensuring the precision of the thin film deposition.

Referring to FIGS. 1, 2, 4, and 7, a partition (230) according to one embodiment of the present invention partitions one mounting portion (220) and an adjacent mounting portion (220) at a set interval, and can be arranged along the outer circumference of the inner housing body (210).

Specifically, the partition (230) may include a wall that is arranged between one mounting portion (220) and an adjacent mounting portion (220) to partition the internal space of the one mounting portion (220) and the internal space of the adjacent mounting portion (220).

In one embodiment, the partition (230) may be formed in the shape of a wall extending from a slope (222) of one mounting portion (220) to a slope (222) of an adjacent mounting portion (220).

As an optional embodiment, the partition (230) is positioned between one mounting portion (220) and an adjacent mounting portion (220) and may be formed in the shape of a wall that protrudes outward from the outer surface of the inner housing body (210).

In one embodiment, the distance 'r2' from the center of the inner housing body (210) to the partition (230) may be formed to be relatively longer than the distance 'r1' from the center of the inner housing body (210) to the mounting portion (220).

The partition (230) and the inner housing body (210) may be formed integrally, but are not limited thereto, and the partition (230) and the inner housing body (210) may be formed as separate parts made of different materials and connected to each other.

As a result, the partition (230) separates/compartments the internal space of the settling portion (220) where the thin film deposition of the object to be treated (OB) is performed, thereby preventing interference between the multiple plasma areas (PA) formed in the internal space of each settling portion (220), thereby improving the precision and uniformity of the thin film formation of the object to be treated (OB) settled on each settling portion (220).

In addition, since the partition (230) separates/compartments the internal space of the mounting portion (220) where the target material of the target portion (320) is deposited on the surface of the object to be treated (OB), the partition (230) restricts the target material of each target portion (320) deposited on the object to be treated (OB) mounted on each mounting portion (220) from moving to the internal space of the adjacent mounting portion (220), thereby having the effect of accurately depositing the intended target material on the surface of the object to be treated (OB) onto the object to be treated (OB).

Referring to FIGS. 1 to 4 and 6 to 8, a sputtering unit (300) according to one embodiment of the present invention is disposed in an external housing (100) and forms a thin film on the surface of an object to be processed (OB), and may include a sputtering body (310), a target unit (320), and an opening/closing unit (330).

A plurality of sputtering sections (300) may be provided, and each of the plurality of sputtering sections (300) may be arranged along the inner circumference of the outer housing (100) facing the inner housing (200).

As an example, the sputtering section (300) may be formed to correspond to the number of settling sections (220), but is not limited thereto, and the number of sputtering sections (300) may be provided differently from the number of settling sections (220) depending on the type of thin film sequentially laminated on the object to be processed (OB).

In one embodiment, the sputtering portion (300) may be equiangularly arranged along the perimeter of the outer housing (100) with respect to the first virtual line (AX1).

As an example, the sputtering unit (300) can be inserted into an insertion hole (110h) formed in the outer housing body (110). In this case, one end of the sputtering unit (300) that generates a magnetic field and an electric field can be positioned to face the mounting unit (220), and the other end opposite to the one end can protrude outwardly from the outer housing body (110).

In one embodiment, the sputtering unit (300) can be detachably inserted into the insertion hole (110h), so that when repair/replacement of the sputtering unit (300) is required, the sputtering unit (300) can be easily separated from the insertion hole (110h).

Referring to FIG. 7, a sputtering body (310) according to one embodiment of the present invention can generate an electric field and a magnetic field, and thus, a gas such as argon (Ar) injected into the inside of the external housing body (110) can be dissociated by the electric field and the magnetic field to form a plasma region (PA).

In addition, the gas dissociated by the electric field and magnetic field can collide with the target portion (320) to release the target material from the target portion (320), and the released target material can be deposited on the surface of the object to be treated (OB), thereby forming a thin film on the surface of the object to be treated (OB).

The sputtering body (310) according to one embodiment of the present invention is applied to a conventional substrate processing device (1) in various structures, and therefore, a detailed description of the internal structure and operating principle of the sputtering body (310) is omitted.

Referring to FIGS. 2 to 4, a target portion (320) according to one embodiment of the present invention provides a target material as a material of a thin film formed on the surface of an object to be processed (OB), and may be placed adjacent to one end of a sputter body (310) facing the object to be processed (OB).

In one embodiment, the target portion (320) may be located on the inside of the insertion hole portion (110h), but is not limited thereto, and the target portion (320) may be located in various locations, such as on the inside of the mounting portion (220) or in the area between the mounting portion (220) and the inner surface of the outer housing body (110).

A plurality of target sections (320) may be provided to correspond to each of a plurality of sputter sections (300) formed along the circumferential direction of the outer housing body (110).

In one embodiment, the target portion (320) corresponding to each sputter portion (300) may be made of different materials.

Accordingly, as the inner housing body (210) rotates in a preset direction, the workpiece (OB) mounted on the mounting portion (220) can sequentially face the target portion (320) made of different target materials arranged in the circumferential direction of the outer housing body (110). Through this, the target materials emitted from the target portion (320) made of the different materials can be sequentially deposited on the surface of the workpiece (OB), so that a multi-layer thin film can be deposited on the surface of the workpiece (OB).

However, it is not limited to this, and the target material forming each target portion (320) corresponding to each sputter portion (300) may be made of various materials depending on the thickness of the thin film to be formed on the surface of the workpiece (OB), the type of the thin film, etc.

Referring to FIGS. 2 and 6, an opening/closing part (330) according to one embodiment of the present invention can selectively open/close an insertion hole (110h) and can be placed on one side of an outer housing body (110) where an insertion hole (110h) is formed.

As an example, the opening/closing portion (330) may be formed in the shape of a blade shutter that selectively opens and closes the insertion hole portion (110h) as a plurality of blades rotate in a preset direction.

In one embodiment, the opening/closing part (330) may be formed in the shape of an iron shutter that can selectively divide an area positioned with the mounting part (220) and an area positioned with the sputter body (310) by moving in one direction when power is applied from the outside.

Specifically, the above direction may be set as a circumferential direction (based on FIG. 2) or an up-down direction (based on FIG. 3) based on the first virtual line, but is not limited thereto.

In one embodiment, the opening/closing unit (220) may receive power from the driving unit (500) and move in a preset direction to connect/divide an area positioned with the settling unit (220) and an area positioned with the sputtering body (310), but is not limited thereto, and the opening/closing unit (220) may receive power from a driving device formed separately from the driving unit (500).

Specifically, the opening/closing unit (220) can be powered by a DC motor that can receive an electrical signal from the outside. As a result, when using a conventional pneumatic motor, the problem of difficulty in precisely controlling the compressibility of air in the opening/closing unit (220) or the need for a separate pneumatic device can be solved.

However, it is not limited thereto, and the opening/closing part (330) is located in an area adjacent to the sputtering part (300) facing the object to be treated (OB), and can be formed in various shapes within the technical concept of being able to selectively partition the area where the target part (320) is located and the area where the object to be treated (OB) is located.

Accordingly, when the deposition of the target material on one object to be processed (OB) is completed, when the inner housing body (210) rotates for surface treatment on another object to be processed (OB), or when the inner housing body (210) or the support member (400) is replaced, the release of the target material from the target part (320) to the inner housing (200) can be easily controlled by driving the opening/closing member (330) without having to turn the sputter body (310) on/off.

Referring to FIG. 4, a support member (400) according to one embodiment of the present invention supports a processing object (OB) and can be detachably placed on a fixing member (220).

Specifically, the support member (400) can be placed on one side of the mounting member (220) facing the sputter member (300), and can be inserted into the mounting member (220) by being guided along an insertion path by a guide member (221) placed on the one side of the mounting member (220).

As an example, the support member (400) may be formed in the shape of a flat plate, but is not limited thereto, and the support member (400) may be formed in various shapes that can support an object to be processed (OB), such as a curved plate, and can be inserted into a guide member (221) so as to be fixed in position on one side of the mounting member (220).

Accordingly, by removing the support member (400) from the fixing member (220), the workpiece (OB) that has completed the surface treatment process can be removed from the substrate treatment device (1), and by inserting the support member (400) to which the workpiece (OB) is attached into the fixing member (220) to perform surface treatment on a new workpiece (OB) in the substrate treatment device (1), there is an effect of facilitating the exchange of the workpiece (OB) in relation to the substrate treatment device (1).

In one embodiment, the support member (400) may be arranged to cover one surface of the mounting member (220) facing the sputtering member (300). This prevents the one surface of the mounting member (220) from being damaged by target material emitted from the plasma region (PA) or the target member (320), thereby improving the durability of the substrate processing device (1).

In one embodiment, the support member (400) may further include a support handle member (401), and the support handle member (401) may be formed to protrude on one side of the support member (400) so that the user can easily grip the support member (400).

As an optional embodiment, the support handle part (401) may be formed in the shape of a groove on one side of the support part (400), thereby making it easy for a user to move the support part (400) in a preset direction.

However, it is not limited thereto, and the support handle part (401) is connected to one side of the support part (400) and may be formed in various shapes such as a protrusion, a groove, or a ring to enable the user to easily apply force to the support part (400).

Accordingly, even if the support member (400) is attached in close contact with one side of the mounting member (220) or the guide member (221), the support member (400) can be easily separated from the mounting member (220) or the guide member (221) by the user applying force in a preset direction to the support handle member (401).

Referring to FIGS. 1, 3, and 8, a driving unit (500) according to one embodiment of the present invention can receive power from the outside and apply driving force to enable the shaft unit (150) or the internal housing (200) to rotate. The driving unit (500) is applied to various structures in conventional driving devices, and therefore, a detailed description of the internal configuration and operating principle of the driving unit (500) is omitted.

Referring to FIGS. 2, 3, 7, and 8, a pressure adjustment unit (600) according to one embodiment of the present invention can form an internal space of an external housing (100) where a surface treatment process of an object to be treated (OB) is performed into a low pressure or vacuum region (VA) by exhausting a fluid located in an internal space of an external housing (100) to the outside.

The conventional substrate processing device (1) had a problem in that a plurality of workpieces to be processed (OB) and a plurality of sputtering units (300) were accommodated in one chamber, and the amount of exhaust gas that the pressure adjusting unit (600) had to exhaust was excessively large.

In contrast, a substrate processing device (1) according to one embodiment of the present invention includes a chamber-shaped outer housing (100) and a drum-shaped inner housing (200) accommodated inside the chamber, so that the vacuum area (VA) is limited to the space between the inner surface of the outer housing (100) and the outer surface of the inner housing (200), thereby reducing the exhaust amount that the pressure adjusting unit (600) must exhaust, thereby solving the above-described problem. Through this, the capacity of the pump required to form the inner space of the outer housing (100) into a low-pressure or vacuum area (VA) can also be reduced, and further, the time required to form the inner space of the outer housing (100) into a low-pressure or vacuum area (VA) can also be shortened.

Referring to FIG. 5, a heating unit (700) according to one embodiment of the present invention can receive power from the outside and provide thermal energy to an object to be treated (OB). This has the effect of ensuring the uniformity of a thin film formed on the object to be treated (OB).

Referring to FIG. 5, a vibration unit (800) according to one embodiment of the present invention receives power from the outside and provides vibration energy to an object to be treated (OB), and may include a vibration generating unit, a vibration transmitting unit (820), and a separation unit (830).

In one embodiment, the vibration generating unit can generate vibration energy by receiving power from an external source.

In one embodiment, the vibration transmission unit (820) may be connected to the vibration generation unit and the object to be treated (OB), respectively. Specifically, the vibration transmission unit (820) may be directly connected to the vibration generation unit and may be indirectly connected to the object to be treated (OB) through the support unit (400), the inner housing body (210), and the transmission unit (900) described later.

As an example, the vibration transmitting unit (820) may be formed in the shape of a spring. However, it is not limited thereto, and the vibration transmitting unit (820) may be formed in various shapes capable of amplifying the vibration energy generated from the vibration generating unit.

In one embodiment, the separation unit (830) is connected to one side of the vibration generating unit to secure a separation distance between the vibration generating unit and the heating unit (700). As a result, there is an effect of minimizing the influence of the heating unit (700) on the vibration generating unit.

In one embodiment, the separation portion (830) may be made of an insulator.

Referring to FIG. 5, a transmission unit (900) according to one embodiment of the present invention is positioned adjacent to one surface of a support unit (400) or a mounting unit (220) in contact with the support unit (400), and can uniformly transmit thermal energy generated from a heating unit (700) to an object to be treated (OB).

In one embodiment, the transmission unit (900) may be formed of a ceramic heat sink, but is not limited thereto, and the transmission unit (900) may be formed of various materials having high thermal conductivity.

The idea of the present invention should not be limited to the embodiments described above, and not only the scope of the patent claims described below, but also all scopes equivalent to or equivalently modified from the scope of the patent claims are included in the scope of the idea of the present invention.

1: Substrate processing device OB: Workpiece to be processed
100: Outer housing 200: Inner housing
300: Sputtering part 400: Supporting part
500: Drive unit 600: Pressure control unit
700: Heating section 800: Vibration section
900: Transmission Department

Claims (10)

The outer housing forming the appearance;
An inner housing which is inserted into the interior of the outer housing so as to be able to rotate relative to the outer housing and includes a mounting portion on which a subject matter to be treated is mounted;
A sputtering unit disposed in the above outer housing and forming a thin film on the surface of a workpiece; and
It includes a driving unit that provides driving force so that the inner housing can rotate;
A substrate processing device, wherein the above-mentioned fixing portion is formed in the shape of a concave groove portion on the outer surface of the inner housing toward the center of the inner housing. In the first paragraph,
The above sputtering section is provided in multiple units,
A substrate processing device, wherein each of the plurality of sputtering sections is arranged along the inner peripheral surface of the outer housing facing the inner housing. In the second paragraph,
The above-mentioned anchoring member is provided in multiple numbers,
A substrate processing device, wherein the plurality of fixing portions are arranged along the outer peripheral surface of the inner housing facing the outer housing. In the third paragraph,
A substrate processing device, wherein a partition is formed on the outer surface of the inner housing to partition one of the mounting portions and adjacent mounting portions at a set interval. In the third paragraph,
A substrate processing device in which the inner housing is formed in a cylindrical shape and is rotatable about a first virtual line that is perpendicular to the ground. In clause 5,
A substrate processing device, wherein the above-mentioned fixing portion and the above-mentioned sputtering portion are arranged to face each other along a second virtual line perpendicular to the first virtual line. In the first paragraph,
A substrate processing device further comprising a support member that is detachably positioned on the above-described mounting member and supports the object to be processed. In Article 7,
The above support member is arranged on one side of the above fixing member facing the above sputtering member,
A substrate processing device in which a guide portion that guides the insertion path of the support portion is protrudingly formed on one side of the above-mentioned fixing portion In Article 7,
A substrate processing device further comprising a vibrating unit positioned on one side of the inner housing adjacent to the mounting unit and configured to vibrate the support unit. In the first paragraph,
A substrate processing device further comprising a rotation limiting member that limits the rotation range of the inner housing.

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