KR20240169415A - Heating unit and method for manufacturing the same - Google Patents

Abstract

The heat generating unit of the present invention comprises: a substrate formed from a thermoplastic resin composition containing 100 parts by weight of a polyaryletherketone resin and 1 to 20 parts by weight of an additive for laser direct structuring; and a plating layer formed on at least a portion of a surface of the substrate by a laser direct structuring process and a plating process, wherein the plating layer is a laminate of a copper plating layer and a nickel plating layer, and the plating layer has a cross-sectional thickness of 100 to 1,000 ㎛, and a cross-sectional thickness ratio of the copper plating layer and the nickel plating layer is 1:1 to 1:80. The heat generating unit has excellent heat generating performance, plating reliability, etc.

Description

HEATING UNIT AND METHOD FOR MANUFACTURING THE SAME

The present invention relates to a heating unit and a method for manufacturing the same. More specifically, the present invention relates to a heating unit having excellent heating performance, plating reliability, etc., and a method for manufacturing the same.

In order to plate a metal layer on at least a portion of the surface of a molded article formed from a thermoplastic resin composition, a laser direct structuring process (LDS process) can be used. The LDS process is a process performed before a plating step, which means a process in which a laser is irradiated on a plating target area of the surface of the molded article to modify the plating target area of the surface of the molded article so that the area has properties suitable for plating. To this end, the thermoplastic resin composition for manufacturing the molded article must contain a laser direct structuring additive (LDS additive) capable of forming a metal nucleus by a laser. The additive decomposes when exposed to a laser to generate a metal nucleus. In addition, the area irradiated with the laser has a roughened surface. Due to the metal nucleus and surface roughness, the area modified by the laser becomes suitable for plating.

An electronic cigarette is an atomizing device that forms vapor by heating and vaporizing a liquid, and includes a vaporizing unit for vaporizing the liquid. The vaporizing unit is a heating unit that generates heat and vaporizes the liquid when power is applied, and the vaporizing unit of an electronic cigarette is usually in the form of a metal coil such as copper wound around the inside or outside of a plastic cylinder. In the case of a vaporizing unit (heating coil unit) that uses a metal coil, the maximum temperature is about 250℃, and has an operating time of about 4 minutes, including a heating time of about 30 seconds to the maximum temperature.

Recently, research has begun on manufacturing a heating unit using a metal plating process that uses a laser direct structuring process rather than applying a metal coil. In order for a heating unit manufactured using a plating process to be used as a heating unit for electronic cigarettes, etc., it must have excellent heating performance, such as a time of less than 100 seconds to reach 150℃, and excellent plating reliability, etc.

Therefore, there is a need to develop a heating unit with excellent heating performance, plating reliability, etc., and a method for manufacturing the same.

The background technology of the present invention is disclosed in Korean Patent Publication No. 10-2011-0018319, etc.

The purpose of the present invention is to provide a heating unit having excellent heating performance, plating reliability, etc.

Another object of the present invention is to provide a method for manufacturing the heating unit.

The above and other objects of the present invention can all be achieved by the present invention described below.

1. One aspect of the present invention relates to a heat generating unit. The heat generating unit comprises: a substrate formed from a thermoplastic resin composition comprising 100 parts by weight of a polyaryletherketone resin and 1 to 20 parts by weight of an additive for laser direct structuring; and a plating layer formed on at least a portion of a surface of the substrate by a laser direct structuring process and a plating process, wherein the plating layer is a laminate of a copper plating layer and a nickel plating layer, and the plating layer has a cross-sectional thickness of 100 to 1,000 ㎛, and a cross-sectional thickness ratio of the copper plating layer and the nickel plating layer is 1:1 to 1:80.

2. In the above 1 specific example, the polyaryl ether ketone resin may include a repeating unit represented by the following chemical formula 1.

[Chemical Formula 1]

3. In the above specific examples 1 or 2, the polyaryl ether ketone resin may have a melt viscosity of 50 to 500 Pa·s as measured by a capillary viscometer under conditions of a temperature of 400° C. and a shear rate of 1000 sec ^-1 according to ASTM D3835.

4. In the above specific examples 1 to 3, the additive for laser direct structuring may include at least one of a heavy metal complex oxide spinel and a copper salt.

5. In the above specific examples 1 to 4, the plating process may include a copper electroless plating step, a copper electrolytic plating step, and a nickel electrolytic plating step.

6. In the above 1 to 5 specific examples, the plating process may include a nickel electroless plating step, a nickel electrolytic plating step, and a copper electrolytic plating step.

7. In the above specific examples 1 to 6, the plating layer may have a maximum temperature of 200 to 300°C as measured by a thermal imaging camera when supplied with 20 A current and 10 V voltage.

8. In the above specific examples 1 to 7, the time taken for the plating layer to reach 150° C., as measured by a thermal imaging camera, after supplying 20 A current and 10 V voltage, is 1 to 100 seconds.

9. In the above 1 to 8 specific examples, the thermoplastic resin composition is aged at 25°C for 6 hours on an injection-molded specimen having a size of 50 mm × 90 mm × 3.2 mm, then the surface of the specimen is activated in a stripe shape through a laser direct structuring process, and the plating layer is formed on the activated surface through a plating process, and then the plated specimen is left in a chamber under conditions of 85°C and 85% RH for 72 hours, and 100 grids having a size of 1 mm × 1 mm are imprinted on the plating layer, and then the number of grids that are not peeled off when the specimen is removed with tape may be 90 to 100.

10. In the above specific examples 1 to 9, the thermoplastic resin composition is aged at 25°C for 6 hours on an injection-molded specimen having a size of 50 mm × 90 mm × 3.2 mm, then the surface of the specimen is activated in a stripe shape through a laser direct structuring process, and the plating layer is formed on the activated surface through a plating process, and then the plated specimen is left in a chamber under 250°C conditions for 200 hours, and 100 grids having a size of 1 mm × 1 mm are imprinted on the plating layer (copper layer), and then the number of grids that are not peeled off when the specimen is removed with tape may be 90 to 100.

11. Another aspect of the present invention relates to a method for manufacturing a heating unit. The method comprises the steps of: manufacturing a substrate from a thermoplastic resin composition comprising 100 parts by weight of a polyaryletherketone resin and 1 to 20 parts by weight of an additive for laser direct structuring; irradiating a laser on at least a portion of a surface area of the substrate; electrolessly plating copper or nickel on the area irradiated with the laser; electrolytically plating copper or nickel on the electroless-plated plating layer of copper or nickel; and electrolytically plating nickel or copper on the electrolytically-plated plating layer of copper or nickel to form a plating layer; wherein the plating layer is a laminate of a copper plating layer and a nickel plating layer, and the plating layer has a cross-sectional thickness of 100 to 1,000 ㎛, and a cross-sectional thickness ratio of the copper plating layer and the nickel plating layer is 1:1 to 1:80.

12. In the above 11 specific examples, the substrate may be manufactured by injection molding the thermoplastic resin composition using an injection molding machine under conditions of a molding temperature of 380 to 480°C and a mold temperature of 50 to 200°C.

13. In the above 11 or 12 specific examples, the wavelength of the laser can be 248 nm, 308 nm, 355 nm, 532 nm, 1,064 nm or 10,600 nm.

14. In embodiments 11 to 13, the electroless plating of copper can be performed in an electroless copper plating solution at 55°C for 10 to 40 minutes, and the electroless plating of nickel can be performed in an electroless nickel plating solution at 50°C for 10 to 40 minutes.

15. In embodiments 11 to 14, the electrolytic plating of copper can be performed at a current density of 10 A/dm ² for 1 to 3,000 minutes, and the electrolytic plating of nickel can be performed at a current density of 5 A/dm ² for 1 to 3,000 minutes.

The present invention has the effect of providing a heating unit having excellent heating performance, plating reliability, etc., and a method for manufacturing the same.

Figure 1 schematically illustrates a heating unit according to one specific example of the present invention.

Hereinafter, the present invention will be described in detail as follows.

A heating unit according to the present invention comprises (A) a substrate formed from a thermoplastic resin composition; and (B) a plating layer.

In this specification, “a to b” indicating a numerical range is defined as “≥a and ≤b”.

(A) Substrate

According to one specific example of the present invention, a substrate is formed from a thermoplastic resin composition for a laser direct structuring process (LDS process), wherein the thermoplastic resin composition comprises (a) a polyaryletherketone resin and (b) an additive for laser direct structuring.

(a) polyaryl ether ketone resin

A polyaryl ether ketone resin according to one specific example of the present invention can improve the plating reliability, heat resistance, etc. of a heat generating unit, and a polyaryl ether ketone resin used in a conventional thermoplastic resin composition can be used.

In a specific example, a polyaryl ether ketone resin (such as a polyether ether ketone resin) containing a repeating unit represented by the following chemical formula 1 can be used.

[Chemical Formula 1]

In a specific example, the polyaryl ether ketone resin may have a melt viscosity of 50 to 500 Pa·s, for example, 100 to 400 Pa·s, as measured by a capillary viscometer under conditions of a temperature of 400° C. and ^a shear rate of 1000 sec -1 according to ASTM D3835. In the above range, the plating reliability, heat resistance, etc. of the heating unit may be excellent.

(b) Additives for laser direct structuring

An additive for laser direct structuring (LDS) according to one specific example of the present invention is capable of forming a metal nucleus by a laser, and an additive for laser direct structuring used in a typical resin composition for laser direct structuring can be used. Here, the laser means light amplified by stimulated emission (stimulated emission light), and the laser can be ultraviolet light having a wavelength of 100 to 400 nm, visible light having a wavelength of 400 to 800 nm, or infrared light having a wavelength of 800 to 25,000 nm, and for example, infrared light having a wavelength of 1,000 to 2,000 nm.

In specific examples, the additive for laser direct structuring may include a heavy metal mixture oxide spinel and/or a copper salt.

In specific examples, the heavy metal composite oxide spinel may include magnesium aluminum oxide (MgAl ₂ O ₄ ), zinc aluminum oxide (ZnAl ₂ O ₄ ), iron aluminum oxide (FeAl ₂ O ₄ ), copper iron oxide (CuFe ₂ O ₄ ), copper chromium oxide (CuCr ₂ O ₄ ), manganese iron oxide (MnFe ₂ O ₄ ), nickel iron oxide (NiFe ₂ O ₄ ), titanium iron oxide (TiFe ₂ O ₄ ), iron chromium oxide (FeCr ₂ O ₄ ), magnesium chromium oxide (MgCr ₂ O ₄ ), and combinations thereof. For example, copper chromium oxide (CuCr ₂ O ₄ ) can be used. Since the copper chromium oxide (CuCr ₂ O ₄ ) has a dark color, it can be applied when the color required for the final molded product is a dark color such as black or gray.

In specific examples, examples of the copper salt include, but are not limited to, copper hydroxide phosphate, copper phosphate, copper sulfate, cuprous thiocyanate, and combinations thereof. For example, copper hydroxide phosphate can be used. The copper hydroxide phosphate is a compound in which copper phosphate and copper hydroxide are combined, and may be specifically Cu ₃ (PO ₄ ) ₂ ·2Cu(OH) ₂ , Cu ₃ (PO ₄ ) ₂ ·Cu(OH) ₂ , etc. The copper hydroxide phosphate does not lower the color reproducibility of an additionally added coloring agent, so that a molded product of a desired color can be easily obtained.

In a specific example, the additive for laser direct structuring may have an average particle diameter of 0.01 to 50 ㎛, for example, 0.1 to 30 ㎛, specifically 0.5 to 10 ㎛. In the above range, a plating surface can be uniformly formed during plating through laser direct structuring. In the present invention, unless otherwise specified, the average particle diameter is a number average diameter, and means the diameter measured by D50 (the particle diameter at the point where the distribution ratio is 50%).

In a specific example, the additive for laser direct structuring may be included in an amount of 1 to 20 parts by weight, for example, 5 to 15 parts by weight, based on 100 parts by weight of the polyaryl ether ketone resin. If the content of the additive for laser direct structuring is less than 1 part by weight based on 100 parts by weight of the polyaryl ether ketone resin, when the thermoplastic resin composition (substrate) is irradiated with a laser, a sufficient amount of metal nuclei may not be formed for plating, which may result in failure of plating or deterioration of plating reliability, etc., and if it exceeds 20 parts by weight, there is a concern that the plating reliability, mechanical properties, etc. of the thermoplastic resin composition (substrate) may deteriorate.

The thermoplastic resin composition according to one specific example of the present invention may further include additives included in conventional thermoplastic resin compositions. Examples of the additives include, but are not limited to, inorganic fillers, flame retardants, anti-dripping agents, lubricants, nucleating agents, stabilizers, release agents, pigments, dyes, and mixtures thereof. When the additives are used, the content thereof may be 0.001 to 40 parts by weight, for example, 0.1 to 10 parts by weight, based on 100 parts by weight of the polyaryl ether ketone resin.

A thermoplastic resin composition according to one specific example of the present invention may be in the form of pellets obtained by mixing the above components and melt-extruding them at 360 to 420°C, for example, 380 to 410°C, using a conventional twin-screw extruder.

In a specific example, the thermoplastic resin composition is aged at 25°C for 6 hours on an injection-molded specimen measuring 50 mm × 90 mm × 3.2 mm, then the surface of the specimen is activated in a stripe shape through a laser direct structuring process, and the plating layer is formed on the activated surface through a plating process, and the plated specimen is left in a chamber under conditions of 85°C and 85% RH for 72 hours, and 100 grid lines measuring 1 mm × 1 mm are imprinted on the plating layer (copper layer), and then the number of grid lines that are not peeled off when the specimen is removed with tape may be 90 to 100.

In a specific example, the thermoplastic resin composition is aged at 25°C for 6 hours on an injection-molded specimen measuring 50 mm × 90 mm × 3.2 mm, then the surface of the specimen is activated in a stripe shape through a laser direct structuring process, and the plating layer is formed on the activated surface through a plating process, and the plated specimen is left in a chamber under 250°C conditions for 200 hours, and 100 grids measuring 1 mm × 1 mm are imprinted on the plating layer (copper layer), and then the number of grids that are not peeled off when the specimen is removed with tape may be 90 to 100.

A substrate according to one specific example of the present invention is formed from the thermoplastic resin composition. For example, a molded product can be manufactured using the thermoplastic resin composition by a molding method such as injection molding, compression molding, blow molding, or extrusion molding. The substrate can be easily formed by a person having ordinary knowledge in the field to which the present invention belongs.

(B) Plating layer

According to one specific example of the present invention, a plating layer is formed on at least a portion of a surface area of the substrate by a laser direct structuring process and a plating process, and is a layered structure in which a copper plating layer and a nickel plating layer are laminated. The plating layer may have a cross-sectional thickness of 100 to 1,000 ㎛, and a cross-sectional thickness ratio of the copper plating layer and the nickel plating layer may be 1:1 to 1:80.

In a specific example, the plating process may include a copper electroless plating step, a copper electrolytic plating step, and a nickel electrolytic plating step. In this case, a plating layer in the form of a copper plating layer and a nickel plating layer sequentially laminated on a portion of the substrate surface can be obtained.

In a specific example, the plating process may include a nickel electroless plating step, a nickel electrolytic plating step, and a copper electrolytic plating step. In this case, a plating layer in the form of a nickel plating layer and a copper plating layer sequentially laminated on a portion of the substrate surface can be obtained.

In a specific example, the plating layer may have a thickness of 100 to 1,000 ㎛, for example, 100 to 700 ㎛, as measured in a cross-section by SEM/EDS (scanning electron microscope/energy dispersive spectroscopy). If the thickness of the cross-section of the plating layer is less than 100 ㎛, there is a concern that plating reliability, etc. may deteriorate, and if it exceeds 1,000 ㎛, there is a concern that heat generation performance, etc. may deteriorate.

In a specific example, the plating layer may have a cross-sectional thickness ratio (copper plating layer:nickel plating layer) of the copper plating layer and the nickel plating layer as measured by SEM/EDS (scanning electron microscope/energy dispersive spectroscopy) of 1:1 to 1:80, for example, 1:1.1 to 1:50. When the cross-sectional thickness ratio of the plating layers is less than 1:1, there is a concern that heat generation performance, plating reliability, etc. may deteriorate, and when it exceeds 1:80, there is a concern that heat generation performance, etc. may deteriorate.

In a specific example, the plating layer may have a maximum temperature of 200 to 300°C, for example, 230 to 280°C, as measured by a thermal imaging camera when supplied with 20 A current and 10 V voltage.

In a specific example, the plating layer may have a time to reach a temperature of 150° C. as measured by a thermal imaging camera of 1 to 100 seconds, for example, 5 to 60 seconds, after being supplied with a current of 20 A and a voltage of 10 V.

A heating unit according to one specific example of the present invention includes the substrate and the plating layer, and thus has excellent heating performance, plating reliability, etc., and thus can be used as a vaporizing unit (heating unit) of an electronic cigarette, an induction internal circuit, etc. In particular, when the heating unit is used as a vaporizing unit of an electronic cigarette, the shape of the substrate may be cylindrical, and the plating layer may be formed in a coil-like pattern on the inside or outside of the cylindrical substrate.

FIG. 1 schematically illustrates a heat generating unit according to one embodiment of the present invention. The sizes of components constituting the invention in the drawing are exaggerated for clarity of the specification and are not limited thereto. As illustrated in FIG. 1, a heat generating unit (10) according to one embodiment of the present invention may include a substrate (20); and a plating layer (30) formed on at least a portion of the surface of the substrate (20) by a laser direct structuring process and a plating process.

A heat generating unit (10) according to one specific example of the present invention can be manufactured by a manufacturing method including the steps of: manufacturing a substrate (20) from the thermoplastic resin composition; irradiating a laser to at least a portion of a surface area (a plating layer (30) area) of the substrate (20); electrolessly plating copper or nickel on the area irradiated with the laser; electrolytically plating copper or nickel on the electroless-plated plating layer of copper or nickel; and electrolytically plating nickel or copper on the electrolytically-plated plating layer of copper or nickel to form a plating layer (30).

In a specific example, the substrate (20) may be manufactured by injection molding the thermoplastic resin composition using an injection molding machine under conditions of a molding temperature of 380 to 480° C. and a mold temperature of 50 to 200° C.

In a specific example, the additive for laser direct structuring included in the substrate (20) is decomposed by the laser irradiation to generate metal nuclei. In addition, the area irradiated with the laser (the area of the plating layer (30)) has a surface roughness suitable for plating. The wavelength of the laser may be 248 nm, 308 nm, 355 nm, 532 nm, 1,064 nm, or 10,600 nm.

In a specific example, the electroless plating (metallization) process of the copper or nickel may be performed through a conventional electroless plating process. For example, a copper or nickel electroless plating layer may be formed on a laser-irradiated area (plating layer (30) area) of a surface of a substrate (20) by immersing the substrate (20) irradiated with a laser in one or more electroless plating baths.

In a specific example, the electrolytic plating (metallization) process of the copper or nickel and the electrolytic plating process of the nickel or copper may be performed through a conventional electrolytic plating process. For example, the substrate (20) on which copper or nickel is electrolessly plated may be immersed in one or more electrolytic plating tanks, copper or nickel may be electroplated on the electroless plating layer of copper or nickel, and then nickel or copper may be electroplated on the electrolytic plating layer of copper or nickel, so as to finally form the plating layer (30) on the laser-irradiated area of the surface of the substrate (20).

In a specific example, the electroless plating of copper can be performed in an electroless copper plating solution (such as Circuposit 4500) at 55°C for 10 to 40 minutes, and the electroless plating of nickel can be performed in an electroless nickel plating solution (such as Ronamax SMT-115) at 50°C for 10 to 40 minutes.

In a specific example, the electrolytic plating of copper can be performed at a current density of 10 A/dm ² for 1 to 3,000 minutes, and the electrolytic plating of nickel can be performed at a current density of 5 A/dm ² for 1 to 3,000 minutes. In the above range, a plating layer having a desired overall cross-sectional thickness of the plating layer and a cross-sectional thickness ratio of the copper plating layer and the nickel plating layer can be formed.

In this way, the heating unit (10) in which a plating layer (30) is formed on at least a portion of the surface of the substrate (20) by a laser direct structuring process can be easily formed by a person having ordinary knowledge in the field to which the present invention belongs.

Hereinafter, the present invention will be described more specifically through examples; however, these examples are for the purpose of explanation only and should not be construed as limiting the present invention.

Example

Below, the specifications of each component used in the examples and comparative examples are as follows.

(A) Polyaryl ether ketone resin

(A1) Polyether ether ketone resin (manufacturer: Victrex, product name: 150G, melt viscosity: 130 Pa·s) was used.

(A2) Polyether ether ketone resin (manufacturer: Victrex, product name: 450G, melt viscosity: 350 Pa·s) was used.

(B) Additives for laser direct structuring

(B1) Copper hydroxide phosphate (Manufacturer: Merck performance materials, product name: Iriotec ^® 8840) was used.

(B2) Copper chromium oxide (CuCr ₂ O ₄ , manufacturer: SHEPHERD, product name: Black 1G) was used.

Examples 1 to 3 and Comparative Examples 1 to 5

After adding each of the above components in the contents as described in Tables 1 and 2 below, thermoplastic resin composition pellets were manufactured by extrusion at 380°C. The extrusion was performed using a twin-screw extruder with L/D=36 and a diameter of 36 mm, and the manufactured pellets were dried at 100°C for 4 hours or more and then injected using a 10 Oz injection molding machine (molding temperature: 400°C, mold temperature: 150°C) to manufacture substrate specimens. Next, copper and/or nickel plating layers were formed as described in Tables 1 and 2 below, to manufacture heating unit specimens. Here, the electroless plating of copper (Examples 1 to 3 and Comparative Examples 1 to 4) was performed in an electroless copper plating solution (Circuposit 4500) at 55°C for 10 to 40 minutes, and the electroless plating of nickel (Comparative Example 5) was performed in an electroless nickel plating solution (Ronamax SMT-115) at 50°C for 10 to 40 minutes. In addition, the electrolytic plating of copper (Examples 1 to 3 and Comparative Examples 1 to 4) was performed at a current density of 10 A/dm ² for 1 to 3,000 minutes, and the electrolytic plating of nickel (Examples 1 to 3 and Comparative Examples 2 to 5) was performed at a current density of 5 A/dm ² for 1 to 3,000 minutes. The physical properties of the manufactured heating unit specimens were evaluated by the following methods, and the results are shown in Tables 1 and 2 below.

Method of measuring physical properties

(1) Maximum temperature of the plating layer: After supplying 20 A current and 10 V voltage to the plating layer of the heating unit specimens manufactured in the examples and comparative examples, the maximum temperature (unit: ℃) of the plating layer was measured using a thermal imaging camera (manufacturer: FLIR, device name: T335).

(2) Time until the plating layer reaches 150°C: After supplying 20 A current and 10 V voltage to the plating layer of the heating unit specimens manufactured in the examples and comparative examples, the time (unit: seconds) until the temperature of the plating layer reaches 150°C was measured using a thermal imaging camera (manufacturer: FLIR, device name: T335).

(3) Evaluation of high-humidity plating reliability: After aging a 50 mm × 90 mm × 3.2 mm injection-molded specimen (substrate specimen) at 25°C for 6 hours, the surface of the specimen was activated in a stripe shape through a laser direct structuring process, and copper and/or nickel plating layers were formed as described in Tables 1 and 2 below. The plated specimen was then left in a chamber under conditions of 85°C and 85% RH for 72 hours, and 100 grid lines with a size of 1 mm × 1 mm were imprinted on the plating layer (copper layer), and the number of grid lines that were not peeled off when removed with tape was measured.

(4) Evaluation of high-temperature plating reliability: After aging a 50 mm × 90 mm × 3.2 mm injection-molded specimen at 25°C for 6 hours, the surface of the specimen was activated in a stripe shape through a laser direct structuring process, and copper and/or nickel plating layers were formed as described in Tables 1 and 2 below. The plated specimen was then left in a chamber at 250°C for 200 hours, and 100 grids with a size of 1 mm × 1 mm were engraved on the plating layer (copper layer), and the number of grids that were not peeled off when removed with tape was measured.

Example 1 2 3 (A1) (Weight) 100 100 - (A2) (Weight) - - 100 (B1) (Weight) 10 - 10 (B2) (Weight) - 10 - Copper plating layer cross-sectional thickness (㎛) 13 15 257 Nickel plating layer cross-sectional thickness (㎛) 95 531 341 Total thickness of plating layer cross section (㎛) 108 546 598 Sectional thickness ratio (copper:nickel) 1:7.3 1:35.4 1:1.3 Maximum temperature (℃) 271 247 257 Time to reach 150℃ (sec) 10 35 18 High humidity plating reliability (pcs) 97 96 98 High temperature plating reliability (pcs) 98 95 97

Comparative example 1 2 3 4 5 (A1) (Weight) 100 100 100 100 - (A2) (Weight) - - - - 100 (B1) (Weight) 10 10 15 - 10 (B2) (Weight) - - - 10 - Copper plating layer cross-sectional thickness (㎛) 1,052 11 321 13 - Nickel plating layer cross-sectional thickness (㎛) - 1,096 258 51 431 Total thickness of plating layer cross section (㎛) 1,052 1,107 579 64 431 Sectional thickness ratio (copper:nickel) - 1:99.6 1:0.8 1:3.9 - Maximum temperature (℃) 163 174 184 211 231 Time to reach 150℃ (sec) 304 258 191 60 87 High humidity plating reliability (pcs) 95 94 64 75 55 High temperature plating reliability (pcs) 95 97 75 71 64

From the above results, it can be seen that the heating unit of the present invention has excellent heating performance (maximum temperature, time to reach 150°C), high humidity and high temperature plating reliability, etc.

On the other hand, in the case of Comparative Example 1 where a nickel plating layer is not applied and the thickness of the cross-section of the plating layer exceeds the range of the present invention, it can be seen that the heat generation performance, etc. are deteriorated, and in the case of Comparative Example 2 where the thickness of the cross-section of the plating layer exceeds the range of the present invention and the cross-section thickness ratio of the copper plating layer and the nickel plating layer exceeds the range of the present invention, it can be seen that the heat generation performance, etc. are deteriorated. In addition, in the case of Comparative Example 3 where the cross-section thickness ratio of the copper plating layer and the nickel plating layer is less than the range of the present invention, it can be seen that the heat generation performance, high-humidity and high-temperature plating reliability, etc. are deteriorated, and in the case of Comparative Example 4 where the thickness of the cross-section of the plating layer is less than the range of the present invention, it can be seen that the high-humidity and high-temperature plating reliability, etc. are deteriorated, and in the case of Comparative Example 5 where a copper plating layer is not applied, it can be seen that the high-humidity and high-temperature plating reliability, etc. are deteriorated.

The present invention has been described with reference to embodiments. Those skilled in the art will understand that the present invention can be implemented in modified forms without departing from the essential characteristics of the present invention. Therefore, the disclosed embodiments should be considered from an illustrative rather than a restrictive perspective. The scope of the present invention is indicated by the claims, not the foregoing description, and all differences within the scope equivalent thereto should be interpreted as being included in the present invention.

Claims (15)

A substrate formed from a thermoplastic resin composition comprising 100 parts by weight of a polyaryl ether ketone resin and 1 to 20 parts by weight of an additive for laser direct structuring; and
A plating layer formed by a laser direct structuring process and a plating process on at least a portion of the surface of the substrate;
The above plating layer is a laminate of a copper plating layer and a nickel plating layer.
The above plating layer has a cross-sectional thickness of 100 to 1,000 ㎛,
A heating unit characterized in that the cross-sectional thickness ratio of the copper plating layer and the nickel plating layer is 1:1 to 1:80.
A heat generating unit in claim 1, characterized in that the polyaryl ether ketone resin includes a repeating unit represented by the following chemical formula 1.
[Chemical Formula 1]

In the first paragraph, the polyaryl ether ketone resin is a heat generating unit characterized in that the melt viscosity, as measured by a capillary viscometer under conditions of 400° C. and 1000 sec ^-1 shear rate according to ASTM D3835, is 50 to 500 Pa·s.
A heating unit according to claim 1, characterized in that the additive for laser direct structuring comprises at least one of a heavy metal complex oxide spinel and a copper salt.
A heating unit according to claim 1, characterized in that the plating process includes a copper electroless plating step, a copper electrolytic plating step, and a nickel electrolytic plating step.
A heating unit according to claim 1, characterized in that the plating process includes a nickel electroless plating step, a nickel electrolytic plating step, and a copper electrolytic plating step.
In the first paragraph, the heat generating unit is characterized in that the plating layer has a maximum temperature of 200 to 300°C as measured by a thermal imaging camera when 20 A current and 10 V voltage are supplied.
In the first paragraph, the heat generating unit is characterized in that the time taken for the plating layer to reach 150°C as measured by a thermal imaging camera is 1 to 100 seconds after supplying 20 A current and 10 V voltage.
In the first paragraph, the thermoplastic resin composition is a heating unit characterized in that after an injection-molded specimen measuring 50 mm × 90 mm × 3.2 mm is aged at 25°C for 6 hours, the surface of the specimen is activated in a stripe shape through a laser direct structuring process, and the plating layer is formed on the activated surface through a plating process, the plated specimen is left in a chamber under conditions of 85°C and 85% RH for 72 hours, and 100 grids measuring 1 mm × 1 mm are imprinted on the plating layer, and then the number of grids that are not peeled off when the tape is removed is 90 to 100.
In the first paragraph, the thermoplastic resin composition is a heating unit characterized in that after an injection-molded specimen measuring 50 mm × 90 mm × 3.2 mm is aged at 25°C for 6 hours, the surface of the specimen is activated in a stripe shape through a laser direct structuring process, and the plating layer is formed on the activated surface through a plating process, the plated specimen is left in a chamber under 250°C conditions for 200 hours, and 100 grids measuring 1 mm × 1 mm are imprinted on the plating layer (copper layer), and then the number of grids that are not peeled off when the specimen is removed with tape is 90 to 100.
A substrate is prepared from a thermoplastic resin composition comprising 100 parts by weight of a polyaryletherketone resin and 1 to 20 parts by weight of an additive for laser direct structuring;
Irradiating a laser to at least a portion of a surface area of the substrate;
Electroless plating of copper or nickel on the laser-irradiated area;
Electrolytic plating of copper or nickel on a layer of electroless plating of copper or nickel; and
A step of forming a plating layer by electrolytically plating nickel or copper on a plating layer on which copper or nickel is electrolytically plated;
The above plating layer is a laminate of a copper plating layer and a nickel plating layer.
The above plating layer has a cross-sectional thickness of 100 to 1,000 ㎛,
A method for manufacturing a heating unit, characterized in that the cross-sectional thickness ratio of the copper plating layer and the nickel plating layer is 1:1 to 1:80.
A method for manufacturing a heating unit in claim 11, characterized in that the substrate is manufactured by injection molding the thermoplastic resin composition using an injection molding machine under conditions of a molding temperature of 380 to 480°C and a mold temperature of 50 to 200°C.
A method for manufacturing a heating unit, characterized in that in claim 11, the wavelength of the laser is 248 nm, 308 nm, 355 nm, 532 nm, 1,064 nm or 10,600 nm.
A method for manufacturing a heating unit, characterized in that in claim 11, the electroless plating of copper is performed in an electroless copper plating solution at 55°C for 10 to 40 minutes, and the electroless plating of nickel is performed in an electroless nickel plating solution at 50°C for 10 to 40 minutes.
A method for manufacturing a heat generating unit, characterized in that in claim 11, the electrolytic plating of copper is performed at a current density of 10 A/dm ² for 1 to 3,000 minutes, and the electrolytic plating of nickel is performed at a current density of 5 A/dm ² for 1 to 3,000 minutes.