KR20240166871A - Elastic member and electronic device including the elastic member - Google Patents

Abstract

The present disclosure relates to an electronic device. An electronic device according to one embodiment of the present disclosure may include a support member including a mounting portion in which a battery is placed and a mounting portion formed such that a mounting member is inserted at a location spaced from the mounting portion; a mounting body including a buffer portion having at least a portion surrounding the battery and a hole formed through which the mounting member passes; and an elastic member disposed at least a portion surrounding the mounting member within the hole.

Description

{ELASTIC MEMBER AND ELECTRONIC DEVICE INCLUDING THE ELASTIC MEMBER}

Various embodiments disclosed in this document relate to electronic devices, for example, to elastic members and electronic devices including the same.

Thanks to the remarkable development of information and communication technology and semiconductor technology, the distribution and use of various electronic devices are rapidly increasing. Recent electronic devices are being developed to be portable and communicate.

An electronic device may refer to a device that performs a specific function according to a program installed in it, such as a home appliance, an electronic notebook, a portable multimedia player, a mobile communication terminal, a tablet PC, an audio/video device, a desktop/laptop computer, or a car navigation system. For example, these electronic devices can output stored information as audio or video. As the integration of electronic devices increases and ultra-high-speed, large-capacity wireless communication becomes widespread, various functions can be installed in a single electronic device, such as a mobile communication terminal, recently. For example, not only a communication function, but also an entertainment function such as a game, a multimedia function such as music/video playback, a communication and security function such as mobile banking, or a schedule management or electronic wallet function are being integrated into a single electronic device. These electronic devices are being miniaturized so that users can conveniently carry them.

An electronic device according to one embodiment of the present disclosure includes a support member including a mounting member in which a battery is placed and a mounting member formed such that a mounting member is inserted at a location spaced from the mounting member; a mounting body including a buffer member in which at least a portion surrounds the battery and a hole through which the mounting member passes is formed; and an elastic member disposed at least a portion of which surrounds the mounting member within the hole.

An electronic device according to one embodiment of the present disclosure comprises: a support member including a mounting member on which a battery is placed, and a mounting member formed such that a mounting member is inserted at a position spaced from the mounting member; a mounting body including a buffer member having a hole formed so as to penetrate the battery at least partially and a hole through which the mounting member passes; and an elastic member disposed within the hole so as to surround the mounting member at least partially, wherein the hole includes a first hole region in which a first gap is formed between an outer surface of the mounting member and the buffer member; and a second hole region in which a second gap is formed between an outer surface of the mounting member and the buffer member, the second gap being larger than the first gap and in which the elastic member is positioned.

FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.
FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment of the present disclosure.
FIG. 3 is a perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.
FIG. 4 is an exploded perspective view showing the front side of an electronic device according to one embodiment of the present disclosure.
FIG. 5 is an exploded perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.
FIG. 6A is a portion of an electronic device with a bonding body removed, according to one embodiment of the present disclosure.
FIG. 6b is a part of an electronic device with a coupled body mounted thereon according to one embodiment of the present disclosure.
Figure 7a is a cross-sectional view taken along line A-A' shown in Figure 6b.
Figure 7b is a cross-sectional view taken along line A-A' shown in Figure 6b.
FIG. 8 is a cross-sectional view of an electronic device according to one embodiment of the present disclosure with some of its components removed.
FIG. 9A is a cross-sectional view of an electronic device according to one embodiment of the present disclosure with some of its components removed.
Figure 9b is a drawing of the structure shown in Figure 9a viewed obliquely.
FIG. 10 is a cross-sectional view of a portion of an electronic device according to one embodiment of the present disclosure.

FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

The processor (120) may control at least one other component (e.g., a hardware or software component) of an electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store result data in a nonvolatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

The auxiliary processor (123) may control at least a portion of functions or states associated with at least one of the components of the electronic device (101) (e.g., the display module (160), the sensor module (176), or the communication module (190)), for example, while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing device) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. Such learning may be performed, for example, in the electronic device (101) itself on which the artificial intelligence model is executed, or may be performed through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers. The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-networks, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may additionally or alternatively include a software structure.

The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or nonvolatile memory (134).

The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

The audio output module (155) can output an audio signal to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive an incoming call. According to one embodiment, the receiver can be implemented separately from the speaker or as a part thereof.

The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) can include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) can include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can obtain sound through an input module (150), or output sound through an audio output module (155), or an external electronic device (e.g., an electronic device (102)) (e.g., a speaker or a headphone) directly or wirelessly connected to the electronic device (101).

The sensor module (176) can detect an operating state (e.g., power or temperature) of the electronic device (101) or an external environmental state (e.g., user state) and generate an electric signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., the electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that a user can perceive through a tactile or kinesthetic sense. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module (180) can capture still images and moving images. According to one embodiment, the camera module (180) can include one or more lenses, image sensors, image signal processors, or flashes.

The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery (189) can power at least one component of the electronic device (101). In one embodiment, the battery (189) can include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

The communication module (190) may support establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., the electronic device (102), the electronic device (104), or the server (108)), and performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., the application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module or a power line communication module). Among these communication modules, a corresponding communication module may communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196) to identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199).

The wireless communication module (192) can support a 5G network and next-generation communication technology after a 4G network, for example, NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), terminal power minimization and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) may support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) may support various requirements specified in an electronic device (101), an external electronic device (e.g., an electronic device (104)), or a network system (e.g., a second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL) each, or 1 ms or less for round trip) for URLLC realization.

The antenna module (197) may transmit or receive signals or power to or from the outside (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). The signal or power may be transmitted or received between the communication module (190) and the external electronic device through the at least one selected antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC positioned on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) positioned on or adjacent a second side (e.g., a top side or a side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

At least some of the above components may be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, a general purpose input and output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)).

In one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). In one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of executing the function or service itself or in addition, request one or more external electronic devices to perform at least a part of the function or service. One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as it is or additionally and provide it as at least a part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide an ultra-low latency service by using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an IoT (Internet of Things) device. The server (108) may be an intelligent server using machine learning and/or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199). The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

The electronic devices according to various embodiments disclosed in this document may be devices of various forms. The electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliance devices. The electronic devices according to embodiments of this document are not limited to the above-described devices.

It should be understood that the various embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly dictates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first) is referred to as "coupled" or "connected" to another (e.g., a second) component, with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

The term "module" used in various embodiments of this document may include a unit implemented in hardware, software or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be an integrally configured component or a minimum unit of the component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the called at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, ‘non-transitory’ simply means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded between a seller and a buyer as a commodity. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play StoreTM) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a part of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as a memory of a manufacturer's server, a server of an application store, or an intermediary server.

According to various embodiments, each component (e.g., a module or a program) of the above-described components may include a single or multiple entities, and some of the multiple entities may be separately arranged in other components. According to various embodiments, one or more components or operations of the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, the multiple components (e.g., a module or a program) may be integrated into one component. In such a case, the integrated component may perform one or more functions of each of the multiple components identically or similarly to those performed by the corresponding component of the multiple components before the integration. According to various embodiments, the operations performed by the module, program, or other component may be executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

FIG. 3 is a perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

The embodiments of FIGS. 2 to 3 may be combined with the embodiments of FIG. 1 or the embodiments of FIGS. 4 to 11.

Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1 ) may include a housing (210) including a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) surrounding a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing (210) may also refer to a structure forming a portion of the first side (210A) of FIG. 2 , the second side (210B) of FIG. 3 , and the side surface (210C). According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate including various coating layers, or a polymer plate). The second side (210B) can be formed by a substantially opaque back plate (211). The back plate (211) can be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side surface (210C) can be formed by a side structure (or “side bezel structure”) (218) that is joined to the front plate (202) and the back plate (211) and includes a metal and/or a polymer. In one embodiment, the back plate (211) and the side structure (218) can be formed integrally and include the same material (e.g., a metal material such as aluminum).

Although not shown, the front plate (202) may include a seamlessly extending region(s) that is curved toward the back plate (211) at least along a portion of an edge. In one embodiment, the front plate (202) (or the back plate (211)) may include only one of the curved extending regions toward the back plate (211) (or the front plate (202)) at one edge of the first surface (210A). In some embodiments, the front plate (202) or the back plate (211) may be substantially flat. For example, the curved extending region may not be included. When the curved extending region is included, the thickness of the electronic device (101) in the portion that includes the curved extending region may be smaller than that of the other portions.

According to one embodiment, the electronic device (101) may include at least one of a display (220), an audio module (203, 207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), a light emitting element (206), and a connector hole (208, 209). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (217) or the light emitting element (206)) or may additionally include other components.

The display (220) may be visually exposed, for example, through a significant portion of the front plate (202). In one embodiment, at least a portion of the display (220) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, a corner of the display (220) may be formed to be substantially the same as an adjacent outer shape of the front plate (202). In one embodiment (not shown), in order to expand the area over which the display (220) is visually exposed, the gap between the outer edge of the display (220) and the outer edge of the front plate (202) may be formed to be substantially the same.

In one embodiment (not shown), a recess or opening may be formed in a part of a screen display area of the display (220), and at least one of an audio module (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included that are aligned with the recess or opening. In one embodiment (not shown), at least one of an audio module (214), a sensor module (204), a camera module (205), a fingerprint sensor (not shown), and a light-emitting element (206) may be included on a back surface of the screen display area of the display (220). In one embodiment (not shown), the display (220) may be coupled with or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field-type stylus pen. In one embodiment, at least a portion of the sensor modules (204, 219), and/or at least a portion of the key input device (217), may be positioned in the first areas (210D), and/or the second areas (210E).

The audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). The microphone hole (203) may have a microphone placed inside to acquire external sound, and in one embodiment, multiple microphones may be placed to detect the direction of the sound. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. In one embodiment, the speaker hole (207, 214) and the microphone hole (203) may be implemented as one hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

The sensor module (204, 219) can generate an electric signal or a data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (204, 219) can include, for example, a first sensor module (204) (e.g., a proximity sensor) and/or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and/or a third sensor module (219) and/or a fourth sensor module (e.g., a fingerprint sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor can be disposed on not only the first surface (210A) (e.g., the display (220)) of the housing (210), but also the second surface (210B) or the side surface (210C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

The camera modules (205, 212, 213) may include a first camera device (205) disposed on a first surface (210A) of the electronic device (101), a second camera device (212) disposed on a second surface (210B), and/or a flash (213). The camera devices (205, 212) may include one or more lenses, an image sensor, and/or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device (101). In one embodiment, the flash (213) may emit infrared light, and infrared light emitted by the flash (213) and reflected by a subject may be received via the third sensor module (219). The electronic device (101) or the processor of the electronic device (101) can detect depth information of the subject based on the time at which infrared rays are received from the third sensor module (219).

The key input device (217) may be disposed on a side surface (210C) of the housing (210). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (220). In one embodiment, the key input device may include a sensor module disposed on a second surface (210B) of the housing (210).

The light emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light emitting element (206) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light emitting element (206) may provide a light source that is linked to the operation of, for example, the camera module (205). The light emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

The connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and/or data with an external electronic device, and/or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

FIG. 4 is an exploded perspective view showing the front side of an electronic device according to one embodiment of the present disclosure.

FIG. 5 is an exploded perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

The embodiments of FIGS. 4 to 5 may be combined with the embodiments of FIGS. 1 to 3, or the embodiments of FIGS. 6 to 11.

Referring to FIGS. 3 and 4, the electronic device (101) (e.g., the electronic device (101) of FIG. 1 or 2) may include a side structure (310), a first support member (311) (e.g., a bracket), a front plate (320) (e.g., the front plate (202) of FIG. 1), a display (330) (e.g., the display (220) of FIG. 1), at least one printed circuit board (or board assembly) (340a, 340b), a battery (350), a second support member (360) (e.g., a rear case), an antenna, a camera assembly (307), and a rear plate (380) (e.g., the rear plate (211) of FIG. 2). When including a plurality of printed circuit boards (340a, 340b), the electronic device (101) can electrically connect different printed circuit boards by including at least one flexible printed circuit board (340c). For example, the printed circuit boards (340a, 340b) can include a first circuit board (340a) positioned above (e.g., in the +Y-axis direction) the battery (350) and a second circuit board (340b) positioned below (e.g., in the -Y-axis direction), and the flexible printed circuit board (340c) can electrically connect the first circuit board (340a) and the second circuit board (340b).

According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., the first support member (311) or the second support member (360)) or may additionally include another component. At least one of the components of the electronic device (101) may be identical to or similar to at least one of the components of the electronic device (101) of FIG. 1 or FIG. 2, and any redundant description will be omitted below.

The first support member (311) may be provided in a flat shape at least in part. In one embodiment, the first support member (311) may be disposed inside the electronic device (101) and connected to the side structure (310), or may be formed integrally with the side structure (310). The first support member (311) may be formed of, for example, a metallic material and/or a non-metallic (e.g., polymer) material. When the first support member (311) is formed at least partially of a metallic material, the side structure (310) or a portion of the first support member (311) may function as an antenna. The first support member (311) may have a display (330) coupled to one surface and a printed circuit board (340a, 340b) coupled to the other surface. A processor, a memory, and/or an interface may be mounted on the printed circuit board (340a, 340b). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communications processor.

In one embodiment, the housing (301) may include a first support member (311) and a side structure (310). In one embodiment, the housing (301) may be understood as a structure for accommodating, protecting, or arranging a printed circuit board (340a, 340b), or a battery (350). In one embodiment, the housing (301) may be understood as including structures that can be visually or tactilely recognized by a user in the appearance of the electronic device (101), for example, the side structure (310), the front plate (320), and/or the rear plate (380). For example, the housing (301) may include structures forming the appearance of the electronic device (101), for example, the side structure (310), the front plate (320), or the rear plate (380). The housing (301) may be substantially the same as the housing (210) described with reference to FIGS. 2 and 3 . In one embodiment, the 'front or rear surface of the housing (301)' may refer to the first surface (210A) of FIG. 1 or the second surface (210B) of FIG. 2. In one embodiment, the first support member (311) is disposed between the front plate (320) (e.g., the first surface (210A) of FIG. 1) and the rear plate (380) (e.g., the second surface (210B) of FIG. 2) and may function as a structure for arranging electrical/electronic components such as printed circuit boards (340a, 340b) or camera assemblies (307).

The memory may include, for example, volatile memory or non-volatile memory.

The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card/MMC connector, or an audio connector.

The second support member (360) may include, for example, an upper support member (360a) or a lower support member (360b). In one embodiment, the upper support member (360a) may be arranged to surround a printed circuit board (340a, 340b) (e.g., the first circuit board (340a)) together with a portion of the first support member (311). For example, the upper support member (360a) of the second support member (360) may be arranged to face the first support member (311) with the first circuit board (340a) interposed therebetween. In one embodiment, the lower support member (360b) of the second support member (360) may be arranged to face the first support member (311) with the second circuit board (340b) interposed therebetween. Circuit devices implemented in the form of integrated circuit chips (e.g., processors, communication modules, or memories) or various electrical/electronic components may be placed on printed circuit boards (340a, 340b), and according to an embodiment, the printed circuit boards (340a, 340b) may be provided with an electromagnetic shielding environment from the second support member (360). In one embodiment, the lower support member (360b) may be utilized as a structure on which electrical/electronic components, such as a speaker module or an interface (e.g., a USB connector, an SD card/MMC connector, or an audio connector), may be placed. In one embodiment, electrical/electronic components, such as a speaker module or an interface (e.g., a USB connector, an SD card/MMC connector, or an audio connector) may be placed on an additional printed circuit board (not shown). For example, the lower support member (360b) may be arranged to surround an additional printed circuit board (e.g., a second printed circuit board (340b)) together with another portion of the first support member (311). An additional printed circuit board not shown or a speaker module or interface arranged on the lower support member (360b) may be arranged corresponding to the audio module (207) or connector hole (208, 309) of FIG. 1.

The battery (350) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially on the same plane as, for example, the printed circuit boards (340a, 340b). The battery (350) may be integrally disposed within the electronic device (101), and may also be disposed so as to be detachably attached to the electronic device (101). In one embodiment, the electronic device (101) may include a coupling body (460) that surrounds at least a portion of the battery (350). For example, at least a portion of the battery (350) may be coupled with the coupling body (460). The battery (350) and the coupling body (460) may be disposed on a mounting portion (3111) of the support member (311).

Although not shown, the antenna may include a conductive pattern implemented on a surface of the second support member (360), for example, by a laser direct structuring method. In one embodiment, the antenna may include a printed circuit pattern formed on a surface of a thin film, and the thin film-type antenna may be disposed between the back plate (380) and the battery (350). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by the side structure (310) and/or a portion or combination of the first support member (311).

In one embodiment, the camera assembly (307) may include at least one camera module. Within the electronic device (101), the camera assembly (307) (or at least one camera module) may receive at least a portion of light incident through an optical hole or camera window. In one embodiment, the camera assembly (307) may be disposed on the first support member (311) at a location adjacent the printed circuit board (340a, 340b). In one embodiment, the camera module(s) of the camera assembly (307) may be generally aligned with one of the camera windows and may be at least partially wrapped around the second support member (360) (e.g., the upper support member (360a)).

In one embodiment, the first support member (311) may be referred to as a “support member.” The support member (311) may include a mounting portion (3111). The mounting portion (3111) may include a recess that is sunken from one surface of the support member (311). For example, the battery (350) may be placed in the mounting portion (3111).

According to one embodiment, the support member (311) may include a coupling portion (3112). The coupling portion (3112) may be spaced apart from the fixing portion (3111). For example, a plurality of coupling portions (3112) may be formed. For example, a plurality of coupling portions (3112) may be formed symmetrically with respect to the fixing portion (3111).

FIG. 6A is a drawing showing a portion of a support member (411) on which a battery (450) (e.g., battery (350) of FIG. 5) is disposed, with a joining body (e.g., 460 of FIG. 6B) removed, according to one embodiment of the present disclosure. The components described with reference to FIG. 6A may be partly or entirely identical to the components described with reference to FIGS. 1 to 5. The components described with reference to FIG. 6A may be partly or entirely identical to the components described with reference to FIGS. 6B to 10.

According to one embodiment, the electronic device (400) may include a housing (410). The description of the housing (410) may be substantially identical to the description of the housing (e.g., 301 of FIG. 5) described with reference to FIG. 5. The housing (410) may provide a space in which a battery (450) is placed. The housing (410) may support the battery (450).

In one embodiment, the housing (410) may include a support member (411). The support member (411) may be a part of the housing (410). The description of the support member (411) may be substantially identical to the description of the first support member (e.g., 311 of FIG. 5) described with reference to FIG. 5. The support member (411) may provide a space in which the battery (450) is placed.

In one embodiment, the support member (410) may include a mounting portion (4111). The description of the mounting portion (4111) may be substantially identical to the description of the mounting portion (e.g., 3111 of FIG. 5) described with reference to FIG. 5. The mounting portion (4111) may be formed by being sunken into one surface of the support member (411). The battery (450) may be placed in the mounting portion (4111). The mounting portion (4111) may include a peripheral wall (4111a). For example, the peripheral wall (4111a) may surround at least a portion of the battery (450).

According to one embodiment, the support member (410) may include a coupling portion (4112). The description of the coupling portion (4112) may be substantially identical to the description of the coupling portion (e.g., 4112 of FIG. 5) described with reference to FIG. 5. For example, the coupling portion (4112) may be spaced apart from the mounting portion (4111). The coupling portions (4112) may be formed in multiple numbers. The coupling portions (4112) may be formed at each of a position spaced apart from the mounting portion (4111) in a first direction and a position spaced apart in a second direction opposite to the first direction. The coupling portion (4112) may include a coupling hole (4112a). The coupling hole (4112a) may be formed in the support member (411). The coupling member (e.g., 464 of FIG. 7a) may be inserted into the coupling hole (4112a).

In one embodiment, the battery (450) may be placed inside the mounting portion (4111). At least a portion of the battery (450) may be surrounded by a peripheral wall (4111a) and its movement may be restricted by the peripheral wall (4111a). The electronic device (400) may include a substrate (440) (e.g., a flexible printed circuit board (340c)). For example, the substrate (440) may be a flexible circuit board. For example, the substrate (440) may extend from the mounting portion (4111) to the outside of the mounting portion (4111).

FIG. 6b is a drawing showing a part of a support member (411) on which a battery (450) is placed, in a state where a coupling body (e.g., 460 of FIG. 6b) is coupled, according to one embodiment of the present disclosure. The components described with reference to FIG. 6b may be partly or entirely the same as the components described with reference to FIGS. 1 to 6a. The components described with reference to FIG. 6b may be partly or entirely the same as the components described with reference to FIGS. 7a to 10.

In one embodiment, the electronic device (400) may include a coupling body (460). The coupling body (460) may be coupled with the support member (411). The coupling body (460) may accommodate a battery (450). The coupling body (460) may surround at least a portion of the battery (450). The coupling body (460) may extend along a perimeter of the battery (450). The battery (450) may be restricted from moving by the coupling body (460). In one embodiment, the substrate (440) may be exposed to the outside of the coupling body (460).

According to one embodiment, the coupling body (460) may include a border (462). The border (462) may extend along the circumference of the battery (450). For example, the border (462) may have a closed loop shape. For example, the border (462) may have a void on the inside. The border (462) may be located between the mounting portion (e.g., 4111 of FIG. 6A) and the coupling portion (e.g., 4112 of FIG. 6A).

According to one embodiment, the coupling body (460) may include a buffer portion (463). For example, the buffer portion (463) may be formed integrally with or coupled with a portion of the edge (462). The buffer portion (463) may be positioned corresponding to the coupling portion (e.g., 4112 of FIG. 6A). The buffer portion (463) may protrude from the edge (462) in a direction away from the battery (450). For example, a plurality of buffer portions (463) may be arranged. In one embodiment, the buffer portion (463) may include a first buffer portion (4631). The first buffer portion (4631) may protrude from the edge (462) in a first direction (D1). The buffer portion (463) may include a second buffer portion (4632). The second buffer portion (4632) may protrude from the edge (462) in a second direction (D2). For example, the first direction (D1) and the second direction (D2) may be opposite directions.

According to one embodiment, the electronic device (400) may include a coupling member (464). For example, the coupling member (464) may be a screw. The coupling member (464) may couple the support member (411) and the coupling body (460). The coupling member (464) may penetrate the coupling body (460). For example, the coupling member (464) may penetrate the buffer portion (463). The coupling member (464) may be inserted into the coupling portion (e.g., 4112 of FIG. 6A). For example, a plurality of coupling members (464) may be arranged to correspond to each of a plurality of buffer portions (463).

Fig. 7a is a cross-sectional view of the A-A' line illustrated in Fig. 6b. The components described with reference to Fig. 7a may be partially or entirely identical to the components described with reference to Figs. 1 to 6b. The components described with reference to Fig. 7a may be partially or entirely identical to the components described with reference to Figs. 7b to 10.

According to one embodiment, the joining body (460) may include a frame (462) and a buffer portion (463). The joining member (464) may join the supporting member (411) and the buffer portion (463).

In one embodiment, the support member (411) may include a support plate (4113). For example, the support plate (4113) may be plate-shaped. In one embodiment, the coupling portion (4112) may protrude from the support plate (4113). The coupling portion (4112) may include a coupling hole (4112a). For example, the coupling hole (4112a) may be opened in a direction in which the coupling member (464) is inserted. For example, the coupling hole (4112a) may have a groove structure in which one end is open and the other end is closed. The coupling hole (4112a) may be referred to as a “coupling groove.” The coupling portion (4112) may include a coupling hole outer wall (4112b). The coupling hole outer wall (4112b) may be cylindrical. The coupling hole (4112a) may be formed on the inner side of the coupling hole outer wall (4112b). The coupling portion (4112) may include an outer wall end portion (4112c). The outer wall end portion (4112c) may face the hole (468) of the buffer portion (463). For example, the elastic member (465) may be secured to the outer wall end portion (4112c). For example, a screw thread may be formed on the inner surface of the coupling hole outer wall (4112b). The coupling member (464) may be rotatably engaged with the inner surface of the coupling hole outer wall (4112b).

In one embodiment, the buffer portion (463) may include a first buffer portion (463a). The buffer portion (463) may include a second buffer portion (463b). The first buffer portion (463a) and the second buffer portion (463b) may be integral. The first buffer portion (463a) may be a portion of the buffer portion (463) that is coupled to the edge (462). The second buffer portion (463b) may be a portion of the buffer portion (463) that is located farther from the edge (462) than the first buffer portion (463a).

According to one embodiment, the buffer portion (463) may include a buffer body (4633). The buffer portion (463) may include a protrusion (4634). The buffer body (4633) may be coupled with the edge (462). The protrusion (4634) may protrude from the buffer body (4633). The protrusion (4634) may protrude from the buffer body (4633) toward the coupling member (464). The protrusion (4634) may protrude from the buffer body (4633) toward the center of the hole (468). The buffer body (4633) and the protrusion (4634) may be integral.

According to one embodiment, the buffer portion (463) may include a hole (468). The hole (468) may be named a “coupling hole.” The hole (468) of the buffer portion (463) may be named a “first coupling hole (468),” and the hole (4112a) of the support member (411) may be named a “second coupling hole (4112a).” The coupling member (464) may be inserted into the hole (468). The hole (468) may include a first hole region (466). The first hole region (466) may be a portion of the hole (468) surrounded by a protrusion (4634). The hole (468) may include a second hole region (467). The second hole region (467) may be a portion of the hole (468) surrounded by a buffer body (4633). The first hole region (466) and the second hole region (467) may be connected to each other. For example, the diameter of the first hole region (466) may be smaller than the diameter of the second hole region (467).

In one embodiment, the coupling member (464) can penetrate the first coupling hole (468) and the second coupling hole (4112a). For example, the coupling member (464) can penetrate at least a portion of the first coupling hole (468) and be spaced apart from the second coupling hole (4112a). In one embodiment, the coupling member (464) can penetrate only the first coupling hole (468) and not the second coupling hole (4112a). In one embodiment, the support member (411) can not form the second coupling hole (4112a). The support member (411) can include a support plate (4113), and the support plate (4113) can face the first coupling hole (468). One end of the first coupling hole (468) may be blocked by the support plate (4113), and the first coupling hole (468) may be a groove formed in the buffer member (463). The coupling member (464) may be engaged with the outer wall (4112b) of the coupling hole of the coupling portion (4112). At least a portion of the coupling member (464) may be positioned inside the hole (468) of the buffer portion (463). At least a portion of the coupling member (464) may be spaced apart from the buffer portion (463).

In one embodiment, the coupling member (464) may include a head (4641). The head (4641) may be mounted on one surface of the buffer portion (463). For example, a diameter of the head (4641) may be larger than a diameter of the hole (468). For example, the hole (468) may include a first hole area (466), and the diameter of the head (4641) may be larger than a width of the first hole area (466) (e.g., W1 of FIG. 7B). For example, the head (4641) may be mounted on a protrusion (4634), and the diameter of the head (4641) may be larger than a width of the first hole area (466) formed by the protrusion (4634) (e.g., W1 of FIG. 7B). The coupling member (464) may include a first body portion (4642). The first body part (4642) can be connected to the head (4641). The first body part (4642) can be located inside the first hole area (466). The coupling member (464) can include a second body part (4643). The second body part (4643) can be integral with the first body part (4642). The second body part (4643) can be located inside the second hole area (467). The coupling member (464) can include a fixing part (4644). The fixing part (4644) can be connected to the second body part (4643). The fixing part (4644) can be located inside the second coupling hole (4112a). The fixing part (4644) can be connected to the coupling part (4112). For example, screw threads may be formed on the outer surface of the fixed portion (4644). In one embodiment of the present disclosure, the connecting member (464) may have screw threads formed on the outer surface of the fixed portion (4644) and may not have screw threads formed on the outer surface of the body portions (4642, 4643).

According to one embodiment, the electronic device (400) may include an elastic member (465). The elastic member (465) may be disposed inside the hole (468) of the buffer portion (463). The elastic member (465) may be disposed in the second hole area (467). The elastic member (465) may be disposed between the protrusion (4634) and the outer wall end portion (4112c). In one embodiment, the elastic member (465) may be disposed to surround the coupling member (464). The elastic member (465) may be disposed between the second body portion (4643) of the coupling member (464) and the buffer body (4633). In one embodiment, the elastic member (465) may include an elastic material. For example, the elastic force of the elastic member (465) may be greater than the elastic force of the buffer portion (463). The elastic member (465) may include, for example, a metal or rubber material. The buffer portion (463) may include, for example, a plastic material.

Fig. 7b is a cross-sectional view of the A-A' line illustrated in Fig. 6b. Table 1 is a table summarizing the numerical ranges of the components illustrated in Fig. 7b. The components described with reference to Fig. 7b and Table 1 may be partly or entirely identical to the components described with reference to Figs. 1 to 7a. The components described with reference to Fig. 7b and Table 1 may be partly or entirely identical to the components described with reference to Figs. 8 to 10.

division Dimensions (mm) H 2.5 ~ 7 H1 0.5 ~ 1.4 H2 1 ~ 2.8 H3 1 ~ 2.8 W1 1.5 ~ 2.5 W2 2.1 ~ 3.9 W3 1.1 ~ 1.7 W4 0.2 ~ 0.4 W5 0.5 ~ 1.1

According to one embodiment, the direction in which the joining member (464) is inserted may be defined as a "first direction." A direction orthogonal to the first direction may be defined as a "second direction." The first direction may be named a "height direction." The second direction may be named a "width direction."

According to one embodiment, the electronic device (400) may include a first region (S1). The first region (S1) may include a portion of the buffer portion (463). The protrusion (4634), the first hole region (466), and the first body portion (4642) may be located in the first region (S1). The electronic device (400) may include a first gap (466a). The first gap (466a) may be a space formed between the protrusion (4634) and the first body portion (4642). The first gap (466a) may be a portion of the first hole region (466). For example, the first gap (466a) may be an empty space.

According to one embodiment, the electronic device (400) may include a second region (S2). The second region (S2) may include a portion of the buffer portion (463). The buffer body (4633), the second hole region (467), the second body portion (4643), and the elastic member (465) may be located in the second region (S2). The electronic device (400) may include a second gap (467a). The second gap (467a) may be a space formed between the buffer body (4633) and the second body portion (4643). The second gap (467a) may be a portion of the second hole region (467). The elastic member (465) may be disposed inside the second gap (467a).

According to one embodiment, the electronic device (400) may include a third region (S3). The third region (S3) may include a portion of the coupling portion (4112). The second coupling hole (4112a), the coupling hole outer wall (4112b), and the fixing portion (4644) may be located within the third region (S3).

According to one embodiment, the first region (S1) can have a first height (H1). For example, the first height (H1) can be in a range from 0.5 mm to 1.4 mm. The second region (S2) can have a second height (H2). For example, the second height (H2) can be in a range from 1 mm to 2.8 mm. The third region (S3) can have a third height (H3). For example, the third height (H3) can be in a range from 1 mm to 2.8 mm. The above-described heights (H1, H2, H3) can be referred to as “distances in the first direction.” The depth (H) at which the joining member (464) is inserted can be in a range from 2.5 mm to 7 mm.

According to one embodiment, the height (H1) of the first region (S1) may be smaller than the height (H2) of the second region (S2). For example, the height (H1) of the first region (S1) may be smaller than the height (H3) of the third region (S3). For example, the height (H2) of the second region (S2) may be substantially equal to the height (H3) of the third region (S3).

According to one embodiment, the first hole region (466) may have a first width (W1). For example, the first width (W1) may be in a range from 1.5 mm to 2.5 mm. The second hole region (467) may have a second width (W2). For example, the second width (W2) may be in a range from 2.1 mm to 3.9 mm. The second coupling hole (4112a) may have a third width (W3). For example, the third width (W3) may be in a range from 1.1 mm to 1.7 mm. The above-described widths (W1, W2, W3) may be referred to as “distances in the second direction.”

According to one embodiment, the width (W1) of the first hole region (466) may be smaller than the width (W2) of the second hole region (467). For example, the width (W1) of the first hole region (466) may be larger than the width (W3) of the second coupling hole (4112a). For example, the width (W2) of the second hole region (467) may be larger than the width (W3) of the second coupling hole (4112a).

According to one embodiment, the first gap (466a) may have a fourth width (W4). For example, the fourth width (W4) may be in a range from 0.2 mm to 0.4 mm. The second gap (467a) may have a fifth width (W5). For example, the fifth width (W5) may be in a range from 0.5 mm to 1.1 mm. The above-described widths (W4, W5) may be referred to as “the gap between the joining member (464) and the buffer portion (463).” The width (W4) of the first gap (466a) may be smaller than the width (W5) of the second gap (467a).

Due to the numerical ranges of the above-described components (e.g., H, H1, H2, H3, W1, W2, W3, W4, W5), the shock transmitted to the battery (e.g., 450 of FIG. 6b) can be mitigated. For example, by forming the width (W2) of the second hole area (467) in which the elastic member (465) is arranged to be larger than the first and third widths (W1, W3), a space for deformation of the elastic member (465) can be secured. For example, by forming the first width (W1) to be smaller than the second width (W2), the elastic member (465) can be supported by the protrusion (4634), and the shock in the height direction can be reduced due to deformation of the elastic member (465) due to interference with the protrusion (4634).

According to one embodiment, the rim (462), the buffer body (4633), and the protrusion (4634) may be integral. For example, the rim (462) and the buffer portion (463) may be integral. For example, each of the rim (462) and the buffer portion (463) may be a part of the joining body (460). Each of the buffer body (4633) and the protrusion (4634) may be a part of the buffer portion (463). The buffer body (4633) may be a part connected to the rim (462) and may be a cylinder having a width (W6) between the rim (462) and the hole (468). The protrusion (4634) may be a part protruding from the buffer body (4633) toward the hole (468) and may be a cylinder protruding from the buffer body (4633) by a seventh width (W7).

According to one embodiment, the coupling body (460) may include a frame (462) and a plate (not shown) to accommodate the battery (450). The plate (not shown) may be a part of the coupling body (460) arranged in the Z-axis direction of the battery (450). The plate (not shown) may extend from the frame (462) toward a receiving space (for example, the receiving space (4111) of FIG. 6A). The plate (not shown) may be mounted on the upper side of the support plate (4113). The battery (450) may be mounted on the plate (not shown). The plate (not shown) may be an adhesive member (for example, a tape).

FIG. 8 is a drawing of a region near a buffer portion (463) according to one embodiment of the present disclosure, viewed in the D direction (see FIG. 7b) with the support member (411) removed. The components described with reference to FIG. 8 may be partly or entirely the same as the components described with reference to FIGS. 1 to 7b. The components described with reference to FIG. 8 may be partly or entirely the same as the components described with reference to FIGS. 9a to 10.

According to one embodiment, the elastic member (465) may be arranged to surround the coupling member (464). The elastic member (465) may be arranged inside the hole (468). The elastic member (465) may be deformably arranged between the buffer portion (463) and the coupling member (464). For example, the elastic member (465) may be made of a rubber material. For example, the elastic member (465) may be cylindrical. For example, the cross section of the elastic member (465) may be ring-shaped.

FIG. 9a is a drawing showing a region near a buffer portion (563) of a coupling body (560) according to one embodiment of the present disclosure when a support member (e.g., 411 of FIG. 7b) is removed, viewed in the D direction (see FIG. 7b). FIG. 9b is a drawing showing the structure illustrated in FIG. 9a when viewed obliquely. The components described with reference to FIGS. 9a and 9b may be partly or entirely the same as the components described with reference to FIGS. 1 to 8. The components described with reference to FIGS. 9a and 9b may be partly or entirely the same as the components described with reference to FIG. 10.

In one embodiment, the coupling body (560) may include a border (562) and a buffer portion (563). The description of the border (562) and the buffer portion (563) may be substantially identical to the description of the border (e.g., 462) and the buffer portion (e.g., 463) of FIGS. 6A to 7B. The coupling member (564) may penetrate the buffer portion (563). The description of the coupling member (564) may be substantially identical to the description of the coupling member (e.g., 464) of FIGS. 6A to 7B. In one embodiment, the buffer portion (563) may include a buffer body (5633), a protrusion (5634), and/or a hole (568). The description of the buffer body (5633), the protrusion (5634), and the hole (568) can be substantially identically applied to the description of the buffer body (4633), the protrusion (4634), and the hole (468) of FIGS. 6A to 7B.

According to one embodiment, the coupling body (560) may include an elastic member (565). The elastic member (565) may be placed inside the hole (568). The elastic member (565) may be placed between the buffer body (5633) and the coupling member (564). At least a portion of the elastic member (565) may be in contact with an outer surface of the coupling member (564). For example, the elastic member (565) may include a plate spring. The cross section of the elastic member (565) may be, for example, an arc shape. The elastic member (565) may be, for example, an arch shape.

According to one embodiment, a plurality of elastic members (565) may be arranged. The plurality of elastic members (565) may be spaced apart from each other in the circumferential direction of the coupling member (564). For example, at least three elastic members (565) may be arranged. The plurality of elastic members (565) may include a first elastic member (5651), a second elastic member (5652), and/or a third elastic member (5653). Some of the plurality of elastic members (5651, 5652, 5653) may face each other. At least a portion of the first elastic member (5651) may face at least a portion of the second elastic member (5652) and at least a portion of the third elastic member (5653). At least a portion of the second elastic member (5652) can face at least a portion of the first elastic member (5651) and at least a portion of the third elastic member (5653). At least a portion of the third elastic member (5653) can face at least a portion of the first elastic member (5651) and at least a portion of the second elastic member (5652).

FIG. 10 is a part of a cross-sectional view of an electronic device (600) including a battery (650), a support member (611), and a coupling body (660) according to one embodiment of the present disclosure. The components described with reference to FIG. 10 may be some or all of the same as the components described with reference to FIGS. 1 to 9B.

According to one embodiment, the electronic device (600) may include a battery (650), a support member (611), and a coupling body (660). The description of the battery (650), the support member (611), and the coupling body (660) of FIGS. 6A to 7B may be substantially identically applied.

According to one embodiment, the support member (611) may include a joining portion (6112) and a joining hole (6112a). The description of the joining portion (6112) and the joining hole (6112a) may be substantially identical to the description of the joining portion (e.g., 4112) and the joining hole (e.g., 4112a) of FIGS. 6A to 7B.

In one embodiment, the coupling body (660) may include a rim (661). The rim (661) may extend along a perimeter of the battery (650). The rim (661) may surround at least a portion of the battery (650). The coupling body (660) may include a body end portion (662). The body end portion (662) may be integral with the rim (661). The body end portion (662) may be a portion of the rim (661) that forms a space between the rim (661) and the battery (650) in which an elastic member (663) is disposed. For example, the rim (661) and the body end portion (662) may include a plastic material.

According to one embodiment, the coupling body (660) may include an elastic member (663). The elastic member (663) may include, for example, a rubber material. For example, the elastic member (663) may include a material having greater elasticity than the edge (661) and the body end portion (662). The elastic member (663) may be positioned corresponding to the coupling portion (6112). The elastic member (663) may be surrounded by the edge (661) and the body end portion (662).

According to one embodiment, the electronic device (600) may include a coupling member (664). The coupling member (664) may penetrate at least a portion of the elastic member (663) and the coupling portion (6112). The coupling member (664) may be a screw. The elastic member (663) may include a hole (668) through which the coupling member (664) penetrates.

According to one embodiment, the elastic member (663) may include an elastic body (6633). The elastic member (663) may include an elastic protrusion (6634). The elastic protrusion (6634) may protrude from the elastic body (6633) toward the hole (668). The width of the hole (668) may decrease along the direction in which the elastic member (664) is inserted. For example, the width of the hole (668) surrounded by the elastic protrusion (6634) may be smaller than the width of the hole (668) surrounded by the elastic body (6633).

In one embodiment, the coupling member (664) may include a head (6641). The coupling member (664) may include a leg (6642). The head (6641) may be surrounded by an elastic body (6633). The head (6641) may be seated on an elastic protrusion (6634). The leg (6642) may be surrounded by an elastic protrusion (6634). The leg (6642) may be inserted into and fixed into a coupling hole (6112a) of the coupling portion (6112). Screw threads may be formed on an inner surface of the coupling portion (6112), and the coupling member (664) may include screw threads that engage with the coupling portion (6112).

According to one embodiment, the battery (650) may include a jelly roll (651). The electronic device according to various embodiments of the present disclosure may protect battery (650) components including the jelly roll (651) by absorbing shock by an elastic member (e.g., 465, 565, 663) when shock is applied to the electronic device.

The electronic device places a battery inside the housing to drive the electronic device. The battery may be fixed to the housing using tape or screws. When the electronic device is subjected to impact due to being dropped or the like, the impact applied to the housing may be transmitted to the battery. If the battery is fixed to the housing using tape, the tape may be torn by external impact. If the battery is fixed to the housing using screws, the amount of impact applied to the battery may increase due to the lack of a structure to alleviate the impact.

A problem to be solved in the present disclosure may be to alleviate the impact applied to a battery.

A problem to be solved in the present disclosure may be to provide a buffer structure that firmly fixes a battery while alleviating shock applied to the battery.

The problems to be solved in the present disclosure are not limited to the problems mentioned above, and may be determined in various ways without departing from the spirit and scope of the present disclosure.

An electronic device according to various embodiments of the present disclosure can reduce the amount of shock applied to a battery (e.g., 450 of FIG. 6b) by the elastic force of the elastic member (e.g., 465 of FIG. 7a) by arranging an elastic member (e.g., 465 of FIG. 7a) on a joining portion (e.g., a buffer portion (463) of FIG. 7a) that fixes a battery (e.g., 450 of FIG. 6b).

Electronic devices according to various embodiments of the present disclosure can suppress a phenomenon in which an elastic member (e.g., 465 of FIG. 7a) is detached from the inside of a hole (e.g., 468 of FIG. 7a) divided into first and second hole regions (e.g., 466 and 467 of FIG. 7a).

The effects obtainable from the present disclosure are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by a person skilled in the art to which the present disclosure belongs from the description below.

An electronic device (e.g., 400 of FIG. 6B) according to one embodiment of the present disclosure may include a support member (e.g., 411 of FIG. 7A) including a mounting portion (e.g., 4111 of FIG. 6A) in which a battery (e.g., 450 of FIG. 6A) is placed, and a coupling portion (e.g., 4112 of FIG. 7A) formed such that a coupling portion (e.g., 464 of FIG. 7A) is inserted at a location spaced from the mounting portion (e.g., 4111 of FIG. 6A).

An electronic device (e.g., 400 of FIG. 6B) according to one embodiment of the present disclosure may include a bonding body (e.g., 460 of FIG. 7A) including a buffer portion (e.g., 463 of FIG. 7A) that surrounds at least a portion of the battery (e.g., 450 of FIG. 6A) and has a hole (e.g., 468 of FIG. 7A) formed through which the bonding member (e.g., 464 of FIG. 7A) passes.

An electronic device according to one embodiment of the present disclosure (e.g., 400 of FIG. 6b) may include an elastic member (e.g., 465 of FIG. 7a) arranged so as to surround at least a portion of the coupling member (e.g., 464 of FIG. 7a) within the hole (e.g., 468 of FIG. 7a).

According to one embodiment of the present disclosure, a coupling member (e.g., 464 of FIG. 7a) may be spaced apart from the buffer portion (e.g., 463 of FIG. 7a) to form a gap (e.g., 466a, 467a of FIG. 7b), and the elastic member (e.g., 465 of FIG. 7a) may be placed inside the gap (e.g., 466a, 467a of FIG. 7b).

A hole (e.g., 468 of FIG. 7a) according to one embodiment of the present disclosure may include a first hole region (e.g., 466 of FIG. 7a) including a first gap (e.g., 466a of FIG. 7b) formed between the coupling member (e.g., 464 of FIG. 7a) and the buffer portion (e.g., 463 of FIG. 7a).

A hole (e.g., 468 in FIG. 7a) according to one embodiment of the present disclosure may include a second hole region (e.g., 467 in FIG. 7a) formed between the coupling member (e.g., 464 in FIG. 7a) and the buffer portion (e.g., 463 in FIG. 7a) and including a second gap (e.g., 467a in FIG. 7b) in which the elastic member (e.g., 465 in FIG. 7a) is disposed.

A buffer portion (e.g., 463 of FIG. 7a) according to one embodiment of the present disclosure may include a buffer body (e.g., 4633 of FIG. 7a) spaced apart from the coupling member (e.g., 464 of FIG. 7a).

A buffer portion (e.g., 463 of FIG. 7a) according to one embodiment of the present disclosure may include a protrusion (e.g., 4634 of FIG. 7a) that protrudes from the buffer body (e.g., 4633 of FIG. 7a) toward the coupling member (e.g., 464 of FIG. 7a).

An elastic member (e.g., 465 in FIG. 7a) according to one embodiment of the present disclosure may be positioned between the protrusion (e.g., 4634 in FIG. 7a) and the joining portion (e.g., 4112 in FIG. 7a).

A support member (e.g., 411 of FIG. 7a) according to one embodiment of the present disclosure may include a plate (e.g., 4113 of FIG. 7a).

A support member (e.g., 411 in FIG. 7a) according to one embodiment of the present disclosure may include a coupling hole outer wall (e.g., 4112b in FIG. 7a) that protrudes from the plate (e.g., 4113 in FIG. 7a) toward the coupling body (e.g., 460 in FIG. 7a) and forms a coupling hole (e.g., 4112a in FIG. 7a) on the inside.

A support member (e.g., 411 in FIG. 7a) according to one embodiment of the present disclosure may include an outer wall end portion (e.g., 4112c in FIG. 7a) facing the buffer portion (e.g., 463 in FIG. 7a).

An elastic member (e.g., 465 in FIG. 7a) according to one embodiment of the present disclosure can be mounted on the outer wall end portion (e.g., 4112c in FIG. 7a).

According to one embodiment of the present disclosure, the width of the first hole area (e.g., 466 of FIG. 7a) of the hole (e.g., 468 of FIG. 7a) in which the elastic member (e.g., 465 of FIG. 7a) is not arranged may be smaller than the width of the second hole area (e.g., 467 of FIG. 7a) of the hole (e.g., 468 of FIG. 7a) in which the elastic member (e.g., 465 of FIG. 7a) is arranged.

A coupling member (e.g., 464 of FIG. 7a) according to one embodiment of the present disclosure may include a first body portion (e.g., 4641 of FIG. 7a) spaced apart from the buffer portion (e.g., 463 of FIG. 7a).

A coupling member (e.g., 464 of FIG. 7a) according to one embodiment of the present disclosure may include a second body part (e.g., 4642 of FIG. 7a) connected to the first body part (e.g., 4641 of FIG. 7a) and surrounded by the elastic member (e.g., 465 of FIG. 7a).

A coupling member (e.g., 464 of FIG. 7a) according to one embodiment of the present disclosure may include a fixing member (e.g., 4643 of FIG. 7a) connected to the second body part (e.g., 4642 of FIG. 7a) and inserted into the coupling member (e.g., 4112 of FIG. 7a).

According to one embodiment of the present disclosure, the width of the joining hole (e.g., 4112a of FIG. 7a) of the supporting member (e.g., 4112 of FIG. 7a) into which the joining member (e.g., 464 of FIG. 7a) is inserted may be smaller than the width of the hole (e.g., 468 of FIG. 7a) surrounded by the elastic member (e.g., 465 of FIG. 7a).

A joining member according to one embodiment of the present disclosure (e.g., 464 of FIG. 7A) may include a screw having threads formed therein.

According to one embodiment of the present disclosure, the screw thread of the joining member (e.g., 464 of FIG. 7a) may be formed on a portion of the joining member (e.g., 464 of FIG. 7a) that is inserted into the joining portion (e.g., 4112 of FIG. 7a).

A hole (e.g., 468 of FIG. 7a) according to one embodiment of the present disclosure may include a first hole region (e.g., 466 of FIG. 7a) including a first gap (e.g., 466a of FIG. 7b) formed between the coupling member (e.g., 464 of FIG. 7a) and the buffer portion (e.g., 463 of FIG. 7a).

A hole (e.g., 468 of FIG. 7a) according to one embodiment of the present disclosure may include a second hole region (e.g., 467 of FIG. 7a) in which an elastic member (e.g., 465 of FIG. 7a) is disposed between the coupling member (e.g., 464 of FIG. 7a) and the buffer portion (e.g., 463 of FIG. 7a).

According to one embodiment of the present disclosure, the height of the first hole region (e.g., 466 in FIG. 7a) may be smaller than the height of the second hole region (e.g., 467 in FIG. 7a).

The elastic force of the elastic member (e.g., 465 of FIG. 7a) according to one embodiment of the present disclosure may be greater than the elastic force of the buffer portion (e.g., 463 of FIG. 7a).

According to one embodiment of the present disclosure, a plurality of connecting portions (e.g., 4112 of FIG. 6a) may be arranged symmetrically with respect to the fixing portion (e.g., 4111 of FIG. 6a).

An elastic member (e.g., 465 of FIG. 8) according to one embodiment of the present disclosure may be cylindrical and surround the joining member (e.g., 464 of FIG. 7a).

An elastic member (e.g., 565 of FIG. 9b) according to one embodiment of the present disclosure may be an arch-shaped member arranged so that at least a portion thereof is in contact with the joining member (e.g., 564 of FIG. 9a) within the hole (e.g., 568 of FIG. 9a).

According to one embodiment of the present disclosure, a plurality of elastic members (e.g., 565 in FIG. 9b) may be arranged spaced apart from each other in the circumferential direction of the connecting member (e.g., 564 in FIG. 9a).

An electronic device (e.g., 400 of FIG. 6B) according to one embodiment of the present disclosure includes a support member (e.g., 411 of FIG. 7A) including a mounting member (e.g., 4111 of FIG. 6A) in which a battery (e.g., 450 of FIG. 6A) is placed, and a mounting member (e.g., 4112 of FIG. 7A) formed such that a mounting member (e.g., 464 of FIG. 7A) is inserted at a position spaced from the mounting member (e.g., 4111 of FIG. 6A); a coupling body (e.g., 460 of FIG. 7A) including a buffer member (e.g., 463 of FIG. 7A) at least partially surrounding the battery (e.g., 450 of FIG. 6A) and having a hole (e.g., 468 of FIG. 7A) through which the mounting member (e.g., 464 of FIG. 7A) passes; And an elastic member (e.g., 465 of FIG. 7a) disposed at least partially inside the hole (e.g., 468 of FIG. 7a) to surround the coupling member (e.g., 464 of FIG. 7a), wherein the hole (e.g., 468 of FIG. 7a) includes a first hole region (e.g., 466 of FIG. 7a) in which a first gap (e.g., 466a of FIG. 7b) is formed between an outer surface of the coupling member (e.g., 464 of FIG. 7a) and the buffer portion (e.g., 463 of FIG. 7a); And a second hole region (e.g., 467 of FIG. 7a) may be formed between the outer surface of the connecting member (e.g., 464 of FIG. 7a) and the buffer portion (e.g., 463 of FIG. 7a) and which is larger than the first gap (e.g., 466a of FIG. 7b) and in which the elastic member (e.g., 465 of FIG. 7a) is positioned (e.g., 467 of FIG. 7a).

A buffer portion (e.g., 463 of FIG. 7a) according to one embodiment of the present disclosure may include a buffer body (e.g., 4633 of FIG. 7a) spaced apart from the coupling member (e.g., 464 of FIG. 7a).

A buffer portion (e.g., 463 of FIG. 7a) according to one embodiment of the present disclosure may include a protrusion (e.g., 4634 of FIG. 7a) protruding from the buffer body (e.g., 4633 of FIG. 7a) toward the coupling member (e.g., 464 of FIG. 7a).

An elastic member (e.g., 465 of FIG. 7a) according to one embodiment of the present disclosure may be positioned between at least a portion of the buffer portion (e.g., 463 of FIG. 7a) and the joining portion (e.g., 4112 of FIG. 7a).

According to one embodiment of the present disclosure, the height of the first hole region (e.g., 466 in FIG. 7a) may be smaller than the height of the second hole region (e.g., 467 in FIG. 7a).

A joining member (e.g., 464 of FIG. 7a) according to one embodiment of the present disclosure may include a first body portion (e.g., 4641 of FIG. 7a) positioned within the first hole region (e.g., 466 of FIG. 7a).

A joining member (e.g., 464 of FIG. 7a) according to one embodiment of the present disclosure may include a second body portion (e.g., 4642 of FIG. 7a) positioned within the second hole region (e.g., 467 of FIG. 7a).

A coupling member (e.g., 464 of FIG. 7a) according to one embodiment of the present disclosure may include a fixing member (e.g., 4643 of FIG. 7a) having threads formed and inserted into a coupling hole (e.g., 4112a of FIG. 7a) formed in the coupling portion (e.g., 4112 of FIG. 7a).

Although the detailed description of this document has described specific embodiments, it will be apparent to those skilled in the art that various modifications may be made without departing from the scope of this document.

101: Electronic Devices
400: Electronic devices
410: Housing
411: Absence of support
450: Battery
460: Combined body
463: Buffer section
464: Absence of joint
465: Elastic member

Claims (20)

In electronic devices,
A support member (411) including a mounting portion (4111) in which a battery (450) is placed and a joining portion (4112) formed so that a joining member (464) is inserted at a position spaced from the mounting portion (4111);
A bonding body (460) including a buffer portion (463) that surrounds at least a portion of the battery (450) and has a hole (468) formed through which the bonding member (464) passes; and
An electronic device including an elastic member (465) arranged so as to surround at least a portion of the coupling member (464) within the hole (468).
In the first paragraph,
An electronic device in which at least a portion of the above-described connecting member (464) is spaced apart from the above-described buffer portion (463) to form a gap (466a, 467a), and the above-described elastic member (465) is positioned inside the gap (466a, 467a).
In any one of paragraphs 1 and 2,
The above hole (468) is
A first hole area (466) including a first gap (466a) formed between the above-mentioned connecting member (464) and the above-mentioned buffer portion (463); and
An electronic device including a second hole region (467) formed between the above-described joining member (464) and the above-described buffer portion (463) and including a second gap (467a) in which the above-described elastic member (465) is placed.
In any one of claims 1 to 3,
The above buffer portion (463) is
A buffer body (4633) spaced apart from the above-mentioned connecting member (464); and
It includes a protrusion (4634) protruding from the above buffer body (4633) toward the above connecting member (464),
The above elastic member (465) is
An electronic device positioned between the above protrusion (4634) and the above joining portion (4112).
In any one of claims 1 to 4,
The above support member (411) is
Plate (4113);
A coupling hole outer wall (4112b) protruding from the above plate (4113) toward the coupling body (460) and forming a coupling hole (4112a) on the inside; and
Including an outer wall end (4112c) facing the above buffer portion (463),
The above elastic member (465) is
An electronic device mounted on the outer wall section (4112c).
In any one of claims 1 to 5,
An electronic device in which the width of the first hole area (466) of the hole (468) in which the elastic member (465) is not arranged is smaller than the width of the second hole area (467) of the hole (468) in which the elastic member (465) is arranged.
In any one of claims 1 to 6,
The above-mentioned connecting member (464) is
A first body part (4641) spaced apart from the above buffer part (463);
A second body part (4642) connected to the first body part (4641) and surrounded by the elastic member (465); and
An electronic device including a fixed portion (4643) connected to the second body portion (4642) and inserted into the connecting portion (4112).
In any one of paragraphs 1 to 7,
An electronic device in which the width of the joining hole (4112a) of the supporting member (4112) into which the joining member (464) is inserted is smaller than the width of the hole (468) surrounded by the elastic member (465).
In any one of claims 1 to 8,
The above-mentioned connecting member (464) is
A screw comprising a threaded member,
An electronic device in which the screw thread of the above-mentioned connecting member (464) is formed on a part of the above-mentioned connecting member (464) that is inserted into the above-mentioned connecting portion (4112).
In any one of claims 1 to 9,
The above hole (468) is
A first hole area (466) including a first gap (466a) formed between the above-mentioned connecting member (464) and the above-mentioned buffer portion (463); and
It includes a second hole area (467) in which the elastic member (465) is placed between the above-mentioned connecting member (464) and the above-mentioned buffer portion (463),
An electronic device in which the height of the first hole area (466) is smaller than the height of the second hole area (467).
In any one of claims 1 to 10,
An electronic device in which the elastic force of the elastic member (465) is greater than the elastic force of the buffer portion (463).
In any one of claims 1 to 11,
The above joint part (4112) is
An electronic device in which a plurality of devices are arranged symmetrically based on the above-mentioned mounting portion (4111).
In any one of claims 1 to 12,
The above elastic member (465) is
A cylindrical electronic device surrounding the above-mentioned connecting member (464).
In any one of claims 1 to 13,
The above elastic member (565) is
An electronic device having an arch shape, at least a portion of which is positioned within the hole (568) to be in contact with the joining member (564).
In Article 14,
The above elastic member (565) is
An electronic device in which a plurality of devices are arranged spaced apart from each other in the circumferential direction of the above-mentioned connecting member (564).
In electronic devices,
A support member (411) including a mounting portion (4111) in which a battery (450) is placed and a joining portion (4112) formed so that a joining member (464) is inserted at a position spaced from the mounting portion (4111);
A bonding body (460) including a buffer portion (463) that surrounds at least a portion of the battery (450) and has a hole (468) formed through which the bonding member (464) passes; and
An elastic member (465) is included, at least part of which is arranged to surround the connecting member (464) within the hole (468).
The above hole (468) is
A first hole area (466) in which a first gap (466a) is formed between the outer surface of the above-mentioned connecting member (464) and the above-mentioned buffer portion (463); and
An electronic device including a second hole area (467) in which a second gap (467a) is formed between the outer surface of the above-mentioned connecting member (464) and the above-mentioned buffer portion (463), which is larger than the above-mentioned first gap (466a) and in which the above-mentioned elastic member (465) is positioned.
In Article 16,
The above buffer portion (463) is
A buffer body (4633) spaced apart from the above-mentioned connecting member (464); and
An electronic device including a protrusion (4634) protruding from the above buffer body (4633) toward the above coupling member (464).
In any one of Articles 16 to 17,
The above elastic member (465) is
An electronic device positioned between at least a portion of the above buffer portion (463) and the above joining portion (4112).
In any one of Articles 16 to 18,
An electronic device in which the height of the first hole area (466) is smaller than the height of the second hole area (467).
In any one of Articles 16 to 19,
The above-mentioned connecting member (464) is
A first body part (4641) located within the first hole area (466);
A second body part (4642) located within the second hole area (467); and
An electronic device including a fixing part (4643) having a screw thread formed and inserted into a joining hole (4112a) formed in the above joining part (4112).

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