KR20240124551A - Antenna module and manufacturing method thereof - Google Patents

Abstract

The present disclosure is a technology for manufacturing an antenna module by first bonding a first antenna substrate and a second antenna substrate through an adhesive substrate, and secondly bonding the first antenna substrate and the second antenna substrate through a fusion process.

Description

{ANTENNA MODULE AND MANUFACTURING METHOD THEREOF}

The present invention relates to a technology for an antenna module including two or more antennas for transmitting and receiving signals of different frequency bands and a method for manufacturing the same.

The mobile terminal is equipped with a wireless charging function. Wireless charging charges the battery built into the mobile terminal through wireless power transfer between the mobile terminal and the wireless power transmission coil mounted on the charger.

Recently, high-power wireless power transmission technology of 20W or more is being developed and applied for high-speed wireless charging of mobile devices.

Manufacturers are using various types of antennas for high-power wireless power transmission. For example, manufacturers are using heterojunction combo antennas that combine a coil for wireless power transmission and a printed circuit board type antenna as antennas for high-power wireless power transmission.

However, conventional heterojunction combo antennas have a problem in that the defect rate increases as the bonding strength decreases during the provision process.

The matters described in the background technology above are intended to help understand the background of the invention and may include matters that are not publicly available prior art.

Korean Patent No. 10-2137633

The present invention has been proposed to solve the above-mentioned problem, and aims to provide an antenna module and a method for manufacturing the same by first bonding a first antenna substrate and a second antenna substrate through an adhesive substrate, and secondly bonding the first antenna substrate and the second antenna substrate through a fusion process.

In order to achieve the above-described purpose, an antenna module according to an embodiment of the present invention includes a first antenna substrate having a coil formed thereon, a second antenna substrate having a bonding pattern formed thereon and disposed on an upper portion of the first antenna substrate and bonded to the coil, and an adhesive substrate having a bonding hole formed thereon and overlapping the bonding pattern and interposed between the first antenna substrate and the second antenna substrate.

The first antenna substrate includes a first sheet having a first jig hole formed therein, a first coil forming a first loop wound on an upper surface of the first sheet, and a second coil forming a second loop wound on an upper surface of the first sheet, wherein the first coil can be arranged in an inner peripheral area of the second loop.

The second antenna substrate may include a first base substrate disposed on an upper portion of the first sheet and having a second jig hole formed therein that overlaps the first jig hole, a first bonding pattern disposed on an upper surface of the first base substrate and connected to a first end of the first coil, a second bonding pattern disposed on an upper surface of the first base substrate to be spaced apart from the first bonding pattern and connected to a second end of the first coil, a third bonding pattern disposed on an upper surface of the first base substrate to be spaced apart from the first bonding pattern and the second bonding pattern and connected to the first end of the second coil, and a fourth bonding pattern disposed on an upper surface of the first base substrate to be spaced apart from the first to third bonding patterns and connected to the second end of the second coil.

The adhesive substrate may be formed with a first bonding hole penetrating the adhesive substrate and overlapping the first end of the first coil and the first bonding pattern, a second bonding hole penetrating the adhesive substrate and overlapping the second end of the first coil and the second bonding pattern, a third bonding hole penetrating the adhesive substrate and overlapping the first end of the second coil and the third bonding pattern, and a fourth bonding hole penetrating the adhesive substrate and overlapping the second end of the second coil and the fourth bonding pattern. The adhesive substrate may further be formed with a third jig hole overlapping the first jig hole and the second jig hole.

The first antenna substrate includes a first sheet having a first jig hole and a second jig hole formed therein, a first coil formed by winding on an upper surface of the first sheet to form a first loop, a second coil disposed on an upper surface of the first sheet, and a third coil formed by winding on an upper surface of the first sheet to form a second loop, wherein the first coil and the second coil can be disposed on an inner peripheral region of the second loop.

An antenna module according to an embodiment of the present invention further includes a connecting member arranged on an upper surface of a first antenna member, wherein the connecting member includes a base member having a third jig hole formed thereon, the third jig hole overlapping the first jig hole, and a connecting pattern arranged on an upper surface of the base member and configured to connect the first coil and the second coil, wherein a first end of the connecting pattern can be connected to a first end of the first coil, and a second end of the connecting pattern can be connected to a first end of the second coil.

The second antenna substrate may include a first base substrate disposed on an upper portion of the first sheet and having a third jig hole formed therein that overlaps the second jig hole, a first bonding pattern disposed on an upper surface of the first base substrate and connected to a second end of the first coil, a second bonding pattern disposed on an upper surface of the first base substrate to be spaced apart from the first bonding pattern and connected to the second end of the second coil, a third bonding pattern disposed on an upper surface of the first base substrate to be spaced apart from the first bonding pattern and the second bonding pattern and connected to the first end of the third coil, and a fourth bonding pattern disposed on an upper surface of the first base substrate to be spaced apart from the first to third bonding patterns and connected to the second end of the third coil.

The adhesive substrate may be formed with a first bonding hole penetrating the adhesive substrate and overlapping the second end of the first coil and the first bonding pattern, a second bonding hole penetrating the adhesive substrate and overlapping the second end of the second coil and the second bonding pattern, a third bonding hole penetrating the adhesive substrate and overlapping the first end of the third coil and the third bonding pattern, and a fourth bonding hole penetrating the adhesive substrate and overlapping the second end of the third coil and the fourth bonding pattern.

The first antenna substrate and the second antenna substrate can be configured to be first bonded by an adhesive substrate and secondly bonded through fusion of the coil and the bonding pattern.

In order to achieve the above object, a method for manufacturing an antenna module according to an embodiment of the present invention may include a step of preparing a first antenna substrate having a coil formed thereon, a step of preparing a second antenna substrate having a bonding pattern formed thereon, a step of preparing an adhesive substrate having a bonding hole formed thereon, a step of mounting the first antenna substrate on a jig, a step of mounting the adhesive substrate on the jig so as to be positioned on top of the first antenna substrate, a step of mounting the second antenna substrate on the jig so as to be positioned on top of the adhesive substrate, a step of firstly bonding the first antenna substrate, the adhesive substrate, and the second antenna substrate laminated on the jig, and a step of secondly bonding the first antenna substrate, the adhesive substrate, and the second antenna substrate bonded in the first bonding step.

In the first bonding step, the first antenna substrate, the adhesive substrate, and the second antenna substrate laminated on the jig are pressed so that the adhesive substrate can bond the first antenna substrate and the second antenna substrate.

In the secondary bonding step, the first antenna substrate, the adhesive substrate, and the second antenna substrate laminated on the jig can be fused to perform the secondary bonding of the adhesive substrate and the second antenna substrate.

In the second bonding step, the bonding pattern of the second antenna substrate can be heat-fused to bond the bonding pattern and the coil.

According to the present invention, the antenna module and the manufacturing method thereof have the effect of improving workability during antenna manufacturing and increasing the bonding strength of the first antenna substrate and the second antenna substrate by first bonding a first antenna substrate and a second antenna substrate through an adhesive substrate and then secondly bonding the first antenna substrate and the second antenna substrate through a fusion process.

In addition, the antenna module and the method for manufacturing the same have the effect of increasing the bonding strength of the first antenna substrate and the second antenna substrate by first bonding the first antenna substrate and the second antenna substrate through an adhesive substrate and then secondly bonding the first antenna substrate and the second antenna substrate through a fusion process, thereby increasing the alignment accuracy between the coil and the pattern.

In addition, the antenna module and its manufacturing method have the effect of minimizing the defect rate due to misalignment and increasing the yield by first bonding the first antenna substrate and the second antenna substrate through an adhesive substrate and then secondly bonding the first antenna substrate and the second antenna substrate through a fusion process.

In addition, the antenna module and its manufacturing method have the effect of minimizing changes in antenna performance due to misalignment by first bonding the first antenna substrate and the second antenna substrate through an adhesive substrate and then secondly bonding the first antenna substrate and the second antenna substrate through a fusion process.

FIG. 1 is an exploded perspective view illustrating an antenna module according to a first embodiment of the present invention.
FIG. 2 is a drawing for explaining the first antenna substrate of FIG. 1.
Figure 3 is a drawing for explaining the connection description of Figure 1.
FIGS. 4 and 5 are drawings for explaining the second antenna substrate of FIG. 1.
Figure 6 is a drawing for explaining the bonding pattern shown in Figures 4 and 5.
Fig. 7 is a drawing for explaining a modified example of the second antenna substrate of Fig. 1.
Figure 8 is a drawing for explaining the adhesive substrate of Figure 1.
FIG. 9 is a drawing for explaining the bonding of the first antenna substrate, the second antenna substrate, and the adhesive substrate of FIG. 1.
Figure 10 is an exploded perspective view illustrating an antenna module according to a second embodiment of the present invention.
Fig. 11 is a drawing for explaining the first antenna substrate of Fig. 10.
FIG. 12 and FIG. 13 are drawings for explaining the second antenna substrate of FIG. 10.
Fig. 14 is a drawing for explaining a modified example of the second antenna substrate of Fig. 10.
Figure 15 is a drawing for explaining the adhesive substrate of Figure 10.
FIG. 16 is a flow chart for explaining a method for manufacturing an antenna module according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

The examples are provided so that this invention will be more fully described to those skilled in the art, and the following examples may be modified in many different forms, and the scope of the present invention is not limited to the following examples. Rather, these examples are provided so that this disclosure will be more faithful and complete, and to fully convey the spirit of the present invention.

The terms used in this specification are used to describe particular embodiments and are not intended to limit the invention. Also, the singular form in this specification may include the plural form unless the context clearly indicates otherwise.

In the description of the embodiments, when each layer (film), region, pattern or structure is described as being formed "on" or "under" the substrate, each layer (film), region, pad or pattern, "on" and "under" include both being formed "directly" or "indirectly" via another layer. In addition, the principle is that the reference for each layer being on or under is based on the drawing.

The drawings are intended only to facilitate understanding of the invention and should not be construed as limiting the scope of the invention. In addition, the relative thickness, length, or relative size in the drawings may be exaggerated for convenience and clarity of explanation.

Referring to FIG. 1, an antenna module according to a first embodiment of the present invention is configured to include a first antenna substrate (100), a connection substrate (200), a second antenna substrate (300), and an adhesive substrate (400). At this time, the first antenna substrate (100) and the second antenna substrate (300) are first bonded by the adhesive substrate (400) and then secondarily bonded through a fusion process. The first antenna substrate (100) and the connection substrate (200) can be first bonded through an adhesive sheet (not shown) and then secondarily bonded through a fusion process. Here, the fusion process is exemplified as a thermal fusion process, and includes physically and electrically bonding the first antenna substrate (100) to the second antenna substrate (300) and the connection substrate (200).

Referring to FIG. 2, the first antenna substrate (100) includes a first sheet (110), a first coil (120), a second coil (130), and a third coil (140). At this time, the first coil (120) and the second coil (130) form a first radiating coil, and the third coil (140) forms a second radiating coil.

The first sheet (110) is composed of a coverlay film. The first sheet (110) is a film formed of a resin material, for example, formed of a resin material such as polyimide (PI) or polypropylene (PP).

A first sheet (110) is formed with a pair of first jig holes (112) for aligning a first antenna substrate (100) and a connecting substrate (200) in a manufacturing process of an antenna module, and a plurality of second jig holes (114) for aligning the first antenna substrate (100), the second antenna substrate (300), and the adhesive substrate (400). The first jig hole (112) and the second jig hole (114) are formed by penetrating the first sheet (110).

The first coil (120) is placed on the upper surface of the first sheet (110). As an example, the first coil (120) is a coil for wireless power transmission.

The first coil (120) is wound multiple times on the upper surface of the first sheet (110) to form a first loop. The first coil (120) is wound around an imaginary first winding axis that vertically penetrates the first sheet (110) to form a first loop. A first end (120a) of the first coil (120) is arranged in an inner peripheral region of the first loop. A second end (120b) of the first coil (120) is arranged in an outer peripheral region of the first loop.

The second coil (130) is placed on the upper surface of the first sheet (110) to form a first radiating coil together with the first coil (120). In this case, the first radiating coil is, for example, a coil for wireless power transmission.

The second coil (130) is arranged in the outer circumference area of the first loop formed by the first coil (120). The second coil (130) is spaced apart from the first loop by a predetermined distance and is arranged along the outer circumference of the first loop. The first end (130a) of the second coil (130) is arranged adjacent to the first end (120a) of the first coil (120), and the second end (130b) of the second coil (130) is arranged adjacent to the second end (120b) of the first coil (120). At this time, the straight-line distance between the second end (130b) of the second coil (130) and the first end (120a) of the first coil (120) is, for example, shorter than the straight-line distance between the second end (130b) of the second coil (130) and the second end (120b) of the first coil (120).

The third coil (140) is disposed on the upper surface of the first sheet (110). The third coil (140) is disposed so as to be spaced apart from the first coil (120) on the upper surface of the first sheet (110). The third coil (140) is disposed in the outer peripheral area of the first loop formed by the first coil (120). In other words, the first loop formed by the first coil (120) is disposed in the inner peripheral area of the second loop formed by the third coil (140). Here, the third coil (140) forms a second radiating coil, and as an example, the second radiating coil is a coil for short-range communication.

The third coil (140) is wound at least once on the upper surface of the first sheet (110) to form a second loop. The third coil (140) is wound around a virtual second winding axis that vertically penetrates the first sheet (110) to form a second loop. At this time, the second winding axis may be the same axis as the first winding axis. The first end (140a) of the third coil (140) is arranged in the inner peripheral region of the second loop. The second end (140b) of the third coil (140) is arranged in the outer peripheral region of the second loop.

The connecting material (200) is placed on the upper surface of the first sheet (110). The connecting material (200) electrically connects the first end (120a) of the first coil (120) and the first end (130a) of the second coil (130). The connecting material (200) can be first bonded to the antenna material through an adhesive sheet (not shown) and then secondarily bonded through fusion.

Referring to FIG. 3, the connecting material (200) is configured to include a first base material (210) and a first connecting pattern (220).

The first base substrate (210) is composed of a printed circuit board. A pair of third jig holes (212) are formed in the first base substrate (210) to align the first antenna substrate (100) and the connection substrate (200). The pair of third jig holes (212) are formed by penetrating the first base substrate (210) and are formed at positions corresponding to the pair of first jig holes (112) formed in the first sheet (110). The pair of third jig holes (212) overlap the pair of first jig holes (112) as the connection substrate (200) is placed on the upper surface of the first antenna substrate (100), thereby forming a pair of jig holes through which a guide protrusion of the jig penetrates.

The first connection pattern (220) is arranged on the lower surface of the first base substrate (210). The first connection pattern (220) is formed on the lower surface of the first base substrate (210) through a printing process. Here, the lower surface of the first base substrate (210) is a surface that faces the upper surface of the first antenna substrate (100) (i.e., the upper surface of the first sheet (110)) when the connection substrate (200) is arranged on the upper surface of the first antenna substrate (100).

A first end (220a) of a first connection pattern (220) is electrically connected to a first end (120a) of a first coil (120). A second end (220b) of a first connection pattern (220) is electrically connected to a first end (130a) of a second coil (130). Through this, the first connection pattern (220) electrically connects the first coil (120) and the second coil (130) to form a coil for wireless power transmission together with the first coil (120) and the second coil (130).

Referring to FIGS. 4 and 5, the second antenna substrate (300) is configured to include a second base substrate (310), a terminal pattern (320), a bonding pattern (330), a second connection pattern (342), a third connection pattern (344), a fourth connection pattern (346), and a fifth connection pattern (348).

The second base substrate (310) is composed of a flexible printed circuit board (FPCB). The second base substrate (310) may be formed of the same material as the first base substrate (210) or may be formed of a different material.

A plurality of fourth jig holes (312) are formed in the second base substrate (310) to align the first antenna substrate (100), the second antenna substrate (300), and the adhesive substrate (400) in the manufacturing process of the antenna module. At this time, one or more fourth jig holes (312) are formed by penetrating the second base substrate (310), and are formed at positions corresponding to the plurality of second jig holes (114) formed in the first sheet (110). The plurality of fourth jig holes (312) overlap with the plurality of second jig holes (114) as the second antenna substrate (300) is placed on the upper surface of the first antenna substrate (100), thereby forming a plurality of jig holes through which the guide protrusions of the jig penetrate.

The terminal pattern (320) is a terminal that connects the first radiating coil formed by the first coil (120) and the second coil (130) and the second radiating coil formed by the third coil (140) to the outside. The terminal pattern (320) may be configured to include at least one of an upper terminal pattern (320) arranged on the upper surface of the second base substrate (310) and a lower terminal pattern (320) arranged on the lower surface of the second base substrate (310).

As an example, the terminal pattern (320) is configured to include a first terminal pattern (322), a second terminal pattern (324), a third terminal pattern (326), and a fourth terminal pattern (328). The first terminal pattern (322) to the fourth terminal pattern (328) are arranged to be spaced apart from each other by a predetermined interval.

The first terminal pattern (322) is connected to the second connection pattern (342). The first terminal pattern (322) may be configured to include a first upper terminal pattern (322a) arranged on an upper surface of the second base substrate (310) and a first lower terminal pattern (322b) arranged on a lower surface of the second base substrate (310). The first upper terminal pattern (322a) and the first lower terminal pattern (322b) are arranged to overlap with the second base substrate (310) interposed therebetween, and are electrically connected through a via hole. At this time, the first terminal pattern (322) may be configured as one of the first upper terminal pattern (322a) and the first lower terminal pattern (322b).

The second terminal pattern (324) is connected to the third connection pattern (344). The second terminal pattern (324) may be configured to include a second upper terminal pattern (324a) arranged on an upper surface of the second base substrate (310) and a second lower terminal pattern (324b) arranged on a lower surface of the second base substrate (310). The second upper terminal pattern (324a) and the second lower terminal pattern (324b) are arranged to overlap with the second base substrate (310) interposed therebetween, and are electrically connected through a via hole. At this time, the second terminal pattern (324) may also be configured as one of the second upper terminal pattern (324a) and the second lower terminal pattern (324b).

The third terminal pattern (326) is connected to the fourth connection pattern (346). The third terminal pattern (326) may be configured to include a third upper terminal pattern (326a) arranged on an upper surface of the second base substrate (310) and a third lower terminal pattern (326b) arranged on a lower surface of the second base substrate (310). The third upper terminal pattern (326a) and the third lower terminal pattern (326b) are arranged to overlap with the second base substrate (310) interposed therebetween, and are electrically connected through a via hole. At this time, the third terminal pattern (326) may also be configured as one of the third upper terminal pattern (326a) and the third lower terminal pattern (326b).

The fourth terminal pattern (328) is connected to the fifth connection pattern (348). The fourth terminal pattern (328) may be configured to include a fourth upper terminal pattern (328a) arranged on an upper surface of the second base substrate (310) and a fourth lower terminal pattern (328b) arranged on a lower surface of the second base substrate (310). The fourth upper terminal pattern (328a) and the fourth lower terminal pattern (328b) are arranged to overlap with the second base substrate (310) interposed therebetween, and are electrically connected through a via hole. At this time, the fourth terminal pattern (328) may also be configured as one of the fourth upper terminal pattern (328a) and the fourth lower terminal pattern (328b).

The bonding pattern (330) is a pattern that connects the first radiating coil and the second radiating coil to the terminal pattern (320). The bonding pattern (330) may be configured to include an upper bonding pattern (330a) arranged on the upper surface of the second base substrate (310) and a lower bonding pattern (330b) arranged on the lower surface of the second base substrate (310).

The first bonding pattern (330) connects the second end (120b) of the first coil (120) and the first terminal pattern (322). That is, the first bonding pattern (330) is connected to the second bonding pattern (342) and electrically connected to the second end (120b) of the first coil (120), thereby electrically connecting the second end (120b) of the first coil (120) and the first terminal pattern (322).

The first bonding pattern (330) is configured to include a first upper bonding pattern (332a) arranged on the upper surface of the second base substrate (310) and a first lower bonding pattern (332b) arranged on the lower surface of the second base substrate (310). The first upper bonding pattern (332a) and the first lower bonding pattern (332b) are arranged to overlap with the second base substrate (310) interposed therebetween, and are electrically connected through via holes.

The second bonding pattern (330) connects the second end (130b) of the second coil (130) and the second terminal pattern (324). That is, the second bonding pattern (330) is connected to the third bonding pattern (344) and electrically connected to the second end (130b) of the second coil (130), thereby electrically connecting the second end (130b) of the second coil (130) and the second terminal pattern (324).

The second bonding pattern (330) is configured to include a second upper bonding pattern (334a) arranged on the upper surface of the second base substrate (310) and a second lower bonding pattern (334b) arranged on the lower surface of the second base substrate (310). The second upper bonding pattern (334a) and the second lower bonding pattern (334b) are arranged to overlap with the second base substrate (310) interposed therebetween, and are electrically connected through via holes.

The third bonding pattern (330) connects the first end (140a) of the third coil (140) and the third terminal pattern (326). That is, the third bonding pattern (330) is connected to the fourth bonding pattern (346) and electrically connected to the first end (140a) of the third coil (140), thereby electrically connecting the first end (140a) of the third coil (140) and the third terminal pattern (326).

The third bonding pattern (330) is configured to include a third upper bonding pattern (336a) arranged on the upper surface of the second base substrate (310) and a third lower bonding pattern (336b) arranged on the lower surface of the second base substrate (310). The third upper bonding pattern (336a) and the third lower bonding pattern (336b) are arranged to overlap with the second base substrate (310) interposed therebetween, and are electrically connected through via holes.

The fourth bonding pattern (330) connects the second end (140b) of the third coil (140) and the fourth terminal pattern (328). That is, the fourth bonding pattern (330) is connected to the fifth bonding pattern (348) and electrically connected to the second end (140b) of the third coil (140), thereby electrically connecting the second end (140b) of the third coil (140) and the fourth terminal pattern (328).

The fourth bonding pattern (330) is configured to include a fourth upper bonding pattern (338a) arranged on the upper surface of the second base substrate (310) and a fourth lower bonding pattern (338b) arranged on the lower surface of the second base substrate (310). The fourth upper bonding pattern (338a) and the fourth lower bonding pattern (338b) are arranged to overlap with the second base substrate (310) interposed therebetween, and are electrically connected through via holes.

The bonding pattern (330) is a bonding point of a thermal bonding process that secondarily bonds the first antenna substrate (100) and the second antenna substrate (300) that were first bonded by the adhesive substrate (400). That is, the first antenna substrate (100) and the second antenna substrate (300) are secondarily bonded and electrically connected through a thermal bonding process for the bonding pattern (330).

Referring to FIG. 6, the upper bonding pattern (330a) and the lower bonding pattern (330b) are connected through a via hole (V). The upper bonding pattern (330a) and the lower bonding pattern (330b) have a structure in which a first metal layer (M1) and a second metal layer (M2) are laminated. The first metal layer (M1) is, for example, copper (cu), which is mainly used as a metal pattern. The second metal layer (M2) is a metal layer for facilitating fusion, and is, for example, gold (Au).

Meanwhile, the first terminal pattern (322) to the fourth terminal pattern (328) and the second connection pattern (342) to the fifth connection pattern (348) are composed only of the first metal layer (M1).

The second connection pattern (342) is arranged on the upper surface of the second base substrate (310). The first end of the second connection pattern (342) is connected to the first terminal pattern (322), and the second end of the second connection pattern (342) is connected to the first bonding pattern (330). Accordingly, the second connection pattern (342) connects the first terminal pattern (322) and the first bonding pattern (330).

The third connection pattern (344) is arranged on the upper surface of the second base substrate (310), but is arranged so as to be spaced apart from the second connection pattern (342). The first end of the third connection pattern (344) is connected to the second terminal pattern (324), and the second end of the third connection pattern (344) is connected to the second bonding pattern (330). Accordingly, the third connection pattern (344) connects the second terminal pattern (324) and the second bonding pattern (330).

The fourth connection pattern (346) is arranged on the upper surface of the second base substrate (310), but is arranged so as to be spaced apart from the second connection pattern (342) and the third connection pattern (344). The first end of the fourth connection pattern (346) is connected to the third terminal pattern (326), and the second end of the fourth connection pattern (346) is connected to the third bonding pattern (330). Accordingly, the fourth connection pattern (346) connects the third terminal pattern (326) and the third bonding pattern (330).

The fifth connection pattern (348) is arranged on the upper surface of the second base substrate (310), but is arranged so as to be spaced apart from the second connection pattern (342) to the fourth connection pattern (346). The first end of the fifth connection pattern (348) is connected to the fourth terminal pattern (328), and the second end of the fifth connection pattern (348) is connected to the fourth bonding pattern (330). Accordingly, the fifth connection pattern (348) connects the fourth terminal pattern (328) and the fourth bonding pattern (330).

Meanwhile, in FIGS. 4 and 5, the pattern is simplified and illustrated for easy explanation of the second antenna substrate (300), but it is not limited thereto and may further include an additional terminal pattern (320), an antenna pattern, a thermistor connection pattern, etc. as illustrated in FIG. 7, or may be configured in various modified forms.

An adhesive substrate (400) is interposed between the first antenna substrate (100) and the second antenna substrate (300). The adhesive substrate (400) is a substrate that primarily bonds the first antenna substrate (100) and the second antenna substrate (300). For example, the thickness of the adhesive substrate (400) is approximately 1 ㎛ or more and 20 ㎛ or less.

Referring to FIG. 8, one or more fifth jig holes (410) are formed in the adhesive substrate (400). The fifth jig holes (410) are formed by penetrating the adhesive substrate (400), and are formed at positions corresponding to a plurality of second jig holes (114) formed in the first sheet (110) and a plurality of fourth jig holes (312) formed in the second base substrate (310). The plurality of fifth jig holes (410) overlap with the plurality of second jig holes (114) and the plurality of fourth jig holes (312) as the adhesive substrate (400) is interposed between the first antenna substrate (100) and the second antenna substrate (300), thereby forming a plurality of jig holes through which guide protrusions of the jig penetrate.

A plurality of bonding holes (430) are formed in the adhesive substrate (400). As an example, a first bonding hole (432), a second bonding hole (434), a third bonding hole (436), and a fourth bonding hole (438) are formed in the adhesive substrate (400).

The first bonding hole (432) is formed by penetrating the adhesive substrate (400). The first bonding hole (432) is formed at a position corresponding to the first bonding pattern (330). As the adhesive substrate (400) is interposed between the first antenna substrate (100) and the second antenna substrate (300), the first bonding hole (432) exposes the first bonding pattern (330) so that the first bonding pattern (330) and the second end (120b) of the first coil (120) face each other. At this time, the first bonding pattern (330) is exposed through the first bonding hole (432) and faces the second end (120b) of the first coil (120), and the first bonding pattern (330) and the second end (120b) of the first coil (120) are secondarily bonded through a heat fusion process.

The second bonding hole (434) is formed by penetrating the adhesive substrate (400). The second bonding hole (434) is formed at a position corresponding to the second bonding pattern (330). As the adhesive substrate (400) is interposed between the first antenna substrate (100) and the second antenna substrate (300), the second bonding hole (434) exposes the second bonding pattern (330) so that the second bonding pattern (330) and the second end (130b) of the second coil (130) face each other. At this time, the second bonding pattern (330) is exposed through the second bonding hole (434) and faces the second end (130b) of the second coil (130), and the second bonding pattern (330) and the second end (130b) of the second coil (130) are secondarily bonded through a heat fusion process.

The third bonding hole (436) is formed by penetrating the adhesive substrate (400). The third bonding hole (436) is formed at a position corresponding to the third bonding pattern (330). As the adhesive substrate (400) is interposed between the first antenna substrate (100) and the second antenna substrate (300), the third bonding hole (436) exposes the third bonding pattern (330) so that the third bonding pattern (330) and the first end (140a) of the third coil (140) face each other. At this time, the third bonding pattern (330) is exposed through the third bonding hole (436) and faces the first end (140a) of the third coil (140), and the third bonding pattern (330) and the first end (140a) of the third coil (140) are secondarily bonded through a heat fusion process.

The fourth bonding hole (438) is formed by penetrating the adhesive substrate (400). The fourth bonding hole (438) is formed at a position corresponding to the fourth bonding pattern (330). As the adhesive substrate (400) is interposed between the first antenna substrate (100) and the second antenna substrate (300), the fourth bonding hole (438) exposes the fourth bonding pattern (330) so that the fourth bonding pattern (330) and the second end (140b) of the third coil (140) face each other. At this time, the fourth bonding pattern (330) is exposed through the fourth bonding hole (438) and faces the second end (140b) of the third coil (140), and the fourth bonding pattern (330) and the second end (140b) of the third coil (140) are secondarily bonded through a heat fusion process.

Referring to FIG. 9, the first antenna substrate (100) and the second antenna substrate (300) are first bonded (temporarily bonded) by an adhesive substrate (400), and the bonding pattern (330) exposed through the bonding hole (430) of the adhesive substrate (400) and the end of the coil are secondarily bonded (thermally fused).

Referring to FIG. 10, the antenna module according to the second embodiment of the present invention is configured to include a first antenna substrate (500), a second antenna substrate (600), and an adhesive substrate (700). At this time, the first antenna substrate (500) and the second antenna substrate (600) are first bonded by the adhesive substrate (700) and then secondly bonded through a fusion process. The fusion process is, for example, a thermal fusion process, and includes physically and electrically bonding the first antenna substrate (500) to the second antenna substrate (600).

Referring to FIG. 11, the first antenna substrate (500) includes a first sheet (510), a first coil (520), and a second coil (530).

A plurality of first jig holes (512) are formed in the first sheet (510) to align the first antenna substrate (500), the second antenna substrate (600), and the adhesive substrate (700) in the manufacturing process of the antenna module. The first jig holes (512) are formed by penetrating the first sheet (510).

The first coil (520) is placed on the upper surface of the first sheet (510). As an example, the first coil (520) is a first radiating coil for wireless power transmission.

The first coil (520) is wound multiple times on the upper surface of the first sheet (510) to form a first loop. The first coil (520) is wound around an imaginary first winding axis that vertically penetrates the first sheet (510) to form a first loop. A first end (520a) of the first coil (520) is arranged in an inner peripheral region of the first loop. A second end (520b) of the first coil (520) is arranged in an outer peripheral region of the first loop.

The second coil (530) is disposed on the upper surface of the first sheet (510). The second coil (530) is disposed so as to be spaced apart from the first coil (520) on the upper surface of the first sheet (510). The second coil (530) is disposed in the outer peripheral region of the first loop formed by the first coil (520). In other words, the first loop formed by the first coil (520) is disposed in the inner peripheral region of the second loop formed by the second coil (530). Here, the second coil (530) forms a second radiating coil, and as an example, the second radiating coil is a coil for short-range communication.

The second coil (530) is wound at least once on the upper surface of the first sheet (510) to form a second loop. The second coil (530) is wound around a virtual second winding axis that vertically penetrates the first sheet (510) to form a second loop. At this time, the second winding axis may be the same axis as the first winding axis. The first end (530a) of the second coil (530) is arranged in the inner peripheral region of the second loop. The second end (530b) of the second coil (530) is arranged in the outer peripheral region of the second loop.

Referring to FIGS. 12 and 13, the second antenna substrate (600) is configured to include a first base substrate (610), a terminal pattern (620), a bonding pattern (640), a radiation pattern (650), a first connection pattern (632), a second connection pattern (634), a third connection pattern (636), and a fourth connection pattern (638).

The first base substrate (610) is composed of a flexible printed circuit board (FPCB). The first base substrate (610) includes a first region (A1) corresponding to the second base substrate of the first embodiment and a second region (A2) extending from the first region (A1) to form a radiation pattern (650).

A plurality of second jig holes (612) are formed in the first base substrate (610) to align the first antenna substrate (500), the second antenna substrate (600), and the adhesive substrate (700) in the manufacturing process of the antenna module. At this time, the plurality of second jig holes (612) are formed by penetrating the first base substrate (610), and are formed at positions corresponding to the plurality of first jig holes (512) formed in the first sheet (510). The plurality of second jig holes (612) overlap with the plurality of first jig holes (512) as the second antenna substrate (600) is placed on the upper surface of the first antenna substrate (500), thereby forming a plurality of jig holes through which the guide protrusions of the jig penetrate.

The terminal pattern (620) is a terminal that connects the first radiating coil, which is the first coil (520), and the second radiating coil formed by the second coil (530) and the radiating pattern (650), to the outside. The terminal pattern (620) may be configured to include at least one of an upper terminal pattern (620a) arranged on the upper surface of the first base substrate (610) and a lower terminal pattern (620b) arranged on the lower surface of the first base substrate (610).

As an example, the terminal pattern (620) is configured to include a first terminal pattern (622), a second terminal pattern (624), a third terminal pattern (626), and a fourth terminal pattern (628). The first terminal pattern (622) to the fourth terminal pattern (628) are arranged to be spaced apart from each other by a predetermined interval.

The first terminal pattern (622) is connected to the first connection pattern (632). The first terminal pattern (622) may be configured to include a first upper terminal pattern (622a) arranged on an upper surface of the first base substrate (610) and a first lower terminal pattern (622b) arranged on a lower surface of the first base substrate (610). The first upper terminal pattern (622a) and the first lower terminal pattern (622b) are arranged to overlap with the first base substrate (610) interposed therebetween, and are electrically connected through a via hole. At this time, the first terminal pattern (622) may be configured as one of the first upper terminal pattern (622a) and the first lower terminal pattern (622b).

The second terminal pattern (624) is connected to the second connection pattern (634). The second terminal pattern (624) may be configured to include a second upper terminal pattern (624a) arranged on an upper surface of the first base substrate (610) and a second lower terminal pattern (624b) arranged on a lower surface of the first base substrate (610). The second upper terminal pattern (624a) and the second lower terminal pattern (624b) are arranged to overlap with the first base substrate (610) interposed therebetween, and are electrically connected through a via hole. At this time, the second terminal pattern (624) may also be configured as one of the second upper terminal pattern (624a) and the second lower terminal pattern (624b).

The third terminal pattern (626) is connected to the third connection pattern (636). The third terminal pattern (626) may be configured to include a third upper terminal pattern (626a) arranged on an upper surface of the first base substrate (610) and a third lower terminal pattern (626b) arranged on a lower surface of the first base substrate (610). The third upper terminal pattern (626a) and the third lower terminal pattern (626b) are arranged to overlap with the first base substrate (610) interposed therebetween, and are electrically connected through a via hole. At this time, the third terminal pattern (626) may also be configured as one of the third upper terminal pattern (626a) and the third lower terminal pattern (626b).

The fourth terminal pattern (628) is connected to the fourth connection pattern (638). The fourth terminal pattern (628) may be configured to include a fourth upper terminal pattern (628a) arranged on an upper surface of the first base substrate (610) and a fourth lower terminal pattern (628b) arranged on a lower surface of the first base substrate (610). The fourth upper terminal pattern (628a) and the fourth lower terminal pattern (628b) are arranged to overlap with the first base substrate (610) interposed therebetween, and are electrically connected through a via hole. At this time, the fourth terminal pattern (628) may be configured as one of the fourth upper terminal pattern (628a) and the fourth lower terminal pattern (628b).

The bonding pattern (640) is a pattern that connects the first radiating coil and the second radiating coil to the terminal pattern (620). The bonding pattern (640) may be configured to include an upper bonding pattern (640a) arranged on the upper surface of the first base substrate (610) and a lower bonding pattern (640b) arranged on the lower surface of the first base substrate (610).

The first bonding pattern (642) is arranged in the first region (A1) of the first base substrate (610) to connect the second end (520b) of the first coil (520) and the first terminal pattern (622). That is, the first bonding pattern (642) is connected to the first connection pattern (632) and is electrically connected to the second end (520b) of the first coil (520), thereby electrically connecting the second end (520b) of the first coil (520) and the first terminal pattern (622).

The first bonding pattern (642) is configured to include a first upper bonding pattern (642a) arranged on the upper surface of the first base substrate (610) and a first lower bonding pattern (642b) arranged on the lower surface of the first base substrate (610). The first upper bonding pattern (642a) and the first lower bonding pattern (642b) are arranged to overlap with the first base substrate (610) interposed therebetween, and are electrically connected through via holes.

The second bonding pattern (644) is arranged in the second area (A2) of the first base substrate (610) to connect the first end (520a) of the first coil (520) and the second terminal pattern (624). That is, the second bonding pattern (644) is connected to the second connection pattern (634) and is electrically connected to the first end (520a) of the first coil (520), thereby electrically connecting the first end (520a) of the first coil (520) and the second terminal pattern (624).

The second bonding pattern (644) is configured to include a second upper bonding pattern (644a) arranged on the upper surface of the first base substrate (610) and a second lower bonding pattern (644b) arranged on the lower surface of the first base substrate (610). The second upper bonding pattern (644a) and the second lower bonding pattern (644b) are arranged to overlap with the first base substrate (610) interposed therebetween, and are electrically connected through via holes.

The third bonding pattern (646) is arranged in the first region (A1) of the first base substrate (610) to connect the first end (530a) of the second coil (530) and the first end of the third coil. That is, the third bonding pattern (646) is connected to the first end of the third coil and electrically connected to the first end (530a) of the second coil (530), thereby electrically connecting the first end (530a) of the second coil (530) and the first end of the third coil.

The third bonding pattern (646) is configured to include a third upper bonding pattern (646a) arranged on the upper surface of the first base substrate (610) and a third lower bonding pattern (646b) arranged on the lower surface of the first base substrate (610). The third upper bonding pattern (646a) and the third lower bonding pattern (646b) are arranged to overlap with the first base substrate (610) interposed therebetween, and are electrically connected through via holes.

The fourth bonding pattern (648) is arranged in the first region (A1) of the first base substrate (610) to connect the second end (530b) of the second coil (530) and the fourth terminal pattern (628). That is, the fourth bonding pattern (648) is connected to the fourth connection pattern (638) and electrically connected to the second end (530b) of the second coil (530), thereby electrically connecting the second end (530b) of the second coil (530) and the fourth terminal pattern (628).

The fourth bonding pattern (648) is configured to include a fourth upper bonding pattern (648a) arranged on the upper surface of the first base substrate (610) and a fourth lower bonding pattern (648b) arranged on the lower surface of the first base substrate (610). The fourth upper bonding pattern (648a) and the fourth lower bonding pattern (648b) are arranged to overlap with the first base substrate (610) interposed therebetween, and are electrically connected through via holes.

The bonding pattern (640) is a bonding point of a thermal bonding process that secondarily bonds the first antenna substrate (500) and the second antenna substrate (600) that were first bonded by the adhesive substrate (700). That is, the first antenna substrate (500) and the second antenna substrate (600) are secondarily bonded and electrically connected through a thermal bonding process for the bonding pattern (640).

The upper bonding pattern (640a) and the lower bonding pattern (640b) are connected through a via hole. The upper bonding pattern (640a) and the lower bonding pattern (640b) have a structure in which a first metal layer and a second metal layer are laminated (see FIG. 6). As an example, the first metal layer is copper (cu), which is mainly used as a metal pattern. The second metal layer is a metal layer for facilitating heat welding, and as an example, it is gold (Au).

The first terminal pattern (622) to the fourth terminal pattern (628) and the first connection pattern (632) to the fourth connection pattern (638) are composed only of the first metal layer.

The radiation pattern (650) is arranged on the upper surface of the first base substrate (610). The radiation pattern (650) is formed on the upper surface of the first base substrate (610) through a printing process. At this time, the radiation pattern (650) is arranged in the second area (A2) of the first base substrate (610).

The radiation pattern (650) is wound around a virtual third winding axis that vertically penetrates the first base substrate (610) to form a third loop. At this time, as the second antenna substrate (600) is placed on the upper surface of the first antenna substrate (500), the third loop is placed to overlap the inner peripheral area of the first loop.

The first end of the radiation pattern (650) is connected to the third bonding pattern (646), and the second end of the radiation pattern (650) is connected to the third terminal pattern (626) through the third connection pattern (636). At this time, the second end of the radiation pattern (650) is connected to the third connection pattern (636) by way of the lower surface of the first base substrate (610).

Through this, the radiation pattern (650) is electrically connected to the second coil (530) to form a second radiation coil (i.e., a coil for short-range communication) together with the second coil (530). At this time, the radiation pattern (650) is arranged in the inner region of the first loop formed by the first coil (520; i.e., the first radiation coil) and acts as an auxiliary radiator to minimize the shadow region of the second coil (530; i.e., the second radiation coil).

The first connection pattern (632) is arranged on the upper surface of the second base substrate. The first end of the first connection pattern (632) is connected to the first terminal pattern (622), and the second end of the first connection pattern (632) is connected to the first bonding pattern (642). Accordingly, the first connection pattern (632) connects the first terminal pattern (622) and the first bonding pattern (642).

The second connection pattern (634) is arranged on the upper surface of the second base substrate. The first end of the second connection pattern (634) is connected to the second terminal pattern (624), and the second end of the second connection pattern (634) is connected to the second bonding pattern (644). Accordingly, the second connection pattern (634) connects the second terminal pattern (624) and the second bonding pattern (644).

The third connection pattern (636) is arranged on the upper surface of the second base substrate. The first end of the third connection pattern (636) is connected to the third terminal pattern (626), and the second end of the third connection pattern (636) is connected to the second end of the radiation pattern (650). Accordingly, the third connection pattern (636) connects the third terminal pattern (626) and the radiation pattern (650).

The fourth connection pattern (638) is arranged on the upper surface of the second base substrate. The first end of the fourth connection pattern (638) is connected to the fourth terminal pattern (628), and the second end of the fourth connection pattern (638) is connected to the fourth bonding pattern (648). Accordingly, the fourth connection pattern (638) connects the fourth terminal pattern (628) and the fourth bonding pattern (648).

Meanwhile, in FIGS. 12 and 13, the pattern is simplified and illustrated for easy explanation of the second antenna substrate (600), but it is not limited thereto and may be configured to further include an additional terminal pattern (620), an antenna pattern, a thermistor connection pattern (630), etc. as illustrated in FIG. 14, or may be configured in various modified forms.

An adhesive substrate (700) is interposed between the first antenna substrate (500) and the second antenna substrate (600). The adhesive substrate (700) is a substrate that primarily bonds the first antenna substrate (500) and the second antenna substrate (600). For example, the thickness of the adhesive substrate (700) is approximately 1 ㎛ or more and 20 ㎛ or less.

Referring to FIG. 15, a plurality of third jig holes (710) are formed in the adhesive substrate (700). The third jig holes (710) are formed by penetrating the adhesive substrate (700). The third jig holes (710) are formed at positions corresponding to the plurality of first jig holes (512) formed in the first sheet (510) and the plurality of second jig holes (612) formed in the first base substrate (610). The plurality of third jig holes (710) overlap with the plurality of first jig holes (512) and the plurality of second jig holes (612) as the adhesive substrate (700) is interposed between the first antenna substrate (500) and the second antenna substrate (600), thereby forming a plurality of jig holes through which the guide protrusions of the jig penetrate.

A plurality of bonding holes (720) are formed in the adhesive substrate (700). As an example, a first bonding hole (722), a second bonding hole (724), a third bonding hole (726), and a fourth bonding hole (728) are formed in the adhesive substrate (700).

The first bonding hole (722) is formed by penetrating the adhesive substrate (700). The first bonding hole (722) is formed at a position corresponding to the first bonding pattern (642). As the adhesive substrate (700) is interposed between the first antenna substrate (500) and the second antenna substrate (600), the first bonding hole (722) exposes the first bonding pattern (642) so that the first bonding pattern (642) and the second end (520b) of the first coil (520) face each other. At this time, the first bonding pattern (642) is exposed through the first bonding hole (722) and faces the second end (520b) of the first coil (520), and the first bonding pattern (642) and the second end (520b) of the first coil (520) are secondarily bonded through a heat fusion process.

The second bonding hole (724) is formed by penetrating the adhesive substrate (700). The second bonding hole (724) is formed at a position corresponding to the second bonding pattern (644). As the adhesive substrate (700) is interposed between the first antenna substrate (500) and the second antenna substrate (600), the second bonding hole (724) exposes the second bonding pattern (644) so that the second bonding pattern (644) and the first end (520a) of the first coil (520) face each other. At this time, the second bonding pattern (644) is exposed through the second bonding hole (724) and faces the first end (520a) of the first coil (520), and the second bonding pattern (644) and the first end (520a) of the first coil (520) are secondarily bonded through a heat fusion process.

The third bonding hole (726) is formed by penetrating the adhesive substrate (700). The third bonding hole (726) is formed at a position corresponding to the third bonding pattern (646). As the adhesive substrate (700) is interposed between the first antenna substrate (500) and the second antenna substrate (600), the third bonding hole (726) exposes the third bonding pattern (646) so that the third bonding pattern (646) and the first end (530a) of the second coil (530) face each other. At this time, the third bonding pattern (646) is exposed through the third bonding hole (726) and faces the first end (530a) of the second coil (530), and the third bonding pattern (646) and the first end of the third coil are secondarily bonded through a heat fusion process.

The fourth bonding hole (728) is formed by penetrating the adhesive substrate (700). The fourth bonding hole (728) is formed at a position corresponding to the fourth bonding pattern (648). As the adhesive substrate (700) is interposed between the first antenna substrate (500) and the second antenna substrate (600), the fourth bonding hole (728) exposes the fourth bonding pattern (648) so that the fourth bonding pattern (648) and the second end (530b) of the second coil (530) face each other. At this time, the fourth bonding pattern (648) is exposed through the fourth bonding hole (728) and faces the second end (530b) of the second coil (530), and the fourth bonding pattern (648) and the second end (530b) of the second coil (530) are secondarily bonded through a heat fusion process.

The first antenna substrate (500) and the second antenna substrate (600) are first bonded (temporarily bonded) by an adhesive substrate (700), and the bonding pattern (640) exposed through the bonding hole (720) of the adhesive substrate (700) and the end of the coil are secondarily bonded (thermally fused).

Hereinafter, referring to FIG. 16, a method for manufacturing an antenna module according to a first embodiment of the present invention comprises a first antenna substrate preparation step (S110), a second antenna substrate preparation step (S120), an adhesive substrate preparation step (S130), a first antenna substrate mounting step (S140), an adhesive substrate mounting step (S150), a second antenna substrate mounting step (S160), a first and second antenna substrate primary bonding step (S170), and a first and second antenna substrate secondary bonding step (S180).

In the first antenna substrate preparation step (S110), a first antenna substrate is prepared in which one or more coils operating as a radiator are formed. In the first antenna substrate preparation step (S110), as an example, a first antenna substrate including a first sheet in which a plurality of jig holes are formed and one or more coils formed on the first sheet to form a radiating coil are prepared.

In the second antenna substrate preparation step (S120), as an example, a second antenna substrate is prepared, including a first base substrate having a plurality of jig holes formed thereon, a plurality of terminal patterns formed on the first base substrate, a plurality of bonding patterns formed on the first base substrate, and a plurality of connection patterns formed on the first base substrate and connecting the plurality of terminal patterns and the plurality of bonding patterns.

In the adhesive substrate preparation step (S130), an adhesive substrate having a plurality of jig holes and a plurality of bonding holes formed is prepared. At this time, the bonding holes are holes that expose the bonding pattern of the second antenna substrate.

In the first antenna substrate mounting step (S140), the first antenna substrate is mounted on a jig for manufacturing an antenna module. In the first antenna substrate mounting step (S140), the first antenna substrate is mounted on the jig such that a plurality of guide protrusions formed on the jig are inserted through a plurality of jig holes formed on the first antenna substrate.

In the adhesive substrate mounting step (S150), the adhesive substrate is mounted on a jig on which the first antenna substrate is mounted. In the adhesive substrate mounting step (S150), the adhesive substrate is mounted on the jig such that a plurality of guide protrusions formed on the jig are inserted through a plurality of jig holes formed on the adhesive substrate. Through the adhesive substrate mounting step (S150), the adhesive substrate is placed on the upper surface of the first antenna substrate. At this time, in the adhesive substrate mounting step (S150), the adhesive substrate is mounted on the jig such that the ends of the coils formed on the first antenna substrate overlap the joining holes formed on the adhesive substrate.

In the second antenna substrate mounting step (S160), the second antenna substrate is mounted on a jig on which the first antenna substrate and the adhesive substrate are mounted. In the second antenna substrate mounting step (S160), the second antenna substrate is mounted on the jig such that a plurality of guide protrusions formed on the jig are inserted through a plurality of jig holes formed on the second antenna substrate. Through the second antenna substrate mounting step (S160), the second antenna substrate is placed on the upper surface of the adhesive substrate. At this time, in the second antenna substrate mounting step (S160), the second antenna substrate is mounted on the jig such that the bonding pattern of the second antenna substrate overlaps the bonding holes formed on the adhesive substrate.

In the first bonding step (S170), the first antenna substrate, the adhesive substrate, and the second antenna substrate are sequentially laminated on the jig, and the second antenna substrate is first bonded (temporarily bonded) by applying pressure to the second antenna substrate. In the first bonding step (S170), the first antenna substrate and the second antenna substrate are first bonded by the adhesive substrate as the second antenna substrate is applied from above. At this time, through the first bonding step (S170), the ends of the coil formed on the first antenna substrate are arranged to face the bonding patterns formed on the second antenna substrate through the bonding holes.

In the second bonding step (S180), the first antenna substrate and the second antenna substrate that were first bonded through step S170 are bonded for the second time. In the second bonding step (S180), heat is applied to the bonding pattern of the second antenna substrate through a thermal fusion process to bond the ends of the coil formed on the first antenna substrate and the bonding patterns of the second antenna substrate.

The above description is merely an illustrative description of the technical idea of the present invention, and those skilled in the art will appreciate that various modifications and variations may be made without departing from the essential characteristics of the present invention. Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention but to explain it, and the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within a scope equivalent thereto should be interpreted as being included in the scope of the rights of the present invention.

100: 1st antenna substrate 110: 1st sheet
112: 1st jig hole 114: 2nd jig hole
120: 1st coil 130: 2nd coil
140: 3rd coil 200: Connection material
210: 1st base material 212: 3rd jig hole
220: First connection pattern 300: Second antenna description
310: 2nd base material 312: 4th jig hole
320: Terminal pattern 330: Bonding pattern
340: Connection pattern 400: Adhesive substrate
410: 5th jig hole 430: Joint hole
500: 1st antenna substrate 510: 1st sheet
512: 1st jig hole 520: 1st coil
530: Second coil 600: Second antenna substrate
610: 1st base material 612: 2nd jig hole
620: Terminal pattern 622: First terminal pattern
624: 2nd terminal pattern 626: 3rd terminal pattern
628: 4th terminal pattern 640: Bonding pattern
642: First bonding pattern 644: Second bonding pattern
646: Third joint pattern 648: Fourth joint pattern
650: Radiation pattern 630: Connection pattern
700: Adhesive substrate 710: Third jig hole
720: Joint hole

Claims (14)

A first antenna substrate having a coil formed thereon;
A second antenna substrate is formed on the upper portion of the first antenna substrate and has a bonding pattern bonded to the coil; and
An antenna module including a bonding hole overlapping the above bonding pattern and an adhesive substrate interposed between the first antenna substrate and the second antenna substrate. In the first paragraph,
The above first antenna description is,
A first sheet having a first jig hole formed therein;
A first coil forming a first loop that is wound on the upper surface of the first sheet; and
A second coil is included, which forms a second loop that is wound on the upper surface of the first sheet,
An antenna module in which the first coil is arranged in the inner region of the second loop. In the second paragraph,
The above second antenna material is,
A first base substrate arranged on the upper portion of the first sheet and having a second jig hole formed thereon, overlapping the first jig hole;
A first bonding pattern disposed on an upper surface of the first base substrate and connected to a first end of the first coil;
A second bonding pattern disposed on the upper surface of the first base substrate so as to be spaced apart from the first bonding pattern and connected to the second end of the first coil;
A third bonding pattern is arranged on the upper surface of the first base substrate so as to be spaced apart from the first bonding pattern and the second bonding pattern, and is connected to the first end of the second coil; and
An antenna module including a fourth bonding pattern arranged to be spaced apart from the first bonding pattern to the third bonding pattern on the upper surface of the first base substrate and connected to the second end of the second coil. In the third paragraph,
In the above adhesive material,
A first bonding hole penetrating the adhesive substrate and overlapping the first end of the first coil and the first bonding pattern;
A second bonding hole formed through the adhesive substrate and overlapping the second end of the first coil and the second bonding pattern;
A third bonding hole formed by penetrating the above adhesive substrate and overlapping the first end of the second coil and the third bonding pattern; and
An antenna module having a fourth bonding hole formed by penetrating the adhesive substrate and overlapping the second end of the second coil and the fourth bonding pattern. In paragraph 4,
In the above adhesive material,
An antenna module further comprising a third jig hole formed overlapping the first jig hole and the second jig hole. In the first paragraph,
The above first antenna description is,
A first sheet having a first jig hole and a second jig hole formed therein;
A first coil formed by winding on the upper surface of the first sheet to form a first loop;
A second coil arranged on the upper surface of the first sheet; and
A third coil is included that forms a second loop that is wound on the upper surface of the first sheet,
An antenna module in which the first coil and the second coil are arranged in the inner region of the second loop. In Article 6,
Further comprising a connecting material arranged on the upper surface of the first antenna material,
The above connection description is,
A base substrate having a third jig hole formed overlapping the first jig hole; and
A connection pattern is provided on the upper surface of the base material and configured to connect the first coil and the second coil,
An antenna module wherein a first end of the connection pattern is connected to a first end of the first coil, and a second end of the connection pattern is connected to a first end of the second coil. In Article 6,
The above second antenna material is,
A first base substrate formed with a third jig hole that is positioned on the upper portion of the first sheet and overlaps the second jig hole;
A first bonding pattern disposed on an upper surface of the first base substrate and connected to a second end of the first coil;
A second bonding pattern disposed on the upper surface of the first base substrate so as to be spaced apart from the first bonding pattern and connected to the second end of the second coil;
A third bonding pattern is arranged on the upper surface of the first base substrate so as to be spaced apart from the first bonding pattern and the second bonding pattern, and is connected to the first end of the third coil; and
An antenna module including a fourth bonding pattern arranged to be spaced apart from the first bonding pattern to the third bonding pattern on the upper surface of the first base substrate and connected to the second end of the third coil. In Article 8,
In the above adhesive material,
A first bonding hole penetrating the adhesive substrate and overlapping the second end of the first coil and the first bonding pattern;
A second bonding hole formed through the adhesive substrate and overlapping the second end of the second coil and the second bonding pattern;
A third bonding hole formed by penetrating the adhesive substrate and overlapping the first end of the third coil and the third bonding pattern; and
An antenna module having a fourth bonding hole formed by penetrating the adhesive substrate and overlapping the second end of the third coil and the fourth bonding pattern. In the first paragraph,
An antenna module configured such that the first antenna substrate and the second antenna substrate are first bonded by the adhesive substrate and secondly bonded through fusion of the coil and the bonding pattern. A step of preparing a first antenna substrate in which a coil is formed;
A step of preparing a second antenna substrate on which a bonding pattern is formed;
A step of preparing an adhesive substrate in which a bonding hole is formed;
Step of mounting the first antenna substrate on the jig;
A step of mounting the adhesive substrate on the jig, wherein the adhesive substrate is mounted so as to be positioned on top of the first antenna substrate;
A step of mounting the second antenna substrate on the jig, wherein the second antenna substrate is mounted so that the second antenna substrate is positioned on top of the adhesive substrate;
A step of first bonding the first antenna substrate, the adhesive substrate and the second antenna substrate laminated on the jig; and
A method for manufacturing an antenna module, comprising a step of secondarily bonding the first antenna substrate, the adhesive substrate, and the second antenna substrate that were bonded in the first bonding step. In Article 11,
In the above first bonding step,
A method for manufacturing an antenna module, wherein the first antenna substrate, the adhesive substrate, and the second antenna substrate laminated on the jig are pressed so that the adhesive substrate bonds the first antenna substrate and the second antenna substrate. In Article 11,
In the above second bonding step,
A method for manufacturing an antenna module, comprising fusing the first antenna substrate, the adhesive substrate, and the second antenna substrate laminated on the jig to secondarily bond the adhesive substrate and the second antenna substrate. In Article 11,
In the above second bonding step,
A method for manufacturing an antenna module by heat-melting a bonding pattern of the second antenna substrate to bond the bonding pattern and the coil.

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