KR20240108365A - Organic Light Emitting Display Device - Google Patents

Abstract

An organic light emitting display device according to an embodiment of the present invention includes a flexible substrate, a thin film transistor on the substrate, a first protective layer on the thin film transistor, a planarization layer on the first protective layer, and an organic light emitting element on the planarization layer. and a second protective layer covering a bank, a spacer on the bank, a thin film transistor, and an area where an organic light emitting element is disposed, the bank being made of a black material, and the outer portion of the second protective layer on the first protective layer. It includes structures arranged to surround and spaced apart, and the structure is composed of a stack of the same material as the bank and the same material as one of the planarization layer and spacer, thereby improving the external visibility of the organic light emitting display device and reducing the width of the bezel area. there is.

Description

Organic Light Emitting Display Device

The present invention relates to an organic light emitting display device, and more specifically, to an organic light emitting display device with an improved encapsulation structure.

As we enter the full-fledged information age, the field of flat panel displays that visually display electrical information signals is developing rapidly, and research is continuing to develop performance such as thinner, lighter, and lower power consumption for various flat panel displays. .

Representative flat panel display devices include Liquid Crystal Display device (LCD), Plasma Display Panel device (PDP), Field Emission Display device (FED), and Electrowetting display device. Wetting Display device (EWD) and Organic Light Emitting Display Device (OLED).

Among them, the organic light emitting display device is a self-emitting display device, and unlike the liquid crystal display device, it does not require a separate light source and can be manufactured in a lightweight and thin form. In addition, organic light emitting display devices are not only advantageous in terms of power consumption due to low voltage operation, but also have excellent color reproduction, response speed, viewing angle, and contrast ratio (CR), so they are expected to be utilized in various fields.

The organic light emitting display device places an emissive layer (EML) made of organic material between two electrodes, an anode and a cathode, injects holes from the anode into the light emitting layer, and injects electrons into the light emitting layer. ) is injected from the cathode into the light-emitting layer, the injected electrons and holes recombine with each other to form excitons and generate light. At this time, the light emitting layer contains a host material and a dopant material, and the interaction of the two materials is used. At this time, the host generates excitons from electrons and holes and plays a role in transferring energy to the dopant, and the dopant is a dye-based organic material added in a small amount and serves to receive energy from the host and convert it into light.

Generally, an organic light emitting display device arranges an injection layer or a transport layer between an anode and a light emitting layer and between a cathode and a light emitting layer to allow holes and electrons to move smoothly from the anode and cathode to the light emitting layer.

In this way, an organic light emitting display device containing a light emitting layer using an organic material is encapsulated by covering the organic light emitting display device using glass, metal, or film to prevent moisture or oxygen from the outside. It prevents oxidation of the light-emitting layer and electrode by blocking inflow, and protects the organic light-emitting display device from external mechanical or physical shock.

[White organic light emitting device] (Patent Application No. 10-2007-0053472)

An organic light emitting display device is composed of organic light emitting elements that actually emit light, including an anode, a cathode, and a light emitting layer, and each pixel area in the organic light emitting element is defined by being partitioned through a bank.

Banks included in conventional organic light emitting display devices are made of transparent organic polyimide, acryl, or benzocyclobutene (BCB) resin. However, when the organic light emitting display device is used externally, external light is reflected from the surfaces of metals disposed below the bank through the transparent bank, causing a problem in that the visibility of the organic light emitting display device is reduced.

Organic light emitting display devices are encapsulated by stacking several protective layers on top of the organic light emitting device to block the inflow of moisture or oxygen from the outside. Recent organic light emitting display devices use silicon oxycarbon (SiOCz), acryl, or epoxy resin (SiOCz), acryl, or epoxy resin (SiOCz) on the front of the organic light emitting device disposed in the display area that displays light to protect the organic light emitting device from foreign substances. Place a particle cover layer (PCL) composed of resin, etc. However, during the manufacturing process of the organic light emitting display device, there was a problem in that the foreign matter compensation layer disposed on the top of the organic light emitting device flowed to the outer area around the display area, resulting in the outer area being designed to be unnecessarily wide.

The inventors of the present invention recognized the above-mentioned problems and invented an organic light emitting display device having a new structure that can minimize external light reflection of the organic light emitting display device by improving the banks that make up the organic light emitting display device.

In addition, the inventors of the present invention invented an organic light emitting display device that can minimize the outer non-display area by improving the encapsulation structure of the organic light emitting display device.

Problems to be solved according to embodiments of the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

An organic light emitting display device according to an embodiment of the present invention includes a flexible substrate, a thin film transistor on the substrate, a first protective layer on the thin film transistor, a planarization layer on the first protective layer, and an organic light emitting element on the planarization layer. and a bank made of a black material, a spacer on the bank, a second protective layer covering the area where the thin film transistor and the organic light emitting element are disposed, and a second protective layer on the first protective layer and spaced apart from the outer portion of the second protective layer. It includes a structure surrounding a protective layer, and the structure is made up of a stack of the same material as the bank and the same material as one of the planarization layer and the spacer.

An organic light emitting display device according to an embodiment of the present invention includes a substrate including a display area and an outer area surrounding the display area, an inorganic material layer covering the display area and the outer area of the substrate, and a bank located in the display area and composed of a black material. , includes a structure in which at least two layers are stacked on an inorganic material layer in the outer area, and the two layers of the structure are composed of black material and organic material, respectively.

An organic light emitting display device according to an embodiment of the present invention includes a flexible substrate, a thin film transistor on the substrate, a first protective layer on the thin film transistor, a planarization layer on the first protective layer, and an organic light emitting element on the planarization layer. and a second protective layer covering the bank, a spacer on the bank, a thin film transistor, and an area where the organic light emitting element is disposed, the bank including a black material to prevent reflection of external light, and the second protective layer on the first protective layer. 2. It includes a structure spaced apart from the outer portion of the second protective layer and surrounding the second protective layer to prevent the flow of the protective layer, and the structure is laminated with the same material as the bank and the same material as one of the planarization layer and the spacer.

Specific details of other embodiments are included in the detailed description and drawings.

According to an embodiment of the present invention, an organic light emitting display device including a bank using a black material can provide an organic light emitting display device with improved visibility by preventing external light from being reflected from the metal surface below the bank when used externally. .

According to an embodiment of the present invention, an organic light emitting display device including a structure can minimize the bezel of the organic light emitting display device by preventing flow and flooding of the foreign matter compensation layer.

According to an embodiment of the present invention, an organic light emitting display device including a structure composed of a bank material, a planarization layer, and a spacer can be manufactured simply by changing the design of the mask without adding a separate process.

According to an embodiment of the present invention, the adhesion of the structure to the lower passivation layer is improved, thereby preventing flow and flooding of the foreign matter compensation layer without loss of the structure.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description below.

Since the content of the invention described above in the problem to be solved, the means for solving the problem, and the effect do not specify the essential features of the claim, the scope of the claim is not limited by the matters described in the content of the invention.

1 is a plan view of a partial area of an organic light emitting display device according to an embodiment of the present invention.
Figure 2 is a cross-sectional view illustrating a pixel included in the display area of an organic light emitting display device according to an embodiment of the present invention.
Figure 3 is a cross-sectional view for explaining the outer area of the organic light emitting display device according to the first embodiment of the present invention.
Figure 4 is a cross-sectional view for explaining the outer area of the organic light emitting display device according to the second embodiment of the present invention.

The advantages and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and will be implemented in various different forms. The present embodiments only serve to ensure that the disclosure of the present invention is complete and that common knowledge in the technical field to which the present invention pertains is not limited. It is provided to fully inform those who have the scope of the invention, and the present invention is only defined by the scope of the claims.

The shapes, sizes, proportions, angles, numbers, etc. disclosed in the drawings for explaining embodiments of the present invention are illustrative, and the present invention is not limited to the matters shown. Like reference numerals refer to like elements throughout the specification. Additionally, in describing the present invention, if it is determined that a detailed description of related known technologies may unnecessarily obscure the gist of the present invention, the detailed description will be omitted. When 'includes', 'has', 'consists of', etc. mentioned in the specification are used, other parts may be added unless 'only' is used. When a component is expressed in the singular, the plural is included unless specifically stated otherwise.

When interpreting a component, it is interpreted to include the margin of error even if there is no separate explicit description.

In the case of a description of a positional relationship, for example, if the positional relationship of two parts is described as 'on top', 'on the top', 'on the bottom', 'next to', etc., 'immediately' Alternatively, there may be one or more other parts placed between the two parts, unless 'directly' is used.

Although first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are merely used to distinguish one component from another. Accordingly, the first component mentioned below may also be the second component within the technical spirit of the present invention.

Each feature of the various embodiments of the present invention can be combined or combined with each other partially or entirely, and various technical interconnections and operations are possible, and each embodiment can be implemented independently of each other or together in a related relationship. It may be possible.

Figure 1 is a schematic plan view of a partial area of an organic light emitting display device 100 according to an embodiment of the present invention.

Referring to FIG. 1, the organic light emitting display device 100 of the present invention has a display area (A/A) and a display area (A/A) in which pixels 116 that actually emit light through thin film transistors and organic light emitting elements are arranged. It consists of an outer area (B/A) arranged around the outer part of A).

The display area (A/A) of the organic light emitting display device 100 includes a plurality of pixels 116, a plurality of data lines 114 that transmit externally generated data signals to the pixels 116, and a gate signal that is transmitted to the pixels ( A plurality of gate lines 112 that transmit data to 116) are disposed. The detailed structure of the pixel 116 is explained in FIG. 2.

The outer area (B/A) of the organic light emitting display device 100 contains components related to various circuits that transmit externally generated signals to the pixel 116 through a plurality of gate lines 112 or data lines 114. And components for a bag to block the inflow of moisture or oxygen from the outside are disposed.

Components related to the circuit may include, for example, data drivers or gate drivers.

The data driver converts a digital video signal input from the outside into an analog video signal using the gamma voltage generated by the gamma voltage generator. The converted image signal is transmitted to a plurality of pixels 116 through a plurality of data lines 114.

The gate driver includes a plurality of shift registers, and each shift register is connected to each gate line 112. The gate driver receives a gate start pulse (GSP) and a plurality of clock signals from the data driver, and the shift register of the gate driver sequentially shifts the gate start pulses to each gate line 112. Activates a plurality of connected pixels 116.

In order to prevent oxidation of the light emitting layer and electrode by blocking the inflow of moisture or oxygen from the outside, the encapsulation components are configured to cover the entire display area (A/A) and outer area (B/A). The detailed structures of components for encapsulation of the organic light emitting display device 100 disposed in the outer area B/A, including the first structure 160a and the second structure 160b, are explained in FIGS. 3 and 4. do.

FIG. 2 is a detailed cross-sectional view showing line I-I' of the display area (A/A) shown in FIG. 1 to illustrate pixels included in the display area (A/A) of the organic light emitting display device according to an embodiment of the present invention. am.

Referring to FIG. 2 , the organic light emitting display device 200 includes a substrate 210, a thin film transistor 220, and an organic light emitting element 240.

The substrate 210 serves to support and protect the components of the organic light emitting display device 200 disposed on the top. Recently, plastic substrates such as polyimide, which have flexible characteristics, are being applied to various display devices.

A buffer layer 212 is disposed on the substrate 210 to prevent moisture or oxygen from penetrating from the outside of the substrate 210. The buffer layer 212 may be composed of a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto and may be omitted depending on the structure or characteristics of the organic light emitting display device 200. there is.

The thin film transistor 220 disposed on the buffer layer 212 includes a gate electrode 222, a source electrode 224, a drain electrode 226, and a semiconductor layer 228.

The semiconductor layer 228 is made of amorphous silicon or polycrystalline silicon, which has better mobility than amorphous silicon, has low energy consumption and excellent reliability, and can be applied to a driving thin film transistor within a pixel. ), or it can be made of an oxide semiconductor such as ZnO (Zinc Oxide) or IGZO (Indium-Gallium-Zinc Oxide), which has excellent mobility and uniformity characteristics, but is not limited thereto. The semiconductor layer 228 may include a source region containing p-type or n-type impurities, a drain region, and a channel between the two regions, and a source region adjacent to the channel and A low concentration doping region may be included between the drain regions.

The gate insulating layer 231 is an insulating film composed of a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx), and is placed so that the current flowing in the semiconductor layer 228 does not flow to the gate electrode 222.

The gate electrode 222 is connected to the gate line and functions as a switch or valve of the thin film transistor 220 through an externally transmitted electrical signal, and is made of a conductive metal, such as copper (Cu), aluminum (Al), and molybdenum. It may be composed of (Mo), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), and neodymium (Nd) or alloys thereof, a single layer or multiple layers, but is not limited thereto. no.

The source electrode 224 and the drain electrode 226 are connected to the data line so that an external electrical signal is transmitted from the thin film transistor 220 to the organic light emitting device 240. The source electrode 224 and the drain electrode 226 are made of conductive metal, such as copper (Cu), aluminum (Al), molybdenum (Mo), chromium (Cr), gold (Au), titanium (Ti), nickel ( It may be composed of metal materials such as Ni), neodymium (Nd), or alloys thereof, or a single layer or multiple layers, but is not limited thereto.

In order to insulate the gate electrode 222, the source electrode 224, and the drain electrode 226 from each other, an interlayer insulating layer 233 is disposed between the gate electrode 222, the source electrode 224, and the drain electrode 226. You can.

A passivation layer 235 made of an inorganic insulating film such as silicon oxide (SiOx) or silicon nitride (SiNx) is placed on the top of the thin film transistor 220 to prevent unnecessary electrical connections between components of the thin film transistor 220. It can prevent contamination or damage from the outside.

Depending on the positions of the components constituting the thin film transistor 220, it can be classified into an inverted staggered structure and a coplanar structure. In an inverted staggered thin film transistor, the gate electrode is located on the opposite side of the source electrode and drain electrode based on the semiconductor layer. As shown in FIG. 2, in the thin film transistor 220 having a coplanar structure, the gate electrode 222 is located on the same side as the source electrode 224 and the drain electrode 226 with respect to the semiconductor layer 228.

In Figure 2, the thin film transistor 220 is shown as a coplanar structure, but it can also be configured as a thin film transistor with an inverted staggered structure.

Additionally, for convenience of explanation, only the driving thin film transistor is shown among the various thin film transistors that can be included in the organic light emitting display device, but switching thin film transistors, capacitors, etc. may also be included in the organic light emitting display device.

Protects the thin film transistor 220, alleviates the step caused by the thin film transistor 220, and reduces parasitic capacitance ( To reduce parasitic-capacitance, a planarization layer 237 may be disposed on the thin film transistor 220. At this time, the planarization layer 237 may be made of an organic material such as polyimide or photo acryl.

The organic light emitting device 240 disposed on the planarization layer 237 includes an anode 242, a light emitting portion 244, and a cathode 246.

The anode 242 may be disposed on the planarization layer 237. The anode 242 is an electrode that supplies holes to the light emitting unit 244, and can be electrically connected to the thin film transistor 220 through a contact hole in the planarization layer 237.

The anode 242 may be made of, for example, transparent conductive materials such as indium tin oxide (ITO) or indium zinc oxide (IZO), but is not limited thereto.

Alternatively, when the organic light emitting display device 200 is a top emission device that emits light toward the top where the cathode 246 is disposed, the anode 242 is such that the light emitted from the light emitting unit 244 is transmitted to the anode 242. ) may further include a reflective layer so that it can be reflected and more smoothly emitted toward the top where the cathode 246 is disposed. Additionally, it may be a two-layer structure in which a transparent conductive layer made of a transparent conductive material and a reflective layer are sequentially stacked, or it may be a three-layer structure in which a transparent conductive layer, a reflective layer, and a transparent conductive layer are sequentially stacked. The reflective layer may be silver (Ag) or an alloy containing silver.

The bank 251 disposed on the anode 242 and the planarization layer 237 serves to define the corresponding pixel by dividing the pixel area that actually emits light.

A pixel that emits light in the organic light emitting display device 200 includes sub-pixels that emit light of one color, and in this case, each sub-pixel may emit light of a different color.

For example, the first pixel may emit red light, the second pixel may emit green light, and the third sub-pixel may emit blue light. In this way, one pixel can be formed by combining subpixels that emit light of different colors.

When a conventional organic light emitting display device is used externally, external light is reflected from the surfaces of metals disposed below the bank through the transparent bank, causing a problem in that the visibility of the organic light emitting display device is reduced.

In the organic light emitting display device 200 according to an embodiment of the present invention, the material used in the bank 251 has been improved from a conventional transparent organic material to a black material that exhibits a black color that can minimize reflection of external light.

Below, a description will be given of forming the bank 251 by forming a photoresist on the anode 242 and then using a photolithography process.

Photoresist refers to a photosensitive resin that can produce patterns by changing its solubility in a developer under the action of light. Photoresist can be classified into positive photoresist and negative photoresist. Positive photoresist increases the solubility of the exposed area in the developing solution, allowing the exposed area to be removed during the development process to obtain a pattern. In addition, the solubility of the negative photoresist in the developer solution of the exposed portion is greatly reduced, so that the non-exposed portion is removed in the development process, thereby allowing a pattern to be obtained.

The photoresist for forming the bank 251 included in the organic light emitting display device 200 according to an embodiment of the present invention must be made of a material that minimizes reflection of external light.

The photoresist for forming the bank 251 may be made of a material containing black pigment, a black material. The photoresist may be an organic material and may contain photosensitive compounds including at least one of a polymer, a monomer, and a photoinitiator.

Looking at the reaction mechanism, the photoresist before exposure has black pigment dispersed in a photosensitive compound. After exposure, the photoinitiator contained in the photosensitive compound generates radicals by light. The monomer has a double bond, so it reacts with the radicals of the photoinitiator and becomes cross-linked. Accordingly, after exposure, a photoresist with a high molecular weight is formed and thus is not dissolved by a developer. Afterwards, in the developing process using a developer, the portion that is not dissolved by the developer becomes the bank 251, and the portion that is dissolved by the developer is removed. The photoresist forming the bank 251 may be referred to as a negative photoresist.

To improve crosslinking after exposure, the photoinitiator may include an imine-based photoinitiator. The imine series may be, for example, an oxime or an oxime ester. Oximes or oxime esters are long-wavelength photoinitiators that can improve crosslinking. Here, long wavelength refers to 365nm or more. Additionally, the light source used during exposure is a high-pressure mercury lamp and has multiple wavelengths. The multiple wavelengths may be 436 nm for the G-line, 405 nm for the H-line, and 365 nm for the I-line. Among these, the photoetching process is performed using the I-line of 365 nm or higher.

Oximes or oxime esters can minimize by-products generated after exposure, so they can minimize impurities generated when by-products react with other molecules in the baking process, which is a subsequent process after cross-linking. Additionally, since oxime or oxime ester is used together with black pigment, a bank 251 with high light blocking properties can be provided. Alternatively, the photoinitiator may be composed of oxime or oxime ester and acetonephenone.

For example, oxime can be represented by Formula 1 below.

[Formula 1]

Here, R and R' may be either an alkyl group or a phenyl group having 1 to 15 carbon atoms.

For example, oxime ester can be represented by Formula 2 below.

[Formula 2]

Here, R is an aryl group, and R' may be either an alkyl group having 1 to 15 carbon atoms or a phenyl group.

The monomer may contain a hexafunctional group, for example, DPHA (DiPentaerythritol HexaAcrylate). This DPHA has double bonds and can be quickly cured by light after crosslinking. Accordingly, the photoresist for forming the bank 251 can be formed as a hard film, and the developing resistance is improved, which has the effect of preventing the film from being lost even during a developing process with a high concentration of developer.

Polymers include cardo-based. Cardo-based polymers have excellent heat resistance, miscibility with pigments, and solubility. Additionally, the polymer may further include epoxy acrylate. Therefore, polymers containing cardo series and epoxy acrylate serve to improve dispersibility by allowing black pigment to be well dispersed within the polymer. Dispersibility refers to the uniformity of the photoresist, and as dispersibility improves, a more uniform bank 251 can be formed.

For example, the Caddo series can be expressed as [Chemical Formula 3] below.

[Formula 3]

The developer may be, for example, TetraMethylAmmoniumHydroxide (TMAH) or Potassium Hydroxide (KOH).

The bank 251 may have an optical density (OD), which indicates the degree of light blocking, of 4 or less at a thickness of 3 μm of the bank 251. Optical density (OD) is measured with an OD meter.

The bank 251 must be made of a material with high step coverage, and step coverage means uniform coverage on the bottom and walls of a trench or hole, such as a reverse taper. A thick film can be deposited. The taper angle of the bank 251 is set to 45 degrees or less so that the layers including the anode 245 and the light emitting unit 244 to be formed on the bank 251 can be formed uniformly.

The volume resistivity of the bank 251 can be configured to be 1X10 ¹⁵ Ω·cm or more. The higher the volume resistivity, the more likely it is to reduce leakage current. As the organic layers constituting the light emitting unit 244 are composed of a common layer, when current is applied to drive a specific sub-pixel, the leakage current flows to other neighboring sub-pixels through organic layers such as the hole injection layer or hole transport layer. It is a flowing phenomenon. This leakage current causes other sub-pixels to unintentionally emit light, causing color mixing between sub-pixels and lowering luminance. Therefore, when the volume resistivity is 1X10 ¹⁵ Ω·cm or more, color mixing or luminance reduction between sub-pixels due to leakage current can be prevented. Volume resistivity is measured with Ultra High Resistance Meter R8340A.

By constructing the bank 251 with a material containing black pigment and a photosensitive compound, when the incident angle of external light is 45 degrees, the reflected luminance at a reflection angle of 30 degrees can be less than 30 nits, thereby improving reflection by external light and increasing the reflected luminance. can be reduced. The reflected luminance of the bank 251 is measured with DMS803. Here, the reflected luminance may include reflected luminance on the left and right sides of the organic light emitting display device. Therefore, when the left and right reflected luminance is at an incident angle of external light of 45 degrees, it may be less than 30 nits at a reflection angle of 30 degrees. Accordingly, the viewing characteristics of the organic light emitting display device 200 according to an embodiment of the present invention in the left and right directions can be improved.

Therefore, in order to minimize reflection of external light, the optical density (OD) of the bank 251 can be set to 4 or less when the thickness of the bank 251 is 3 μm. And, to improve step coverage, the taper angle can be configured to be 45 degrees or less. And, in order to reduce leakage current and improve brightness, the volume resistivity can be set to 1X10 ¹⁵ Ω·cm or more.

By constructing the bank 251 with a material containing black pigment and a photosensitive compound, a uniform film with improved dispersibility can be formed, and development resistance has been improved to prevent the film from being lost even during the development process with a high concentration of developer. Therefore, the bank 251 can be formed in which light blocking properties are improved and reflection by external light can be minimized.

By composing the bank 251 with a material containing black pigment and a photosensitive compound, reflection by external light is reduced, and thus the organic light emitting display device 200 with improved reflected luminance can be provided.

A fine metal mask (FMM), which is a deposition mask, is used to define the pixel area where the bank 251 actually emits light, define the corresponding pixel, and form the light emitting portion 244 of the organic light emitting device 240. At this time, in order to prevent damage that may occur due to contact between the bank 251 and the deposition mask and to maintain a certain distance between the bank 251 and the deposition mask, polyimide, a transparent organic material, is placed on the top of the bank 251. ), photo acryl, and benzocyclobutene (BCB; BenzoCycloButene) may be disposed.

A light emitting unit 244 is disposed between the anode 242 and the cathode 246. The light emitting unit 244 serves to emit light and may be composed of a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, etc., depending on the structure or characteristics of the organic light emitting display device 200. Accordingly, some chanting elements may be omitted.

The hole injection layer and the hole transport layer are disposed between the anode 242 and the light emitting layer and facilitate the movement of holes from the anode 242 to the light emitting layer.

The hole injection layer is disposed on the anode 242 and serves to facilitate hole injection. The hole injection layer is, for example, HAT-CN (dipyrazino[2,3-f:2',3'-h]quinoxaline-2,3,6,7,10.11-hexacarbonitrile), CuPc (phthalocyanine), and It may be composed of one or more of NPD (N,N'-bis(naphthalene-1-yl)-N,N'-bis(phenyl)-2,2'-dimethylbenzidine).

The hole transport layer is disposed on the hole injection layer and serves to smoothly transfer holes to the light emitting layer. Hole transport layer (e.g., NPD(N,N'-bis(naphthalene-1-yl)-N,N'-bis(phenyl)-2,2'-dimethylbenzidine), TPD(N,N'- bis-(3-methylphenyl)-N,N'-bis-(phenyl)-benzidine), s-TAD(2,2',7,7'-tetrakis(N,N-dimethylamino)-9,9-spirofluorene ) and MTDATA (4,4',4"-Tris(N-3-methylphenyl-N-phenyl-amino)-triphenylamine).

Micro cavity means that light of a specific wavelength is amplified by constructive interference as light is repeatedly reflected between two layers spaced apart by the optical length. When the organic light emitting display device 200 emits different light for each sub-pixel, the wavelength of the emitted light is different. Therefore, in order to implement a microcavity, the resonance distance must be set for each wavelength of light emitted from each sub-pixel. . In the organic light emitting display device 200, the thickness of the hole transport layer can be adjusted differently in order to set the resonance distance differently for each sub-pixel.

The light-emitting layer is disposed on the hole transport layer and can emit light of a specific color by including a material that can emit light of a specific color. At this time, the light-emitting material can be formed using a phosphorescent material or a fluorescent material.

When the light emitting layer emits red, it contains a host material containing CBP (carbazole biphenyl) or mCP (1,3-bis (carbazol-9-yl), PIQIr (acac) (bis (1-phenylisoquinoline) acetylacetonate iridium ), PQIr (acac) (bis (1-phenylquinoline) acetylacetonate iridium), PQIr (tris (1-phenylquinoline) iridium), and PtOEP (octaethylporphyrin platinum). It may be made of a phosphorescent material containing a dopant containing one or more of the following. Alternatively, it may be made of a fluorescent material containing PBD:Eu(DBM)3(Phen) or Perylene.

When the emitting layer emits green color, it contains a host material containing CBP or mCP and is a phosphorescent material containing a dopant material such as an Ir complex containing Ir(ppy)3 (fac tris(2-phenylpyridine)iridium). It can be done. Additionally, it may be made of a fluorescent material containing Alq3 (tris(8-hydroxyquinolino)aluminum).

When the light emitting layer emits blue light, it may be made of a phosphorescent material including a host material including CBP or mCP and a dopant material including (4,6-F2ppy)2Irpic. In addition, spiro-DPVBi(4,4'-Bis(2,2-diphenyl-ethen-1-yl)biphenyl), DSA(1-4-di-[4-(N,N-di-phenyl)amino] It may be made of a fluorescent material containing any one of styryl-benzene), PFO-based polymer, and PPV-based polymer.

The electron transport layer and the electron injection layer are disposed between the light-emitting layer and the cathode 246, and facilitate the movement of electrons from the cathode 246 to the light-emitting layer.

The electron transport layer is disposed on the light-emitting layer and serves to transfer electrons from the electron injection layer to the light-emitting layer. The electron transport layer is, for example, Liq (8-hydroxyquinolinolato-lithium), PBD (2-(4-biphenyl)-5-(4-tert-butylphenyl)-1,3,4oxadiazole), TAZ (3-(4 -biphenyl)4-phenyl-5-tert-butylphenyl-1,2,4-triazole), spiro-PBD, BCP(2,9-Dimethyl-4,7-diphenyl-1,10-phenanthroline) and BAlq(bis It may be composed of one or more of (2-methyl-8-quinolinolate)-4-(phenylphenolato)aluminium).

The electron injection layer is an organic layer disposed on the electron transport layer to facilitate injection of electrons from the cathode 246. The electron injection layer may be a metal inorganic compound such as BaF2, LiF, NaCl, CsF, _Li2O and BaO, and HAT-CN (dipyrazino[2,3-f:2',3'-h]quinoxaline-2, 3,6,7,10.11-hexacarbonitrile), CuPc (phthalocyanine), and NPD (N,N'-bis(naphthalene-1-yl)-N,N'-bis(phenyl)-2,2'-dimethylbenzidine) It may be any one or more organic compounds.

The cathode 246 is disposed on the light emitting unit 244 and serves to supply electrons to the light emitting unit 244. Since the cathode 246 must supply electrons, it can be made of a metal material such as magnesium (Mg) or silver-magnesium (Ag:Mg), which is a conductive material with a low work function, but is not limited thereto.

Alternatively, if the organic light emitting display device 200 is a top emission type, the cathode 246 is made of indium tin oxide (ITO), indium zinc oxide (IZO), or indium tin zinc oxide (Indium Tin). It may be a transparent conductive oxide of the Zinc Oxide (ITZO), Zinc Oxide (ZnO), and Tin Oxide (TiO) series.

A protective layer 248 may be disposed on the cathode 246 to prevent contamination or damage to the organic light emitting device 240 from the outside, and may be composed of a single layer or multiple layers of organic or inorganic material, but is not limited thereto. no.

FIG. 3 shows in detail the line II-II' of the outer area (B/A) shown in FIG. 1 to explain the outer area (B/A) of the organic light emitting display device 300 according to the first embodiment of the present invention. This is the cross-sectional view shown.

For convenience of explanation, FIG. 3 shows only the outer area (B/A) of the organic light emitting display device 300 according to an embodiment of the present invention described in FIGS. 1 and 2, and other components are omitted. Explain.

Referring to FIG. 3 , the outer area (B/A) of the organic light emitting display device 300 includes a substrate 310 and an encapsulation portion 370. The thin film transistor and the organic light emitting device may be disposed in the display area (A/A), and the thin film transistor and the organic light emitting device are omitted in FIG. 3 .

The substrate 310 serves to support and protect the components of the organic light emitting display device 300 disposed on the top. Recently, plastics such as polyimide, which have flexible characteristics, are used as substrates and are used in various display devices.

An insulating layer 334 is disposed on the substrate 310. The insulating layer 334 may include at least one of a buffer layer, a gate insulating layer, and an interlayer insulating layer that are substantially the same as those described in FIG. 2 , and may have some components depending on the structure or characteristics of the organic light emitting display device 300. Components may be omitted.

A passivation layer 335 made of an inorganic insulating film such as silicon oxide (SiOx) or silicon nitride (SiNx) is disposed on the insulating layer 334 to prevent contamination or damage from the outside of the thin film transistor.

In order to alleviate the step caused by the thin film transistor on the passivation layer 335 and to reduce the parasitic capacitance generated between the thin film transistor, gate line and data line, and organic light emitting elements, polyimide is used. A planarization layer 337 composed of an organic material such as polyimide or photo acryl is disposed.

On the planarization layer 337, a pixel area that emits light can be divided to define a pixel, and a bank 351 made of a black material that can minimize reflection of external light is placed.

In order to maintain a certain distance between the bank 351 and the FMM mask, which is a deposition mask, transparent organic materials such as polyimide, photo acryl, and benzocyclobutene (BCB) are placed on the top of the bank 251. A spacer 353 composed of one is disposed.

The passivation layer 335, planarization layer 337, bank 351, and spacer 353 are substantially the same as those described in FIG. 2, and detailed descriptions are omitted here.

Inflow of moisture or oxygen from the outside onto the top of the thin film transistor, organic light emitting element, passivation layer 335, planarization layer 337, bank 351, and spacer 353, etc., which are components of the organic light emitting display device 300. An encapsulation unit 370 for encapsulation is disposed to prevent oxidation of the light emitting layer and electrode by blocking the oxidation layer.

The encapsulation portion 370 includes a first encapsulation layer 371, a second encapsulation layer 373, a foreign matter compensation layer 375, a first barrier film 377, a second barrier film 379, and a first structure 360a. ), and includes a second structure 360b.

The first encapsulation layer 371 is formed on the top of components such as thin film transistors, organic light emitting devices, banks 351, and spacers 353 arranged in the display area (A/A) and on the entire upper surface of the outer area (B/A). It is placed. The first encapsulation layer 371 may be made of one of the inorganic materials silicon nitride (SiNx) or aluminum oxide (AlyOz), but is not limited thereto.

The foreign matter compensation layer 375 is disposed on the front surface of the area including the display area A/A on the first encapsulation layer 371. The foreign matter compensation layer 375 may be made of organic silicon oxycarbon (SiOCz), acryl, or epoxy-based resin, but is not limited thereto.

In order for the foreign matter compensation layer 375 to effectively compensate for foreign matter, the viscosity of the foreign matter compensation layer 375 may be 500 (centipoise; cp) to 30,000 cp, and more preferably 2,000 cp to 4,000 cp.

When the foreign matter compensation layer 375 is formed of acrylic or epoxy-based resin, the foreign matter compensation layer 375 may be formed through a slit coating or screen printing process. At this time, epoxy-based resins such as high viscosity Bisphenol-A-Epoxy or low viscosity Bisphenol-F-Epoxy can be used.

The foreign matter compensation layer 375 may further include additives, such as a wetting agent to reduce the surface tension of the resin to improve the uniformity of the resin, a leveling agent to improve the surface flatness of the resin, And a defoaming agent to remove air bubbles contained in the resin may be further added as an additive. In addition, the foreign matter compensation layer 375 may further include an initiator, and it is recommended to use an antimony-based initiator or an anhydride-based initiator that hardens the liquid resin by initiating a chain reaction with heat. possible.

The cross-section of the foreign matter compensation layer 375 is formed to be flat in the display area (A/A) and has a shape that gradually becomes thinner toward the outer area (B/A). The part where the foreign matter compensation layer 375 gradually becomes thinner has a slope, which may cause light refraction and deteriorate image quality, so the foreign matter compensation layer 375 is located in the outer area (B/A). It is desirable to be placed in .

The foreign matter compensation layer 375 serves to improve problems caused by foreign matter or particles that may occur during the process. For example, there may be defects in the first encapsulation layer 371 due to cracks caused by foreign substances or particles, but the foreign substances or particles may be covered by the foreign matter compensation layer 375, and the upper surface of the foreign matter compensation layer 375 is flattened.

Since the foreign matter compensation layer 375 has excellent fluidity, there are cases where the foreign matter compensation layer 375 flows into the outer area (B/A), resulting in the problem that the outer area (B/A) is designed to be unnecessarily wide. . Accordingly, the first structure 360a and the second structure 360b according to an embodiment of the present invention are placed along the outer edge of the foreign matter compensation layer 375 in the outer area (B/A) of the organic light emitting display device 300. form

The first structure 360a and the second structure 360b are disposed at a certain distance from the foreign matter compensation layer 375 in the outer area B/A.

When forming the foreign matter compensation layer 375 during the manufacturing process of the organic light emitting display device 300, the foreign matter compensation layer 375 is formed due to the first structure 360a and the second structure 360b disposed adjacent to the foreign matter compensation layer 375. (375) The flow of materials is prevented, and the width of the outer area (B/A) of the organic light emitting display device 300 is reduced, thereby minimizing the bezel.

The flow of the foreign matter compensation layer 375 material is primarily prevented through the first structure 360a disposed adjacent to the foreign matter compensation layer 375, and even when the first structure 360a is flooded, the first structure (360a) is disposed adjacent to the foreign matter compensation layer 375. Through the second structure 360b disposed at a certain distance from 360a), unnecessary flow and flooding of the material of the foreign matter compensation layer 375 occurring in the outer area (B/A) can be prevented. At this time, the separation distance between the first structure 360a and the second structure 360b is preferably placed at least 2 μm apart in order to minimize the mutual influence between the structures while minimizing the width of the outer area (B/A). do. At this time, the separation distance may vary depending on the height of the first structure 360a and the second structure 360b, the thickness, viscosity, and application area of the foreign matter compensation layer 375, and is not limited thereto.

The first structure 360a and the second structure 360b include first and second lower layers 362a and 362b and first and second upper layers 364a and 364b, respectively. The first and second lower layers 362a and 362b are formed of the same material and the same process as the planarization layer 337, and the first and second upper layers 364a and 364b are formed of the same material and the same process as the bank 351. . Accordingly, the first structure 360a and the second structure 360b can be formed only by changing the mask design without additional processes.

At this time, the first structure 360a and the second structure 360b are disposed on the passivation layer 335 and include the first and second lower layers 362a and 362b using the same material as the planarization layer 337 and the passivation layer ( 335), the flow and overflow of the material of the foreign matter compensation layer 375 can be minimized without loss of the first structure 360a and the second structure 360b due to the adhesion between them.

The first structure 360a and the second structure 360b can be formed to have a height of 3.7 μm to 4.0 μm. At this time, the height of the first structure 360a and the second structure 360b may vary depending on the design of the planarization layer 337 and the bank 351. For example, if the planarization layer 337 and the bank 351 are formed to a height of 2.3 μm and 1.7 μm, respectively, the total height of the first structure 360a and the second structure 360b becomes 4.0 μm. This height may vary depending on the thickness, viscosity, and application area of the foreign matter compensation layer 375, and is therefore not limited thereto.

It is preferable that the first structure 360a adjacent to the foreign matter compensation layer 375 be placed at least 50 μm apart. This separation distance may vary depending on the height of the first structure 360a and the second structure 360b, the thickness, viscosity, and application area of the foreign matter compensation layer 375, and is not limited thereto.

When the foreign matter compensation layer 375 is formed of acrylic or epoxy-based resin, the height of the foreign matter compensation layer 375 may be in the range of 15 μm to 25 μm. Accordingly, the height of the foreign matter compensation layer 375 is formed to be higher than the height of the first structure 360a and the second structure 360b. As previously explained, the foreign matter compensation layer 375 is formed to be flat within the display area (A/A) and has a shape that gradually becomes lower toward the outer area (B/A). Accordingly, the foreign matter compensation layer 375 of the first structure 360a and the second structure 360b gradually becomes thinner, so that the height of the first structure 360a and the second structure 360b increases with the foreign matter compensation layer 375. It is desirable to form it in a location that can effectively block it.

The second encapsulation layer 373 is formed on the foreign matter compensation layer 375 and the first encapsulation layer 371, and the first encapsulation layer 371 and the second encapsulation layer 373 are of the second structure 360b. While contacting each other on the outer side, the foreign matter compensation layer 375 is sealed by the first encapsulation layer 371 and the second encapsulation layer 373, so that a direct moisture penetration path through the foreign matter compensation layer 375 can be blocked. The second encapsulation layer 373 may be made of one of the inorganic materials silicon nitride (SiNx) or aluminum oxide (AlyOz), but is not limited thereto.

By disposing the first barrier film 377 and the second barrier film 379 on the second encapsulation layer 373, the organic light emitting display device 300 can further delay the infiltration of oxygen and moisture from the outside.

The first barrier film 377 is composed of a light-transmitting and double-sided adhesive film, and may be made of any one of the following insulating materials: Olefin-based, Acrylic-based, and Silicon-based. , The second barrier film 379 may be made of any one of COP (Copolyester Thermoplastic Elastomer), COC (Cycoolefin Copolymer), and PC (Polycarbonate), but is not limited thereto. Infiltration of moisture and oxygen from the outside can be further delayed through the first barrier film 377 and the second barrier film 379, thereby improving the lifespan and reliability of the organic light emitting display device 300.

FIG. 4 is a cross-sectional view showing in detail line II-II' of the outer area shown in FIG. 1 to explain the outer area of the organic light emitting display device according to the second embodiment of the present invention.

For convenience of explanation, FIG. 4 shows only the outer area (B/A) of the organic light emitting display device 400 according to an embodiment of the present invention described in FIGS. 1 and 2, and other components are omitted. Explain.

Referring to FIG. 4 , the outer area (B/A) of the organic light emitting display device 400 includes a substrate 410, an encapsulation portion 470, etc. The thin film transistor and the organic light emitting device may be disposed in the display area (A/A), and the thin film transistor and the organic light emitting device are omitted in FIG. 4 .

The substrate 410 serves to support and protect the components of the organic light emitting display device 400 disposed on the top. Recently, plastics such as polyimide, which have flexible characteristics, are used as substrates and are used in various display devices.

An insulating layer 434 is disposed on the substrate 410. The insulating layer 434 may include at least one of a buffer layer, a gate insulating layer, and an interlayer insulating layer that are substantially the same as those described in FIG. 2 , and may include some of the elements depending on the structure or characteristics of the organic light emitting display device 400. Components may be omitted.

A passivation layer 435 made of an inorganic insulating film such as silicon oxide (SiOx) or silicon nitride (SiNx) is disposed on the insulating layer 434 to prevent contamination or damage from the outside of the thin film transistor.

In order to alleviate the step caused by the thin film transistor on the passivation layer 435 and to reduce the parasitic capacitance generated between the thin film transistor, gate line and data line, and organic light emitting elements, polyimide is used. A planarization layer 437 composed of an organic material such as polyimide or photo acryl is disposed.

On the planarization layer 437, a pixel area that emits light can be divided to define a pixel, and a bank 451 made of a black material that can minimize reflection of external light is placed.

In order to maintain a constant distance between the bank 451 and the FMM mask, which is a deposition mask, transparent organic materials such as polyimide, photo acryl, and benzocyclobutene (BCB) are placed on the top of the bank 451. A spacer 453 consisting of one is disposed.

The passivation layer 435, planarization layer 437, bank 451, and spacer 453 are substantially the same as those described in FIG. 2, and detailed description will be omitted here.

Inflow of moisture or oxygen from the outside onto the top of the thin film transistor, organic light emitting element, passivation layer 435, planarization layer 437, bank 451, and spacer 453, etc., which are components of the organic light emitting display device 400. An encapsulation unit 470 for encapsulation is disposed to prevent oxidation of the light emitting layer and electrode by blocking the oxidation layer.

The encapsulation portion 470 includes a first encapsulation layer 471, a second encapsulation layer 473, a foreign matter compensation layer 475, a first barrier film 477, a second barrier film 479, and a first structure 460a. ), and includes a second structure 460b.

The first encapsulation layer 471 is formed on the top of components such as thin film transistors, organic light emitting devices, banks 451, and spacers 453 disposed in the display area (A/A) and on the entire surface of the outer area (B/A). It is placed. The first encapsulation layer 471 may be made of either silicon nitride (SiNx) or aluminum oxide (AlyOz), which are inorganic materials, but is not limited thereto.

The foreign matter compensation layer 475 is disposed on the entire surface of the area including the display area A/A on the first encapsulation layer 471. The foreign matter compensation layer 475 may be made of organic silicon oxycarbon (SiOCz), acryl, or epoxy-based resin, but is not limited thereto.

In order for the foreign matter compensation layer 475 to effectively compensate for foreign matter, the viscosity of the foreign matter compensation layer 475 may be 500 (centipoise; cp) to 30,000 cp, and more preferably 2,000 cp to 4,000 cp.

When the foreign matter compensation layer 475 is formed of acrylic or epoxy-based resin, the foreign matter compensation layer 475 may be formed through a slit coating or screen printing process. At this time, epoxy-based resins such as high viscosity Bisphenol-A-Epoxy or low viscosity Bisphenol-F-Epoxy can be used.

The foreign matter compensation layer 475 may further include additives, such as a wetting agent to reduce the surface tension of the resin to improve the uniformity of the resin, a leveling agent to improve the surface flatness of the resin, A defoaming agent to remove air bubbles contained in the resin may be further added as an additive. In addition, the foreign matter compensation layer 475 may further include an initiator, and it is better to use an antimony-based initiator or an anhydride-based initiator that hardens the liquid resin by initiating a chain reaction with heat. possible.

The cross-section of the foreign matter compensation layer 475 is formed to be flat in the display area (A/A) and has a shape that gradually becomes thinner toward the outer area (B/A). The part where the foreign matter compensation layer 475 gradually becomes thinner has a slope and causes refraction of light, which may deteriorate image quality, so it is preferable to place it in the outer area (B/A).

The foreign matter compensation layer 475 serves to improve problems caused by foreign matter or particles that may occur during the process. For example, there may be defects in the first encapsulation layer 471 due to cracks caused by foreign substances or particles, but these bends and foreign substances can be covered by the foreign matter compensation layer 475, and the foreign matter compensation layer 475 The upper surface is flattened.

Since the foreign matter compensation layer 475 has excellent fluidity, there are cases where the foreign matter compensation layer 475 flows into the outer area (B/A), resulting in the problem that the outer area (B/A) is designed to be unnecessarily wide. . Accordingly, the first structure 460a and the second structure 460b according to an embodiment of the present invention are installed along the outer edge of the foreign matter compensation layer 475 in the outer area (B/A) of the organic light emitting display device 400. form

The first structure 460a and the second structure 460b are disposed at a certain distance from the foreign matter compensation layer 475 in the outer area B/A.

When forming the foreign matter compensation layer 475 during the manufacturing process of the organic light emitting display device 400, the foreign matter compensation layer 475 is formed due to the first structure 460a and the second structure 460b disposed adjacent to the foreign matter compensation layer 475. (475) The flow of material is prevented, and the width of the outer area (B/A) of the organic light emitting display device 400 is reduced, thereby minimizing the bezel.

The flow of the foreign matter compensation layer 475 material is primarily prevented through the first structure 460a disposed adjacent to the foreign matter compensation layer 475, and even when the first structure 460a is flooded, the first structure (460a) is disposed adjacent to the foreign matter compensation layer 475. Through the second structure 460b arranged at a certain distance from 460a), the material of the foreign matter compensation layer 475 is prevented from unnecessary additional flow and flooding occurring in the outer area (B/A). At this time, the separation distance between the first structure 460a and the second structure 460b is preferably placed at least 2 μm apart in order to minimize the mutual influence between the structures while minimizing the width of the outer area (B/A). do. At this time, the separation distance may vary depending on the height of the first structure 460a and the second structure 460b, the thickness, viscosity, and application area of the foreign matter compensation layer 475, and is not limited thereto.

The first structure 460a and the second structure 460b include first and second lower layers 464a and 464b and first and second upper layers 466a and 466b, respectively. The first and second lower layers 464a and 464b are made of the same material as the bank 451 and are formed through the same process, and the first and second upper layers 466a and 466b are made of the same material as the spacer 453 and are formed through the same process. Accordingly, the first structure 460a and the second structure 460b can be formed by simply changing the mask design without additional processes. In particular, the bank 451 and the first and second lower layers 464a and 464b, and the spacer 453 and the first and second upper layers 466a and 466b can be formed in one process after sequentially stacking, thereby simplifying the process. , it may be possible to manufacture the first structure 460a and the second structure 460b.

The first structure 460a and the second structure 460b may be formed to have a height of 3.7 μm to 4.0 μm. At this time, the height of the first structure 460a and the second structure 460b may vary depending on the design of the bank 451 and the spacer 453. For example, if the bank 451 and the spacer 453 are formed to have a height of 1.7 μm and 2.0 μm, respectively, the height of the first structure 460a and the second structure 460b, which have a multi-layer structure, is 3.7 μm. This height may vary depending on the thickness, viscosity, and application area of the foreign matter compensation layer 475, and is therefore not limited thereto.

It is preferable that the first structure 460a adjacent to the foreign matter compensation layer 475 be placed at least 50 μm apart. This separation distance may vary depending on the height of the first structure 460a and the second structure 460b, the thickness, viscosity, and application area of the foreign matter compensation layer 475, and is not limited thereto.

When the foreign matter compensation layer 475 is formed of acrylic or epoxy-based resin, the height of the foreign matter compensation layer 475 may be in the range of 15 μm to 25 μm. Accordingly, the height of the foreign matter compensation layer 475 is formed to be higher than the height of the first structure 460a and the second structure 460b. As previously explained, the foreign matter compensation layer 475 is formed to be flat within the display area (A/A) and has a shape that gradually becomes lower toward the outer area (B/A). Accordingly, the foreign matter compensation layer 475 of the first structure 460a and the second structure 460b gradually becomes thinner, so that the height of the first structure 460a and the second structure 460b increases with the foreign matter compensation layer 475. It is desirable to form it in a location that can effectively block it.

The second encapsulation layer 473 is formed on the foreign matter compensation layer 475 and the first encapsulation layer 471, and the first encapsulation layer 471 and the second encapsulation layer 473 are of the second structure 460b. While contacting each other on the outer side, the foreign matter compensation layer 475 is sealed by the first encapsulation layer 471 and the second encapsulation layer 473, thereby blocking a direct moisture penetration path through the foreign matter compensation layer 475. The second encapsulation layer 473 may be made of either silicon nitride (SiNx) or aluminum oxide (AlyOz), which are inorganic materials, but is not limited thereto.

By disposing the first barrier film 477 and the second barrier film 479 on the second encapsulation layer 473, the organic light emitting display device 400 can further delay the infiltration of oxygen and moisture from the outside.

The first barrier film 477 is composed of a light-transmitting and double-sided adhesive film, and can be made of any one of the following insulating materials: Olefin-based, Acrylic-based, and Silicon-based. , The second barrier film 479 may be made of any one of COP (Copolyester Thermoplastic Elastomer), COC (Cycoolefin Copolymer), and PC (Polycarbonate), but is not limited thereto. Infiltration of moisture and oxygen from the outside can be further delayed through the first barrier film 477 and the second barrier film 479, thereby improving the lifespan and reliability of the organic light emitting display device 400.

An organic light emitting display device according to an embodiment of the present invention includes a flexible substrate, a thin film transistor on the substrate, a first protective layer on the thin film transistor, a planarization layer on the first protective layer, and an organic light emitting element on the planarization layer. and a bank made of a black material, a spacer on the bank, a second protective layer covering the area where the thin film transistor and the organic light emitting element are disposed, and a second protective layer on the first protective layer and spaced apart from the outer portion of the second protective layer. It includes a structure surrounding a protective layer, and the structure is made up of a stack of the same material as the bank and the same material as one of the planarization layer and the spacer.

In the organic light emitting display device according to an embodiment of the present invention, structures may be arranged continuously or discontinuously.

In the organic light emitting display device according to an embodiment of the present invention, the structure may be composed of a plurality of structures.

In the organic light emitting display device according to an embodiment of the present invention, the separation distance between the plurality of structures may be 2 μm or more.

In the organic light emitting display device according to an embodiment of the present invention, the structure may be spaced apart from the outer portion of the second protective layer by more than 50 μm.

An organic light emitting display device according to an embodiment of the present invention includes a substrate including a display area and an outer area surrounding the display area, an inorganic material layer covering the display area and the outer area of the substrate, and a bank located in the display area and composed of a black material. , includes a structure in which at least two layers are stacked on an inorganic material layer in the outer area, and at least two layers of the structure are composed of a black material and an organic material, respectively.

In the organic light emitting display device according to an embodiment of the present invention, the adhesion of the organic material to the inorganic material layer may be greater than that of the black material.

The organic light emitting display device according to an embodiment of the present invention further includes a planarization layer on the inorganic material layer, and the planarization layer may be made of the same material as the material forming the structure.

In the organic light emitting display device according to an embodiment of the present invention, the structure may be arranged continuously or discontinuously in the outer area.

In the organic light emitting display device according to an embodiment of the present invention, the structure includes a plurality of structures, and the plurality of structures may be disposed in an outer area.

In the organic light emitting display device according to an embodiment of the present invention, the separation distance between the plurality of structures may be 2 μm or more.

An organic light emitting display device according to an embodiment of the present invention includes a flexible substrate, a thin film transistor on the substrate, a first protective layer on the thin film transistor, a planarization layer on the first protective layer, and an organic light emitting element on the planarization layer. and a second protective layer covering the bank, a spacer on the bank, a thin film transistor, and an area where the organic light emitting element is disposed, the bank including a black material to prevent reflection of external light, and the second protective layer on the first protective layer. 2. It includes a structure spaced apart from the outer portion of the second protective layer and surrounding the second protective layer to prevent the flow of the protective layer, and the structure is laminated with the same material as the bank and the same material as one of the planarization layer and the spacer.

In the organic light emitting display device according to an embodiment of the present invention, the structure may be continuously or discontinuously spaced from the outer portion of the second protective layer to surround the second protective layer.

In the organic light emitting display device according to an embodiment of the present invention, the structure may be composed of a plurality of structures.

In the organic light emitting display device according to an embodiment of the present invention, the separation distance between the plurality of structures may be 2 μm.

In the organic light emitting display device according to an embodiment of the present invention, the structure may be disposed at a distance of 50 μm or more from the outer portion of the second protective layer.

Although embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and various modifications may be made without departing from the technical spirit of the present invention. . Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but are for illustrative purposes, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive. The scope of protection of the present invention should be interpreted in accordance with the claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of rights of the present invention.

100, 200, 300, 400: Organic light emitting display device
110, 210, 310, 410: substrate
112: gate line 114: data line
116: pixel
160a, 360a, 460a: first structure
362a, 464a: first lower layer
364a, 466a: first upper layer
160b, 360b, 460b: second structure
362b, 464b: second lower layer
364b, 466b: second upper layer
212: buffer layer 220: thin film transistor
222: gate electrode 224: source electrode
226: drain electrode 228: semiconductor layer
231: gate insulating layer 233: interlayer insulating layer
235, 335, 435: Passivation layer
237, 337, 437: Flattening layer
240: Organic light emitting device
242: anode 244: light emitting unit
246: cathode 248: protective layer
251, 351, 451: Bank
253, 353, 453: Spacer
334, 434: insulating layer
370, 470: Encapsulation part
371, 471: first encapsulation layer
373, 473: second encapsulation layer
375, 475: Foreign matter compensation layer
377, 477: first barrier film
379, 479: Second barrier film
A/A: Display area
B/B: Outer area

Claims (13)

flexible substrate;
a thin film transistor on the substrate;
a first protective layer on the thin film transistor;
a planarization layer on the first protective layer;
a bank composed of an organic light emitting element and a black material on the planarization layer;
A spacer on the bank and made of a transparent organic material;
a second protective layer covering an area where the thin film transistor and the organic light emitting device are disposed; and
It is on the first protective layer, and includes a structure that is spaced apart from an outer portion of the second protective layer and surrounds the second protective layer,
The structure includes a lower layer made of the same material as the planarization layer and an upper layer disposed on the lower layer and made of the same material as the bank. According to claim 1,
An organic light emitting display device in which the structure is arranged continuously or discontinuously. According to clause 2,
The structure is an organic light emitting display device composed of a plurality of structures. According to clause 3,
An organic light emitting display device wherein the separation distance between the plurality of structures is 2μm or more. According to claim 1,
An organic light emitting display device wherein the structure is spaced apart from the outer portion of the second protective layer by more than 50 μm. According to claim 1,
The bank is an organic light emitting display device including black pigment and a photosensitive compound. According to claim 1,
The first protective layer is composed of an inorganic insulating film,
The structure is disposed in contact with the first protective layer. According to claim 1,
The organic light emitting device includes an anode, a light emitting unit, and a cathode,
The bank is in direct contact with the anode,
The spacer is spaced apart from the anode in an organic light emitting display device. A substrate including a display area and an outer area surrounding the display area;
an inorganic material layer covering the display area and the outer area of the substrate;
A planarization layer disposed on the inorganic layer;
a bank located in the display area and made of black material; and
At least two layers are stacked on the inorganic layer in the outer area, and include a structure arranged to surround the display area and spaced apart from the planarization layer and the bank disposed in the display area,
An organic light emitting display device wherein a lower layer of the at least two layers of the structure is composed of an organic material constituting the planarization layer, and an upper layer of the at least two layers of the structure is composed of the same material as the bank. According to clause 9,
An organic light emitting display device in which the adhesion of the organic material to the inorganic material layer is greater than the adhesion of the black material to the inorganic material layer. According to clause 9,
The structure is an organic light emitting display device arranged continuously or discontinuously in the outer area. According to claim 10,
The structure is an organic light emitting display device composed of a plurality of structures. According to claim 12,
An organic light emitting display device wherein the separation distance between the plurality of structures is 2μm or more.